DE102012106942A8 - Method for exchanging at least one electronic component arranged on a carrier - Google Patents

Method for exchanging at least one electronic component arranged on a carrier Download PDF

Info

Publication number
DE102012106942A8
DE102012106942A8 DE102012106942.5A DE102012106942A DE102012106942A8 DE 102012106942 A8 DE102012106942 A8 DE 102012106942A8 DE 102012106942 A DE102012106942 A DE 102012106942A DE 102012106942 A8 DE102012106942 A8 DE 102012106942A8
Authority
DE
Germany
Prior art keywords
exchanging
carrier
electronic component
component arranged
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102012106942.5A
Other languages
German (de)
Other versions
DE102012106942A1 (en
Inventor
Dietmar Birgel
Dr. Glatz Franz
Christoph Hippin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser Flowtec AG
Original Assignee
Endress and Hauser Flowtec AG
Flowtec AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser Flowtec AG, Flowtec AG filed Critical Endress and Hauser Flowtec AG
Priority to DE201210106942 priority Critical patent/DE102012106942A1/en
Publication of DE102012106942A1 publication Critical patent/DE102012106942A1/en
Publication of DE102012106942A8 publication Critical patent/DE102012106942A8/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/225Correcting or repairing of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0486Replacement and removal of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815Controlling of component placement on the substrate during or after manufacturing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/176Removing, replacing or disconnecting component; Easily removable component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder
DE201210106942 2012-07-30 2012-07-30 Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier Withdrawn DE102012106942A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE201210106942 DE102012106942A1 (en) 2012-07-30 2012-07-30 Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201210106942 DE102012106942A1 (en) 2012-07-30 2012-07-30 Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier

Publications (2)

Publication Number Publication Date
DE102012106942A1 DE102012106942A1 (en) 2014-01-30
DE102012106942A8 true DE102012106942A8 (en) 2014-04-10

Family

ID=49912142

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201210106942 Withdrawn DE102012106942A1 (en) 2012-07-30 2012-07-30 Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier

Country Status (1)

Country Link
DE (1) DE102012106942A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116329044A (en) * 2023-04-19 2023-06-27 一汽丰田汽车有限公司 Method and device for spraying bumper, electronic equipment and storage medium

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0307574A1 (en) * 1987-08-31 1989-03-22 Siemens Aktiengesellschaft Soldering head for soldering or unsoldering components
DE19910173A1 (en) * 1999-02-24 2000-09-21 Siemens Ag Waste solder material removal method for circuit boards
DE19931110A1 (en) * 1999-07-06 2001-01-25 Ekra Eduard Kraft Gmbh Print head for ejecting a hot liquid medium and method for producing a joint comprising metallic solder
JP2002158437A (en) * 2000-11-20 2002-05-31 Nagoya Electric Works Co Ltd Method and apparatus for removing solderless part of printed board
US6574861B1 (en) * 2001-04-11 2003-06-10 Applied Micro Circuits Corporation System and method for solder ball rework
DE10249850A1 (en) * 2002-10-25 2004-05-13 Siemens Ag Process for quality control of connection balls of electronic components
US6845556B1 (en) * 2002-03-20 2005-01-25 Emc Corporation Techniques for reworking circuit boards with ni/au finish
DE102004003521B3 (en) * 2004-01-21 2005-02-17 Siemens Ag Repair soldering head for component replacement with circulation of heat transfer medium used for melting solder for releasing component to be replaced
JP2008085247A (en) * 2006-09-29 2008-04-10 Omron Corp Soldering apparatus and soldering method using the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0307574A1 (en) * 1987-08-31 1989-03-22 Siemens Aktiengesellschaft Soldering head for soldering or unsoldering components
DE19910173A1 (en) * 1999-02-24 2000-09-21 Siemens Ag Waste solder material removal method for circuit boards
DE19931110A1 (en) * 1999-07-06 2001-01-25 Ekra Eduard Kraft Gmbh Print head for ejecting a hot liquid medium and method for producing a joint comprising metallic solder
JP2002158437A (en) * 2000-11-20 2002-05-31 Nagoya Electric Works Co Ltd Method and apparatus for removing solderless part of printed board
US6574861B1 (en) * 2001-04-11 2003-06-10 Applied Micro Circuits Corporation System and method for solder ball rework
US6845556B1 (en) * 2002-03-20 2005-01-25 Emc Corporation Techniques for reworking circuit boards with ni/au finish
DE10249850A1 (en) * 2002-10-25 2004-05-13 Siemens Ag Process for quality control of connection balls of electronic components
DE102004003521B3 (en) * 2004-01-21 2005-02-17 Siemens Ag Repair soldering head for component replacement with circulation of heat transfer medium used for melting solder for releasing component to be replaced
JP2008085247A (en) * 2006-09-29 2008-04-10 Omron Corp Soldering apparatus and soldering method using the same

Also Published As

Publication number Publication date
DE102012106942A1 (en) 2014-01-30

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Legal Events

Date Code Title Description
R163 Identified publications notified
R005 Application deemed withdrawn due to failure to request examination