DE102011013511A8 - Plattenmagazin - Google Patents
Plattenmagazin Download PDFInfo
- Publication number
- DE102011013511A8 DE102011013511A8 DE201110013511 DE102011013511A DE102011013511A8 DE 102011013511 A8 DE102011013511 A8 DE 102011013511A8 DE 201110013511 DE201110013511 DE 201110013511 DE 102011013511 A DE102011013511 A DE 102011013511A DE 102011013511 A8 DE102011013511 A8 DE 102011013511A8
- Authority
- DE
- Germany
- Prior art keywords
- disk magazine
- magazine
- disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011013511.1A DE102011013511B4 (de) | 2011-03-10 | 2011-03-10 | Plattenmagazin und Vorrichtung zum Abseparieren von plattenförmigen Gegenständen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011013511.1A DE102011013511B4 (de) | 2011-03-10 | 2011-03-10 | Plattenmagazin und Vorrichtung zum Abseparieren von plattenförmigen Gegenständen |
Publications (3)
Publication Number | Publication Date |
---|---|
DE102011013511A1 DE102011013511A1 (de) | 2012-09-13 |
DE102011013511A8 true DE102011013511A8 (de) | 2013-06-13 |
DE102011013511B4 DE102011013511B4 (de) | 2017-01-12 |
Family
ID=46705395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102011013511.1A Expired - Fee Related DE102011013511B4 (de) | 2011-03-10 | 2011-03-10 | Plattenmagazin und Vorrichtung zum Abseparieren von plattenförmigen Gegenständen |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102011013511B4 (de) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6286684B1 (en) * | 1999-07-23 | 2001-09-11 | Ray G. Brooks | Protective system for integrated circuit (IC) wafers retained within containers designed for storage and shipment |
DE102004041647A1 (de) * | 2004-08-27 | 2006-03-09 | Steag Hamatech Ag | Verfahren und Vorrichtung zum Abheben von scheibenförmigen, ein Innenloch aufweisenden Substraten von einem Stapel |
US20090095650A1 (en) * | 2007-10-12 | 2009-04-16 | Peak Plastic And Metal Products (Int'l) Ltd. | Wafer container with staggered wall structure |
DE102008023456A1 (de) * | 2008-05-14 | 2009-11-26 | Siltronic Ag | Träger zur Aufnahme von Halbleiterscheiben |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005033859B3 (de) | 2005-07-12 | 2006-12-14 | Q-Cells Ag | Wafermagazin für Halbleiterwafer oder waferartige Gegenstände |
DE102008030629A1 (de) | 2008-06-20 | 2009-12-24 | Aci-Ecotec Gmbh & Co. Kg | Wafermagazin |
EP2256796A1 (de) | 2009-05-29 | 2010-12-01 | Hennecke Systems GmbH | Vorrichtung zum Transport von Wafern und/oder Solarzellen |
-
2011
- 2011-03-10 DE DE102011013511.1A patent/DE102011013511B4/de not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6286684B1 (en) * | 1999-07-23 | 2001-09-11 | Ray G. Brooks | Protective system for integrated circuit (IC) wafers retained within containers designed for storage and shipment |
DE102004041647A1 (de) * | 2004-08-27 | 2006-03-09 | Steag Hamatech Ag | Verfahren und Vorrichtung zum Abheben von scheibenförmigen, ein Innenloch aufweisenden Substraten von einem Stapel |
US20090095650A1 (en) * | 2007-10-12 | 2009-04-16 | Peak Plastic And Metal Products (Int'l) Ltd. | Wafer container with staggered wall structure |
DE102008023456A1 (de) * | 2008-05-14 | 2009-11-26 | Siltronic Ag | Träger zur Aufnahme von Halbleiterscheiben |
Also Published As
Publication number | Publication date |
---|---|
DE102011013511A1 (de) | 2012-09-13 |
DE102011013511B4 (de) | 2017-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R016 | Response to examination communication | ||
R016 | Response to examination communication | ||
R018 | Grant decision by examination section/examining division | ||
R020 | Patent grant now final | ||
R082 | Change of representative | ||
R084 | Declaration of willingness to licence | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |