DE102012106942A8 - Method for exchanging at least one electronic component arranged on a carrier - Google Patents
Method for exchanging at least one electronic component arranged on a carrier Download PDFInfo
- Publication number
- DE102012106942A8 DE102012106942A8 DE102012106942.5A DE102012106942A DE102012106942A8 DE 102012106942 A8 DE102012106942 A8 DE 102012106942A8 DE 102012106942 A DE102012106942 A DE 102012106942A DE 102012106942 A8 DE102012106942 A8 DE 102012106942A8
- Authority
- DE
- Germany
- Prior art keywords
- exchanging
- carrier
- electronic component
- component arranged
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210106942 DE102012106942A1 (en) | 2012-07-30 | 2012-07-30 | Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210106942 DE102012106942A1 (en) | 2012-07-30 | 2012-07-30 | Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102012106942A1 DE102012106942A1 (en) | 2014-01-30 |
DE102012106942A8 true DE102012106942A8 (en) | 2014-04-10 |
Family
ID=49912142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE201210106942 Withdrawn DE102012106942A1 (en) | 2012-07-30 | 2012-07-30 | Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102012106942A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116329044A (en) * | 2023-04-19 | 2023-06-27 | 一汽丰田汽车有限公司 | Method and device for spraying bumper, electronic equipment and storage medium |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0307574A1 (en) * | 1987-08-31 | 1989-03-22 | Siemens Aktiengesellschaft | Soldering head for soldering or unsoldering components |
DE19910173A1 (en) * | 1999-02-24 | 2000-09-21 | Siemens Ag | Waste solder material removal method for circuit boards |
DE19931110A1 (en) * | 1999-07-06 | 2001-01-25 | Ekra Eduard Kraft Gmbh | Print head for ejecting a hot liquid medium and method for producing a joint comprising metallic solder |
JP2002158437A (en) * | 2000-11-20 | 2002-05-31 | Nagoya Electric Works Co Ltd | Method and apparatus for removing solderless part of printed board |
US6574861B1 (en) * | 2001-04-11 | 2003-06-10 | Applied Micro Circuits Corporation | System and method for solder ball rework |
DE10249850A1 (en) * | 2002-10-25 | 2004-05-13 | Siemens Ag | Process for quality control of connection balls of electronic components |
US6845556B1 (en) * | 2002-03-20 | 2005-01-25 | Emc Corporation | Techniques for reworking circuit boards with ni/au finish |
DE102004003521B3 (en) * | 2004-01-21 | 2005-02-17 | Siemens Ag | Repair soldering head for component replacement with circulation of heat transfer medium used for melting solder for releasing component to be replaced |
JP2008085247A (en) * | 2006-09-29 | 2008-04-10 | Omron Corp | Soldering apparatus and soldering method using the same |
-
2012
- 2012-07-30 DE DE201210106942 patent/DE102012106942A1/en not_active Withdrawn
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0307574A1 (en) * | 1987-08-31 | 1989-03-22 | Siemens Aktiengesellschaft | Soldering head for soldering or unsoldering components |
DE19910173A1 (en) * | 1999-02-24 | 2000-09-21 | Siemens Ag | Waste solder material removal method for circuit boards |
DE19931110A1 (en) * | 1999-07-06 | 2001-01-25 | Ekra Eduard Kraft Gmbh | Print head for ejecting a hot liquid medium and method for producing a joint comprising metallic solder |
JP2002158437A (en) * | 2000-11-20 | 2002-05-31 | Nagoya Electric Works Co Ltd | Method and apparatus for removing solderless part of printed board |
US6574861B1 (en) * | 2001-04-11 | 2003-06-10 | Applied Micro Circuits Corporation | System and method for solder ball rework |
US6845556B1 (en) * | 2002-03-20 | 2005-01-25 | Emc Corporation | Techniques for reworking circuit boards with ni/au finish |
DE10249850A1 (en) * | 2002-10-25 | 2004-05-13 | Siemens Ag | Process for quality control of connection balls of electronic components |
DE102004003521B3 (en) * | 2004-01-21 | 2005-02-17 | Siemens Ag | Repair soldering head for component replacement with circulation of heat transfer medium used for melting solder for releasing component to be replaced |
JP2008085247A (en) * | 2006-09-29 | 2008-04-10 | Omron Corp | Soldering apparatus and soldering method using the same |
Also Published As
Publication number | Publication date |
---|---|
DE102012106942A1 (en) | 2014-01-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R163 | Identified publications notified | ||
R005 | Application deemed withdrawn due to failure to request examination |