DE102012004365A1 - Method for manufacturing smart card that is utilized for e.g. detection of access authorization to cellular radio system, involves connecting module contact unit, coil and component contact unit by external force applied on embedded module - Google Patents

Abstract

The method involves providing a data carrier body (12) and an electronic module (20), and providing an elastic support unit for the module in the carrier body. The module is embedded into the carrier body such that the module is mounted on the support unit, and a module contact unit is arranged adjacent to and spaced from an antenna coil (30) and a component contact unit of the carrier body. The module contact unit, the coil and the component contact unit are temporarily and electrically connected together by external force applied on the embedded elastically mounted module. The antenna coil is designed as an etched or printed coil or a wire coil. The elastic support unit is designed as a silicone element. The electronic module is designed as a chip module. An independent claim is also included for a portable data carrier.

Description

The present invention relates to a portable data carrier with an electronic module and to a method for producing such a data carrier.

Portable, mostly card-shaped data carriers, in particular chip cards, are used in many fields, for example as identity documents, to prove access authorization to a mobile radio network or to carry out transactions of cashless payment transactions. A smart card has a card body and an integrated circuit embedded in the card body. In order to enable efficient production of the chip card, the integrated circuit is first packaged in a chip module in a variety of manufacturing processes and then the chip module is installed in the card body. As a rule, the chip module is glued into a recess of the card body.

Communication with the integrated circuit can be carried out via a contact field of the chip card, which is contacted by a contacting unit for this purpose. The contact field is usually part of the chip module. Alternatively or in addition to the communication via the contact field, a contactless communication may be provided. For this purpose, the card body may have an antenna, which is electrically connected to the integrated circuit during installation of the chip module. Depending on the field of application of the chip card, the card body may have, in addition to the antenna, other or further electrical components which are electrically connected to the integrated circuit during installation of the chip module.

With the vast majority of techniques used to incorporate a chip module into a card body, the areas where the electrically conductive connections between the integrated circuit of the chip module and the electrical component of the card body are formed are not directly accessible by means of a tool. Therefore, contacting methods are required which, despite this lack of accessibility, permit the formation of an electrically conductive connection between the integrated circuit and the electrical component.

The electrically conductive connection between the integrated circuit and the electrical component can be produced in a variety of ways, for example non-positively, cohesively or by means of an electrically conductive material.

Depending on the technical application, it may be desirable to electrically connect an electrical component only temporarily to the integrated circuit of the data carrier. In the case of an antenna as the electrical component of the data carrier, for example, a permanently produced electrically conductive connection between the antenna and the integrated circuit of the data carrier may be disadvantageous. In this context, attacks (so-called relay attacks) are known, by means of which an unauthorized third party can read out data from the data carrier without the knowledge and consent of the authorized user of the data carrier.

In order to prevent such attacks, it is known to provide a switching device by means of which the user can electrically connect the non-switched state of the circuit separate circuit for contactless data transmission with the integrated circuit. Only in the switched state, and thus only with the knowledge and consent of the user of the data carrier, then a contactless reading of data from the disk is possible.

Known solutions have the disadvantage that they considerably complicate the production of the corresponding data carrier due to the usually complicated arrangement, for example the arrangement of additional switching elements between a contact device of the module and the antenna, and thus more expensive. Other solutions, which are based on an arrangement of elasto-resistive materials between the contact elements to be connected, as for example in the US 2007/0290051 A1 is described, in addition to the additional manufacturing costs have the disadvantage that a desired contact stability in the switched state can not always be guaranteed.

Object of the present invention is to propose a method for producing a portable data carrier with switchable electrical component, which takes into account the disadvantages mentioned above.

This object is achieved by a method, a portable data carrier and a data carrier body having the features of the independent claims. Advantageous embodiments and further developments are specified in the dependent claims.

In a method according to the invention for producing a portable data carrier, which comprises a data carrier body with an electrical component and an electronic module embedded at least partially in the data carrier body, a first step is used Disk body and an electronic module provided. According to the invention, at least one elastic support element for the module is provided in the data carrier body, preferably in a recess of the data carrier body. The module is then embedded in the data carrier body in such a way that the module is supported on the at least one elastic support element and on the other hand a contact device of the module is arranged adjacent to and spaced from the electrical component of the data carrier such that the contact device of the module and the electrical component of the module Volume body by external force on the embedded, elastically mounted module can be temporarily electrically connected.

In this way, a portable data carrier with switchable electrical component can be produced in a particularly simple and cost-effective manner. By means of the elastic support element, the contact device of the embedded module - in the unswitched state - kept at a distance from the electrical component of the disk body. Thus, the electrical component is separated from the integrated circuit of the data carrier. A simple, external force on the module, for example, the fact that the user holds the disk in the region of the module between two fingers and exerts a predetermined pressure, causes a connection of the electrical component, d. H. the electrical component is temporarily, as long as the force continues, electrically connected to the contact means of the module - and above - connected to the integrated circuit of the data carrier.

The switching process is reversible, since with decreasing or lacking force due to the elasticity of the support element of the distance - and thus the electrical insulation - between the contact device of the module and the electrical component of the disk body is restored. An accidental or unintentional switching operation is practically impossible. The elasticity of the support element is chosen such that the force required for switching an unintentional force, for example, by slightly bending a card-shaped data carrier, exceeds.

It is further advantageous that the method can be carried out using conventional electronic modules. The step of embedding the module in the data carrier body does not differ from the procedure for embedding a module in a data carrier body, in which a permanent electrically conductive connection between the electrical component of the data carrier body and the contact device of the module is produced. Thus, existing manufacturing facilities and manufacturing processes can continue to be used unchanged.

Complicated additional switching elements are not required. This is particularly advantageous because the available space, especially in the case of smart cards as portable data carriers, is very limited. Only the at least one elastic support element must be arranged or formed in a suitable position and in a suitable manner in the data carrier body, which otherwise does not need to be distinguished from a conventional data carrier body. Hereinafter, two preferred embodiments of the elastic support member will be described in detail.

A portable data carrier according to the invention comprises a data carrier body according to the invention with an electrical component as well as an electronic module embedded at least partially in the data carrier body. The data carrier body is distinguished by the at least one elastic support element for the electronic module in the data carrier body. The at least one support element is suitably positioned in the data carrier body and has suitable material properties, in particular elasticity properties, as well as a suitable dimensioning, which enable the embedding of the module in the data carrier body to form the data carrier in the manner indicated below. The module is mounted in the data carrier body according to the invention on the at least one elastic support element and a contact means of the module is adjacent and spaced from the electrical component of the data carrier arranged such that the contact means of the module and the electrical component of the data carrier body by external force on the embedded elastically mounted module can be temporarily electrically connected.

According to a first preferred embodiment, the at least one elastic support element in the form of at least one silicone element can be provided and arranged on the data carrier body. Other comparable materials are also usable. Essential for the suitability of the material for forming an elastic support element according to the invention are defined, constant material constants (such as modulus of elasticity, shear modulus), which are also valid for long-term operation and many switching operations, ie. H. after multiple compression of the support element, substantially preserved.

In general, the number, shape and size of the at least one support element, for example a silicone element, as well as the position of the arrangement of the at least one support element in the data carrier body on the basis of the material constants of the material of the support element, for example silicone, as well as the required deformation of the support element to enable a switching operation at a predetermined force are determined.

According to a second preferred embodiment, the at least one elastic support element can be formed by means of a web of data carrier body material. In this case, the web is formed, for example, during the production of a recess, which is generally multi-layered and formed for embedding the module in the data carrier body. If the recess is milled out of the data carrier body, for example, the web can be left in a suitable form. In order to increase the elasticity of the web, this can be partially interrupted and / or broken.

Also according to this embodiment, the dimensions of the web or of the separated part webs can be determined on the basis of the parameters described above.

As already mentioned, the module is usually embedded in a stepped recess of the disk body. In this case, the at least one elastic support element is preferably arranged on the edge of such a step of this recess, in which the electrical component of the data carrier body or a component contact device of this component is at least partially contactable exposed. The wording "on the edge" is here broad, in the sense of "spatially adjacent, close to" to interpret. Ie. in particular, that the at least one support element can be present both in the same stage in which the electrical component is exposed, and in an adjacent adjacent step. Such a spatially adjacent arrangement of the at least one support element in relation to the electrical component allows an optimized adaptation of the support element, in particular with regard to the required dimensions of the at least one support element. An optimized dimensioning and spatial arrangement of the at least one elastic support element in the data carrier body in turn makes it possible to ensure an easy to perform, reversible, reproducible and stable switching operation.

According to a first variant, the module is designed in such a way that, when the module is embedded in the data carrier body, the contact device of the module and the electrical component of the data carrier body via a spatial profile, preferably a survey, the contact means of the module by external force on the Embedded module can be temporarily directly electrically connected electrically. Ie. between the contact device of the module and the electrical component of the disk body no additional electrically conductive material is required. Accordingly, no manufacturing step for arranging such a material is required.

Such a profile in the contact device can be formed in various ways. Preferably, a protrusion in the contact device of the module, which may be formed, for example, by a copper foil applied to a carrier material, is formed by connecting the copper foil and the carrier material by means of laminating under pressure and heat. A laminating sheet or the like used here, which adjoins the copper foil, then comprises at least one depression into which the copper foil is pressed during lamination. This results in a corresponding survey in the copper foil. This survey can be additionally stabilized that as a carrier material, for example, a fiber-reinforced plastic, eg. B. a known from printed circuit board production FR4 material is used. During lamination, the plastic flows into the region of the depression not covered by the copper foil in the laminating sheet. After lamination, the plastic cools and cures, thereby stabilizing the area under the elevation of the copper foil and virtually eliminating deformation of the elevation due to external force.

Such a method for producing the spatial profile, for. As a survey, the contact means of the module has the advantage that the profile can be made in virtually any desired shape and number, depending on the corresponding recesses in the lamination, and with very high precision. In this way, the height of the survey z. B. can be adjusted very precisely to a depth of a recess in the disk body in which the electrical component is exposed contactable.

According to a second variant, the contact means of the module and the electrical component of the data carrier body are not directly, but via an electrically conductive material, which is preferably elastic, electrically conductively connected. Therefore, the method includes a further step before embedding the module. In this case, the electrically conductive material is arranged in a recess of the data carrier body such that the material is electrically conductively connected to the electrical component of the data carrier body. The module is then embedded in such a way that the contact device of the module and the electrical component of the data carrier body on the Material can be temporarily electrically connected by means of external force on the embedded module.

In the unswitched state, the contact means of the module is spaced from the electrically conductive material disposed on the electrical component. If force is exerted on the module, the support element deforms and the contact device of the module is pressed onto or into the electrically conductive material and connected to it in an electrically conductive manner. This embodiment, in particular when using an elastic electrically conductive material, allows the compensation of smaller manufacturing tolerances, for example when embedding the module or when forming the at least one elastic support element.

The invention will now be described by way of example with reference to the accompanying drawings. Show:

1 a plan view of a preferred embodiment of a data carrier according to the invention;

2 a section of a first variant of a volume body for the disk 1 in plan view without embedded electronic module;

3 a section of a second variant of a volume body for the disk 1 in plan view without embedded electronic module;

4 the section of the disk body 2 in a sectional view with an embedded module according to a first variant;

5 the section of the disk body 3 in a sectional view with an embedded module according to a second variant;

6 the cutout 4 when force is applied to the embedded module; and

7 the cutout 5 when force is applied to the embedded module.

1 shows a portable disk 10 in the form of a chip card in a schematic plan view. The disk 10 has a volume body 12 into which an electronic module 20 embedded in the form of a chip module. The module 20 comprises an integrated circuit for storing and / or processing data (not shown) which is incorporated in a potting body 23 is shed. Furthermore, the module has 20 via a contact field 24 located on the outside of the disk body 12 is arranged and the inside of the disk body 12 arranged integrated circuit covered. Between the integrated circuit and the contact pad 24 a plurality of (not shown) electrically conductive connections are formed, so that the integrated circuit via the contact field 24 electrical signals can be supplied and the electrical circuit but the contact field 24 Can send out signals. For this, the contact field 24 be connected to a reader (not shown).

The volume body 12 has in its interior an electrical component 30 in the form of an antenna coil. This may be formed for example as a printed or etched coil or as a wire coil. The antenna 30 Is electrically connectedр to the integrated circuiteasons andürt analogous toanceniden the field of transmission of signalsatzen that are received from the circuit andloch. In the case of the antenna 30 If there is a corresponding data transmission contactless, this is the disk 10 at a suitable distance from a reader (not shown).

Alternatively or in addition to the antenna 30 can in the volume body 12 of the disk 10 out 1 further (not shown) electrical components 30 be arranged, such as a display, a switch, a sensor, a battery and the like. These electrical components can, as described in detail below, be electrically conductively connected to the integrated circuit by the method proposed here.

The 2 and 3 each show a variant of a data carrier body 12 for a in 1 shown disk 10 , in each case before the insertion of the module 20 , fragmentary in a schematic plan view.

The volume body 12 out 2 includes a recess 42 . 44 . 46 into which the module 20 is at least partially embedded. The recess 42 . 44 . 46 is multi-level trained. A first step 42 has a depth which is approximately the thickness of a carrier layer 22 of the module (cf. 4 and 5 ). Another level 44 the recess 42 . 44 . 46 is compared to the first stage 42 formed deeper. At the bottom of the step 44 occurs a component contact device 32 the electrical component 30 which otherwise in the volume body 12 is inaccessible embedded, out and there is directly contactable.

The component contact device 32 is integral with the component 30 educated. It is also possible, the component contact device 32 separately form and electrically conductive with the component 30 connect to. It can continue for certain electrical components 30 be possible to do this directly, without providing a separate component contact device 32 , electrically conductive with a corresponding contact means of the module 20 can be connected.

A third stage 46 the recess 42 . 44 . 46 serves to receive the potting body 23 and is usually deeper than the steps 42 and 44 ,

With regard to the features described so far, the data carriers of the 2 and 3 match. At the edge of the stage 44 adjacent to the component contactor 32 and adjacent to the transition to the stage 46 , Are each a plurality of elastic support elements 70 arranged.

In the volume body 12 out 2 are the elastic support elements 70 as silicone elements, in the form of small cylinders, formed and in a separate manufacturing step in the disk body 12 , which may for example be made of PVC or another suitable plastic, has been used. The function of the support elements 70 will be described below with reference to the 4 and 6 described in detail.

In the volume body 12 out 3 are the elastic support elements 70 ' formed as a rectangular cuboid, which consist of the same material as the disk body 12 , To form the support elements 70 ' is when making the recess 42 . 44 . 46 , for example, by milling, a corresponding web have been left. By forming additional recesses in the web then the support elements 70 ' emerged. Also the function of the support elements 70 ' will be described below with reference to the 5 and 7 described in detail.

In addition to the arrangement 2 is in the volume body 12 out 3 on the exposed component contact device 32 an elastic, electrically conductive material 50 arranged. Also the function of this material 50 follows from the description of 5 and 7 ,

A volume body 12 out 2 and 3 can be formed by various methods, for example by injection molding or by laminating various films. The recess 42 . 44 . 46 , and optionally to form the support elements 70 ' required bridge (cf. 3 ), can already be provided in the films, for example, punched out, or from the disk body 12 be milled out.

The 4 and 5 each show the excerpts from the 2 and 3 in a side sectional view, wherein in the corresponding recesses 42 . 44 . 46 now each an electronic module 20 . 20 ' has been embedded. It should be noted at this point that the dimensions of the present drawings, which merely serve to fundamentally and schematically describe the present invention, need not be to scale.

An electronic module 20 . 20 ' as it is in the 4 and 5 is shown schematically in part, can be prepared by applying to a carrier layer 22 , which may consist of a plastic-impregnated fiber fabric, preferably a fiberglass fabric impregnated with epoxy resin, on both sides an electrically conductive layer 24 . 26 , For example, in the form of a copper foil is applied. Other suitable materials instead of copper are also usable.

The application of the electrically conductive layers 24 . 26 on the carrier layer 22 is usually done by lamination using laminating. When laminating, the layers become 24 . 22 . 26 Pressed under pressure and heat (eg approx. 20 bar at approx. 180 ° C) between the laminating sheets and thereby firmly connected. Instead of lamination, other suitable tools may be used, such as rollers or the like.

The use of smooth lamination sheets results in a module 20 ' as it is in 5 is shown. Both electrically conductive layers 24 and 26 are flat and serve the module, as described below, as a contact surface 24 and module contact device 26 ,

However, a laminating sheet used for laminating may also have a spatially structured profile, for example one or more depressions. These may have been formed in the laminating sheet, for example by means of lasers or another suitable method. In lamination, the one becomes the electrically conductive layer 26 , which adjoins this laminating, pressed in the depression due to the existing pressure. This results in how in 4 shown in the electrically conductive layer 26 a survey, that is generally a profile corresponding to the profile in the laminating.

The plastic in the carrier layer 22 flows during lamination, due to its material properties and the pressure and Heat, in the region of the recesses of the laminating, which is not already from the copper foil 26 is taken. After lamination, as the plastic cools, it solidifies and thereby stabilizes the bump in the electrically conductive layer 26 , so that a deformation or even destruction of the survey can be counteracted by external force. As a result, after the lamination, the carrier layer also shows 22 a spatial structuring, which substantially corresponds to the structuring of the laminating sheet used in the lamination.

The modules 20 and 20 ' from the 4 and 5 is mean that the layer 24 on the first surface of the carrier layer 22 which are on the surface of the data carrier 10 is arranged, the already mentioned contact field 24 forms. The second, on the opposite surface of the carrier layer 22 arranged film each forms a contact device 26 of the module 20 . 20 ' , About this contact device 26 becomes the module 20 . 20 ' , as described below, with the electrical component 30 the volume body 12 directly (cf. 6 ) or indirectly, via an electrically conductive material 50 (see. 7 ) electrically conductively connected. In the following, the contact device 26 usually as a module contact device 26 to make this conceptually clear of the component contact device 32 the electrical component 30 the volume body 12 to distinguish.

The contact field 24 and the module contact device 26 are connected to the integrated circuit of the module 20 . 20 ' electrically connected, for example via (not shown) bonding wires.

As in the 4 and 5 shown is the module 20 respectively. 20 ' in the stage 42 the recess 42 . 44 . 46 the volume body 12 out 2 respectively. 3 embedded and by means of a suitable adhesive 80 , For example, a hot melt adhesive, have been glued therein. The glue 80 is preferably chosen such that it does not cure completely, ie even after cooling still retains some toughness.

Embedding the module 20 . 20 ' takes place in each case such that the module 20 . 20 ' on the elastic support elements 70 . 70 ' the volume body 12 outsourced. The storage position of the module 20 . 20 ' is due to the arrangement and dimensioning of the support elements 70 . 70 ' defined so that the module contact device 26 of the module 20 . 20 ' and the component contact device 32 the volume body 12 adjacent and spaced from each other. An insulating gap 90 separates the two contact devices 26 . 32 (see. 4 ) or the module contact device 26 from that with the component contactor 32 electrically conductive connected electrically conductive material 50 (see. 5 ).

Material and dimensioning of the elastic support elements 70 . 70 ' are chosen on the one hand so that a slight, for example accidental and unintentional force on the disk body and / or the embedded module does not cause the module contact device 26 with the component contact device 32 electrically connected. Ie. the support elements 70 . 70 ' Prevent in this case too close approach of the module to the disk body 12 in the area of the module contact device 32 , In other words, the insulating gap 90 is retained and the electrical component 32 stays separate from the integrated circuit of the module 20 . 20 ' ,

On the other hand, the elastic support elements 70 . 70 ' however, chosen and designed so that an intended, with a predetermined minimum force exerted force on the disk 10 in the area of the embedded module 20 . 20 ' causes the module contact device 26 with the component contact device 32 electrically connected. Such a force is in the 6 and 7 symbolized by the arrows F and can be done for example by the fact that the user the card-shaped data carrier shown in the example 10 between thumb and forefinger of one hand in the area of the module 20 . 20 ' with moderate force, preferably in the range of 2 to 20 N, compresses. Further preferably, the data carrier is set up to establish the conductive connection in response to a force in the range 2 to 4 N. By the force, which preferably substantially perpendicular to the surface of the data carrier 10 acts, the elastic support elements 70 . 70 ' as far as deformed, that the gap 90 disappears. As a result, the module contact device 26 with the component contact device 32 directly (cf. 6 ) or over the elastic electrically conductive material 50 indirectly (cf. 7 ) electrically conductively connected.

Finally, the choice of material and the spatial dimensioning and design of the elastic support elements takes place 70 . 70 ' such that when the force F falls below the above minimum force, for example, is only about 1 N, or completely absent, the support elements 70 . 70 ' expand again due to their elasticity. This will make the module 20 . 20 ' relocated and the insulating gap 90 arises again (cf. 4 . 5 ), whereby the electrically conductive connection between the module contact device 26 and the component contact device 32 is interrupted.

It is understood that the various embodiments of the elastic support elements 70 . 70 ' arbitrary with the different variants of the electrical module 20 . 20 ' can be combined.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• US 2007/0290051 A1 [0008]

Claims (15)

Method for producing a portable data carrier ( 10 ) comprising a data carrier body ( 12 ) with an electrical component ( 30 . 32 ) as well as at least partially into the data carrier body ( 12 ) embedded electronic module ( 20 ; 20 ' ), comprising the step of - providing the data carrier body ( 12 ) and the electronic module ( 20 ; 20 ' ); characterized by the steps: - providing at least one elastic support element ( 70 ; 70 ' ) for the module ( 20 ; 20 ' ) in the volume body ( 12 ); - Embedding the module ( 20 ; 20 ' ) in the volume body ( 12 ) such that the module ( 20 ; 20 ' ) on the at least one elastic support element ( 70 ; 70 ' ) and a contact device ( 26 ) of the module ( 20 ; 20 ' ) adjacent and spaced apart from the electrical component ( 30 . 32 ) of the data carrier body ( 12 ) is arranged, that the contact device ( 26 ) of the module ( 20 ; 20 ' ) and the electrical component ( 30 . 32 ) of the data carrier body ( 12 ) by means of external force (F) on the embedded, elastically mounted module ( 20 ; 20 ' ) can be temporarily electrically connected. A method according to claim 1, characterized in that the at least one elastic support element ( 70 ) provided in the form of at least one silicone element and on the disk body ( 12 ) is arranged. A method according to claim 1, characterized in that the at least one elastic support element ( 70 ' ) is formed by means of a web of media body material. Method according to claim 3, characterized in that the web ( 70 ' ) is partially interrupted and / or broken in order to increase the elasticity of the web. Method according to one of claims 1 to 4, characterized in that the module ( 20 ; 20 ' ) in a stepped recess ( 42 . 44 . 46 ) of the data carrier body ( 12 ) is embedded, wherein the at least one elastic support element ( 70 ; 70 ' ) at the edge of a step ( 44 ) of the recess ( 42 . 44 . 46 ), in which the electrical component ( 30 . 32 ) is at least partially contactable exposed. Method according to one of claims 1 to 5, characterized in that the module ( 20 ; 20 ' ) is provided such that when the module ( 20 ; 20 ' ) in the volume body ( 12 ), the contact device ( 26 ) of the module ( 20 ; 20 ' ) and the electrical component ( 30 . 32 ) of the data carrier body ( 12 ) via a spatial profile, preferably a survey, the contact device ( 26 ) of the module ( 20 ; 20 ' ) by external force (F) on the embedded module ( 20 ; 20 ' ) can be temporarily connected directly electrically conductive. Method according to one of claims 1 to 5, characterized by the step before embedding the module ( 20 ; 20 ' ): - arranging an electrically conductive material ( 50 ) in a recess ( 42 . 44 . 46 ) of the data carrier body ( 12 ) such that the material ( 50 ) with the electrical component ( 30 . 32 ) of the data carrier body ( 12 ) is electrically connected, wherein the module ( 20 ; 20 ' ) is then embedded in such a way that the contact device ( 26 ) of the module ( 20 ; 20 ' ) and the electrical component ( 30 . 32 ) of the data carrier body ( 12 ) about the material ( 50 ) by external force (F) on the embedded module ( 20 ; 20 ' ) can be temporarily electrically connected. Portable disk ( 10 ) comprising a data carrier body ( 12 ) with an electrical component ( 20 ; 20 ' ) as well as at least partially into the data carrier body ( 12 ) embedded electronic module ( 20 ; 20 ' ), characterized by at least one elastic support element ( 70 ; 70 ' ) for the module ( 20 ; 20 ' ) in the volume body ( 12 ), where the module ( 20 ; 20 ' ) on the at least one elastic support element ( 70 ; 70 ' ) and a contact device ( 26 ) of the module ( 20 ; 20 ' ) adjacent and spaced apart from the electrical component ( 26 ) of the data carrier body ( 12 ) is arranged, that the contact device ( 26 ) of the module ( 20 ; 20 ' ) and the electrical component ( 30 . 32 ) of the data carrier body ( 12 ) by means of external force (F) on the embedded, elastically mounted module ( 20 ; 20 ' ) can be temporarily electrically connected. Disk ( 10 ) according to claim 8, characterized in that the at least one elastic support element ( 70 ) is formed in the form of at least one silicone element. Disk ( 10 ) according to claim 8, characterized in that the at least one elastic support element ( 70 ' ) is formed by a web of data carrier body material, wherein the web ( 70 ' ) is preferably partially interrupted and / or broken. Disk ( 10 ) according to one of claims 8 to 10, characterized in that the module ( 20 ; 20 ' ) in a stepped recess ( 42 . 44 . 46 ) of the data carrier body ( 12 ), wherein the at least one elastic support element ( 70 ; 70 ' ) at the edge of a step ( 44 ) of the recess ( 42 . 44 . 46 ) is arranged, in which the electrical component ( 30 . 32 ) is at least partially contactable exposed. Disk body ( 12 ) comprising an electrical component ( 30 . 32 ) and suitable for producing a portable data carrier ( 10 ) according to one of claims 8 to 11, characterized by at least one elastic support element ( 70 ; 70 ' ) for an electronic module ( 20 ; 20 ' ) in the volume body ( 12 ), which in the volume body ( 12 ) is arranged such that the module ( 20 ; 20 ' ) in the volume body ( 12 ) can be embedded in such a way that the module ( 20 ; 20 ' ) on the at least one elastic support element ( 70 ; 70 ' ) and a contact device ( 26 ) of the module ( 20 ; 20 ' ) adjacent and spaced apart from the electrical component ( 30 . 32 ) of the data carrier body ( 12 ) is arranged, that the contact device ( 26 ) of the module ( 20 ; 20 ' ) and the electrical component ( 30 . 32 ) of the data carrier body ( 12 ) by means of external force (F) on the embedded, elastically mounted module ( 20 ; 20 ' ) can be temporarily electrically connected. Disk body ( 12 ) according to claim 12, characterized in that the at least one elastic support element ( 70 ) is formed in the form of at least one silicone element. Disk body ( 12 ) according to claim 12, characterized in that the at least one elastic support element ( 70 ' ) is formed by a web of data carrier body material, wherein the web ( 70 ' ) is preferably partially interrupted and / or broken. Disk body ( 12 ) according to one of claims 12 to 14, characterized by a stepped recess ( 42 . 44 . 46 ) in the volume body ( 12 ) into which the module ( 20 ; 20 ' ) is embedable, wherein the at least one elastic support element ( 70 ; 70 ' ) at the edge of a step ( 44 ) of the recess ( 42 . 44 . 46 ) is arranged, in which the electrical component ( 30 . 32 ) is at least partially contactable exposed.

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