DE102011016519B4 - Device for processing a workpiece by means of a high-energy machining beam - Google Patents

Abstract

Device for processing a workpiece (20) with a high-energy machining beam (14), comprising
a machining beam source (10, 12),
a surveillance camera (24) for generating an electronically evaluable image,
an evaluation unit (36) for evaluating the image,
a focus lens (18) for focusing the machining beam (14) on an impact location (A) on the surface of the workpiece (20) and for focusing the surveillance camera (24) on the impact location (A),
a drive device (32) for displacing the focus lens (18) perpendicular to its optical axis,
a spatially resolving sensor device for generating the position of a target impact point (N) of the workpiece (20) containing data, and
a device for merging this data with the electronically evaluable image recorded by the surveillance camera (24).

Description

The invention relates to a device for machining a workpiece by means of a high-energy machining beam.

Welding, cutting or cutting operations can be carried out precisely with focused on a surface of a workpiece to be machined high-energy processing beams, such as electron beams or laser beams. In this case, an online quality control of the respective processing by electronic evaluation of an image of the point of impact of the machining beam on the workpiece is possible. Prerequisite for a good quality control is a meaningful image of the point of impact, whereby in many cases of application the actual point of impact must coincide with a target point of impact, for example a joint between two workpieces. Further, there is often the need to additionally have an image of the point of impact for a perfect quality control, which is not generated by backscattering of the processing beam, but which is produced by illuminating the point of impact with a focused on the point of incidence illumination beam.

From the DE 20 2007 018 689 U1 is a system for active readjustment of the focus position in optics for high-power laser radiation for laser material processing is known, which includes a sensor for detecting the focus position and a control computer, which processes the sensor data and determines correction data corresponding to which at least parts of the optics for changing the focus position in parallel be moved to the optical axis.

From the WO 2011/009594 A1 is a laser processing head with a camera with an arranged in front of the camera in the beam path imaging optics for observing a processing region of a workpiece to be machined by means of the laser beam workpiece known. Focusing optics serve to focus the laser beam on the workpiece surface, and an evaluation unit is designed to adjust the imaging optics with a change in their focal length in the direction of their optical axis in order to focus the camera image again. A change in the focal length can be caused by a warming of the focusing optics.

From the DE 10 2009 057 209 A1 is a equipped with a scanner optics device for material processing by laser, in particular for laser welding, known. The device includes an image sensor which is movable with the scanner optics and which is optically integrated into a partial region of the beam path of the scanner optical system beginning with the processing position on the workpiece, and at least one projector which is movable with the scanner optics and serves to generate measurement light Form of measuring structures to project on the workpiece to be machined. The image sensor is sensitive in the wavelength range of the measurement light emitted from the projector and on the side of a deflection unit facing away from the beam path, which is transparent to the wavelength range of the light emitted from the projector and reflects light of the wavelength range of the light emitted from the processing laser.

The EP 1 567 301 B1 describes a processing apparatus in which a processing beam passes through a dichroic mirror onto a focus lens which focuses it onto a workpiece surface. By means of the dichroic mirror, a line through the focus lens is projected into the processing beam from a light source at a small distance from the point of impact to produce a highlighter mark. The highlighter is projected through a mirror onto an imager. With the help of the image generated by the image converter of the highlighter, the processing point can be moved along a desired path on the object surface. For this purpose, the focus lens is adjustable in a direction parallel to the workpiece surface and in a direction perpendicular to the workpiece surface and the entire device is pivotable about an axis. The observation beam path from the highlighter to the image converter is oblique to the beam path of the processing beam, so that the shape and position of the highlighter, which depends on the geometry of a joining edge to be welded, is changed by changing, for example, the angle of incidence of the observation beam path on the workpiece surface. If the focus line deforms as a result of heating due to the high power of the processing beam, this causes the highlighter both shifts in position and changed in terms of their geometry, so that the processing beam is tracked according to the modified highlighter, although the location of the Joining edge has remained unchanged.

The invention has for its object to provide a device for machining a workpiece by means of a high-energy machining beam, which allows good conditions for quality control of the machining of the workpiece with simple implementation.

A solution of the above object is achieved with a device according to claim 1.

The device according to claim 1 is further developed with the features of the subclaims 2 to 6 in an advantageous manner.

The invention enables by the movement of a lens irradiated by the processing beam or the illumination beam a controlled displacement of the point of impact of the processing beam on the workpiece or the illuminated spot of the workpiece along the surface of the workpiece, whereby an online tracking of the processing beam according to a predetermined Machining path on the surface of the workpiece or a tracking of the illumination beam such that the point of impact is illuminated, is possible. The control of the movement is preferably carried out by electronic evaluation of a spatially resolving image of a region of the workpiece surface, which contains the point of impact of the machining beam and optionally additionally the illumination field of an illumination beam and / or a target impact point of the machining beam as the workpiece to be machined. In addition, the invention makes it possible to monitor the quality of the machining of the workpiece with the machining beam.

The invention is explained below with reference to schematic drawings, for example, and with further details.

• 1 eine Prinzipansicht einer Vorrichtung zur Bearbeitung eines Werkstücks mittels eines hochenergetischen Bearbeitungsstrahls,
• 2 eine abgeänderte Ausführungsform einer Bearbeitungsvorrichtung, und
• 3 eine weitere Ausführungsform einer Bearbeitungsvorrichtung, die nicht alle beanspruchten Merkmale zeigt.

In the figures represent:

• 1 a schematic view of an apparatus for machining a workpiece by means of a high-energy machining beam,
• 2 a modified embodiment of a processing device, and
• 3 a further embodiment of a processing apparatus, which does not show all the claimed features.

1 shows schematically in side view a first embodiment of an apparatus for processing a workpiece by means of a high-energy machining beam.

In the example shown is made of an optical fiber 10 emerging high-energy laser light from a collimator, such as a collimator lens, in a preferably at least approximately parallel processing beam 14 transformed. The processing beam 14 is from a preferably dichroic mirror 16 preferably parallel to the optical axis O a focus lens 18 reflected. In the focal plane of the focus lens 18 is one with the processing beam 14 workpiece to be machined 20 , After passing through the focus lens 18 the machining beam is applied to the surface of the workpiece 20 focused or bundled and meets in a place of impact A on the workpiece.

On the of the focus lens 18 opposite side of the mirror 16 there is an optic 22 a total of 24 designated surveillance camera with a sensor field 26 for recording an electronically storable and evaluable image. The security camera 24 is oriented so that its optical axis O with the center line M of the mirror 16 to the focus lens 18 mirrored processing beam coincides. The optics 22 is set so that parallel incident light on the sensor field 26 is focused.

The focus lens 18 is inside a stationary bracket 30 by means of a drive device 32 perpendicular to the midline M or optical axis O movable.

On the bracket 30 is a route guidance camera 34 with integrated light source for illuminating the surface of the workpiece 20 assembled. The destination guide camera 34 contains an image plate or a sensor field for receiving an electronically evaluable, spatially resolving image of the workpiece surface.

For the evaluation and control of the various devices is an electronic evaluation and control unit 36 whose entrances 38 with the sensor field 26 the security camera 24 and the sensor field of the guidance camera 34 are connected and their outputs 40 with the drive device 32 and the light source 35 are connected.

The function of the device is for example as follows:

First, assume the focus lens 18 find themselves in a position in which their optical axis O with the center line M of the machining beam 14 coincides. The processing beam 14 is then on a point of impact A on the surface of the workpiece 20 focussed, which does not correspond to a desired point of impact or processing, for example one on the workpiece 20 existing seam or joint, hereinafter referred to as the processing line or point to be processed or target point of impact N is designated and which is to be welded or processed with the processing beam, such as a high-energy laser beam. The processing line N may also be a line along which the workpiece surface is to be remelted or hardened.

Before the start of processing is by the unit 36 controls the light source 35 switched on and the laser (not shown) for generating the processing beam briefly activated with reduced power. The destination guide camera 34 thus takes an image of the surface of the workpiece 20 on, on which the processing line N and the point of impact A of the reduced power beam 14 are visible. In the evaluation and control unit 36 be the distance between the point of impact A and the processing line N and determines the direction of the distance and generates a control signal with which the drive device 32 is actuated such that the focus lens 18 according to 1 around the distance a, which is the distance between the point of impact A at with the midline M coincident optical axis O and the processing line N corresponds, is moved. In the example shown are A and N in the paper plane. With 2-dimensional adjustability of the focus lens 18 the distance can be any direction in the plane perpendicular to the optical axis O to have. In the illustrated position of the focus lens 18 falls the point of impact A with the processing line N together, leaving from the unit 36 the unillustrated laser can be activated at full power and the processing of the processing line N with the help of the processing beam 14 can be done.

By means of the explained displaceability of the focus lens 18 perpendicular to the direction of the machining beam can thus misalignments between the workpiece 20 and the machining device are balanced and without a relative movement between the workpiece 20 and the processing device containing the surveillance camera 24 and the guidance camera 34 , the mirror 16 , the collimator 12 , the holder 30 with drive device 32 and the focus lens 18 Contains an adjustment of the point of impact A be made over a range caused by the displaceability of the focus lens 18 inside the holder 30 are limited.

The quality of the processing, for example a laser welding or a laser cut, can be achieved by evaluating the data from the surveillance camera 24 recorded image of the impact site A done online, with the geometric size of the point of impact A , the color of the point of impact A , the brightness without and with additional illumination, the reflection profile of the light reflected in the direction of the camera and possibly other variables conclusions about the quality of welding and the location of the point of impact relative to the desired processing point, for example the processing line N , allow.

The device described can be modified in many ways. For example, an illumination source (not shown) connected to the lens can be provided, which generates an illumination field in the focal point of the lens and thus the respective point of impingement of the processing beam, so that on the sensor field 26 the security camera 24 Images of the respective processing point can be generated, which are generated by the reflected or backscattered radiation of the processing beam and / or from the secondary radiation resulting from the processing and, from another angle, are generated by the illumination beam. The evaluation of these images allows particularly good conclusions about the quality of the processing.

In the presence of such a relatively strong illumination source, which generates a lighting field at the point of impact of the processing beam, the guidance camera can 34 omitted when from the surveillance camera 24 an image is taken, which is the illumination field, in the middle of which the impact site A lies, and the processing line N shows. By evaluating this image, the point of impact can coincide with the processing line N to be brought. Furthermore, such an image allows the use of the surveillance camera 24 also as a guidance camera, because in the picture not only the point of impact A but also an area of the processing line N is visible, along which the point of impact is to be guided.

An illumination source can be completely eliminated if the image analysis of the surveillance camera not only allows the quality control of the processing but also a local match of the processing point with a target processing point, such as the processing line. The focus line 18 is adjusted accordingly if there is no match.

If the length of the processing line N , along which a processing is to take place, the adjustment of the focus lens 18 may exceed the evaluation of the image of the surveillance camera 24 be used to control a drive device, not shown, with the machining device as a whole relative to the workpiece 20 can be moved.

The drive device 32 may be formed such that the focus lens 18 relative to the bracket 30 is only linearly displaceable, or that they are in the whole to the optical axis O vertical plane is displaceable. In addition, the focus lens 18 parallel to the optical axis O be movable to distance tolerances to the surface of the workpiece 20 compensate.

In the illustrated embodiment, the only focus lens is 18 movable. It goes without saying that it is also possible to use optical systems with a plurality of lenses, of which at least one is displaceable in the transverse direction of the optical axis of the lens system.

For accurate recognition of any structures on the surface of the workpiece 20 can the light source 35 the surface of the workpiece 20 in a manner known per se with structured light, For example, a line grid, illuminate. A seam, step or edge on the workpiece 20 can then be determined more easily by electronic image analysis.

The position of a joining edge or other processing line to be machined on the workpiece 20 does not necessarily have to be determined by optical image analysis, but can be detected for example with a spatially resolving eddy current sensor and electronically from the sensor field 26 superimposed on the captured image. Other sensors, such as capacitive sensors, ultrasonic sensors, etc. as well as contact sensors are possible.

The light source 35 and their arrangement can be varied in many ways. For example, around the focus lens 18 several light sources are arranged around.

A high intensity illumination light source used to produce an image of the processing site or point of impact A used in the surveillance camera can be designed such that their light, for example, a semi-transparent mirror in the processing beam 14 is coupled, wherein the illumination light need not be parallel, but the coupled illumination beam can have a slight divergence, so that on the workpiece surface 20 one in comparison to the point of impact A the processing beam larger illumination field is formed, the displacement of the focus lens 18 migrates.

2 shows one opposite 1 modified embodiment of the device, which differs from that of the 1 this distinguishes the dichroic mirror 16 missing and one in the security camera 24 reaching imaging beam path 42 parallel to the processing beam 14 is and according to the distance from the machining beam 14 through the focus lens 18 passes. For the sake of simplicity missing in 2 the evaluation and control unit 36 , the route guidance camera 34 and the holder 30 , For those of 1 corresponding components are in 2 the same reference numerals as in 1 used. The functionality of the embodiment of the device according to 2 corresponds to the 1 ,

In 2 is an additional element 44 drawn, for example, a welding wire whose front end to the processing line N is introduced and from the guidance camera 34 ( 1 ) and / or security camera 24 is detected as a target impact point of the machining beam.

3 shows a further embodiment of a processing device. For those of 1 corresponding components are in 3 the same reference numerals as in 1 used. In contrast to 1 contains the embodiment according to 3 a remote processing device, such as a laser welding device 50 in which at a common frame to an optical fiber 10 or an optical waveguide connectable collimator 12 , the dichroic mirror 16 , the camera 24 and the focus lens 18 are arranged. In contrast to the embodiment according to 1 becomes the processing beam 14 from the dichroic mirror 16 not directly on the focus lens 18 reflected, but passes through two more mirrors 52 and 54 , which are two axes preferably perpendicular to each other from a pivoting device 56 are pivotable, by the fixed in this embodiment focus lens 18 through to the surface of the workpiece 20 , By controlled pivoting of the mirror 52 and 54 can be the point of impact A at the on the surface of the workpiece 20 focused machining beam 14 on the surface of the workpiece 20 impinges along a predetermined path across the surface of the workpiece 20 to be moved. That from the point of impact A backscattered or reflected light reaches the sensor field 26 the security camera 24 ,

Alternatively, the device according to 3 be constructed such that the processing beam 14 not by pivoting the mirrors but by moving the focus line 18 perpendicular to its optical axis, similar to 1 , along the surface of the workpiece 20 is moved.

As already explained, for an on-line quality evaluation of, for example, a weld, the point of impact is advantageous A not only by evaluating as a result of the impact of the machining beam 14 to analyze radiation generated on the workpiece, but in addition to that of a lighting light source 60 generated illumination beam 61 an appropriate wavelength. The light of the illumination light source 60 passes through a collimator lens 62 and a focus lens 64 from which it touches the surface of the workpiece 20 is focused such that a lighting field B arises, which may be slightly larger than the impact site A of the machining beam 14 , The lighting field B is by moving the focus lens 64 movable perpendicular to its optical axis. This is the focus lens 64 in a holder 30 recorded in which they by means of a drive unit 33 in a direction perpendicular to the optical axis of the focus lens 64 directed plane is displaceable. The illumination light source 60 , the collimator lens 62 , the holder 30 and the drive unit 33 are advantageously rigid with the frame of the remote processing device 50 connected. With the remote processing device 50 is still a guidance camera 70 Connected to an electronic image of the surface of the workpiece 20 can record with the evaluation and control unit 36 connected is.

So that the lighting field B the over the surface of the workpiece 20 movable point of impact A follows, takes the route guidance camera 70 an image of the workpiece surface, which is the point of impact A and the lighting field B contains. The evaluation and control unit 36 evaluates this image with regard to the respective location of the point of impact and the illumination field and calculates control signals for the drive unit 33 that the focus lens 64 so shifts that the lighting field B the point of impact A covered. Thus, the illumination field follows B the point of impact A online, so that online quality monitoring of the weld is possible by both the image generated by the processing beam and that of the illumination light source 60 generated image, each from the surveillance camera 24 recorded and, if appropriate, superimposed immediately.

With the embodiments described above by way of example, the features of which can be combined in different ways, it has been explained how a lens displaceable perpendicularly to its optical axis can be used in a variety of ways for displacements of a point of incidence of a radiation passing through it onto a workpiece surface. This can be done for the purpose of tolerance compensation, tracking purposes or otherwise.

In the described examples, the processing beam is a laser beam. Even in electron beam processing, the point of impact of an electron beam on a workpiece surface can be shifted by moving an electron beam lens perpendicular to its axis.

• 1. Verfahren zum Steuern der Bearbeitung eines Werkstücks (20) mittels eines hochenergetischen Bearbeitungsstrahls (14), dadurch gekennzeichnet, dass der Bearbeitungsstrahl (14) und/oder ein Beleuchtungsstrahl (61) durch eine Linse (18; 64) hindurchtritt, die zum Verschieben einer Auftreffstelle (A) des Bearbeitungsstrahls (14) auf das Werkstück (20) und/oder eines vom Beleuchtungsstrahl (61) auf dem Werkstück (20) erzeugten Beleuchtungsfeldes (B) senkrecht zu ihrer optischen Achse (O) bewegt wird.
• 2. Verfahren nach Aspekt 1, wobei die Linse (18; 64) aufgrund von Steuersignalen bewegt wird, die aus einer elektronischen Auswertung eines Bildes der Werkstückoberfläche erzeugt werden, das die Orte wenigstens von zwei der folgenden Elemente enthält: Auftreffstelle des Bearbeitungsstrahls (A), Soll-Auftreffstelle (N), Beleuchtungsfeld (B).
• 3. Verfahren nach Aspekt 1 oder 2, wobei die Linse (18; 64) aufgrund von Steuersignalen bewegt wird, die durch Auswertung von Signalen erzeugt werden, die von einem Eigenschaften der Werkstückoberfläche erfassenden Sensor erzeugt werden.
• 4.. Verfahren nach Aspekt 2 oder 3, wobei durch Bewegen der Linse (18) die Auftreffstelle (A) zur Deckung mit der Soll-Auftreffstelle (N) gebracht wird.
• 5. Verfahren nach einem der Aspekte 2 bis 4, wobei durch Bewegen der Linse (18) das Beleuchtungsfeld (B) in Überdeckung mit der Auftreffstelle (N) gebracht wird.
• 6. Verfahren nach einem der Aspekte 1 bis 5, wobei eine Überwachungskamera (24) durch die bewegbare Linse (18) hindurch ein Bild der Auftreffstelle (A) aufnimmt, das zur Überwachung der Qualität der an der Auftreffstelle (A) erfolgenden Werkstückbearbeitung elektronisch ausgewertet wird.
• 7. Verfahren nach einem der Aspekte 1 bis 6, wobei der Bearbeitungsstrahl ein Elektronenstrahl für eine Schweißbearbeitung des Werkstücks ist.
• 8. Verfahren nach einem der Aspekte 1 bis 6, wobei der Bearbeitungsstrahl (14) ein Laserstrahl ist.
• 9. Vorrichtung zur Bearbeitung eines Werkstücks (20) mit einem hochenergetischen Bearbeitungsstrahl (14), enthaltend eine Bearbeitungsstrahlquelle (10, 12), eine Überwachungskamera (24) zur Erzeugung eines elektronisch auswertbaren Bildes, eine Auswerteinheit (36) zur Auswertung des Bildes, eine Fokuslinse (18) zum Fokussieren des Bearbeitungsstrahls (14) auf eine Auftreffstelle (A) auf der Oberfläche des Werkstücks (20) und zum Fokussieren der Überwachungskamera auf die Auftreffstelle (A) und eine Antriebsvorrichtung (32) zum Verschieben der Fokuslinse (18) senkrecht zu ihrer optischen Achse.
• 10. Vorrichtung nach Aspekt 9, enthaltend einen dichroitischen Spiegel (16), der den Bearbeitungsstrahl (14) auf die Fokuslinse (18) umlenkt, wobei die Überwachungskamera (24) auf der von der Fokuslinse (18) abgewandten Seite des dichroitischen Spiegels (16) in der Verlängerung der optischen Achse des Bearbeitungsstrahls angeordnet ist.
• 11. Vorrichtung zum Steuern der Bearbeitung eines Werkstücks (20) mittels eines hochenergetischen Bearbeitungsstrahls, enthaltend eine Bearbeitungsstrahlquelle (10, 12), eine Remoteoptik (52, 54, 56), mit der eine Auftreffstelle (A) des Bearbeitungsstrahls (14) längs der Oberfläche des Werkstücks (20) bewegbar ist, eine Beleuchtungsstrahlquelle (60, 62) zum Erzeugen eines Beleuchtungsstrahls, der zur Erzeugung eines Beleuchtungsfeldes (B) mittels einer Fokuslinse (64) auf die Oberfläche des Werkstücks (20) fokussierbar ist und eine Antriebseinheit (32) zum Verschieben der Fokuslinse (64) senkrecht zu ihrer optischen Achse, so dass das Beleuchtungsfeld (B) zur Deckung mit der Auftreffstelle (A) bringbar ist.
• 12. Vorrichtung zum Steuern der Bearbeitung eines Werkstücks (20) mittels eines hochenergetischen Bearbeitungsstrahls, enthaltend eine Bearbeitungsstrahlquelle (10, 12), eine Optik mit einer Linse (18), die senkrecht zu ihrer optischen Achse bewegbar ist, so dass eine Auftreffstelle (A) des Bearbeitungsstrahls (14) längs der Oberfläche des Werkstücks (20) bewegbar ist, eine Beleuchtungsstrahlquelle (60, 62) zum Erzeugen eines Beleuchtungsstrahls, der zur Erzeugung eines Beleuchtungsfeldes (B) mittels einer Fokuslinse (64) auf die Oberfläche des Werkstücks (20) fokussierbar ist und eine Antriebseinheit (32) zum Verschieben der Fokuslinse (64) senkrecht zu ihrer optischen Achse, so dass das Beleuchtungsfeld (B) zur Deckung mit der Auftreffstelle (A) bringbar ist.
• 13. Vorrichtung nach einem der Aspekte 6 bis 11, enthaltend eine Zielführungskamera (34) zur Aufnahme eines elektronisch auswertbaren Bildes, das wenigstens zwei der Elemente Auftreffstelle (A), Soll-Auftreffstelle (N) und Beleuchtungsfeld (B) enthält, und eine Bildauswerteinrichtung (70, 36) zum Erzeugen eines Steuersignals bei einer Abweichung zwischen den wenigstens zwei Elementen, wobei das Steuersignal die Antriebseinrichtung (32) derart steuert, dass die Abweichung abnimmt.
• 14. Vorrichtung nach Aspekt 13, enthaltend eine Lichtquelle (35) zum Beleuchten des Werkstücks (20) mit strukturiertem Licht.
• 15. Vorrichtung nach einem der Aspekte 9, 10 oder 13, wobei eine Soll-Auftreffstelle durch eine vorbestimmte Position an einem für die Bearbeitung erforderlichen Zusatzelement (44) bestimmt ist.

Further aspects of the present disclosure:

• 1. Method for controlling the machining of a workpiece ( 20 ) by means of a high-energy machining beam ( 14 ), characterized in that the processing beam ( 14 ) and / or an illumination beam ( 61 ) through a lens ( 18 ; 64 ), which is used to move a point of impact ( A ) of the processing beam ( 14 ) on the workpiece ( 20 ) and / or one of the illumination beam ( 61 ) on the workpiece ( 20 ) generated illumination field ( B ) perpendicular to its optical axis ( O ) is moved.
• 2. Method according to aspect 1 , where the lens ( 18 ; 64 ) is moved on the basis of control signals which are generated from an electronic evaluation of an image of the workpiece surface containing the locations of at least two of the following elements: impact location of the machining beam ( A ), Target impact point ( N ), Illumination field ( B ).
• 3. Method according to aspect 1 or 2 , where the lens ( 18 ; 64 ) is moved based on control signals generated by evaluating signals generated by a sensor of the workpiece surface sensing.
• 4 .. Process by aspect 2 or 3 , whereby by moving the lens ( 18 ) the impact site ( A ) to coincide with the target impingement point ( N ) is brought.
• 5. Method according to one of the aspects 2 to 4 , whereby by moving the lens ( 18 ) the illumination field ( B ) in overlap with the point of impact ( N ) is brought.
• 6. Method according to one of the aspects 1 to 5 , wherein a surveillance camera ( 24 ) by the movable lens ( 18 ) through an image of the impact site ( A ), which is used to monitor the quality of the impact ( A ) occurring workpiece machining is evaluated electronically.
• 7. Method according to one of the aspects 1 to 6 wherein the processing beam is an electron beam for a welding treatment of the workpiece.
• 8. Method according to one of the aspects 1 to 6 , wherein the processing beam ( 14 ) is a laser beam.
• 9. Apparatus for processing a workpiece ( 20 ) with a high-energy machining beam ( 14 ) containing a processing beam source ( 10 . 12 ), a surveillance camera ( 24 ) for generating an electronically evaluable image, an evaluation unit ( 36 ) for evaluating the image, a focus lens ( 18 ) for focusing the processing beam ( 14 ) to a point of impact ( A ) on the surface of the workpiece ( 20 ) and to focus the surveillance camera on the impact site ( A ) and a drive device ( 32 ) for moving the focus lens ( 18 ) perpendicular to its optical axis.
• 10. Device according to aspect 9 containing a dichroic mirror ( 16 ), the processing beam ( 14 ) on the focus lens ( 18 ), whereby the surveillance camera ( 24 ) on the of the focus lens ( 18 ) facing away from the dichroic mirror ( 16 ) is arranged in the extension of the optical axis of the machining beam.
• 11. Device for controlling the machining of a workpiece ( 20 ) by means of a high energy machining beam containing a machining beam source ( 10 . 12 ), a remote optics ( 52 . 54 . 56 ), with which a point of impact ( A ) of the processing beam ( 14 ) along the surface of the workpiece ( 20 ), an illumination beam source ( 60 . 62 ) for generating an illumination beam which is used to generate a lighting field ( B ) by means of a focus lens ( 64 ) on the surface of the workpiece ( 20 ) is focusable and a drive unit ( 32 ) for moving the focus lens ( 64 ) perpendicular to its optical axis so that the illumination field ( B ) to coincide with the point of impact ( A ) can be brought.
• 12. Device for controlling the machining of a workpiece ( 20 ) by means of a high energy machining beam containing a machining beam source ( 10 . 12 ), an optic with a lens ( 18 ), which is movable perpendicular to its optical axis, so that a point of impact ( A ) of the processing beam ( 14 ) along the surface of the workpiece ( 20 ), an illumination beam source ( 60 . 62 ) for generating an illumination beam which is used to generate a lighting field ( B ) by means of a focus lens ( 64 ) on the surface of the workpiece ( 20 ) is focusable and a drive unit ( 32 ) for moving the focus lens ( 64 ) perpendicular to its optical axis so that the illumination field ( B ) to coincide with the point of impact ( A ) can be brought.
• 13. Device according to one of the aspects 6 to 11 comprising a guidance camera ( 34 ) for receiving an electronically evaluable image, the at least two of the elements impingement ( A ), Target impact point ( N ) and illumination field ( B ), and an image evaluation device ( 70 . 36 ) for generating a control signal at a deviation between the at least two elements, wherein the control signal is the drive device ( 32 ) controls so that the deviation decreases.
• 14. Device according to aspect 13 containing a light source ( 35 ) for illuminating the workpiece ( 20 ) with structured light.
• 15. Device according to one of the aspects 9 . 10 or 13 in which a desired point of impact through a predetermined position on an additional element ( 44 ) is determined.

LIST OF REFERENCE NUMBERS

10

Optical fiber

12

collimator

14

processing beam

16

mirror

18

focus lens

20

workpiece

22

optics

24

Security Camera

26

sensor field

30

bracket

32

driving device

34

Navigation camera

35

light source

36

Evaluation and control unit

38

inputs

40

outputs

42

Imaging beam path

44

additional element

50

Remote processing device

52

mirror

54

mirror

56

swivel device

60

Illumination light source

61

illumination beam

62

collimator lens

64

focus lens

70

Navigation camera

O

optical axis of the focus lens

M

Centerline of the machining beam

A

impingement

N

Target impact point

B

illumination field

Claims (6)

Device for processing a workpiece (20) with a high-energy machining beam (14), comprising a machining beam source (10, 12), a monitoring camera (24) for generating an electronically evaluable image, an evaluation unit (36) for evaluating the image, a focus lens (18) for focusing the machining beam (14) on an impact location (A) on the surface of the workpiece (20) and for focusing the surveillance camera (24) on the impact location (A), a drive device (32) for shifting the focus lens (18) perpendicular to its optical axis, a spatially resolving sensor means for generating the position of a target impact location (N) of the workpiece (20) containing data, and means for merging these data with the of the surveillance camera (24) recorded electronically evaluable image. Device after Claim 1 , comprising a dichroic mirror (16) which deflects the processing beam (14) onto the focus lens (18), wherein the surveillance camera (24) on the side of the dichroic mirror (16) facing away from the focus lens (18) in the extension of the optical Axis of the processing beam (14) is arranged. Device after Claim 1 or 2 comprising a light source (35) for illuminating the structured light workpiece (20). Device according to one of Claims 1 to 3 comprising an illumination light source for generating an image of the point of impact (A) in the surveillance camera (24), the light of which is coupled into the processing beam (14) via a semitransparent mirror. Device after Claim 3 or 4 comprising a guidance camera (34) for receiving an electronically evaluable image containing at least two of the impact point (A), target impact point (N) and illumination field (B), and the evaluation unit (36) for generating a control signal in the event of a deviation between the at least two elements, wherein the control signal controls the drive device (32) such that the deviation decreases. Device after Claim 5 wherein the desired impact point (N) is determined by a predetermined position on an additional element (44) required for machining.

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