DE102010019121A1 - Shielding an integrated circuit in a value or security document - Google Patents

Abstract

The subject matter of the invention is a value or security document 10 with an antenna 14 connected to an integrated circuit, the value or security document 10 having a screen 18 of the integrated circuit 12, which protects the integrated circuit 12 against attacks with electromagnetic radiation in each case a layer containing soft magnetic ferrites and covering the integrated circuit on both sides and / or formed by a Faraday cage.

Description

Field of the invention

The invention relates to a value or security document with an integrated circuit and an antenna connected to the integrated circuit.

State of the art

Value and security documents are increasingly being safeguarded by the integration of electronic components. The use of RFID (radio-frequency identification, radio-based identification), in particular in electronic travel documents, has gained particular significance. In particular, ICs are used here according to ISO 14443A / B which are used in machine-readable travel documents in accordance with ICAO 9303 MRTD. For this purpose, an integrated circuit (IC) is integrated with an antenna in the value or security document. Typically, the ICs are embedded in a so-called module. This has on the one hand a mostly metallic framework for stability. In this context, the IC is embedded by means of a potting compound. On the other hand, this potting compound also provides protection against attacks by means of electromagnetic radiation, in particular visible light, via the mechanical protection. The disadvantage of these modules is the great height and the rigidity. A module is a foreign object in a document. Loads, such as bending loads, can destroy the document at the point where the module is embedded.

For this reason, silicon-based thinned ICs have recently been used. For this purpose, the silicon carrier of the IC is thinned so far that the IC has a thickness of only 1 to 80 microns. This makes the IC flexible and can be easily integrated into a document without breaking the IC. The disadvantage, however, is that the IC is thus not shielded from the environment. This may affect the operation of the IC. By irradiation with electromagnetic radiation, in particular with a wavelength of less than 1100 nm, free charge carriers can be generated in the silicon of the integrated circuit. This leads to a malfunction and can be used if necessary for a targeted attack on the IC. It is also known that electromagnetic radiation, for example microwave radiation, which has a wavelength between 1 m and 1 mm, can irreversibly damage an IC.

From the DE 10 2004 056 829 A1 is the integration of a uncaged IC element in a carrier known. It is further disclosed that a substrate with pads is compressed by selective application of pressure in the region of the IC element to be used, whereby the conductivity of the printed coils is increased.

From the EP 0 706 152 A2 For example, a chip card and a method of manufacturing the same are known. The contacting of the chip takes place by means of flip-chip technology.

From the DE 10 2006 059 454 A1 is a document with an integrated contactless readable chip is known, which contains a chip film. The chip has a thickness of at most 50 μm. It is attached via covalent bonds to the polymer matrix of the carrier film, so that the chip is an integral part of the document. It is also known that the chip can in principle be protected against light by an additional protective layer. This can be realized in the form of, for example, a metallization.

Problem of the prior art and object of the invention

In prior art documents, it is not possible to flexibly integrate an integrated circuit into a value or security document while optimally protecting the integrated circuit against attacks.

It is therefore an object to provide a value or security document, which has a flexible and protected against attacks with electromagnetic radiation in the broadest possible frequency range integrated circuit.

Description of the invention and preferred embodiments

The object is achieved by an article according to claim 1. Preferred embodiments are described in the subclaims.

The value or security document according to the invention has a front and a back. For example, the value or security document may be an identity card. The front then carries, for example, the passport photo and the name of the owner. The reverse side may contain further information, for example the address. However, it is not essential to the invention, which side is defined as the front and which as the back. Furthermore, the value or security document has an integrated circuit and an antenna. The integrated circuit is connected to the antenna. The integrated circuit is typically parallel to the front and back of the value or Security document arranged. To protect the integrated circuit from attack, the document includes a shield for the integrated circuit. The shielding of the integrated circuit according to the invention is formed by a Faraday cage or by a respective soft magnetic ferrite containing and the integrated circuit on both sides covering layer or a combination of these two shields.

Electromagnetic radiation can be shielded by the interaction of the electrical and / or magnetic field with a shield. Due to the electrical conductivity of the Faraday cage, on the one hand, an electric field is changed in such a way that a field-free space arises in the interior or that the electric field in the interior is at least greatly attenuated. This type of shielding is very efficient for low frequencies, especially for microwaves, radio waves and electrical discharges.

Electromagnetic radiation, on the other hand, can be shielded by the interaction of the magnetic field with a shield. By a shield of soft magnetic ferritic containing and the integrated circuit on both sides covering layers, the integrated circuit is in an area in which the magnetic field is strongly attenuated. Soft magnetic ferrites are characterized by a very low coercive field strength. This means that they shield a magnetic field very well, but do not cause much attenuation for the resonant circuit formed by the antenna and the integrated circuit. In order to enable absorption and emission of electromagnetic radiation via the antenna, it is also necessary to keep the spatial limit of the shield as small as possible, so that the antenna is disturbed as little as possible.

In addition, metallic structures have reflective properties in the range of visible light, which are known as metallic luster. In contrast, ferrites have a strong absorption in the visible spectral range. Thus, the shield is also effective in the visible spectral range.

The magnetically soft ferrite-containing and the integrated circuit on both sides covering layers and / or the Faraday cage can be produced by printing technology. Particularly preferably, the printing takes place by means of screen printing. In order to perform the shield particularly effective, several shields may be present. For example, several shields can be applied by printing technology to opposite sides of a film.

The advantage of this embodiment is, on the one hand, the double layer thickness of the printed layer achieved in one printing pass, and thus a particularly effective shielding. On the other hand, this can produce a structure which generates interference effects with respect to certain frequencies of the electromagnetic spectrum, which effects can be adjusted via the thickness of the film.

Further, the shield may be incorporated in the form of a film in the security or value document. The foil may for example consist of an electrically conductive or a soft magnetic material. As soft-magnetic ferrites, in particular iron oxides doped with manganese, nickel and / or zinc can be used, which are embedded in a polymer matrix of the film.

In a preferred embodiment of the invention, the shield of the integrated circuit contains soft magnetic ferrites, the ferrites being iron oxides doped with manganese, nickel and / or zinc. The soft magnetic ferrites are preferably applied by printing on a film that forms the value or security document together with other films. Suitable printing methods are high-speed, flat, gravure and through-printing methods, in particular screen printing and dispensing.

In a further preferred embodiment of the invention, the shield of the integrated circuit is formed by a Faraday cage, wherein each constituent element of which the Faraday cage is formed preferably has a sheet resistivity of 10 ^-2 to 10 ⁸ ohms / square, more preferably of 10 ^-2 to 10 ⁶ ohms / square, most preferably from 10 ^-1 to 3 x 10 ^-1 ohms / square. Essential for the Faraday cage is that the components of the Faraday cage, that is, for example, a cage component arranged above the integrated circuit and a cage component arranged below the integrated circuit, are electrically conductively connected to one another. For example, the Faraday cage may be formed by an electrically conductive fabric that covers the integrated circuit from above and below (upper and lower cage components), the two covers being electrically connected together. In another embodiment, the Faraday cage may consist of two substantially plane-parallel planes, for example of printed layers, which have at least one electrical contact with each other. The electrical contact can be generated, for example, via at least one plated-through hole. If the sheet resistivity of the individual cage components is greater than 10 ⁸ ohms / square, the shielding against electric fields is very limited low. If the sheet resistivity is less than 10 ^-2 ohms / square, the currents flowing in the antenna induce excessive eddy currents in the shield, so that the antenna can not provide enough power to the IC. For example, with a sheet resistance of 0.1 to 0.3 ohms / square at a frequency for an RFID application of 13.56 MHz, the attenuation is in a range of 87 to 117 dB.

In another preferred embodiment of the invention, the Faraday cage is formed by at least one material selected from the group consisting of carbon black, graphite, single and multi-walled carbon nanotubes (SWCNT, and multiwalled carbon nanotubes, MWCNT), fullerenes, nickel , Copper and silver formed.

The Faraday cage may be formed by an electrically conductive fabric in an alternative embodiment. As electrically conductive fabrics can be used, which are woven from metal wires or which consist of electrically conductive polymers, in particular polyaniline.

When designing the shield, it should be noted that electromagnetic radiation having a wavelength which is smaller than that of openings or holes in the shield, not or not completely shielded. Since the shield can not be closed at least in the area of the tracks of the antenna, complete shielding against very high frequency electromagnetic radiation can not be achieved. However, a shield against microwave radiation, which has wavelengths in the cm range, is very efficiently possible with a shield having openings in the range up to 1 mm.

In a further preferred embodiment, the at least one first area (above the integrated circuit) and the at least one second area (below the integrated circuit) each have at least two current collecting bars. The current collecting bars are in electrical contact with the electromagnetic shielding of the Faraday cage in the first region and the second region, respectively, thereby electrically contacting the electromagnetic shielding regions. For this purpose, the current collecting bars preferably directly adjoin at least one side of the respective fields of the electromagnetic shielding regions at. The current collection bars reduce the electrical conductivity of the entire shield, but only a small amount of highly conductive material must be used for the current collection bars. The current collecting bars of the at least one first and the at least one second area are electrically connected to one another by at least one through-connection. Preferably, the current collecting beams arranged on the one hand above and on the other hand below the integrated circuit are at least selectively connected to one another at four points. The advantage of this embodiment is that the shield in the at least one first region and the shield in the at least one second region have a relatively high resistance, for example 10 ⁶ to 10 ⁸ ohms / square, and thus can be formed, for example, from a conductive polymer , On the other hand, the current collecting bars have a low resistance, for example 0.01 to 10 ohms, and can be formed in particular from copper or silver for this purpose. Particularly preferably, the at least one first and the at least one second region are each completely enclosed by a current collecting bar. A particular advantage of this embodiment is the combination of the good electrical conductivity of the materials of the current collecting bars, which, however, are often difficult to combine with the material of the document, and the good integration ability, for example, of a conductive polymer, which, however, has a low conductivity.

Preferably, the security or security document has the ID1 format (85.60 mm × 53.98 mm), the ID2 format (105 mm × 74 mm) or the ID3 format (125 mm × 88 mm). The value or security document may differ from these standard formats, especially in terms of strength. In particular, the thickness may be less than 0.8 mm, preferably less than 0.6 mm, more preferably less than 0.5 mm and particularly preferably less than 0.4 mm.

The integrated circuit is preferably a thinned integrated circuit. A thinned integrated circuit is understood to mean an integrated circuit having a thickness of at most 200 μm, preferably of at most 100 μm, more preferably of at most 80 μm, and most preferably of not more than 60 μm. Furthermore, the integrated circuit has a thickness of at least 1 μm, preferably at least 10 μm, more preferably at least 15 μm, more preferably at least 20 μm, and most preferably at least 25 μm.

In a further preferred embodiment of the invention, the integrated circuit is unhoused incorporated in the value or security document. As a result, a particularly compact arrangement in the laminate of the value or security document is achieved, so that the value or security document can have a particularly low overall height. Furthermore, this is a good Integration of the integrated circuit into the document possible, so that it is an integral part of the document.

Furthermore, the integrated circuit is incorporated in a preferred embodiment of the invention by flip-chip adhesive technology in the value or security document and connected to the antenna. For example, the integrated circuit is electrically and mechanically connected to the antenna via an anisotropically conductive adhesive.

In a further preferred embodiment of the invention, the antenna is generated by printing technology. The thickness of the antenna in the value or security document (after drying and lamination) is preferably at most 20 μm, particularly preferably at most 17 μm. The thickness of the antenna is preferably at least 7 μm, more preferably at least 10 μm. The resistance of the antenna is preferably 3 to 10 ohms. The antenna preferably has 2 to 10 turns, particularly preferably 3 to 6 turns, and is preferably formed from conductor tracks. The conductivity and stress crack sensitivity can be optimized by the addition of carbon nanotubes (CNT), in particular multi-walled carbon nanotubes (MWCNT).

The security document may be made of polycarbonate (PC), in particular, bisphenol A polycarbonate, polyethylene terephthalate (PET), derivatives thereof, such as glycol modified PET (PETG), polyethylene naphthalate (PEN), polyvinyl chloride (PVC), polyvinyl butyral (PVB), Polymethyl methacrylate (PMMA), polyimide (PI), polyvinyl alcohol (PVA), polystyrene (PS), polyvinylphenol (PVP), polypropylene (PP), polyethylene (PE), thermoplastic elastomers (TPE), in particular thermoplastic polyurethane (TPU), acrylonitrile Butadiene-styrene (ABS), Teslin ^® and paper and their derivatives exist. Furthermore, the document may also consist of a combination of several of these materials. The value or security document preferably consists of PC or PC / TPU / PC. The value or security document is preferably produced from 3 to 12, particularly preferably 4 to 10, films.

The value or security document can be made of these materials by means of lamination, for example. Typically, the lamination of PC in a hot press at 190 ° C to 200 ° C and a pressure of 350 N / cm ² and in a cooling press at a pressure of 600 N / cm ² .

In a further preferred embodiment of the invention, the antenna has at least two connection contacts. The integrated circuit is connected to the antenna via the terminals. The antenna has two or more turns, wherein the turns of the antenna preferably extend between the connection contacts. The integrated circuit forms a bridge between the terminals and over the turns of the antenna as they pass between the terminals. The latter means that the integrated circuit is located above the antenna.

In a further preferred embodiment of the invention, the antenna has first conductor track sections in the area of the connection contacts and second track track sections outside this area. The first conductor track sections preferably have at most half the width of the second conductor track sections. The first conductor track sections in the region of the connection contacts preferably have a conductivity which is improved by at least the factor of 2 compared to the second conductor track sections outside the region of the connection contacts.

The increased conductivity of the first printed conductor sections in the region of the connecting contacts can be achieved, for example, by local action of pressure and heat during the production of the security document. The local action of pressure and heat is in this case only in the area of the integrated circuit and preferably before the integrated circuit is applied to the antenna. As a result, the conductivity of the thinner in the region of the integrated circuit first conductor track sections is increased. This is particularly advantageous because the resistance of the thinner first trace portions is higher due to the geometry than that of the wider second trace portions of the antenna. As a result, the quality of the antenna can be optimized. Although all trace sections could be adjusted by the application of pressure and heat to an optimum conductivity, but this would be the entire substrate on which the antenna is applied, thermally stressed. This would reduce the life of the value or security document. On the other hand, by such a treatment, the surface of the substrate would be changed in such a way that it becomes more difficult to lamination with further layers, which would cause a further deterioration of the finished value or security document.

The width of the second conductor track sections outside the area of the connection contacts is typically 0.5 to 2 mm and the width of the first conductor track sections in the area of the connection contacts is 0.1 to 0.5 mm.

In a further preferred embodiment of the invention, a depression is produced in the region of the connection contacts. This recess is suitable for receiving the integrated circuit. This significantly reduces the risk of damage to the integrated circuit during lamination of the value or security document. Normally, the integrated circuit rests on the first trace sections of the antenna and thus forms the highest point. Therefore, at the beginning of the lamination, prior to softening of the plastic substrates, the pressure will fall mainly through the integrated circuit, so that it will be subjected to the highest pressure as the most sensitive component. This is avoided when the integrated circuit is received in a recess, since the integrated circuit is then not the highest point and thus the pressure drops evenly across the document.

Preferably, the recess is created by local action of pressure and heat during the manufacture of the value or security document. This is advantageous because at the same time the conductivity of the conductor tracks in the region of the terminal contacts is increased.

To explain the invention, embodiments are described below with reference to the accompanying figures. The individual figures show:

1 : a value or security document in the form of a card with an integrated circuit and a four-turn antenna in a schematic plan view;

2 FIG. 4 is a schematic plan view of an integrated circuit and a seven-turn antenna; FIG.

3 an integrated circuit and a six-turn antenna and a shield in cross-section;

4 FIG. 4 shows an integrated circuit and a six-turn antenna and a shield of an alternative embodiment in cross-section; FIG.

5 an integrated circuit, a three-turn antenna and a shielding element a) in a schematic plan view and b) in cross-section;

6 FIG. 2 shows an integrated circuit and a shielding element in the form of a Faraday cage with current collecting bars in a schematic, perspective view.

Identical objects are referred to below with the same reference numerals.

In 1 is a value or security document 10 shown in map form in a schematic plan view. The document is a card in ID1 format as per ISO 7810 with a format of 85.60 mm × 53.98 mm and a thickness of 0.76 mm, taking into account the usual tolerances. The document 10 has an integrated circuit 12 on which one with an antenna 14 via connection contacts 16 connected is. The turns of the antenna 14 run between the terminals 16 , This results in first conductor track sections 13 in the area of the connection contacts and second conductor track sections 15 outside this area. The integrated circuit 12 forms a bridge between the connection contacts 16 and extends for this purpose over the first conductor track sections 13 , The integrated circuit 12 is using flip-chip technology with the connection contacts 16 connected, in particular with an anisotropically conductive adhesive. The integrated circuit 12 and the antenna 14 are designed such that it is an RFID element according to ISO 14443 which has a resonant frequency of 13.56 MHz. The number of turns of the antenna 14 is 4. The antenna 14 was produced by screen printing with the silver paste type 5029, DuPont, Wilmington, Delaware, USA with a line thickness of 25 microns. In the area of the integrated circuit there is a shield 18 , This shielding 18 is formed in a first region and in a second region, wherein the first region above and the second region below the integrated circuit 12 are located.

In 2 is the scope of a value or security document 10 shown in schematic plan view, in which the integrated circuit 12 located. The integrated circuit is via the connection contacts 16 with the antenna 14 connected. The antenna 14 has in the example shown 7 turns, wherein the integrated circuit 12 a bridge over the first track sections 13 represents, that is, the integrated circuit 12 an electrical connection between the connection contacts 16 manufactures and the antenna 14 bridged. For this purpose, in the case shown, six first conductor track sections 13 under the integrated circuit 12 be performed. Because of the integrated circuit 12 has a size of 1 mm × 1 mm to 2 mm × 2 mm, it means that the running under the integrated circuit first trace sections 13 the antenna 14 must be made relatively narrow. The first trace sections 13 , which are in the area of the connection contacts 16 run, at least by a factor of 2 are made narrower than the second conductor track sections 15 the turns of the antenna 14 outside the range of connection contacts 16 , In the case shown, the first conductor track sections 13 in the area of the connection contacts 16 by a factor of 3 narrower than the second trace sections 15 the turns of the antenna 14 outside the range of connection contacts 16 , The quality of an antenna 14 in particular by the electrical resistance of the antenna 14 certainly. The antenna 14 consists of a material which has an ohmic resistance, in particular copper or silver. Thus, the resistance of the antenna 14 by the length of the antenna trace 14 and the cross-section of the antenna trace 14 dependent. As the thickness of the antenna trace 14 is determined by their manufacturing method, for example by screen printing, and the number of turns and thus the length of the antenna track 14 given by the desired resonant frequency, here 13.56 MHz, the quality of the antenna 14 mainly across the width of the antenna trace 14 be set. The width of the tracks 20 in the area of the connection contacts 16 is due to the size of the integrated circuit 12 specified. The width of the second conductor track sections 15 the turns of the antenna 14 outside the range of connection contacts 16 is chosen to achieve optimum quality in accordance with larger. In the area of the integrated circuit there is a shield 18 , This shielding 18 is formed in a first and in a second region and consists of layers containing soft magnetic ferrites, wherein the first region above and the second region below the integrated circuit 12 are arranged. The screening layers are printed, for example, by screen printing on films adjacent to the film on which the antenna 14 and the integrated circuit 12 are housed.

In 3 become an integrated circuit 12 and an antenna 14 shown with six turns in cross section. Further, located above the integrated circuit 12 in a first area a first layer 30 a shield and below the integrated circuit 12 in a second area, a second layer 32 a shield. All mentioned items are inside the document 10 so that after lamination above, below and between the items shown the material 34 of the document, for example polycarbonate. The first shift 30 the shield in the first area and the second layer 32 the shield in the second region consist of a pressure layer containing nickel-zinc ferrite or manganese-zinc ferrite. These materials are available, for example, from Steward Advanced Materials, Chattanooga, Tennessee, USA, under serial numbers 72599 and 72899 for nickel-zinc ferrite, and 73399 for manganese-zinc ferrite, respectively, the latter being preferred. The average particle size is 10 μm. The layer thickness of the first layer 30 the shield in the first region and the second layer 32 the shield in the second region is 10 to 100 .mu.m, in particular 12 to 50 microns. The layer thickness of the first layer 30 the shield in the first region and the second layer 32 However, the shield in the second region may, if a stronger shielding is to be achieved, be larger, in particular 100 to 300 μm, preferably 200 to 300 μm. The layers were applied by screen printing or dispenser.

In 4 is one to in 3 shown embodiment, alternative embodiment shown. In the production of the document 10 was due to local action of pressure and heat in the area in which the integrated circuit 12 is introduced, a recess in the antenna 14 generates supporting film for receiving the integrated circuit. Due to the effect of pressure and heat, the conductivity of the first conductor track sections 13 in the area of the connection contacts 16 opposite to the second conductor track sections 15 outside the range of connection contacts 16 (not shown here, see top view in 2 ) improved by a factor of 2. As a result, on the one hand, the quality of the antenna 14 optimized without the material 34 which the document 10 forms unnecessarily thermal load and so the life of the document 10 to reduce. In addition, the recess ensures that the integrated circuit lamination of the document 10 is not extremely stressed, so that the waste can be reduced during manufacture.

In 5 another embodiment is shown. The integrated circuit 12 is with the antenna, which has three turns, via the terminals 16 connected. In 5a ) is the section of the document 10 which the integrated circuit 12 contains, in a schematic plan view and in 5b ) shown in cross section. The first shift 50 in a first area and the second layer 54 In a second region of a shield formed in the form of a Faraday cage, this consists of an electrically conductive material. Thus, the Faraday cage does not cause a short circuit between the first trace sections 13 the antenna 14 in the area of the connection contacts 16 leads, rejects the document 10 also an insulator 52 on, between the antenna or the integrated circuit on the one hand and the first layer 50 or the second layer 54 located. The insulator 52 may consist of the same material as the other parts of the document 10 consist, for example, of polycarbonate (PC). It is important that the shield electrical contact between the first layer 50 in the first area and the second layer 54 generated in the second region, so that an electrical connection between them is established by the contact.

For example, the preparation of such a document can be accomplished by using as its base a silver-coated PC film with the conductive side facing upward. On this another PC film is applied, which is the antenna 14 wearing. This is located between the antenna 14 and the lower portion of the shield, an insulating PC layer as an insulator 52 , On the antenna 14 becomes the integrated circuit 12 Applied by flip-chip technology. Above the integrated circuit is another PC film as an insulator 52 brought in. Another silver-coated PC film is applied to this additional PC film with the conductive side facing downwards. This assembly, together with other films and optionally other components to a document at 190 ° C to 200 ° C and 350 to 600 N / cm ² laminated. This results in the in 5 shown Faraday cage of the shield around the integrated circuit 12 , The two conductive silver layers 50 . 54 on the PC foils connect outside the circuit area to form the electrical contact and formation of the Faraday cage.

In 6 is a shielding element in the form of a faraday cage with current collecting bars 64 . 66 shown in a schematic, perspective view. The integrated circuit 12 is with an antenna 14 connected. Above the integrated circuit 12 there is a first electrically conductive layer 60 in a first area and below the integrated circuit 12 a second electrically conductive layer 62 in a second area. The electrically conductive layers have a specific conductivity of 10 ⁶ to 10 ⁸ ohms / square and can for example consist of a film of an electrically conductive polymer, such as polyaniline. Advantage of this embodiment is the good integration of polyaniline. The disadvantage, however, is that electrically conductive polymers have a low conductivity and thus the shielding of the Faraday cage would not be very efficient. To improve the shielding, the cage further comprises an upper current collecting bar 64 and a lower power bus 66 on. These have a high electrical conductivity, in particular from 0.01 to 10 ohms. Preferably, the current collecting bars are made of copper or silver. The current collecting bars can be produced by printing or introduced in wire form. Furthermore, the shield has vias 68 on which the upper current collector bar 64 and the lower power bus 66 connect electrically conductive together.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102004056829 A1 [0004]
• EP 0706152 A2 [0005]
• DE 102006059454 A1 [0006]

Cited non-patent literature

• ISO 14443A / B [0002]
• ISO 7810 [0044]
• ISO 14443 [0044]

Claims (9)

Value or security document ( 10 ), comprising a front and a back, an antenna ( 14 ) and an integrated circuit connected to the antenna ( 12 ), whereby the value or security document ( 10 ) a shield ( 18 ) of the integrated circuit ( 12 ), characterized in that the shield is formed by a respective soft magnetic ferrite containing and the integrated circuit on both sides covering layer and / or by a Faraday cage. Value or security document ( 10 ) according to claim 1, characterized in that the antenna ( 14 ) at least two connection contacts ( 16 ) and is formed by two or more turns, wherein one or more conductor track sections ( 20 ) of the antenna ( 14 ) between the connection contacts ( 16 ) that the integrated circuit ( 12 ) via the connection contacts ( 16 ) with the antenna ( 14 ), that the windings of the antenna ( 14 ) between the connection contacts ( 16 ) and that the integrated circuit ( 12 ) a bridge between the connection contacts ( 16 ). Value or security document ( 10 ) according to claim 2, characterized in that the turns of the antenna ( 14 ) by first conductor track sections ( 20 ) in the area of the connection contacts ( 16 ) and by second conductor track sections ( 22 ) outside the range of the connection contacts ( 16 ) are formed such that the first conductor track sections at most half the width of the second conductor track sections ( 22 ) and that the first conductor track sections ( 20 ) in the area of the connection contacts ( 16 ) one opposite the second conductor track sections ( 22 ) outside the range of the connection contacts ( 16 ) have a conductivity improved by at least a factor of 2. Value or security document ( 10 ) according to one of claims 2 or 3, characterized in that in the region of the connection contacts ( 16 ) a recess for receiving the integrated circuit ( 12 ) is generated. Value or security document ( 10 ) according to any one of the preceding claims, characterized in that the ferrites are selected from the group comprising iron oxides doped with at least one metal selected from the group comprising manganese, nickel and / or zinc. Value or security document ( 10 ) according to one of the preceding claims, characterized in that the Faraday cage has a sheet resistivity of 10 ² to 10 ⁸ ohms / square. Value or security document ( 10 ) according to claim 6, characterized in that the Faraday cage contains at least one material selected from the group comprising carbon black, graphite, single- and / or multi-walled carbon nanotubes, fullerenes, nickel, copper and silver. Value or security document ( 10 ) according to one of the preceding claims, characterized in that the integrated circuit ( 12 ) unhindered in the value or security document is introduced. Value or security document ( 10 ) according to one of the preceding claims, characterized in that the integrated circuit ( 12 ) is introduced by flip-chip adhesive technology in the value or security document and connected to the antenna.

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