DE102012106942A1 - Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier - Google Patents
Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier Download PDFInfo
- Publication number
- DE102012106942A1 DE102012106942A1 DE201210106942 DE102012106942A DE102012106942A1 DE 102012106942 A1 DE102012106942 A1 DE 102012106942A1 DE 201210106942 DE201210106942 DE 201210106942 DE 102012106942 A DE102012106942 A DE 102012106942A DE 102012106942 A1 DE102012106942 A1 DE 102012106942A1
- Authority
- DE
- Germany
- Prior art keywords
- solder
- carrier
- component
- replacement component
- inspection system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
Description
Die vorliegende Erfindung betrifft ein Verfahren zum Austausch mindestens einer auf einem Träger angeordneten elektronischen Komponente gegen eine Ersatzkomponente. Insbesondere bezieht sich die Erfindung auf ein Verfahren zum Austausch oberflächenmontierbarer Bauteile wie QFNs oder BGAs.The present invention relates to a method for exchanging at least one electronic component arranged on a carrier for a replacement component. More particularly, the invention relates to a method of replacing surface mount devices such as QFNs or BGAs.
Aus der Leiterplattenfertigung sind verschiedene Verfahren zur Bestückung der Leiterplatten bekannt. Beispielsweise werden so genannten SMD-Bauteile (Surface Mounted Device) auf Kontaktflächen auf der Vorderseite der Leiterplatte montiert. THT-Bauteile (Through-Hole-Technology) hingegen besitzen Anschlussdrähte, welche durch eine Öffnung in der Leiterplatte gesteckt und auf der gegenüberliegenden Seite der Leiterplatte befestigt werden. Hierbei ist auch eine Mischbestückung mit SMD und THT Bauteilen möglich. Das Löten von SMD-Bauteilen erfolgt in der Regel in einem Reflowverfahren. Zur Vorbereitung hierzu wird die Leiterplatte an den zu bestückenden Stellen mit Lotpaste versehen, welche ein Lotpastendepot bildet. Anschließend wird das Bauteil auf dem entsprechenden Lotdepot positioniert. Die so bestückte Leiterplatte wird einer Wärmequelle ausgesetzt, beispielsweise auf eine Heizplatte aufgelegt oder einem Lötofen zugeführt, wobei die Lotpaste aufgeschmolzen und hierdurch eine Verbindung des Bauteils mit der Leiterplatte hergestellt wird.From printed circuit board manufacturing various methods for assembling the printed circuit boards are known. For example, so-called SMD components (Surface Mounted Device) are mounted on contact surfaces on the front side of the printed circuit board. By contrast, THT components (through-hole technology) have connecting wires which are inserted through an opening in the printed circuit board and fastened on the opposite side of the printed circuit board. Here, a mixed assembly with SMD and THT components is possible. The soldering of SMD components is usually done in a reflow process. In preparation for this, the circuit board is provided at the points to be equipped with solder paste, which forms a Lotpastendepot. Subsequently, the component is positioned on the corresponding solder depot. The so-equipped printed circuit board is exposed to a heat source, for example, placed on a hot plate or supplied to a soldering oven, wherein the solder paste is melted and thereby a connection of the component is made with the circuit board.
Es kann vorkommen, dass Bauteile fehlerhaft sind oder im Laufe des Betriebes ausfallen. Insbesondere bei kostenintensiven Bauteilen oder bei Baugruppen mit einer Vielzahl an Bauteilen wird in einem solchen Fall nicht die komplette Baugruppe entsorgt, sondern das fehlerhafte oder defekte Bauteil ausgetauscht. Beim Entfernen des Bauteils bleibt in der Regel Lot zurück, welches jedoch nicht als Lotpastendepot für die Befestigung des Ersatzbauteils ausreicht. Hierdurch ist ein nachträgliches Aufbringen einer individuell zu bestimmenden Lotmenge auf den Träger oder das Bauteil erforderlich. Da die Flächen, auf welche das Lot aufzubringen ist, oftmals sehr klein sind, ist ein Aufbringen mittels Druckschablone meist nur schwer oder gar nicht möglich. Ein manuelles Aufbringen des Lotes ist jedoch aufwendig.It may happen that components are faulty or fail during operation. In particular, in cost-intensive components or assemblies with a variety of components in such a case, not the complete assembly is disposed of, but replaced the faulty or defective component. When removing the component usually remains back solder, which is not sufficient as a solder paste depot for the attachment of the replacement component. As a result, a subsequent application of an individually determined amount of solder on the carrier or the component is required. Since the surfaces to which the solder is to be applied are often very small, application by means of a printing stencil is usually difficult or even impossible. However, a manual application of the solder is expensive.
Die Aufgabe der Erfindung besteht darin, ein effizientes und zuverlässiges Verfahren zum Austausch eines Bauteils auf einem Träger anzugeben.The object of the invention is to provide an efficient and reliable method for exchanging a component on a carrier.
Die Aufgabe wird gelöst durch ein Verfahren zum Austauschen mindestens einer auf einem Träger angeordneten elektronischen Komponente gegen mindestens eine Ersatzkomponente, wobei die mindestens eine Komponente entfernt wird, wobei zur Ausbildung eines Lotdepots Lot auf den Träger und/oder auf die Ersatzkomponente aufgesprüht wird, und wobei die Ersatzkomponente zumindest mittels des Lotdepots auf dem Träger befestigt wird.The object is achieved by a method for exchanging at least one electronic component arranged on a carrier for at least one replacement component, wherein the at least one component is removed, wherein solder is sprayed on the carrier and / or on the replacement component to form a solder depot, and wherein the replacement component is attached to the carrier at least by means of the solder deposit.
In einer ersten Ausgestaltung der erfindungsgemäßen Lösung wird das Lot mit einem Jetprinter aufgesprüht. Unter einem Jetprinter ist eine Vorrichtung zum Auftragen eines viskosen Mediums, insbesondere Lotpaste, unter Verwendung der Tintenstrahltechnologie zu verstehen. Hierbei werden kleine Tropfen des Mediums mittels eines oder mehrerer Sprühköpfe auf das zu besprühende Element aufgebracht, wobei der Kopf und das Element automatisch relativ zueinander positionierbar sind. In der Regel wird der Kopf an den erforderlichen Stellen über dem Element positioniert. Es sind auch Geräte bekannt, bei welchen das zu besprühende Element an Stelle des Kopfes bewegt wird.In a first embodiment of the solution according to the invention, the solder is sprayed with a jet printer. A jet printer is to be understood as an apparatus for applying a viscous medium, in particular solder paste, using inkjet technology. In this case, small drops of the medium are applied by means of one or more spray heads on the element to be sprayed, wherein the head and the element are automatically positioned relative to each other. As a rule, the head is positioned at the required locations over the element. There are also known devices in which the element to be sprayed is moved in place of the head.
Gemäß einer Ausgestaltung des erfindungsgemäßen Verfahrens wird das Lot auf mindestens eine Anschlussfläche der Ersatzkomponente aufgesprüht. Das Lot wird direkt auf die elektronische Komponente aufgebracht. Dies erleichtert den Austausch, da der bereits bestückte Träger nicht mehr einer entsprechenden Vorrichtung zum Aufbringen von Lot zugeführt werden muss. Es ist auch möglich, sowohl den Träger, als auch die Ersatzkomponente mit dem gleichen oder unterschiedlichen Lotmaterial zu versehen.According to one embodiment of the method according to the invention, the solder is sprayed onto at least one pad of the replacement component. The solder is applied directly to the electronic component. This facilitates the exchange, since the already equipped carrier no longer has to be supplied to a corresponding device for applying solder. It is also possible to provide both the carrier and the replacement component with the same or different solder material.
In einer Ausgestaltung wird der Träger nach dem Entfernen der Komponente an der Position der entfernten Komponente auf Lotrückstände untersucht. In einer Weiterbildung wird der Träger mittels eines Inspektionssystems, insbesondere einem 3D-Inspektionssystem, untersucht. In einer vorteilhaften Ausgestaltung wird für den Fall, dass das Aufsprühen mittels eines Jetprinters erfolgt, der Jetprinter mittels Steuerdaten gesteuert, welche von dem Inspektionssystem erzeugt werden.In one embodiment, after removal of the component at the position of the removed component, the carrier is examined for solder residues. In a further development, the carrier is examined by means of an inspection system, in particular a 3D inspection system. In an advantageous embodiment, in the event that the spraying takes place by means of a jet printer, the jet printer is controlled by means of control data, which are generated by the inspection system.
Eine Ausgestaltung sieht vor, dass die Form und/oder die Höhe und/oder die Position der Lotrückstände ermittelt wird.An embodiment provides that the shape and / or the height and / or the position of the solder residues is determined.
Gemäß einer Weiterbildung wird das Lot derart aufgebracht, dass sich das Lot und die vorhandenen Lotrückstände zu dem Lotdepot ergänzen. Durch die Ermittlung von Form und/oder Höhe und/oder Position eventuell vorhandener Lotrückständen ist ermittelbar, an welcher Stelle des Trägers welche Menge an Lot zu ergänzen ist, um ein Lotdepot für das Befestigen der Ersatzkomponente zu schaffen.According to a further development, the solder is applied in such a way that the solder and the existing solder residues complement the solder deposit. By determining the shape and / or height and / or position of possibly existing solder residues, it can be determined at which point of the carrier which amount of solder is to be added in order to create a solder deposit for securing the replacement component.
Eine Ausgestaltung des Verfahrens sieht vor, dass die Ersatzkomponente über mindestens eine Lötung auf dem Träger befestigt wird.An embodiment of the method provides that the replacement component is attached to the carrier via at least one soldering.
Die Erfindung wird anhand der nachfolgenden Figur näher erläutert. The invention will be explained in more detail with reference to the following figure.
In
Eine Vielzahl an elektronischen Komponenten ist auf einem Träger
Ein Austausch einer elektronischen Komponente
Beim Entfernen der fehlerhaften Komponente
Der Reparaturprozess weist in der illustrierten Ausgestaltung folgende Verfahrensschritte auf: die auszutauschende Komponente
Mittels des Inspektionssystems
In einer anderen Ausgestaltung des Verfahrens entfällt das Inspektionssystem
In einer weiteren alternativen Ausgestaltung wird alternativ oder zusätzlich zu dem Träger
Das beim Schablonendruck bestehende Problem, dass die Lotpaste bei Öffnungen geringer Größe nicht aus der Schablonenöffnung herausgelöst werden kann, besteht beim Jetprinting nicht, sodass ein zuverlässiges und einfaches Aufbringen der Lotpaste ermöglicht ist. Das Reparaturverfahren ist somit besonders schnell durchführbar und erfordert in der Regel kein Nachbessern. Weiterhin sind mittels des Jetprintings auch die elektronischen Ersatzkomponenten
Obgleich nur eine auszutauschende Komponente
BezugszeichenlisteLIST OF REFERENCE NUMBERS
- 11
- Leiterplatte circuit board
- 22
- Auszutauschende Komponente Component to be replaced
- 2222
- Ersatzkomponente replacement component
- 33
- Jetprinter Jetprinter
- 44
- Lotdepot solder deposit
- 55
- Inspektionssystem inspection system
- 66
- Lotrückstände solder residues
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210106942 DE102012106942A1 (en) | 2012-07-30 | 2012-07-30 | Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210106942 DE102012106942A1 (en) | 2012-07-30 | 2012-07-30 | Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102012106942A1 true DE102012106942A1 (en) | 2014-01-30 |
DE102012106942A8 DE102012106942A8 (en) | 2014-04-10 |
Family
ID=49912142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE201210106942 Withdrawn DE102012106942A1 (en) | 2012-07-30 | 2012-07-30 | Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102012106942A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116329044A (en) * | 2023-04-19 | 2023-06-27 | 一汽丰田汽车有限公司 | Method and device for spraying bumper, electronic equipment and storage medium |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0307574A1 (en) * | 1987-08-31 | 1989-03-22 | Siemens Aktiengesellschaft | Soldering head for soldering or unsoldering components |
DE19910173A1 (en) * | 1999-02-24 | 2000-09-21 | Siemens Ag | Waste solder material removal method for circuit boards |
DE19931110A1 (en) * | 1999-07-06 | 2001-01-25 | Ekra Eduard Kraft Gmbh | Print head for ejecting a hot liquid medium and method for producing a joint comprising metallic solder |
JP2002158437A (en) * | 2000-11-20 | 2002-05-31 | Nagoya Electric Works Co Ltd | Method and apparatus for removing solderless part of printed board |
US6574861B1 (en) * | 2001-04-11 | 2003-06-10 | Applied Micro Circuits Corporation | System and method for solder ball rework |
DE10249850A1 (en) * | 2002-10-25 | 2004-05-13 | Siemens Ag | Process for quality control of connection balls of electronic components |
US6845556B1 (en) * | 2002-03-20 | 2005-01-25 | Emc Corporation | Techniques for reworking circuit boards with ni/au finish |
DE102004003521B3 (en) * | 2004-01-21 | 2005-02-17 | Siemens Ag | Repair soldering head for component replacement with circulation of heat transfer medium used for melting solder for releasing component to be replaced |
JP2008085247A (en) * | 2006-09-29 | 2008-04-10 | Omron Corp | Soldering apparatus and soldering method using the same |
-
2012
- 2012-07-30 DE DE201210106942 patent/DE102012106942A1/en not_active Withdrawn
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0307574A1 (en) * | 1987-08-31 | 1989-03-22 | Siemens Aktiengesellschaft | Soldering head for soldering or unsoldering components |
DE19910173A1 (en) * | 1999-02-24 | 2000-09-21 | Siemens Ag | Waste solder material removal method for circuit boards |
DE19931110A1 (en) * | 1999-07-06 | 2001-01-25 | Ekra Eduard Kraft Gmbh | Print head for ejecting a hot liquid medium and method for producing a joint comprising metallic solder |
JP2002158437A (en) * | 2000-11-20 | 2002-05-31 | Nagoya Electric Works Co Ltd | Method and apparatus for removing solderless part of printed board |
US6574861B1 (en) * | 2001-04-11 | 2003-06-10 | Applied Micro Circuits Corporation | System and method for solder ball rework |
US6845556B1 (en) * | 2002-03-20 | 2005-01-25 | Emc Corporation | Techniques for reworking circuit boards with ni/au finish |
DE10249850A1 (en) * | 2002-10-25 | 2004-05-13 | Siemens Ag | Process for quality control of connection balls of electronic components |
DE102004003521B3 (en) * | 2004-01-21 | 2005-02-17 | Siemens Ag | Repair soldering head for component replacement with circulation of heat transfer medium used for melting solder for releasing component to be replaced |
JP2008085247A (en) * | 2006-09-29 | 2008-04-10 | Omron Corp | Soldering apparatus and soldering method using the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116329044A (en) * | 2023-04-19 | 2023-06-27 | 一汽丰田汽车有限公司 | Method and device for spraying bumper, electronic equipment and storage medium |
Also Published As
Publication number | Publication date |
---|---|
DE102012106942A8 (en) | 2014-04-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE102009008771B4 (en) | Solder pressure check device and component mounting system | |
DE112007002127T5 (en) | System for mounting electronic components and method for mounting electronic components | |
DE112007000342T5 (en) | Electronic component mounting system, electronic component placement device and electronic component mounting method | |
DE112006003089T5 (en) | System and method for mounting electronic components | |
DE112006000250T5 (en) | An electronic component mounting system and an electronic component mounting method | |
DE102009015769A1 (en) | Production plant for assembly of substrates, has transport system and robot modules, where robot modules assemble product ranges | |
DE112006000300T5 (en) | Electronic component mounting system and electronic component mounting method | |
DE112017007030T5 (en) | SUBSTRATE INSPECTION DEVICE | |
DE112007002181T5 (en) | Device for the production of printed circuit boards equipped with components and method for the position control of electronic components in a device for the production of printed circuit boards equipped with components | |
DE102013112348A1 (en) | Method for repairing a printed circuit board with at least one defective component | |
DE112006001849T5 (en) | Method for mounting electronic components | |
DE102012106942A1 (en) | Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier | |
WO2008012165A9 (en) | Method and wave soldering system for soldering components onto the top and bottom surface of a circuit board | |
DE3827473A1 (en) | CIRCUIT BOARD TO EQUIP WITH SMD BLOCKS | |
WO2023208614A1 (en) | Mask-printing process with optimized parameters, and device | |
DE4402545A1 (en) | Method for the formation of discrete solder points on corresponding contact connection surfaces on a printed circuit board | |
WO2007056997A1 (en) | Method for producing a contact arrangement between a microelectronic component and a supporting substrate as well as component unit produced by said method | |
DE19607014A1 (en) | Method of making a composite assembly | |
DE2223195B2 (en) | METHOD AND DEVICE FOR NON-THERMAL RELEASE OF MECHANICAL CONNECTIONS | |
DE19807279C2 (en) | Method for manufacturing an electronic component | |
DE102017114801A1 (en) | Method for operating a soldering system | |
DE3413109A1 (en) | Method for soldering printed-circuit boards | |
DE102012106941A1 (en) | Method for manufacturing support of printed circuit board assembly, involves compensating deviations from preset pattern by applying additional viscous medium in substrate at application process performed based on predefined program | |
DE10131225A1 (en) | Contact of SMT electronic component, such as pluggable connector, has surface of at least one section of contact modified | |
DE102021131687A1 (en) | Process for replacing a component mounted on a printed circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R163 | Identified publications notified | ||
R005 | Application deemed withdrawn due to failure to request examination |