DE102012203265B4 - Contactless data transmission device and value and / or security document containing it - Google Patents

Abstract

Contactless data transmission device (50) which has: (a) an electrically insulating carrier film layer (10), (b) an electrical conductor structure (20) arranged on the carrier film layer (10) with connection contacts (21a, 21b) and (c) with the electrical conductor structure (20) electrically connected electronic component (30) with at least two contact points (31, 32), wherein the electronic component (30) is placed in a mounting area (40) on the electrical conductor structure (20) and wherein the at least two contact points (31, 32) of the electronic component (30) are each electrically connected to a connection contact (21a, 25a) of the electrical conductor structure (20), characterized in that the electrical conductor structure (20) in at least one of the boundary (41) of the assembly area (40) at least partially enclosing expansion area (44, 45) is guided in at least one line guideway which is longer than a hypothetical one Conductor track (47) which would run in a straight line between the point of entry of the line guide track into the at least one expansion area (44, 45) and its exit point from the at least one expansion area (44, 45), with at least one line guide track in the expansion area (44, 45) undulating, sawtooth-like, loop-like or along a meandering line and the electrical conductor run structure (20) is formed by an antenna conductor run in the form of at least one spiral turn (21, 22, 23, 24, 25), the at least one spiral turn ( 21, 22, 23, 24, 25) runs through between the at least two contact points (31, 32) of the electronic component (30).

Description

The present invention relates to a contactless data transmission device which has an electrically insulating carrier film layer, an electrical conductor track structure arranged on the carrier film layer and an electronic component electrically connected to the electrical conductor track structure, as well as a value and / or security document with at least two document layers connected to one another by lamination, wherein one of the layers is formed by the contactless data transmission device. A value and / or security document can be, for example, a smart card or an identification document. For example, the document can be an identity card, passport, access card, driver's license, vehicle registration document, vehicle registration document, company ID, ski pass or other authorization ID, a ticket in local public transport, a banknote, credit card, check card, cash card, admission ticket, identification card, visa or the like be. The document can be in the form of a card with a front and a back or it can be designed as a book-like document. It can essentially be made of paper or also of plastic. In the case of an identity card, for example, the front side bears the photo and the name of the holder. The back can contain further information, for example the address of the owner.

Contactless data transmission devices are used as transponder units for the execution of RFID (radio frequency identification) methods, for example in documents, in order to be able to read out data linked to the document automatically without contact.

According to the invention, an electronic component is understood to mean in particular semiconductor chips, in particular those which are suitable for storing and processing data. In particular, the electronic components include so-called RFID chips, which are suitable for contactless communication. RFID chips can comparatively simply contain just a serial number, for example, and transmit this contactlessly when activated, or they can be microprocessor chips with encryption, such as those used in electronic travel documents, for example.

An example of such a value or security document is in DE 10 2010 019 121 A1 specified. This document has an integrated circuit and an antenna connected to the integrated circuit. The antenna can be printed with a silver paste. The integrated circuit is connected to the antenna via connection contacts. The antenna is arranged in turns, the integrated circuit forming a bridge over the turns and being mounted on the antenna using flip-chip adhesive technology. The integrated circuit can be thinned.

the DE 10 2010 028 444 A1 describes a document with a chip and an antenna for the inductive coupling of energy, the antenna having an outer turn, at least one middle turn and an inner turn, the at least one middle turn being arranged between the outer and the inner turn, the at least one middle turn in a bridging area of the antenna bridges the chip, the inner and outer turns electrically contacting the chip, wherein the middle turns in the bridging area have a smaller wire cross-section than outside the bridging area, and the antenna is covered by a conductive silver paste or a conductive polymer is formed.

603 20 037 T2 describes a communication device with an RFID chip and a wave antenna. the US 2008/0283615 A1 and US 2009/0151150 A1 also describe the coupling of an antenna with a chip.

It is also off EP 0 706 152 A2 a contactless chip card described which has an antenna coil. The antenna coil is obtained by metallizing a base film and structuring the metallization. The connection points for the chip are printed with a conductive adhesive, preferably using screen printing technology, so that the chip can be mounted using flip-chip technology.

The structure of a document for the application of an RFID method, for example in electronic travel documents, given in these publications, however, leads to malfunctions and even failure of the RFID function during production and possibly also during subsequent use of the document. In this context, it has been shown that the contact transition between the integrated circuit and the antenna plays an important role, since the electrical contact in this area can easily be impaired or even destroyed.

The present invention is therefore based on the problem that the RFID function of documents produced in a conventional manner can already be faulty during the production process or fail during use. For this reason, it is an object of the present invention to provide a contactless data transmission device which does not have the errors mentioned and which, in particular, is error-free has a functioning RFID function and can be used with this over a long period of time under practical conditions without any problems.

This object is achieved by the contactless data transmission device according to claim 1 and the value and / or security document according to claim 8. Preferred embodiments of the invention are specified in the subclaims.

1. (a) eine elektrisch isolierende Trägerfolienlage,
2. (b) eine auf der Trägerfolienlage angeordnete elektrische Leiterzugstruktur mit Anschlusskontakten und
3. (c) ein mit der elektrischen Leiterzugstruktur elektrisch verbundenes elektronisches Bauelement mit mindestens zwei Kontaktstellen, wobei das elektronische Bauelement in einem Montagebereich auf der elektrischen Leiterzugstruktur platziert ist und wobei die mindestens zwei Kontaktstellen des elektronischen Bauelements mit jeweils einem Anschlusskontakt der elektrischen Leiterzugstruktur elektrisch verbunden sind.

According to a first aspect, the present invention accordingly relates to a contactless data transmission device. This has the following elements:

1. (a) an electrically insulating carrier film layer,
2. (b) an electrical conductor run structure with connection contacts and arranged on the carrier film layer
3. (c) an electronic component electrically connected to the electrical circuit structure with at least two contact points, the electronic component being placed in a mounting area on the electrical circuit structure and wherein the at least two contact points of the electronic component are each electrically connected to a connection contact of the electrical circuit structure.

In the manner according to the invention, the electrical conductor track structure is guided in at least one expansion area, which at least partially encloses the boundary of the assembly area, in at least one conductor track that is longer than a hypothetical conductor track that extends between the point of entry of the conductor track into the at least one expansion area and the point of exit of the conductor track from which at least one stretch area would run in a straight line.

In the present description and in the claims, the assembly area is preferably to be understood according to the invention as an area on the carrier film layer which is exactly identical to the area occupied by the component in the assembled state.

A data transmission device according to the invention can have more than one component. For example, one or more of the following components, which can be semiconductor circuit elements, for example, can be used: microprocessor, internal / external memory, means for contactless energy supply and communication, antenna, input components (e.g. manipulation of individual switches or touch-sensitive fields / touch sensors), fingerprint sensors, output components , e.g. display, loudspeaker, discrete components, e.g. capacitor, diode, resistor. The teaching according to the invention can be applied to the contacting of all components, but also to some or only a single component. The teaching according to the invention is particularly preferably used for components that have the greatest overall height, since they are most heavily loaded during lamination, and / or the largest components in terms of area, since the greatest forces can arise here due to their size, in particular due to tilting of the components .

The expansion area according to the invention can always be used where components are placed on the carrier and lines run under the components and are connected to the component.

In a further embodiment that is not claimed, the teaching described is also used when a line guideway is guided in the immediate vicinity, i.e. at a small distance, to a component. In this case, too, the steric loads during the lamination can stress the cable guideway. In particular, in the latter case, the conductor track can lead to a contact point of the electronic component and end there.

According to a second aspect, the present invention further relates to a value and / or security document which has at least two document layers connected to one another by lamination. One of these document layers is formed by the contactless data transmission device according to the invention.

The routing of the electrical conductor track structure in at least one expansion area, which at least partially encloses the boundary of the assembly area, in a line guideway that is longer than a hypothetical conductor path, which is straight between the point of entry of the line guideway into the at least one expansion area and the exit point of the line guideway from the at least one expansion area would run, means that the electrical conductor track structure in the at least one expansion area is not guided in a straight line but on a curved path. This curvature can be more or less pronounced. According to the invention, the electrical conductor run structure can run in winding paths or the electrical conductor run structure can be designed in a wave-like or sawtooth shape or the electrical conductor run structure can run in loop-like or meandering paths. In each of these cases, the electrical conductor track structure in the assembly area and in an adjacent surrounding area covers a path that is longer than a hypothetical conductor track that would run in a straight line there. The conductor track structure is preferably changed in a comparatively small area based on its overall length, for example the overall length of an antenna, so that its electrical properties do not or only slightly differ from the behavior of an antenna with a conventional conductor track. An impairment of the switching properties can thus be avoided.

This course of the electrical conductor structure in the at least one expansion area leads to the electrical conductor structure of an expansion or contraction (compression) of the material area of the carrier film layer in the document immediately surrounding the electrical conductor structure, for example an anisotropically conductive adhesive, with which the electronic component is attached the electrical conductor run structure is mounted, can yield by a corresponding deformation / displacement without it forming cracks or even interruptions. As a result, the scrap in the production of a document with an electrical circuit structure is significantly reduced. The electrical circuit structure thus to a certain extent forms an elastic element which can adapt to the deformations in the at least one expansion area without cracks or line interruptions forming in the electrical circuit structure.

This is because it has been found that a document into which the contactless data transmission device is integrated, for example by lamination, is sometimes deformed during practical use, so that mechanical stresses develop in the document. Mechanical stresses can also arise in the document during the production of the document, for example during lamination, since in this process the materials are heated to a relatively high temperature, in particular to a temperature above the glass transition temperature of the polymers used, and expand in the process and during the subsequent cooling process pull together again.

The mechanical stresses mentioned develop in particular in areas in which the document is inhomogeneous, in particular due to the integration of components of different material compositions, between which phase interfaces are formed. This is the case in particular in the embedding area of the electronic component. The electrical conductor structure itself also represents such an inhomogeneity in the laminate material surrounding it. These inhomogeneities lead, for example, to deformation of the document, but heating or cooling can also lead to mechanical stresses within the document, which in the worst case can lead to cracks or even to Can lead to interruptions in the electrical conductor structure. It has been found that, in particular, the areas immediately adjacent to the electronic component are subject to mechanical stresses, so that cracks or even interruptions can easily form in the electrical conductor track structure that runs in these areas, crosses them or runs in their vicinity.

For the reasons explained above, the at least one expansion area defining a non-rectilinear course of the electrical conductor run structure extends to a transition area between the mounting area for the electronic semiconductor circuit element and the adjoining area in the document. According to the invention, the extent of the at least one expansion area is defined on the area at least partially enclosing the boundaries of the assembly area. The at least one expansion area therefore extends, for example, to an area which exclusively covers the boundaries of the assembly area of the electronic semiconductor circuit element, but not also a central area below the component. This is because mechanical stresses occur in particular in the border area of the assembly area. This means that at least one requirement is that the electrical conductor run structure does not run in a straight line, at least in this transition area. According to the invention, however, this does not rule out the fact that the electrical conductor run structure also extends in a curved manner in the central region of the assembly region below the component. It is true that a central area under the component can be excluded from the expansion area, since if the document is deformed in this area, no or only slight mechanical stresses may develop. This is because it must be taken into account in particular that the at least one expansion area extends to the areas on the carrier film layer in which the electrical conductor structure runs at a short distance from the boundaries of the assembly area and, for example, is led into or out of the assembly area. This is because it is precisely in these transition areas that the greatest mechanical stresses arise during either thermal treatment or mechanical deformation of the document, which can lead to the aforementioned damage to the electrical circuit structure.

If the at least one expansion area does not extend to a central area below the electronic component, the conductor tracks in this central area are preferably also not curved but rather run in a straight line. This can be the case, for example, in embodiments that are not claimed when the conductor run structure only leads to contact points of the component, into which So the assembly area leads into it, but not completely through it.

It is of course advantageous that the at least one expansion area, and thus the area in which the electrical conductor structure is not routed in a straight line, extends over the entire assembly area of the electronic component and its surrounding area. In this area, the conductor track is guided in a curved manner, for example in a wavy or sawtooth shape, so that a deformation of the document leads to an exclusively elastic deformation of the electrical conductor run structure.

The conductor track of the electrical conductor run structure is to be understood as a track line along which a conductor run of the electrical conductor run structure runs, regardless of whether the width of the conductor run changes along the course of the track. This track therefore runs along an imaginary line that is formed by a longitudinal bisector of the conductor run. Even in the area of a conductor run in which its width changes, the longitudinal bisector runs centrally between the side edges of the conductor run.

The ability of the electrical conductor run structure achieved in this way to adapt to local deformations in the document is greater, the greater the local curvature of a conductor run of the electrical conductor run structure in the at least one expansion area. As a measure of the curvature, the proportion of conductor run sections to which an adjacent section of the same conductor run at an angle of less than ± 90 °, better still less than ± 60 °, more preferably less than ± 45 ° and most preferably less can serve than ± 30 °. In these cases there is an area of the conductor path in which it can optimally adapt to a deformation of the document by acting like a spring that is compressed or pulled apart. The mentioned angle of the adjacent sections of a conductor path to one another results between two tangents at one point in each of these sections. These tangents are preferably at the turning points of the respective track line.

It is further preferred that there is not only a first conductor run section with a first tangent at a turning point of the track line without there being an adjacent second conductor run section whose second tangent is at a turning point of the track line at an angle of less than ± 90 ° to the first Tangent of the first conductor run section runs. There are preferably at least two such sections. Even more preferably, there are three, four, five or even more such sections of a conductor run.

Due to the curved course of the electrical conductor structure in the at least one expansion area, the inductive and capacitive properties of an antenna structure formed therefrom change compared to a structure in which the electrical conductor structure runs in a straight line in these areas. However, this effect on the resonance frequency of the antenna structure is comparatively small, since this special line routing is only limited to a small area.

If more than one of the conductor tracks crosses the assembly area for the electronic component, they can run parallel to one another in the assembly area, regardless of whether the at least one expansion area covers the entire assembly area or only part of it.

Furthermore, the electrical conductor track structure is formed on the carrier film layer both in the area outside the assembly area for the electronic component and within the assembly area. This means that the conductors run on a single level. This level differs from the level or levels in which the conductor track structure (s) of the electronic component run / run.

According to the present invention, the electrical conductor run structure is formed by an antenna conductor run in the form of at least one spiral turn. The antenna conductor track is used in a transponder (in an RFID device) to inductively couple energy and for contactless communication. It has the at least one spiral turn, particularly preferably more than the one spiral turn, and can then run in the form of the spiral antenna turns, for example in an edge region of the carrier film layer on the carrier film layer. The antenna windings can, for example, run at a close distance from one another and in particular run parallel to one another. The antenna windings can accordingly form a strand which is formed by the antenna windings and which runs, for example, along the edges of the carrier film layer. Due to the parallel routing of the antenna windings in the strand in one plane, the antenna structure forms two ends, which also represent connection contacts for the electronic component. These ends can, for example, be located at the same height on each side of the string, specifically in the assembly area for the electronic component. The width of the antenna conductor tracks of the antenna structure is typically 500 μm to 2 mm. In principle, however, the width can also be smaller, for example 50 μm to 500 μm. The number of spiral turns, their respective width and their distance from one another and the area that is formed by the spiral turns determine together with further parameters, for example the electrical capacitance of the resonant circuit formed therewith, the resonance frequency of the electrical field that is coupled in.

According to the invention, the antenna conductor run of the at least one spiral turn runs between the at least two contact points of the electronic component. As a result, the component can easily be electrically connected to the connection contacts without the conductor runs of the conductor run structure having to be routed in intersecting paths.

In a further preferred development of the present invention, the continuous spiral turns of the strand of the antenna conductor run in the assembly area of the electronic component have a smaller cross section than outside the assembly area. This makes it possible on the one hand to guide the continuous spiral windings over the relatively small mounting surface of the component, while on the other hand the electrical resistance, which influences the quality of the antenna, does not increase too much. For this purpose, the width of the spiral turns in an area outside the assembly area can be greater than in the assembly area. Outside the assembly area, the width can be constant. Furthermore, i.e. in addition or as an alternative to this, the continuous spiral turns of the strand can have a smaller distance from one another in the assembly area than outside the assembly area, so that the component can bridge the strand even if the assembly area is relatively small.

In a further preferred development of the present invention, the spiral turns of the strand crossing the component, for example a chip, taper in a delta-shaped or funnel-shaped transition area towards the assembly area when the width of the spiral turns in the assembly area is smaller than outside. In this way, the mechanical strength of the spiral turns in the (critical) transition area between the areas of the antenna conductor run with a large line cross section and the areas of the antenna conductor run with a small line cross section is increased. Due to the gradual transition from the large to the small line cross-section, mechanical stress peaks are avoided. In this way, damage to the antenna conductor path during the production and use of the document can largely be avoided, and the yield and service life can thus be increased.

In a further preferred development of the present invention, the electronic component is preferably a semiconductor circuit element. In particular, the electronic component is an unpackaged semiconductor circuit element. This achieves a particularly compact arrangement in the document, so that it can have a particularly low overall height. Furthermore, a good integration of the integrated circuit into the document is thereby possible, so that it is an integral part of the document. Another advantage is the flexibility of the integrated circuit.

The electronic component can in particular be thinned. This is to be understood as an integrated circuit, for example. The electronic component can thereby have a thickness of at most 200 μm, preferably at most 100 μm, more preferably at most 80 μm and most preferably at most 60 μm. Furthermore, the electronic component has a thickness of at least 1 μm, preferably of at least 10 μm, more preferably of at least 15 μm, more preferably of at least 20 μm and most preferably of at least 25 μm. In particular if the unhoused component is thinned, a very low overall height can be achieved, so that the document produced with this component also conforms to standards, ie, for example, in accordance with ISO 7813 (Thickness of ID 1 cards of 0.76 mm) can be produced.

The electronic semiconductor circuit element can be a transponder chip, for example. The transponder chip can in particular have a processor designed for contactless data transmission and an electronic memory. The transponder chip is preferably used in the form of an unhoused semiconductor circuit element.

In a further preferred development of the present invention, the electronic component, which is preferably unhoused, is mounted on the electrical conductor structure using flip-chip technology, ie the electronic component is placed upside down with the contact points pointing downwards, mechanically fixed and electrically contacted. For the assembly of the electronic component, it is equipped with contact bumps, which represent its contact points for connection to connection contacts of the antenna conductor run. The contact bumps protrude beyond the connection side of the electronic component so that they can be placed on the connection contacts of the antenna conductor path. This achieves a very low overall height which enables the requirements for the integration of such an electronic component to be met in a value and / or security document in card form. The contact bumps are mostly made of copper, which is coated with a layer of nickel and another very thin layer of gold.

In a further preferred development of the present invention, the electronic component is mounted on the electrical circuit structure by means of an anisotropic conductive adhesive that fills the space under the component, i.e. is electrically and mechanically connected to it. An anisotropically conductive adhesive is to be understood as meaning an adhesive whose electrical conductivity has a preferred direction. The anisotropic conductive adhesive can be applied as a paste (Anisotropic Conductive Paste - ACP) or as a film (Anisotropic Conductive Film - ACF). For example, the anisotropically conductive adhesive can be designed in such a way that it contains approximately evenly spatially distributed electrically conductive particles. Applying pressure to the adhesive surface creates the anisotropy of electrical conductivity. For example, after the electrical circuit structure has been printed, the adhesive is applied to the carrier film layer, for example with a dispenser, a stamp or by means of screen printing. The contact points of the component can, for example, be electrically contacted by means of the ACF and / or by heating a solder through which the connection contacts of the conductor run structure are formed. In the latter case, a solder joint is created.

The electronic semiconductor circuit element is preferably formed by a transponder chip. The electrical conductor run structure is preferably formed by an antenna conductor run. The transponder chip and the antenna conductor run can in particular be arranged parallel to the front and back of the value and / or security document in which the contactless data transmission device is integrated. The antenna conductor run is arranged on the carrier film layer, and the transponder chip is mounted on the antenna conductor run.

In a further preferred development of the present invention, the electrical circuit structure is produced from a conductive paste or a conductive lacquer, for example by printing onto the carrier film layer. The conductive paste or the conductive lacquer contains at least one polymer as a binder and at least one metal and / or a conductive metal oxide and / or other conductive material in the polymer. Copper, silver, gold, iron, zinc, tin and / or carbon, in particular graphite, fullerenes, single-wall and / or multi-wall nanotubes or graphenes, come into consideration as the conductive material. ITO (indium tin oxide), IZO, ATO (antimony oxide) come into consideration as metal oxides. The metals / metal oxides can be in the form of flakes, needles, powder (in particular nanoscale), platelets or the like. In particular, these are present as aggregated particles. Another conductive material that can be used is conductive organic materials / polymers, e.g. polyaniline, PEDOT: PSS. A screen printing technique, for example a sheet-fed printing process or a roll-to-roll printing process, can be used to produce the conductor track structure with the conductive paste or the conductive lacquer. The thickness of the paste or lacquer printed on can be, after curing, in particular 1 μm to 100 μm and particularly preferably about 10 μm. For curing, the conductive paste or the conductive lacquer can either simply be dried or cured by means of heat and / or irradiation with electromagnetic radiation, for example UV radiation. The production of the electrical circuit structure with a conductive paste or a conductive lacquer is simple and therefore inexpensive. It is particularly advantageous if the conductive paste is a composition containing silver particles as an electrically conductive substance.

The printing processes of gravure printing, in particular intaglio printing, as well as gravure printing, planographic printing, in particular offset, letterpress printing, in particular letterset, through printing, in particular screen printing, flexographic printing or digital printing processes, in particular inkjet, can be used. Screen printing, gravure printing and flexographic printing are preferred, and screen printing is particularly preferred.

Furthermore, a compensating film layer can be provided in addition to the carrier film layer. The compensating film layer is arranged on the side of the carrier film layer on which the electronic semiconductor circuit element is also located. It has a recess for receiving the transponder chip, the size of which corresponds to the size of the semiconductor circuit element. The thickness of the compensation layer preferably corresponds approximately to the mounting height of the semiconductor circuit element. This creates a flat document surface in the finished laminate.

The carrier film layer and the other document layers of the document, including the compensating film layer, can be made of polymer materials selected from a group comprising polycarbonate (PC), in particular bisphenol A polycarbonate, polyethylene terephthalate (PET), their derivatives, such as glycol-modified PET (PETG), polyethylene naphthalate (PEN), polyvinyl chloride (PVC), polyvinyl butyral (PVB), polymethyl methacrylate (PMMA), polyimide (PI), polyvinyl alcohol (PVA), polystyrene (PS), polyvinyl phenol (PVP), polypropylene (PP), Polyethylene (PE), thermoplastic elastomers (TPE), in particular thermoplastic polyurethane (TPU), acrylonitrile-butadiene-styrene copolymer (ABS) and their derivatives, and / or paper. The carrier film layer and the other document layers of the document can be made of polymer materials that come from the same family of polymers or from different families. The polymer materials are preferably derived from the carrier film layer and the other Document layers of the document from the same family of polymers. The carrier film layer and the other document layers of the document preferably consist of PC or PC / TPU / PC. The polymers of the carrier film layer and the other document layers can be either unfilled or filled. In the latter case, they are preferably transparent or translucent. If the polymers are filled, they are opaque. The filler material can be, for example, a pigment or a filler material which has a particularly high or a particularly low dielectric constant. The individual document layers can contain different fillers so that they can be transparent, translucent or opaque and can be either colored or not colored in different ways.

To produce a document according to the invention, preferably a value and / or security document, in particular an RFID document, the contactless data transmission device consisting of a carrier film layer with an electrical conductor structure arranged thereon and the electronic component electrically connected to it, as well as other document layers, are brought together to form a document layer stack. For example, further document layers can be integrated into the document layer stack which contain additional security features, for example a photograph of the owner of the document and / or security printing elements and functional colors. The stack can also be closed on the outside by cover film layers (overlays). These cover film layers are preferably transparent and thereby allow the document layers underneath to be viewed. The overlays protect the document layers arranged below and / or offer the possibility of optical laser personalization and the generation of text and image information. In order to form a value and / or security document, the carrier film layer and the further document layers can, for example, have additional security features. Conventional devices which are also used for collating sheets in printing technology can be used for collating. The document layers can be stapled after they have been collated but before lamination, for example by local welding, for example point-like welding, in order to fix the document layers to one another.

The document layers of the stack are then laminated together. When laminating, the stack is laminated in a hot press, for example, at 190 ° C to 200 ° C and a pressure of 350 N / cm ² and in a cooling press at a pressure of 600 N / cm ² if the document layers are made of PC. After the laminate has been completed, the document can be equipped with further security features. In any case, the document layer stack is subjected to an elevated pressure and an elevated temperature. An elevated temperature and an elevated pressure are to be understood as meaning the respective parameters compared to room temperature and normal pressure. However, the temperature must be so high that at least a substantial part of the stack of document layers to be laminated begins to flow and the document layers connect to one another so that a monolithic bond of the document layers is formed. The pressure must also be so high that any air inclusions are safely expelled and the document layers are thus brought into intimate contact with one another.

The value and / or security document according to the invention can, for example, be an identity card, passport, access card, driver's license, vehicle registration document, vehicle registration document, company ID, ski pass, other authorization ID, a ticket in local public transport, a banknote, credit card, check card, cash card, admission ticket, Be an identification card, a visa or the like. The document can be in the form of a card with a front and a back or be designed as a book-like document, for example in ID 1, ID 2 or ID 3 format in accordance with ISO 7810. It can essentially be made of paper or plastic be. In the case of an identity card, for example, the front side bears the photo and the name of the holder. The back can contain further information, for example the address of the owner. In addition, the document can have further security features. The document can be designed as a transponder, in particular as a passive transponder, for example as an RFID security document.

• 1 zeigt eine erfindungsgemäße kontaktlose Datenübertragungseinrichtung mit einer Trägerfolienlage und mit einer darauf angeordneten elektrischen Leiterzugstruktur in Form eines spiralförmigen Antennen-Leiterzuges sowie mit einem ungehäusten Transponderchip in einer schematischen Draufsicht;
• 2 zeigt einen Ausschnitt einer Trägerfolienlage mit wellenförmig gekrümmten Spiralwindungen eines Antennen-Leiterzuges in einer Draufsicht in schematischer Darstellung in einer ersten Ausführungsform; (A) mit gleichbleibender Breite der Spiralwindungen; (B) mit einer Verjüngung der Spiralwindungen im Montagebereich;
• 3 zeigt einen Ausschnitt einer Trägerfolienlage mit wellenförmig gekrümmten Spiralwindungen eines Antennen-Leiterzuges in einer Draufsicht in schematischer Darstellung in einer zweiten Ausführungsform; (A) mit gleichbleibender Breite der Spiralwindungen; (B) mit einer Verjüngung der Spiralwindungen im Montagebereich;
• 4 zeigt einen Ausschnitt einer Spiralwindung eines Antennen-Leiterzuges in einer schematischen Darstellung; (A) mit gleichbleibender Breite des Antennen-Leiterzuges; (B) mit einer Verjüngung des Antennen-Leiterzuges im Montagebereich;
• 5 zeigt mehrere alternative Ausführungsformen von unterschiedlichen gekrümmten Leiterzügen in schematischen Darstellungen;
• 6 zeigt einen Dokumentenstapel vor dem Laminieren in einer schematischen Querschnittsdarstellung.

The figures described below serve to explain the invention in more detail.

• 1 shows a contactless data transmission device according to the invention with a carrier film layer and with an electrical conductor run structure arranged thereon in the form of a spiral antenna conductor run and with an unhoused transponder chip in a schematic plan view;
• 2 shows a section of a carrier film layer with wave-shaped curved Spiral turns of an antenna conductor run in a plan view in a schematic representation in a first embodiment; (A) with constant width of the spiral turns; (B) with a taper of the spiral turns in the mounting area;
• 3 shows a section of a carrier film layer with wave-shaped curved spiral turns of an antenna conductor path in a plan view in a schematic representation in a second embodiment; (A) with constant width of the spiral turns; (B) with a taper of the spiral turns in the mounting area;
• 4th shows a section of a spiral turn of an antenna conductor path in a schematic representation; (A) with the same width of the antenna conductor path; (B) with a taper of the antenna conductor path in the mounting area;
• 5 shows several alternative embodiments of different curved conductor tracks in schematic representations;
• 6th shows a stack of documents before lamination in a schematic cross-sectional illustration.

In the figures explained below, the same reference numerals designate the same elements and elements with the same function.

In the 1 illustrated contactless data transmission device 50 has a carrier film layer 10 on. The carrier film layer 10 For example, it can be made of PC and filled with a white pigment so that it is white, opaque. Their thickness is, for example, 100 μm.

On the carrier film layer 10 is an electrical circuit structure 20th in the form of an antenna conductor track, which is formed by a spiral antenna conductor track, applied. The spiral antenna track 20th has three spiral turns 21 , 22nd , 23 on, the spiral in the edge area of the carrier film layer 10 and parallel to their edges 11 , 12th , 13th , 14th and run parallel to each other. The width of the antenna track 20th can for example be about 400 µm, the distance between adjacent turns 21 , 22nd , 23 for example 300 microns and their thickness for example about 20 microns. The antenna circuit 20th is formed from a conductive silver paste by screen printing, but can of course also be produced in other ways, for example by metallizing the entire surface and subsequent structuring, in particular etching.

A transponder chip 30th is on the carrier film layer 10 assembled. The chip 30th is mounted using flip-chip technology, ie contact points on the chip in the form of contact bumps are pointing downwards at the ends of the antenna conductor path 20th put on, glued on and contacted there ( 6th ). This bridges the chip 30th the one through the antenna track 20th formed strand of spiral and parallel turns 21 , 22nd , 23 . For example, an anisotropic conductive adhesive can be used for chip mounting, which closes the space between the contact bumps between the chip 30th and the top of the carrier film layer 10 fills in and glued the chip to the carrier film layer. At the same time, this conductive adhesive provides electrical contact between the contact bumps on the chip 30th and the ends of the antenna conductor run 20th . The transponder chip 30th has, inter alia, a processor suitable for contactless data transmission and an electronic memory.

In the 2 (A, B) and 3 (A, B) are two embodiments of an antenna track 20th with five spiral turns 21 , 22nd , 23 , 24 , 25th excerpts in the assembly area 40 of the transponder chip, which is mounted in the assembly area, and shown in its surroundings.

The transponder chip 30th has, for example, two contact points in the form of contact bumps ( 6th ). The assembly area 40 on the carrier film layer 10 for the transponder chip 30th is the same size as the chip in this case. Five spiral turns 21 , 22nd , 23 , 24 , 25th are in one strand in the illustration from above to the assembly area 40 introduced. The end 21 ' a first spiral turn 21 ends in the assembly area 40 of the chip 30th . The connection contact 21a the first spiral turn 21 is with a corresponding contact point in the form of a contact bump of the chip 30th tied together. This is where the chip is 30th upside down with the contact bumps down onto this connection contact 21a as well as another connection contact 25a at the end 25 ' the fifth spiral turn 25th pressed on and by means of an anisotropic conductive adhesive 70 electrically connected there ( 6th ). Four spiral turns 21 , 22nd , 23 , 24 cross the assembly area 40 of the chip 30th and leave this in the representation downwards again. The end 25 ' the fifth spiral turn 25th ends in their connection contact 25a also in the assembly area 40 of the chip 30th is also connected there to a corresponding contact point in the form of a contact bump on the chip.

2A and 3A show each Spiral turns 21 , 22nd , 23 , 24 , 25th in the same width inside and outside the assembly area 40 . 2 B and 3B alternatively show that the spiral turns 22nd , 23 , 24 , 25th within the assembly area 40 have a smaller width than outside. The spiral turns 21 , 22nd , 23 , 24 , 25th taper from an area outside the assembly area 40 steadily into the assembly area, so that a mechanically stable structure of the antenna conductor run 20th is also achieved in this transition area.

In the variant of 2 B , 3B have the four continuous spiral turns 21 , 22nd , 23 , 24 of the antenna conductor run 20th in an area outside the assembly area 40 of the chip 30th a larger width than in the mounting area of the chip, so that the quality of the antenna conductor run 20th formed antenna is sufficiently good and also the width of the spiral turns in the mounting area is sufficiently small to ensure that all four spiral turns 21 , 22nd , 23 , 24 between the contact points of the chip 30th or the connection contacts 21a , 25a of the outer spiral turns 21 , 25th can be passed through. Therefore, the spiral turns taper 21 , 22nd , 23 , 24 in this variant in transitional areas 26th , 27 before the coils enter the assembly area 40 or expand again after leaving the assembly area.

The spiral turns 21 , 22nd , 23 , 24 form in the area and in the assembly area 40 ( 2 ) or in the surrounding area and sometimes also in the assembly area 40 ( 3 ) wave-shaped profiles which, in the definition according to the invention, in at least one of the limits 41 of the assembly area 40 at least partially enclosing expansion area 44 , 45 are each guided in a conductor track that is longer than one between the entry point of the antenna conductor path 20th in the at least one expansion area 44 , 45 and the exit point from the at least one expansion area (hypothetical) line guideway running in a straight line 47 . The stretch area 44 in the first embodiment of 2 not only closes the area around the assembly area 40 and its limit 41 but also the assembly area itself almost completely. In the second embodiment of 3 close two expansion areas 44 , 45 only partially the limit 41 of the assembly area 40 and only a small section of the assembly area.

The expansion areas 44 , 45 define surface sections on the carrier film layer 10 in which the spiral turns 21 , 22nd , 23 , 24 do not run in a straight line but are curved. This curved course leads to the cable guideway of the respective spiral turn 21 , 22nd , 23 , 24 is longer than one between the entry point of the respective spiral turn 21 , 22nd , 23 , 24 in the respective expansion range 44 , 45 and the exit point from the expansion area 44 , 45 rectilinear fictitious conductor path 47 . These straight hypothetical conductors 47 are in 2 , 3 only indicated by dashed lines.

The curved line routing in particular causes expansion and compression of the material in the area of the interfaces between the chip 30th , the anisotropic conductive adhesive 70 , which fills the space under the chip, and the carrier film layer 10 balanced ( 6th ). Because the spiral turns 21 , 22nd , 23 , 24 , 25th are able to adapt to such deformations due to their curved line routing by means of slight shifts. A curved line routing in the border area of the assembly area is particularly important for this 40 to its surroundings, because increased mechanical stress is to be expected at these points.

• Erfindungsgemäß ist als Leitungsführungsbahn der elektrischen Leiterzugstruktur 20 eine Spurlinie 60 zu verstehen, entlang der ein Leiterzug 21 der elektrischen Leiterzugstruktur 20 verläuft, unabhängig davon, ob sich die Breite des Leiterzuges 21 entlang des Verlaufes der Spurlinie 60 ändert. In dem in 4B dargestellten Beispiel ändert sich die Breite des Leiterzuges 21 in seinem Verlauf in der Darstellung von oben nach unten, während sich dessen Breite in 4A nicht ändert. In der Ausführungsvariante von 4B verläuft die Spurlinie 60 entlang einer gedachten Linie, die durch eine längs Halbierende des Leiterzuges 21 gebildet ist. In beiden Bereichen, sowohl im oberen Bereich des Leiterzuges 21, in dem er eine größere Breite d₁ als unten (d₂) hat, als auch im unteren Bereich, verläuft die Spurlinie 60 mittig zwischen den Seitenrändern 21b, 21c des Leiterzuges 21. Durch die Verjüngung des Leiterzuges 21 in dem Übergangsbereich 26 verschwenkt diese Spurlinie 60 ein wenig nach rechts, um weiterhin entlang einer längs Halbierenden zwischen den Seitenrändern 21b, 21c zu verlaufen. In dem weiteren Verlauf des Leiterzuges 21 ist dieser in dem Dehnungsbereich 44, der die Grenze 41 des Montagebereiches 40 für den Chip 30 einschließt, nun erfindungsgemäß verkrümmt, da er innerhalb des Dehnungsbereiches 44 verläuft. Die Spurlinie 60 verläuft auch in diesem Bereich als längs Halbierende zwischen den Seitenrändern 21b, 21c des Leiterzuges 21. Entsprechendes gilt auch für die Ausführungsvariante von 4A.

In 4th is to further explain the invention, the curved line routing of the electrical conductor run structure 20th Excerpts shown in detail, again two possible design variants with a constant width of the conductor track 21 ( 4A) and with a reduction in the width of the conductor run 21 in the assembly area 40 ( 4B) shown are:

• According to the invention, the electrical conductor run structure is used as the conductor track 20th a track line 60 to understand along a ladder line 21 the electrical circuit structure 20th runs, regardless of whether the width of the ladder line 21 along the course of the track line 60 changes. In the in 4B The example shown changes the width of the conductor path 21 in its course in the representation from top to bottom, while its width is in 4A does not change. In the variant of 4B the track line runs 60 along an imaginary line through a longitudinal bisector of the conductor run 21 is formed. In both areas, both in the upper area of the ladder line 21 , in which it has a greater width d ₁ than below (d ₂ ), as well as in the lower area, the track line runs 60 in the middle between the margins 21b , 21c of the ladder line 21 . By tapering the ladder line 21 in the transition area 26th swings this track line 60 a little to the right to continue along a bisecting line between the side edges 21b , 21c to run away. In the further course of the ladder 21 is this in the stretching area 44 who is the limit 41 of the assembly area 40 for the chip 30th includes, now curved according to the invention, since it is within the expansion range 44 runs. The track line 60 runs in this area as a longitudinal bisector between the side edges 21b , 21c of the ladder line 21 . The same applies to the variant of 4A .

To achieve the best possible adaptation of the ladder line 21 to achieve possible deformations in the document, the greatest possible curvature of the conductor path 21 chosen. This also leads to a corresponding curvature of the track line 60 . As a measure of the local curvature of the conductor run 21 and thus the track line 60 can be the proportion of ladder sections 21d , 21e , 21f serve to which an adjacent section of the same conductor run 21 runs at an angle α of less than, for example, ± 90 °. In the present case there are three mutually adjacent sections 21d , 21e , 21f of the ladder line 21 shown in which the corresponding track line 60 in each adjacent sections has such a small angle α between two tangents in each case a point of inflection of these sections.

The curvature of the spiral turns 21 can be achieved by different types of conductors in an expansion area 44 , 45 be evoked. In 5 are several alternative variants of different shapes of curved conductor tracks 21 shown. 5 (a) shows a wave-shaped conductor run 21 , 5 (b) a sawtooth-shaped conductor run 21 , 5 (c) a loop-like ladder run 21 and 5 (d) a conductor run in the form of a meander 21 .

In 6th is after all the structure of a document 100 , for example a value and / or security document, in the form of a card with ID 1 format in a schematic cross-sectional view.

The document 100 contains a core film layer 10 with an antenna conductor track formed on it 20th as well as a transponder chip mounted on it 30th who share a contactless data transmission device 50 form, as well as a leveling film layer 80 . The transponder chip 30th is with contact points 31 , 32 equipped in the form of contact bumps. The contact bumps 31 , 32 are in this assembly technique known as flip-chip technology, pointing downwards onto the connection surfaces 21a , 25a ( 2 , 3 ) and fixed there so that an electrical contact is made. So that the chip 30th on the antenna track 20th remains fixed and a good electrical contact is made, the space between the contact side of the chip becomes 30th and the top of the carrier film layer 10 filling anisotropic conductive adhesive 70 used.

The leveling film layer 80 has an opening 81 on into which the chip 30th protrudes. The carrier film layer 10 and the leveling film layer 80 are also with a cover film layer 90 gathered that made the breakthrough 81 and the chip 30th closes at the top. This cover film layer 90 can like the carrier film layer 10 and the leveling film layer 80 made of PC and is preferably opaque to the chip 30th visually shield from the outside. Furthermore, the stack is outwardly covered by outer layers of film (overlays) 95 , 96 completed, which can also be made from PC and, for example, be transparent. This stack is laminated to form a monolithic document body.

Claims (8)

Contactless data transmission device (50) which has: (a) an electrically insulating carrier film layer (10), (b) an electrical conductor structure (20) arranged on the carrier film layer (10) with connection contacts (21a, 21b) and (c) with the electrical conductor structure (20) electrically connected electronic component (30) with at least two contact points (31, 32), wherein the electronic component (30) is placed in a mounting area (40) on the electrical conductor structure (20) and wherein the at least two contact points (31, 32) of the electronic component (30) are each electrically connected to a connection contact (21a, 25a) of the electrical conductor structure (20), characterized in that the electrical conductor structure (20) in at least one of the boundary (41) of the assembly area (40) at least partially enclosing expansion area (44, 45) is guided in at least one line guideway which is longer than a hypothetical one cal conductor track (47) which would run in a straight line between the point of entry of the line guide track into the at least one expansion area (44, 45) and its exit point from the at least one expansion area (44, 45), with at least one line guide track in the expansion area (44, 45) ) runs in a wave-shaped, sawtooth-like, loop-like manner or along a meandering line and the electrical conductor run structure (20) is formed by an antenna conductor run in the form of at least one spiral turn (21, 22, 23, 24, 25), the at least one spiral turn (21, 22, 23, 24, 25) runs through between the at least two contact points (31, 32) of the electronic component (30). Contactless data transmission device (50) according to Claim 1 , characterized in that the at least one spiral turn (21, 22, 23, 24, 25) in the assembly area (40) has a smaller width than in an area outside the assembly area (40). Contactless data transmission device (50) according to one of the preceding claims, characterized in that the electronic component (30) is formed by an unhoused semiconductor chip. Contactless data transmission device (50) according to one of the preceding claims, characterized in that the electronic component (30) is a transponder chip. Contactless data transmission device (50) according to one of the preceding claims, characterized in that the electronic Component (30) is mounted on the electrical circuit structure (20) using flip-chip technology. Contactless data transmission device (50) according to one of the preceding claims, characterized in that the electronic component (30) is mounted on the electrical circuit structure (20) by means of an anisotropic conductive adhesive (70) filling the space under the electronic component (30). Contactless data transmission device (50) according to one of the preceding claims, characterized in that the electrical circuit structure (20) is made from a conductive paste or a conductive lacquer. Value and / or security document (100), comprising at least two document layers (10, 80, 90, 95, 96) connected to one another by lamination, one of the document layers (10, 80, 90, 95, 96) being transmitted by a contactless data transmission device ( 50) according to one of the Claims 1 until 7th is formed.

Images