DE102012200220A8 - Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters - Google Patents

Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters Download PDF

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Publication number
DE102012200220A8
DE102012200220A8 DE102012200220A DE102012200220A DE102012200220A8 DE 102012200220 A8 DE102012200220 A8 DE 102012200220A8 DE 102012200220 A DE102012200220 A DE 102012200220A DE 102012200220 A DE102012200220 A DE 102012200220A DE 102012200220 A8 DE102012200220 A8 DE 102012200220A8
Authority
DE
Germany
Prior art keywords
calibrating
magnetic bearing
active magnetic
bearing robot
robot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102012200220A
Other languages
English (en)
Other versions
DE102012200220A1 (de
Inventor
Ulrich Oldendorf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semilev GmbH
Original Assignee
Semilev GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semilev GmbH filed Critical Semilev GmbH
Priority to DE102012200220A priority Critical patent/DE102012200220A1/de
Priority to US13/882,657 priority patent/US20130245826A1/en
Priority to RU2013130258/28A priority patent/RU2013130258A/ru
Priority to KR1020137016216A priority patent/KR20140022778A/ko
Priority to JP2014516301A priority patent/JP2014520398A/ja
Priority to EP12731351.8A priority patent/EP2636057B1/de
Priority to SG2013032446A priority patent/SG190041A1/en
Priority to CN2012800042709A priority patent/CN103299414A/zh
Priority to PCT/EP2012/061660 priority patent/WO2012175473A2/en
Priority to TW101121871A priority patent/TW201309445A/zh
Publication of DE102012200220A1 publication Critical patent/DE102012200220A1/de
Publication of DE102012200220A8 publication Critical patent/DE102012200220A8/de
Priority to IL226133A priority patent/IL226133A0/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1628—Programme controls characterised by the control loop
    • B25J9/1653—Programme controls characterised by the control loop parameters identification, estimation, stiffness, accuracy, error analysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45063—Pick and place manipulator
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49272—Electromagnetic bearing also used as feed in one axis or positioning in two axis

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
DE102012200220A 2011-06-20 2012-01-10 Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters Withdrawn DE102012200220A1 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE102012200220A DE102012200220A1 (de) 2011-06-20 2012-01-10 Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters
EP12731351.8A EP2636057B1 (de) 2011-06-20 2012-06-19 Verfahren zum kalibrieren eines auf aktiven magnetlagern montierten roboters
RU2013130258/28A RU2013130258A (ru) 2011-06-20 2012-06-19 Способ калибровки автоматического манипулятора, установленного на активных магнитных подшипниках
KR1020137016216A KR20140022778A (ko) 2011-06-20 2012-06-19 능동형 자기 베어링 상에 장착된 로봇의 조정 방법
JP2014516301A JP2014520398A (ja) 2011-06-20 2012-06-19 能動型磁気軸受上に装着されたロボットを較正するための方法
US13/882,657 US20130245826A1 (en) 2011-06-20 2012-06-19 Method for calibrating a robot mounted on active magnetic bearings
SG2013032446A SG190041A1 (en) 2011-06-20 2012-06-19 Method for calibrating a robot mounted on active magnetic bearings
CN2012800042709A CN103299414A (zh) 2011-06-20 2012-06-19 用于校准安装在主动磁悬浮支座上的机器人的方法
PCT/EP2012/061660 WO2012175473A2 (en) 2011-06-20 2012-06-19 Method for calibrating a robot mounted on active magnetic bearings
TW101121871A TW201309445A (zh) 2011-06-20 2012-06-19 裝設於主動磁性軸承上機器人校準方法
IL226133A IL226133A0 (en) 2011-06-20 2013-05-02 A method for calibrating a robot on active magnetic bearings

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102011077817 2011-06-20
DE102011077817.9 2011-06-20
DE102012200220A DE102012200220A1 (de) 2011-06-20 2012-01-10 Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters

Publications (2)

Publication Number Publication Date
DE102012200220A1 DE102012200220A1 (de) 2012-12-20
DE102012200220A8 true DE102012200220A8 (de) 2013-02-28

Family

ID=47228604

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012200220A Withdrawn DE102012200220A1 (de) 2011-06-20 2012-01-10 Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters

Country Status (11)

Country Link
US (1) US20130245826A1 (de)
EP (1) EP2636057B1 (de)
JP (1) JP2014520398A (de)
KR (1) KR20140022778A (de)
CN (1) CN103299414A (de)
DE (1) DE102012200220A1 (de)
IL (1) IL226133A0 (de)
RU (1) RU2013130258A (de)
SG (1) SG190041A1 (de)
TW (1) TW201309445A (de)
WO (1) WO2012175473A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017125123A1 (en) * 2016-01-18 2017-07-27 Applied Materials, Inc. Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber
CN113015604B (zh) * 2018-12-11 2024-03-08 株式会社富士 机器人控制系统及机器人控制方法
DE102022123236A1 (de) * 2022-09-12 2024-03-14 Mafu Robotics GmbH Behandlung von Werkstücken insbesondere von Wafern
CN117703927B (zh) * 2024-02-05 2024-04-16 贵州中航华强科技有限公司 一种磁悬浮轴承控制系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6075334A (en) * 1999-03-15 2000-06-13 Berkeley Process Control, Inc Automatic calibration system for wafer transfer robot
US6591160B2 (en) * 2000-12-04 2003-07-08 Asyst Technologies, Inc. Self teaching robot
JP4501103B2 (ja) * 2003-10-17 2010-07-14 株式会社安川電機 半導体ウェハ搬送ロボットのキャリブレーション方法およびそれを備えた半導体ウェハ搬送ロボット、ウェハ搬送装置
US20050137751A1 (en) * 2003-12-05 2005-06-23 Cox Damon K. Auto-diagnostic method and apparatus
US7942099B2 (en) * 2005-08-23 2011-05-17 Korea Institute Of Machinery & Materials Static bearing conveying apparatus having magnetically preloading and motional error correcting functions
DE102009038756A1 (de) * 2009-05-28 2010-12-09 Semilev Gmbh Vorrichtung zur partikelfreien Handhabung von Substraten

Also Published As

Publication number Publication date
RU2013130258A (ru) 2015-01-10
SG190041A1 (en) 2013-06-28
DE102012200220A1 (de) 2012-12-20
JP2014520398A (ja) 2014-08-21
WO2012175473A3 (en) 2013-04-11
KR20140022778A (ko) 2014-02-25
TW201309445A (zh) 2013-03-01
CN103299414A (zh) 2013-09-11
US20130245826A1 (en) 2013-09-19
IL226133A0 (en) 2013-06-27
EP2636057A2 (de) 2013-09-11
WO2012175473A2 (en) 2012-12-27
EP2636057B1 (de) 2014-11-26

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20140801