DE102011109938A1 - Attaching components on a film, comprises positioning a component on film, pressing a component with flexible foam on the film and transferring the adhesive material from ductile to hardened state - Google Patents

Attaching components on a film, comprises positioning a component on film, pressing a component with flexible foam on the film and transferring the adhesive material from ductile to hardened state Download PDF

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Publication number
DE102011109938A1
DE102011109938A1 DE102011109938A DE102011109938A DE102011109938A1 DE 102011109938 A1 DE102011109938 A1 DE 102011109938A1 DE 102011109938 A DE102011109938 A DE 102011109938A DE 102011109938 A DE102011109938 A DE 102011109938A DE 102011109938 A1 DE102011109938 A1 DE 102011109938A1
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Prior art keywords
film
component
components
adhesive
adhesive material
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DE102011109938A
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German (de)
Inventor
Oliver Wiesener
Winfried Langenkamp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Attaching components on a film comprises (i) positioning at least one component on the film, in which an adhesive material is located between the component and the film, (ii) pressing at least one component with a flexible foam on the film and (iii) transferring the adhesive material from a ductile to a hardened state.

Description

Gebiet der ErfindungField of the invention

Die Erfindung betrifft ein Verfahren zur Fixierung von Bauteilen auf einem Träger.The invention relates to a method for fixing components on a support.

Stand der TechnikState of the art

Elektronische Schaltungen werden immer kleiner und dünner. Um weiteres Gewicht und Bauraum zu sparen, werden seit einigen Jahren Bauteile auf flexible Träger statt auf starren Platten aufgebracht. Dies ermöglicht die flexible Integration der Schaltung in eine Anwendung, die zum Beispiel in einem kleinen Gehäuse untergebracht ist.Electronic circuits are getting smaller and thinner. In order to save further weight and space, components have been applied to flexible supports instead of rigid plates for several years. This allows the flexible integration of the circuit in an application, which is housed for example in a small housing.

Die Bauteile von Schaltungen haben unterschiedliche Geometrien: verschiedene SMD-Gehäusestandards, chip an board und verschiedene Sonderbauteile (z. B. Anzeigegeräte, Batterien, Stecker) sollen im fertigen Produkt eingesetzt werden.The components of circuits have different geometries: different SMD housing standards, chip on board and various special components (eg display devices, batteries, connectors) are to be used in the finished product.

Die elektrische und mechanische Kontaktierung der Bauteile kann über Lötprozesse stattfinden, wenn die Bauteile und die benutzte Folie durch die dabei auftretenden Temperaturen nicht geschädigt werden. Einige Bauteile, insbesondere solche, die organische Moleküle enthalten, werden durch die Temperaturen beim Löten geschädigt (z. B. OLEDs, OPV, Sensoren). Als Folie wird häufig Polyimid eingesetzt, da es bei den Löttemperaturen noch nicht geschädigt wird. Polyimid ist gelblich; wenn die Folie in der Endanwendung sichtbar sein soll, wird die Farbe möglicherweise als störend empfunden. Desweiteren sind diese Polymid-Folien in der Flexibilität eingeschränkt und werden schnell brüchig.The electrical and mechanical contacting of the components can take place via soldering processes, if the components and the film used are not damaged by the temperatures occurring. Some components, in particular those containing organic molecules, are damaged by the temperatures during soldering (eg OLEDs, OPV, sensors). As a film polyimide is often used because it is not damaged at the soldering temperatures. Polyimide is yellowish; if the film is to be visible in the final application, the color may be distracting. Furthermore, these polymide films are limited in flexibility and quickly become brittle.

Alternativ können, wie z. B. beschrieben in ”SMD an Foil 101: A Primer For Applying LEDs And Other Components To Membrane Switches”, veröffentlicht im SGIA Journal, Second Quarter 2003 , Leitkleber benutzt werden, um die Bauteile zu kontaktieren. Dort wird auch beschrieben, gedruckte Silberbahnen als Leiter zu benutzen und verschiedene Klebstoffmaterialien für ein Bauteil zu benutzen: einen ersten Klebstoff für die elektrischen Kontakte, einen zweiten Klebstoff zwischen diesen Klebstoffen, um Kurzschlüsse zwischen den Kontakten zu verhindern und das Bauteil an der Folie zu fixieren, und einen dritten Klebstoff, der über das Bauteil gegossen wird, um mechanische Spannungen aufzunehmen.Alternatively, such. B. described in "SMD to Foil 101: A Primer for Applying LEDs and Other Components To Membrane Switches", published in the SGIA Journal, Second Quarter 2003 , Conductive adhesive can be used to contact the components. It is also described to use printed silver sheets as conductors and to use different adhesive materials for a component: a first adhesive for the electrical contacts, a second adhesive between these adhesives to prevent short circuits between the contacts and to fix the component to the foil , and a third adhesive that is poured over the component to absorb mechanical stresses.

Der erste, elektrisch leitfähige Kleber kann dabei ein sogenannter ”isotrop leitender” oder ein ”anisotrop leitender” Klebstoff sein. In einem isotrop leitenden Klebstoff befinden sich so viele Metallpartikel, dass sich diese Partikel berühren und ein elektrischer Strom innerhalb des Klebstofffilms sowohl parallel zur Folienoberfläche als auch zwischen der Folie (und der darauf befindlichen Leiterbahn) und dem Bauteil fliessen kann. In einem anisotrop leitenden Klebstoff befinden sich weniger elektrisch leitende Partikel; diese Partikel berühren sich nicht, sodass kein Strom parallel zur Folienoberfläche fliessen kann. Die Partikel sind größer als die Dicke der Klebstoffschicht, sodass die Leiterbahn auf der Folie und das Bauteil elektrisch miteinander verbunden sind.The first electrically conductive adhesive may be a so-called "isotropically conductive" or an "anisotropically conductive" adhesive. In an isotropically conductive adhesive, there are so many metal particles that these particles touch and an electrical current can flow within the adhesive film both parallel to the film surface and between the film (and the conductor track thereon) and the component. In an anisotropically conductive adhesive are less electrically conductive particles; these particles do not touch each other so that no current can flow parallel to the surface of the film. The particles are larger than the thickness of the adhesive layer, so that the conductor track on the film and the component are electrically connected to each other.

Zum Aushärten dieser Kleber kann ein Thermodenprozess eingesetzt werden. Dabei wird ein Stempel von oben unter Druck auf das Bauteil aufgedrückt, dann wird der Stempel und möglicherweise auch die Gegendruckplatte erhitzt und wieder abgekühlt. Anschließend wird der Stempel wieder abgenommen, das Bauteil und die Folie sind verklebt.For curing these adhesives, a thermode process can be used. In this case, a stamp is pressed from above under pressure on the component, then the stamp and possibly also the counter-pressure plate is heated and cooled again. Subsequently, the stamp is removed again, the component and the film are glued.

In US 2010/0288416 wird ein Verfahren beschrieben, bei dem ein oder mehrere Halbleiterchips mit einer Dicke unter 200 μm von einem Thermodenkopf mit einer Elastomerfläche auf einer flexiblen Leiterplatte befestigt werden. Dort wird weiter beschrieben, dass die Thermodenseite eine geringere Temperatur haben kann als die Platte, auf der die Folie aufgelegt wird. Schließlich wird erwähnt, dass auf diese Art auch weitere elektronische Bauteile befestigt werden können.In US 2010/0288416 For example, a method is described in which one or more semiconductor chips less than 200 μm thick are mounted on a flexible circuit board by a thermode head having an elastomer surface. There it is further described that the thermode side can have a lower temperature than the plate on which the film is placed. Finally, it is mentioned that in this way also other electronic components can be attached.

Bei Thermodenprozessen muss für jedes Bauteilform eine passende Thermode benutzt werden. Teilweise ist die Bauform so, dass nicht alle Kontakte von oben geheizt werden können (z. B. bei großen Bauteilhöhen oder Hochleistungs-LEDs). Auch Thermodenköpfe mit Elastomerteilen können nur geringe Höhenunterschiede zwischen verschieden dicken Chips ausgleichen.For thermode processes, a suitable thermode must be used for each component shape. Part of the design is such that not all contacts can be heated from above (eg with large component heights or high-power LEDs). Even thermo heads with elastomer parts can only compensate for small height differences between different thickness chips.

Aufgabetask

Der Erfindung liegt daher die Aufgabe zugrunde, mit einer Thermode eine Vielzahl von unterschiedlichen Bauteilen befestigen zu können, insbesondere mehrere verschiedene Bauteile gleichzeitig befestigen zu können.The invention is therefore based on the object with a thermode to attach a variety of different components, in particular to be able to attach several different components at the same time.

Lösungsolution

Die Aufgabe wird dadurch gelöst, dass die Bauteile von einem Schaum an der Oberfläche fixiert werden. Die Energie, die das Haftmaterial aushärtet, wird durch den Träger hindurch zugeführt.The object is achieved in that the components are fixed by a foam on the surface. The energy that hardens the adhesive material is supplied through the carrier.

Vorteileadvantages

Ein Vorteil der Erfindung besteht darin, dass der Schaum sich flexibel dem bearbeiteten Bauteil anpassen kann. Es ist daher nicht mehr nötig, für eine Vielzahl von verschiedenen Gehäuseformen passende Thermodenköpfe vorrätig zu halten und für den Kontaktierungsprozess einzeln einzurichten. Der für eine sichere elektrische Verbindung benötigte Druck wird durch den Schaum gleichmäßig aufrechterhalten. Da der Druck innerhalb des Schaums verteilt wird, ist es nicht nötig, die Andruckkraft passend zur Kontaktfläche der Bauteile einzustellen. So können sowohl sehr dünne (unter 400 μm) als auch dicke (über 5 mm) Bauteile mit dem gleichen Werkzeug bearbeitet werden.An advantage of the invention is that the foam can adapt flexibly to the machined component. It is therefore no longer necessary to keep suitable thermode heads in stock for a large number of different housing shapes and to set them up individually for the contacting process. The for A secure electrical connection needed pressure is maintained evenly by the foam. Since the pressure is distributed within the foam, it is not necessary to adjust the pressing force to match the contact surface of the components. Thus, both very thin (under 400 microns) and thick (over 5 mm) components can be processed with the same tool.

Insbesondere ist es über die Erfindung möglich, eine komplette Schaltung aus vielen verschiedenen Bauteilen in einem Arbeitsschritt zu bearbeiten. Die Bearbeitungsgeschwindigkeit erhöht sich damit, insbesondere wird eine Rolle-zu-Rolle Fertigung deutlich beschleunigt. Das ermöglicht Kosteneinsparung.In particular, it is possible via the invention to process a complete circuit of many different components in one step. The processing speed increases, in particular, a roll-to-roll production is significantly accelerated. This allows cost savings.

Wenn als Träger eine Folie benutzt wird, besteht ein weiterer Vorteil darin, dass der Wärmetransport durch die Folie effizienter ist als durch das Bauteil. Dies führt auch dazu, dass die thermische Belastung für das Bauteil geringer ist als wenn der Klebstoff über das Bauteil geheizt wird. Dieser Vorteil wird um so größer, je dünner der Träger und je dicker das Bauteil ist.When a film is used as a carrier, another advantage is that the heat transfer through the film is more efficient than through the component. This also means that the thermal load on the component is lower than when the adhesive is heated via the component. This advantage is the greater, the thinner the carrier and the thicker the component.

Verschiedene AusgestaltungsmöglichkeitenVarious design options

Das Haftmaterial, das die Bauteile am Träger befestigt, kann unter anderem eine Lotpaste sein, die Temperaturen über 150°C benötigt, um aus dem pastösen Zustand flüssig zu werden und die dann beim Abkühlen erstarrt. Auch verschiedene Klebstoffe sind möglich, die unterschiedlich aushärten können: thermisch (wobei die Wärme über Kontakt zugeführt wird, über Heißluft oder über IR-Strahlung), über UV-Strahlung oder Elektronenstrahlung oder über Chemikalien wie den Wasserdampf in der Umgebungsluft (z. B. Cyanoacrylate).Among other things, the adhesive material which fixes the components to the carrier may be a solder paste which requires temperatures above 150 ° C. to liquefy from the pasty state and which then solidifies on cooling. Various adhesives are also possible, which can cure differently: thermally (the heat being supplied via contact, via hot air or via IR radiation), via UV radiation or electron radiation or via chemicals such as the water vapor in the ambient air (eg. cyanoacrylates).

Die elektrische Leitung kann auf unterschiedliche Weise hervorgerufen werden: der Klebstoff kann anisotrop oder isotrop leitend sein; er kann aber auch nicht leitend sein, dann berühren sich leitende Strukturen auf der Trägerseite und der Bauteilseite, der Klebstoff bewirkt die mechanische Stabilität der Verbindung.The electrical conduction can be caused in different ways: the adhesive can be anisotropic or isotropic conductive; but it can also not be conductive, then touch conductive structures on the support side and the component side, the adhesive causes the mechanical stability of the compound.

Besonders vorteilhaft ist es, wenn nach dem ersten schnellen Härteschritt, der die Bauteile grob fixiert, eine weitere Reaktion abläuft, die den Klebstoff weiter härtet, ohne dass das Produkt aktiv bearbeitet werden muss.It is particularly advantageous if, after the first rapid hardening step, which coarsely fixes the components, a further reaction takes place, which further hardens the adhesive without the product having to be actively worked.

Mögliche Träger für die Bauteile sind zum Beispiel starre Platinen (zum Beispiel aus Epoxidharzen, mehrschichtige Aufbauten aus Keramik- und Metalllagen), flexible Folien (zum Beispiel aus PE, PET, PEN, PES, PA, PI), Papier oder mehrschichtige Aufbauten aus Einzellagen (zum Beispiel beschichtete Papiere, Laminate aus Kunststoff- und Metallfolien).Possible supports for the components are, for example, rigid circuit boards (for example of epoxy resins, multilayer structures of ceramic and metal layers), flexible films (for example of PE, PET, PEN, PES, PA, PI), paper or multilayer structures of individual layers (For example, coated papers, laminates of plastic and metal foils).

Geeignete Bauteile sind zum Beispiel kleine Spritzgussteile, elektronische Bauteile wie SMD-Chips, Schalter, Batterien, Anzeigeelemente, Beleuchtungselemente, Sensoren, Aktoren, die unterschiedlich kombiniert werden.Suitable components are, for example, small injection-molded parts, electronic components such as SMD chips, switches, batteries, display elements, lighting elements, sensors, actuators, which are combined differently.

In den Unteransprüchen sind weitere vorteilhafte Ausgestaltungen der Erfindung angegeben.In the subclaims further advantageous embodiments of the invention are given.

Zeichnungendrawings

Einige Ausführungsbeispiele der Erfindung werden nachstehend anhand der Figuren beschrieben:Some embodiments of the invention are described below with reference to the figures:

1 zeigt eine erste Ausführungsform des Verfahrens anhand von Längsschnitten der bearbeiteten Produkte. 1 shows a first embodiment of the method based on longitudinal sections of the processed products.

2 zeigt eine weitere Ausführungsform des Verfahrens anhand von Längsschnitten der bearbeiteten Produkte. 2 shows a further embodiment of the method based on longitudinal sections of the processed products.

3 zeigt eine dritte Ausführungsform des Verfahrens anhand einer schematischen Darstellung einer Maschine, die das Verfahren anwendet. 3 shows a third embodiment of the method with reference to a schematic representation of a machine that uses the method.

4 zeigt eine vierte Ausführungsform des Verfahrens anhand einer schematischen Darstellung einer Maschine, die das Verfahren anwendet. 4 shows a fourth embodiment of the method with reference to a schematic representation of a machine that uses the method.

1a) zeigt eine Polyimid-Folie (100) mit Leiterbahnen aus Kupfer (110). Auf die Kontaktstellen der Leiterbahnen wurde im Schablonendruck eine Lotpaste (120) aufgetragen und ein SMD-Bauteil (140) mit Beinen (130) aufgesetzt. 1a) shows a polyimide film ( 100 ) with conductor tracks made of copper ( 110 ). On the contact points of the tracks was in stencil printing a solder paste ( 120 ) and an SMD component ( 140 ) with legs ( 130 ).

In Teilbild 1b) ist das SMD-Bauteil (140) von einem Schaum (150) auf die Folie (100) angedrückt und die Folie (100) ist auf eine Platte (160) aufgelegt. Durch den Druck, den der Schaum (150) auf das Bauteil (140) ausübt, wurden die Beine (130) in die Lotpaste (120) hereingedrückt.In figure 1b) the SMD component ( 140 ) of a foam ( 150 ) on the film ( 100 ) and the film ( 100 ) is on a plate ( 160 ) hung up. By the pressure the foam ( 150 ) on the component ( 140 ), the legs ( 130 ) in the solder paste ( 120 ) pressed in.

Über die Platte (160) wird die Folie geheizt, sodass das Lot flüssig wird und die Beine (130) des Bauteils (140) sowie die Leiterbahnen (110) benetzt. Da das Bauteil (140) vom Schaum (150) fixiert wird, wird es sich beim Verflüssigen des Lotes nicht aufrichten (tombstoning).About the plate ( 160 ) the film is heated so that the solder becomes liquid and the legs ( 130 ) of the component ( 140 ) as well as the tracks ( 110 ) wets. Because the component ( 140 ) from the foam ( 150 ) is fixed, it will not straighten up when liquefying the solder (tombstoning).

Dann wird die Platte (160) gekühlt, der Schaum (150) hält das Bauteil (140) in seiner Position auf der Folie (100), bis das Lot fest ist. Schließlich wird der Schaum (150) vom Bauteil (140) abgehoben und die Platte (160) von der Folie entfernt.Then the plate ( 160 ) cooled, the foam ( 150 ) holds the component ( 140 ) in its position on the slide ( 100 ) until the solder is firm. Finally, the foam ( 150 ) of the component ( 140 ) and the plate ( 160 ) removed from the film.

In 2a) ist eine PET Folie (200) dargestellt, auf die Leiterbahnen (210) im Siebdruck aus Silberleitpaste aufgetragen wurden. Auf die Kontaktstellen der Leiterbahnen wurde aus einer Dosiernadel ein isotrop leitfähiger Klebstoff aufgetragen (220), auf eine Stelle zwischen den Kontaktstellen wurde ein nichtleitender Klebstoff (230) aufgetragen. Beide Klebstoffe härten unter Wärmezufuhr in kurzer Zeit aus. In 2a) is a PET film ( 200 ), on the printed conductors ( 210 ) were screen printed from silver conductive paste. An isotropically conductive adhesive was applied from a dispensing needle to the contact points of the printed conductors ( 220 ), to a point between the contact points was a non-conductive adhesive ( 230 ) applied. Both adhesives cure under heat in a short time.

In 2b) wurde das Bauteil (240) aufgesetzt. Der nichtleitende Klebstoff (230) verhindert dabei, dass die leitenden Klebstofftropfen (220) beim Aufsetzen ineinanderfliessen und einen Kurzschluss zwischen den Kontaktflächen erzeugen.In 2 B) became the component ( 240 ). The non-conductive adhesive ( 230 ) prevents the conductive adhesive drops ( 220 ) flow into each other during placement and create a short circuit between the contact surfaces.

In 2c) wurde die Folie auf eine Heizplatte (260) aufgelegt und ein Schaum (250) auf das Bauteil (240) aufgedrückt. Die Hitze der Platte bewirkt nun, dass die Klebstoffe aushärten. Die Klebstoffe (220, 230) sind nun auch im heißen Zustand schon fester als vorher, daher wird das Bauteil (240) beim Entfernen der Folie (200) von der Heizplatte (260) nicht abgelöst.In 2c) the film was placed on a hot plate ( 260 ) and a foam ( 250 ) on the component ( 240 ). The heat of the plate now causes the adhesives to harden. The adhesives ( 220 . 230 ) are now even in the hot state already stronger than before, therefore, the component ( 240 ) when removing the film ( 200 ) from the heating plate ( 260 ) not detached.

Bei dem Verfahren gemäß Zeichnung 2a) bis 2c) können auch temperaturempfindlichere Folien (z. B. aus PET, PE, PEN, Papier, PES) benutzt werden, die im Lotverfahren nicht einfach nutzbar sind.In the method according to drawing 2a) to 2c), more temperature-sensitive films (eg made of PET, PE, PEN, paper, PES) can also be used, which are not easy to use in the soldering process.

Da thermisch aushärtende Klebstoffe nicht abkühlen müssen, um Leiterbahn und Bauteilbeine miteinander zu verbinden, ist es nicht nötig, die Folie abkühlen zu lassen, bevor der Schaum, die Folie mit den befestigten Bauteilen, und die Heizplatte voneinander getrennt werden.Since thermosetting adhesives do not have to cool down to bond the conductor track and component legs together, it is not necessary to allow the film to cool before the foam, the film with the fastened components, and the heating plate are separated.

3 stellt eine weitere Ausgestaltung des Verfahrens anhand der Prinzipskizze einer Maschine dar, die das Verfahren anwendet. Eine Folie wird dabei in einer Abwickeleinheit (Ab) von einer Rolle abgewickelt und den weiteren Schritten zugeführt. Zunächst werden verschiedene Schichten im Flachbett-Siebdruck (D1, D2, D3) aufgetragen. Für den Siebdruck muss das Band regelmäßig angehalten werden, während das Material auf die Folie übertragen wird. Mögliche Schichten, die in diesen Druckwerken aufgetragen werden, sind:

  • – graphische Elemente,
  • – Leiterbahnen
  • – Widerstände
  • – Isolationen
  • – Sensoren
  • – Photovoltaik-Zellen
  • – druckbare Batterien
  • – organische Leuchtdioden
  • – Piezoelektrische Elemente
3 represents a further embodiment of the method based on the schematic diagram of a machine that uses the method. A film is unwound from a roll in an unwinding unit (Ab) and fed to the further steps. First, different layers are applied in flatbed screen printing (D1, D2, D3). For screen printing, the tape must be regularly stopped while the material is transferred to the film. Possible layers that are applied in these printing units are:
  • - graphic elements,
  • - Tracks
  • - Resistances
  • - Isolations
  • - Sensors
  • - Photovoltaic cells
  • - printable batteries
  • - organic light emitting diodes
  • - Piezoelectric elements

Im Anschluss an die druckbaren Elemente wird mit einem Klebstoffdispenser (K) ein unter UV-Licht aushärtender Leitkleber auf die Kontaktstellen aufgebracht. Danach werden in einem Bestückungsmodul (B) die elektronischen Bauteile aufgesetzt.Following the printable elements, an adhesive dispenser (K) is used to apply a UV-curing conductive adhesive to the contact points. Thereafter, the electronic components are placed in a component module (B).

Im nächsten Schritt werden eine UV-transparente Platte (P) und eine Schaumplatte (5) von unten bzw. oben auf die Folie gedrückt, dabei wird der Klebstoff durch die Platte (P) und die Folie hindurch von UV-Licht aktiviert und teilausgehärtet. Die weitere Aushärtung des Klebstoffs, insbesondere in den Bereichen, die von den Leiterbahnen verschattet waren, findet langsamer statt, wenn die Bauteile die Anlage verlassen haben.In the next step, a UV-transparent plate (P) and a foam plate ( 5 ) is pressed from the bottom or top of the film, while the adhesive through the plate (P) and the film is activated by UV light and partially cured. The further curing of the adhesive, especially in the areas which were shaded by the tracks, takes place more slowly when the components have left the plant.

Schließlich wird die Folie mit den bedruckten Elementen und den verklebten Bauteilen auf einer Aufwickeleinrichtung (Af) zu einer Rolle aufgewickelt. Alternativ ist es auch möglich, die Folie in Bögen oder in Nutzen zu schneiden.Finally, the film with the printed elements and the bonded components on a take-up device (Af) is wound into a roll. Alternatively, it is also possible to cut the sheet into sheets or in use.

Beim hier beschriebenen Verfahren werden die druckbaren elektronischen Elemente in der gleichen Geschwindigkeit produziert, in der die weiteren elektronischen Bauteile bestückt werden und die Aushärtung stattfindet, da alle Schritte während eines Durchlaufs einer Folienbahn durch eine Maschine stattfinden. Diese Schritte können aber auch auf getrennten Maschinen stattfinden, dann können die einzelnen Prozessschritte auch unterschiedlich schnell ablaufen.In the method described here, the printable electronic elements are produced at the same speed as the other electronic components are loaded and the curing takes place, since all the steps take place during a passage of a film web through a machine. However, these steps can also take place on separate machines, then the individual process steps can also take place at different speeds.

In 4 ist eine weitere Maschine skizziert, die das Verfahren anwendet. Wieder wird eine Folie von einer Abwickeleinheit (Ab) den weiteren Modulen zugeführt. Die Folie ist in dieser Maschine schon mit flächigen elektronischen Elementen, zumindest Leiterbahnen, ausgestattet.In 4 is outlined another machine that uses the method. Again, a film is fed from one unwinding unit (Ab) to the other modules. The film is already equipped in this machine with flat electronic elements, at least tracks.

Ein anisotrop leitender Kleber wird als Folienfilm aufkaschiert (LK) und die Abdeckung des Klebers abgezogen. In einem Bestückungmodul (B) werden Bauteile aufgesetzt, die zunächst durch den Klebefilm in ihrer Position festgehalten werden.An anisotropic conductive adhesive is laminated as a film film (LK) and the cover of the adhesive removed. In an assembly module (B) components are placed, which are initially held by the adhesive film in position.

Danach wird ein Schaum (S) aufkaschiert. Der Schaum haftet an der folienzugewandten Seite am Leitklebefilm, auf der folienabgewandten Seite ist ein weiterer Klebstofffilm und eine Abdeckfolie aufgetragen.Then a foam (S) is laminated on. The foam adheres to the foil-facing side of the Leitklebefilm, on the side facing away from the film another adhesive film and a cover film is applied.

Der Verbund aus Folie, Bauteilen und Schaum wird dann über eine beheizte Rolle (R) geführt. Der Druck auf die Bauteile wird dabei dadurch erzeugt, dass die Schaumaußenseite gedehnt werden muss. Die Dehnung der oberen Abdeckfolie bewirkt eine Kraft in Richtung auf die beheizte Rolle (R), sodass keine weitere Andruckrolle benötigt wird.The composite of film, components and foam is then passed over a heated roller (R). The pressure on the components is thereby generated that the foam outside must be stretched. The stretching of the top cover causes a force in the direction of the heated roller (R), so that no further pressure roller is needed.

(Wenn die Rolle nur auf der Unterseite beheizt wird, kühlt sie bei einem Stillstand der Maschine ab, sodass das Material auf der Oberseite weniger stark belastet wird.)(If the roll is only heated on the bottom, it cools when the machine is at a standstill Machine so that the material on the top is less heavily loaded.)

Anschließend werden in einer Stanze (ST) einzelne Nutzen aus der Folie und dem Schaum ausgestanzt. Dabei wird die Abdeckfolie auf dem Schaum nicht durchgestanzt.Subsequently, in a punch (ST) individual benefits are punched out of the foil and the foam. The cover film is not punched through on the foam.

Im nächsten Schritt werden die nicht benötigten Teile der Basisfolie und des Schaums entgittert (EG), die Abdeckfolie des Schaums (450) ist dann die zusammenhängende Folienbahn, auf der sich klebend ausgestattete Nutzen (400) befinden.In the next step, the unneeded parts of the base film and the foam are de-icing (EG), the cover of the foam ( 450 ) is then the coherent film web on which adhesive benefits ( 400 ) are located.

Abschliessend wird diese Folie auf einer Aufwickeleinrichtung (Af) zu einer Rolle gewickelt.Finally, this film is wound on a take-up device (Af) into a roll.

In Teilbild 4b) ist ein Nutzen, wie er mit diesem Verfahren hergestellt wurde, dargestellt. Die bedruckte Folie (410) wurde mit elektronischen Bauteilen (420) bestückt. Die Unebenheiten aufgrund der Bauteile werden durch einen Schaum (430) ausgeglichen. Der Schaum (430) ist auf der den Bauteilen abgewandten Seite mit einem Haftklebstoff (440) ausgestattet. Der Haftklebstoff klebt auf einer silikonisierten Abdeckfolie (450), von der er einfach wieder abgezogen werden kann, um den Nutzen (400) an einer anderen Stelle aufzukleben.Part 4b) shows a benefit as produced by this method. The printed foil ( 410 ) was equipped with electronic components ( 420 ) equipped. The unevenness due to the components is caused by a foam ( 430 ) balanced. The foam ( 430 ) is on the side facing away from the components with a pressure sensitive adhesive ( 440 ) fitted. The pressure-sensitive adhesive sticks to a siliconized cover foil ( 450 ), from which it can easily be deducted again to the benefit ( 400 ) stick in another place.

Bei diesem Verfahren wird der Schaum nach seiner Verwendung beim Verkleben weiterbenutzt, um die Unebenheiten durch die Bauteile auszugleichen. Der resultierende Aufbau hat damit zwei ebene Oberflächen.In this method, the foam is used after its use in bonding to compensate for the bumps through the components. The resulting structure thus has two flat surfaces.

ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION

Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Zitierte PatentliteraturCited patent literature

  • US 2010/0288416 [0008] US 2010/0288416 [0008]

Zitierte Nicht-PatentliteraturCited non-patent literature

  • ”SMD an Foil 101: A Primer For Applying LEDs And Other Components To Membrane Switches”, veröffentlicht im SGIA Journal, Second Quarter 2003 [0005] "SMD to Foil 101: A Primer For Applying LEDs and Other Components To Membrane Switches", published in the SGIA Journal, Second Quarter 2003 [0005]

Claims (10)

Verfahren zur Befestigung von Bauteilen auf einer Folie, bei dem 1. mindestens ein Bauteil so auf einer Folie positioniert wird, dass sich zwischen dem Bauteil und der Folie ein Haftmaterial befindet, 2. das mindestens eine Bauteil mit einem nachgiebigen Schaum auf die Folie angedrückt wird, 3. das Haftmaterial aus einem duktilen in einen gehärteten Zustand überführt wird.Method for fixing components on a foil, in which 1. at least one component is positioned on a film in such a way that there is an adhesive material between the component and the film, 2. the at least one component is pressed onto the film with a flexible foam, 3. the adhesive material is transferred from a ductile to a cured state. Verfahren nach Anspruch 1), wobei die Energie zum Härten des Haftmaterials durch die Folie zugeführt wird.The method of claim 1), wherein the energy for curing the adhesive material is supplied through the film. Verfahren nach einem der vorhergehenden Ansprüche, wobei es sich bei den Bauteilen um elektronische Bauelemente, z. B. SMT-Bauteile, handelt.Method according to one of the preceding claims, wherein the components are electronic components, for. As SMT components, is. Verfahren nach einem der vorhergehenden Ansprüche, wobei das Haftmaterial eine Lotpaste ist.Method according to one of the preceding claims, wherein the adhesive material is a solder paste. Verfahren nach einem der vorhergehenden Ansprüche, wobei das Haftmaterial ein Leitkleber ist.Method according to one of the preceding claims, wherein the adhesive material is a conductive adhesive. Verfahren nach Anspruch 5), wobei der Leitkleber in Form von Klebepunkten aufgebracht wird.The method of claim 5), wherein the conductive adhesive is applied in the form of adhesive dots. Verfahren nach Anspruch 5), wobei der Leitkleber als Klebefilm aufgebracht wird.The method of claim 5), wherein the conductive adhesive is applied as an adhesive film. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Schaum durch Zugabe von Füllstoffen hitzestabilisiert wurde.Method according to one of the preceding claims, wherein the foam was heat stabilized by the addition of fillers. Verfahren nach einem der vorhergehenden Ansprüche, wobei das Haftmaterial unter mehreren Bauteilen unterschiedlicher Abmessungen gleichzeitig gehärtet wird.Method according to one of the preceding claims, wherein the adhesive material is cured simultaneously under a plurality of components of different dimensions. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Schaum auf der Folie verbleibt.Method according to one of the preceding claims, wherein the foam remains on the film.
DE102011109938A 2011-03-29 2011-08-10 Attaching components on a film, comprises positioning a component on film, pressing a component with flexible foam on the film and transferring the adhesive material from ductile to hardened state Withdrawn DE102011109938A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0708583A1 (en) * 1994-10-21 1996-04-24 Robert Bosch Gmbh Electronic apparatus and its manufacture
DE19739591A1 (en) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclable circuit board, consisting of a foil and carrier system
US20100288416A1 (en) 2007-12-10 2010-11-18 Sony Chemical & Information Device Corporation Method and apparatus for mounting electric component

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0708583A1 (en) * 1994-10-21 1996-04-24 Robert Bosch Gmbh Electronic apparatus and its manufacture
DE19739591A1 (en) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclable circuit board, consisting of a foil and carrier system
US20100288416A1 (en) 2007-12-10 2010-11-18 Sony Chemical & Information Device Corporation Method and apparatus for mounting electric component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"SMD an Foil 101: A Primer For Applying LEDs And Other Components To Membrane Switches", veröffentlicht im SGIA Journal, Second Quarter 2003

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