DE102011002864A1 - Printed circuit board and method for producing a printed circuit board - Google Patents

Abstract

The present invention relates to a printed circuit board (200) for supplying at least one power electronics component (235), the printed circuit board (200) having at least one first contact area (205) and a second contact area (210) isolated from the first contact area (205) . The printed circuit board has an overlap area (215) which is laterally bounded by the first (205) and second contact area (210), with at least one electrically conductive first layer (240a) in the overlap area (215) inside the printed circuit board (200). and an electrically conductive second layer (240b) are arranged, the first layer (240a) being electrically contactable from the first contact area (205) and extending from the first contact area (205) in the direction of the second contact area (210) and wherein which the second layer (240b) can be electrically contacted from the second contact area (210) extends from the second contact area (210) in the direction of the first contact area (205), and wherein the first (240a) and the second layer (240b) partially overlap.

Description

The present invention relates to a printed circuit board and to a method of manufacturing a printed circuit board according to the main claims.

Usually, in projects in the field of power electronics for automobiles, the connecting lines between battery supply, DC link capacitor and the IGBT's, the so-called. Busbars (as shown in the perspective view 1 can be seen) as massive metal rails (usually copper or aluminum rails) executed. The two metal rails are coated with an insulating layer to avoid short circuits. However, there are some disadvantages to using such metal rails. For example, metal rails are expensive and heavy and require a lot of space on a corresponding printed circuit board. In addition, they require a great deal of mechanical effort and are difficult to assemble, with the further risk of damaging the electrical insulation during assembly. With regard to electronic properties of such printed circuit boards, on the one hand, they would emit very high electric fields and result in a high line inductance, which induces extremely high voltage peaks. This caused the busbar system to heat up considerably. In particular, the problems related to the above-mentioned electronic properties pose a great challenge and must be limited as far as possible with elaborate protection technology.

The DE 20 2007 003 815 U1 shows a printed circuit board multilayer structure with one or more superimposed inner layers, each with an electrically insulating carrier layer which is at least partially provided on one or both sides with a conductor layer, wherein at least one inner layer at least a first and one of the first separately arranged in another lateral region second Inner layer part includes, which differ in their carrier layer thickness and / or their conductor layer thickness from each other.

Against this background, the object of the present invention is to provide an improved printed circuit board for supplying at least one power electronic component and an improved method for producing such a printed circuit board.

This object is solved by the features of the independent claims. Advantageous embodiments of the approach according to the invention will become apparent from the respective dependent claims and the description below.

The present invention provides a printed circuit board for supplying at least one power electronic component, wherein the printed circuit board has at least a first contact region and a second contact region isolated from the first contact region, characterized in that the printed circuit board has an overlap region which laterally through the first and second contact region is limited, wherein in the overlap region in the interior of the printed circuit board at least one electrically conductive first layer and an electrically conductive second layer are arranged, wherein the first layer from the first contact region is electrically contacted and extending from the first contact region in the direction of the second contact region and wherein the second layer is electrically contactable from the second contact region and extends from the second contact region toward the first contact region, and wherein the first and second layers partially e overlap.

• – Anordnen einer elektrisch leitfähigen ersten Lage in einem Überlappungsbereich der durch den ersten und zweiten Kontaktbereich seitlich begrenzt ist, wobei die erste Lage von dem ersten Kontaktbereich aus kontaktierbar ist und sich von dem ersten Kontaktbereich aus in Richtung des zweiten Kontaktbereichs hin erstreckt;
• – Aufbringen einer Isolationslage auf die erste Lage, wobei die Isolationslage derart aufgebracht wird, dass die erste Lage von dem zweiten Kontaktbereich elektrisch isoliert wird; und
• – Einbringen einer elektrisch leitfähigen zweiten Lage auf der Isolationslage, wobei die zweite Lage von dem zweiten Kontaktbereich aus elektrisch kontaktierbar ist und sich von dem zweiten Kontaktbereich aus in Richtung des ersten Kotaktbereichs hin erstreckt, wobei die zweite Lage derart eingebracht wird, dass sie teilweise die erste Lage überlappt.

Furthermore, the present invention provides a method for producing a printed circuit board for supplying at least one power electronic component, the method comprising a step of providing a board main body having a first contact area and a second contact area electrically insulated from the first contact area, characterized in that the method comprises at least the following steps:

• Arranging an electrically conductive first layer in an overlapping region laterally delimited by the first and second contact regions, wherein the first layer is contactable from the first contact region and extends from the first contact region towards the second contact region;
• Applying an insulating layer to the first layer, wherein the insulating layer is applied such that the first layer is electrically insulated from the second contact region; and
• Inserting an electrically conductive second layer on the insulating layer, wherein the second layer is electrically contactable from the second contact region and extends from the second contact region in the direction of the first Kotaktbereichs, wherein the second layer is introduced so that they partially first layer overlaps.

A printed circuit board can be understood to mean, for example, a plate-shaped element, to which electronic components can be attached and supplied with electrical energy and / or signals. A power electronic component may be a component which has a high electrical energy, for example in the form of a high Can handle voltages or a large current. Typically, power electronics devices can process or switch electrical power in the range of more than 500W. A contact region may be understood to be a region of the printed circuit board in which supply lines or strands are laid or can be laid, which are designed to supply electrical energy or signals to electrical components which are contacted with the printed circuit board. In particular, the contact regions can be designed to deliver correspondingly high currents and voltages, which are required by the power electronics component. An overlapping area is to be understood as meaning a limited partial area of the printed circuit board in which at least two electrical mutually insulated layers in the interior of the printed circuit board partially overlap. An overlap is understood to mean an arrangement in which the layers are arranged one above the other with respect to a normal on a main surface of the board without touching each other. In particular, an insulating layer is disposed between the overlapping layers, which prevents shorting of the two overlapping layers arranged. In the present case, a layer may, for example, be understood as meaning a layer, a film or another strip-like element made of an electrically conductive material, such as, for example, metal. For example, the layers may be metal strips which are inserted into the overlapping region during the production of the printed circuit board. However, the location should be such that, for example, it can be inserted manually into the printed circuit board in the overlapping area, since otherwise a sufficient ability to guide high powers in these layers is not ensured. In particular, using semiconductor production techniques such as vapor deposition, sputtering or the like is not suitable for forming or creating the layers in the overlap region.

In this case, a first of the layers can be contacted from the first contact region, while a second of the layers can be contacted from the second contact region. This means that the first layer on one edge of the overlap region in the region of the first contact region offers an electrical contacting possibility, while the second layer on the edge of the overlap region in the region of the second contact region offers an electrical contacting possibility. In particular, the first and second layers are electrically isolated from each other. A partial overlap means in the present application that there is also an (at least small) area in which the first and second positions do not overlap, for example. However, this area where the first and second layers do not overlap may desirably be much smaller than an area where the first and second layers overlap. Conveniently, the first layer also does not extend into the second contact region and / or the second layer does not extend into the first contact region of the printed circuit board.

The present invention offers the advantage that it is now possible to increase the capacitive component in an energy supply line for the power electronics component by overlapping the first and second layers, which are both contactable from the respective different contact regions. The overlapping of the first and second layer in overlapping area acts as a kind of plate capacitor, which is electrically connected between the two contact areas. At the same time can be achieved by such overlapping of the first and second layer, a reduction of the inductive component in the energy supply. By the approach presented here, it is also possible to reduce the mechanical complexity as much as possible (for example, to avoid externally connected to the circuit board capacities or at least smaller) and on the other to design a system that optimally from an electronic point of view is designed. At the same time a low-impedance as possible connection and execution of the bus system and the connected components as well as a good shielding or extinction of the current-carrying conductor generated electromagnetic fields can be achieved.

It is favorable if the overlapping region is bounded on a first side by the first contact region and on a second side opposite the first side by the second contact region. Such an embodiment of the present invention has the advantage that the printed circuit board as far as possible by a distance from each other arrangement of the contact areas as optimal distribution of the currents in the first and second position is possible, so that the effect of the structure presented here is particularly high.

According to a particular embodiment of the present invention, the printed circuit board on an insulating region, which is arranged between the first and second layer, and the first layer in the overlap region isolated from the second contact region laterally and the second layer is insulated from the first contact region. An isolation region can be understood to be one or more layers or sections of the printed circuit board, which consists of material that acts as an electrical insulator. Such an embodiment of the present invention offers the advantage of the best possible and thus safe isolation of the first layer against the second contact region and the second position laterally against the first contact area. In this way, the highest possible voltage between the first and second contact region can be applied, so that the printed circuit board still works reliably even at high powers to be transmitted.

According to a further embodiment of the present invention, in the overlapping region, an insulation region is provided at least between the first and second layer, which has a recess in which the first layer or the second layer is embedded. Such a recess may, for example, be a depression in the insulation area. Such an embodiment of the present invention offers the advantage of a particularly positionally secure introduction of the first layer or of the second layer, such that a position of the first or second layer previously determined, for example, as optimally optimal, with respect to the respective other layer and / or the first and / or. or second contact area can be reliably realized.

In order to further increase an effect and the resulting advantages of the approach presented here, the printed circuit board may have at least one third electrically conductive layer in the overlapping region, which is electrically contactable from the first contact region and from the first contact region in the direction of the second Contact area extends, wherein the third layer is disposed on a first layer opposite side of the second layer, and wherein the second and third layer partially overlap.

A further increased effect, in particular an increase of the capacitive component and the reduction of the inductive component of the energy supply for the power electronics component, can be achieved if the printed circuit board has at least one fourth electrically conductive layer in the overlapping region, which can be electrically contacted from the second contact region is and extends from the second contact region in the direction of the first contact region, wherein the fourth layer is disposed on an opposite side of the second layer of the third layer, and wherein the third and fourth layer partially overlap.

A particularly high effective area, which acts as a surface between respective layers and which can act as a surface of a corresponding plate capacitor with interdigitated electrodes, can be realized if in the overlap region an electrical insulation region is arranged, which extends from the direction of a first main surface of the printed circuit board in the direction one of the first main surface opposite second main surface of the printed circuit board extends and at least the first, second and third layers meandering around.

In order to achieve the largest possible area in which the first and second layer overlap and thus form a high contribution to the formed capacitance between the first and second contact region, the first and second layer may be aligned substantially parallel to a main surface of the printed circuit board. In this direction, there is a great extent possibility, so that with such an extent or orientation of the first and / or second layer, a maximum effect of the approach described here can be achieved.

According to a further embodiment of the present invention, an electrically conductive ground layer which is electrically insulated from the first and / or second layer may be arranged on or on at least one main surface of the printed circuit board in the overlapping region. Such an embodiment of the present invention offers the advantage of the best possible shielding or extinction of the layers through which current flows in the overlapping region, in particular with respect to electromagnetic fields generated by current flow in the layers.

In order to achieve a high current flow and thus high power, which is to be guided by the printed circuit board, in the first contact region a first supply conductor electrically conductively connected to at least the first layer can be arranged, wherein in the second contact region one with at least the second layer is electrically connected second supply conductor may be arranged, wherein the first supply conductor has a greater thickness than the first layer and / or wherein the second supply conductor has a greater thickness than the second layer. These supply conductors carry the major part of the current, so that the layers connected to the supply conductor can be designed accordingly for the main electronic effect, namely as a capacitance-increasing section.

It is particularly advantageous in relation to an increase of the capacitive component in the energy supply line as well as a reduction of the inductive component in the energy supply line when the first supply conductor has a longitudinal extent that corresponds to a longitudinal extension of the first layer and / or that the second supply conductor has a longitudinal extension which corresponds to a longitudinal extent of the second layer. In this way, for example, in the first layer, a current density can be achieved which essentially corresponds to a current density in the first supply conductor and / or in the second layer to a current density can be achieved, which corresponds to a current density in the second and supply conductor substantially.

An embodiment of the present invention particularly well adapted for conducting high currents can be achieved when the first supply conductor is formed as a copper profile element and / or the second supply conductor is formed as a copper profile element.

In order to achieve the best possible contacting of the first and / or second supply conductor, at least one terminal contact pin can be provided, which is embedded or pressed into the first supply conductor or embedded or pressed into the second supply conductor, wherein by the at least one terminal contact pin an electrical Contacting the first or second supply conductor of a main surface of the printed circuit board is feasible. Under a connection pin can be selected technically easy to be implemented Einpresspin, for example in the form of a metal pin.

Particularly advantageous is an embodiment of the present invention as a power electronics circuit, which has at least one power electronics component and at least one capacitance, further comprising a printed circuit board according to an embodiment described above, wherein the at least one power electronics component on a first main surface of the printed circuit board on the Circuit board is arranged and electrically connected to the first layer and wherein the capacitance is disposed on a first main surface opposite the second main surface of the printed circuit board and electrically connected to the second layer. This embodiment of the present invention offers the advantage that a favorable heat dissipation property of the power electronics circuit can be realized by the arrangement of components of the power electronics circuit opposite to the main surfaces.

• – Aufbringen einer zweiten Isolationslage auf die zweite Lage, wobei die zweite Isolationslage derart aufgebracht wird, dass sie die zweite Lage dem ersten Kontaktbereich elektrisch isoliert; und
• – Einbringen einer elektrisch leitfähigen dritten Lage auf der zweiten Isolationslage, wobei die dritte Lage von dem ersten Kontaktbereich aus elektrisch kontaktierbar ist und sich von dem ersten Kontaktbereich aus in Richtung des zweiten Kotaktbereichs hin erstreckt, wobei die dritte Lage derart eingebracht wird, dass sie teilweise die zweite Lage überlappt.

According to a further embodiment of the present invention, the method for producing a printed circuit board may comprise the following steps:

• Applying a second insulating layer to the second layer, wherein the second insulating layer is applied such that it electrically isolates the second layer from the first contact region; and
• - Introducing an electrically conductive third layer on the second insulating layer, wherein the third layer is electrically contacted from the first contact region and extending from the first contact region in the direction of the second Kotaktbereichs, wherein the third layer is introduced such that it partially the second layer overlaps.

Such an embodiment of the present invention offers the advantage of a significant increase in the capacitive component in the power supply line, since now the second layer is sandwiched between the first and third layer. The second layer is thus formed as an intermediate layer between two gleichpoligen layers, so that on both surfaces of the intermediate layer, that is, the second layer, charge carriers can be accumulated, so that the capacitive effect of such a structure is higher compared to a structure without a third layer.

• – Aufbringen einer dritten Isolationslage auf die dritte Lage, wobei die dritte Isolationslage derart aufgebracht wird, dass sie die dritte Lage von dem zweiten Kontaktbereich elektrisch isoliert; und
• – Einbringen einer elektrisch leitfähigen vierten Lage auf der dritten Isolationslage, wobei die vierte Lage von dem zweiten Kontaktbereich aus elektrisch kontaktierbar ist und sich von dem zweiten Kontaktbereich aus in Richtung des ersten Kontaktbereichs hin erstreckt, wobei die vierte Lage derart eingebracht wird, dass sie teilweise die dritte Lage überlappt.

According to a further improved embodiment of the present invention, the method may further comprise at least the following steps:

• Applying a third insulating layer to the third layer, wherein the third insulating layer is applied so as to electrically isolate the third layer from the second contact region; and
• Inserting an electrically conductive fourth layer on the third insulation layer, wherein the fourth layer is electrically contactable from the second contact region and extends from the second contact region in the direction of the first contact region, wherein the fourth layer is introduced such that it partially the third layer overlaps.

Also for such an embodiment of the present invention, the reasons mentioned above in terms of an improvement of the capacitive component in the power supply for the power electronics component can be cited, and now charge carriers can be accumulated on both main surfaces of the third layer. As a result, such a structure of the overlapping area of the printed circuit board with respect to a structure of the overlapping area, in which no fourth layer is provided, has an even better behavior with respect to the increase of the capacitive component in the energy supply line.

The first or second layer can be applied in a particularly secure position if, in a step of applying the insulation layer, the insulation layer (ie an insulation region) is applied, which has a recess, the application taking place in such a way that the first layer is arranged in the recess or wherein the step of introducing the second layer is such that the second layer is introduced into the recess.

It is particularly advantageous if the method has at least one placement step in which a first supply conductor in the first contact region and a second supply conductor are placed in the second contact region, wherein the method further comprises a step of electrical contacting, in which the first supply conductor with the first layer is contacted and in which the second supply conductor is contacted with the second layer. Specifically, in the step of electrical contacting, a material-locking connection, in particular a welding, in particular an infrared welding can be performed. Such an embodiment of the present invention offers the advantage of a secure electrical contacting of the first supply conductor with the first layer and / or the second supply conductor with the second layer. In this way it can be reliably ensured that the desired increase in the capacitive component as well as the desired reduction of the inductive component in the energy supply can also be achieved with the structure presented here.

Hereinafter, advantageous embodiments of the present invention will be described with reference to the accompanying drawings. Show it:

1 a perspective view of a holder for busbars according to the prior art;

2 a cross-sectional view through a printed circuit board according to an embodiment of the present invention with a connected IGBT as a power electronics device;

3 a perspective view of an overlapped in the overlap region embodiment of the printed circuit board according to the invention;

4 a block diagram of the principle of operation of a power flow in power electronics for hybrid technology;

5a and 5b perspective views of an embodiment of a power electronics circuit using an embodiment of the printed circuit board according to the invention; and

6 a flowchart of an embodiment of the method according to the invention.

The same or similar elements may be indicated in the figures by the same or similar reference numerals, wherein a repeated description is omitted. Furthermore, the figures of the drawings, the description and the claims contain numerous features in combination. It is clear to a person skilled in the art that these features are also considered individually or that they can be combined to form further combinations not explicitly described here. Furthermore, the invention in the following description may be explained using different dimensions and dimensions, wherein the invention is not limited to these dimensions and dimensions to understand. Furthermore, method steps according to the invention can be repeated as well as carried out in a sequence other than that described. If an embodiment includes an "and / or" link between a first feature / step and a second feature / step, this may be read such that the embodiment according to one embodiment includes both the first feature / the first feature and the second feature / the second step and according to another embodiment, either only the first feature / step or only the second feature / step.

2 shows a cross-sectional view through a printed circuit board according to an embodiment of the present invention with a connected IGBT as a power electronics device. It is in the 2 the printed circuit board 200 shown having a first contact area 205 , a second contact area 210 as well as an overlap area 215 having. The overlap area 215 is on the left side through the first contact area 205 and on the right side through the second contact area 210 limited. In the first contact area 205 For example, a copper profile is the first supply conductor 220 introduced via which, for example, a positive DC potential DC + in the printed circuit board 200 can be performed, which is used to power a power electronics component. Analogous to this is the second contact area 210 for example, also a copper profile as a second supply conductor 225 introduced via which, for example, a negative DC potential DC- in the printed circuit board 200 can be performed, which is also used to supply a power electronics component. In the first contact area 205 is a first press-in pin 230a arranged, extending from one in 2 above illustrated first main surface of the printed circuit board 200 starting from the first supply conductor 220 extending downwardly and on a first major surface opposite the second major surface of the circuit board 200 from the printed circuit board 200 emerges and electrically with an IGBT 235 as an example of a power electronics device is connected. The same applies in the second supply conductor 225 a second press-in pin 230b introduced or embedded, but not that of the first main surface of the circuit board 200 but from an interior of the utility manager 225 out through the second major surface of the circuit board 200 extends and electrically with another contact of the IGBT 235 connected is. Using the two press-fit pins 230a and 230b can thus electrical energy from different supply conductors 220 respectively. 225 to the IGBT 235 be transmitted as power electronics component.

In order to realize the particular advantages of the approach presented here, in particular to realize an increase in the capacitive component and a reduction of the inductive component in the power supply line for the power electronics component, the overlap region 215 the printed circuit board 200 specially shaped. Here are in the overlap area 215 arranged a plurality of electrically conductive layers, which are electrically effective with the in the first contact area 205 arranged first supply conductor 220 are connected. For example, it is in the overlap area 215 a first location 240a , a third location 240c as well as a fifth location 240e arranged. Between these, with the first supply conductor 220 Connected layers are further electrically conductive layers arranged over an isolation area 245 For example, which may be formed of layers or portions of a conventional circuit board material such as FR4, are electrically insulated from each other. These other electrically conductive layers, such as those between the first layer 240a and the third location 240c arranged second layer 240b that between the third location 240c and the fifth position 240e arranged fourth layer 240d are with the second supply conductor 225 electrically connected in the second contact area 210 is arranged. Furthermore, still a sixth position 240f be provided, which is between the fifth position 240e and the second main surface of the circuit board 200 extends. In this case, the first to sixth layers can consist, for example, of a thick-film inserts which, during the production process, alternate in layers with insulation layers of the insulation region introduced therebetween 245 are arranged. The first, third and fifth layers extend from the first contact region 205 towards the second contact area 210 indicating the second contact area 210 not completely reach, but between its end and the second contact area 210 or the second supply conductor arranged there 225 at least a portion or portion of the isolation area 245 remains to the best possible electrical insulation between the first and the second supply conductor 220 respectively. 225 to reach. At the same time extend the second, fourth and sixth position, starting from the second supply conductor 225 in the second contact area 210 towards the first contact area 205 or the first supply conductor arranged therein 220 wherein also between one end of the second, fourth and sixth layers and the first contact region 205 or the first supply conductor arranged there 220 at least a portion of the isolation region remains to the best possible electrical isolation between the first and the second supply conductor 220 respectively. 225 to reach.

The first to sixth layer extends substantially parallel to a main surface of the circuit board 200 , Thus, the isolation area 245 be described in such a way that it meanders between the individual adjacent layers in the overlapping area 215 extends between the first major surface and the second major surface. According to the above-described sequence of electrically conductive layers 240 and insulation layers of the isolation region disposed therebetween 245 is thus achieved that adjacently arranged electrically conductive layers partially overlap and form a meshed structure. In this case, not all the layers shown here must be realized, but it is also sufficient if, for example, only the first to third layer or the second to fourth layer are arranged in the overlapping region. Of course, further layers increase the effect of the approach presented here.

Furthermore, still in the overlap area 215 on or at the first major surface and / or on or on the second major surface of the circuit board 200 a mass situation 250 that is to say an electrically conductive layer, which is provided for contacting with a ground potential.

One as shown 2 built-up circuit board 200 now allows the sequence of electrically conductive layers 240 in the overlap area 215 a kind of interdigital capacitance between the first supply conductor 220 and the second supply conductor 225 formed. Especially with large power requirements of the power electronics device 235 and the associated large currents in the first and second supply conductor can thus be achieved an increase in the capacitive component in the power supply line. At the same time, it can be achieved by the closely adjacent guiding of different currents in the adjacent layers described here in the overlapping region, a reduction of the inductive component in the power supply, as emerging magnetic fields cancel each other again. At the same time by the enlargement of the cross-section of the supply conductor through the cross-sectional area of each connected to the respective supply conductors electrically conductive layer a low-impedance as possible connection and execution of the Busbarsystems and the connected components can be achieved. In particular, by providing the mass position (s) 250 , Conveniently connected in the operation of the printed circuit board to a ground potential, the best possible shielding or extinction of the current flowing through the conductor generated electromagnetic fields can be achieved. It should be noted, however, that not necessarily a structure or stratification of electrical conductive layers as shown 2 needs to be carried out in order to realize the particular advantages of the approach presented here. On the contrary, it is also possible, for example, to use an embodiment of the present invention in which only one electrically conductive layer is provided, that of the first contact region 205 is electrically contacted, partially overlapping with respect to a second electrically conductive layer is arranged, which form generated contact area 210 electrically conductive contactable. In this case, for example, an increase in the capacitive component in the energy supply can also be realized, even if a sequence of several electrically interleaved layers arranged in one another naturally improves the effect, for example an increase of the capacitive component in the energy supply.

The above-described embodiment of the present invention thus relates to the implementation of a power supply over several layers of a printed circuit board. The distribution of, for example, the positive and negative voltage position takes place alternately, analogous to the arrangement of a multilayer plate capacitor. The power supply system in the printed circuit board is thus available as an additional capacitor. In this case, for example, alternating plus or minus voltage layers are arranged. This creates a kind of "toothing" of the voltage levels. For this reason, it is particularly advantageous for such a structure to arrange at least two positive and two negative voltage positions alternately overlapping (toothed).

The overlapping arrangement of the voltage levels ensures that the resulting magnetic fields cancel each other out again. This positively influences the overall system. In order to achieve the most complete possible encapsulation, a layer can be applied on the top and bottom of the printed circuit board, which is connected to the ground. Thus, it is advantageous to achieve an absolutely sealed voltage-level arrangement which improves all the disadvantages of the prior art (busbar arrangement).

3 shows a perspective view of an overlapped in the overlap region embodiment of the circuit board according to the invention. This shows that in the overlap area 215 the electrical conductive layers 240 are arranged so that they are on the one hand parallel to the first main surface (shown above) of the printed circuit board 200 extend and also parallel to the first supply conductor shown on the left 220 extend. The layers thus have a longitudinal extent, that of the longitudinal extent of the first supply conductor 220 equivalent. The same applies analogously to the extent of the electrical layers in relation to in 3 not shown second supply conductor. Furthermore, it is off 3 seen that the circuit board is completely made of insulation material 245 , For example, the known printed circuit board material is enclosed, so that at as few points on the surface of the printed circuit board 200 there is a risk due to exposed live areas.

4 shows a block diagram of the principle of operation of a power flow in power electronics for hybrid technology. In this case, in particular, a printed circuit board 200 used according to an embodiment of the present invention, as for example with reference to the 2 and 3 was described to a high-voltage battery 400 a DC link capacitor 410 and a power electronics device (for example, the IGBT 235 ) to connect with each other. Off in the block diagram 4 is the printed circuit board described above in the form of the connection bus shown at the top of the picture 200 reproduced, wherein for example by the two lines shown, the first connecting conductor 220 and the second connection conductor 225 is represented. The power electronics component 235 For example, it can be obtained from a DC voltage DC supplied to it using the printed circuit board described above 200 is supplied, a three-phase AC or a three-phase AC voltage AC ~ generate, which for the operation of a motor 420 is used.

The 5a and 5b show perspective views of an embodiment of a power electronics circuit using an embodiment of the printed circuit board according to the invention 200 , Here is in 5a a view is shown on a bottom of the power electronics circuit, wherein a plurality of power electronics components 235 are shown. Here are the power electronics components 235 with the first and second supply conductors 220 respectively. 225 connected, which in turn connected to corresponding layers in the overlapping area 215 are contacted. In the 5b a view is shown on an upper side of the power electronics circuit, wherein it can be seen that a DC link capacitor 410 on top of the circuit board 200 is arranged. That way, too Spatial separation of the power electronics components 235 and the DC link capacitor 410 done, which among other things leads to an improved heat dissipation possibility. However, such an arrangement requires the best possible, low-loss and low-radiating energy conduction in the printed circuit board, which is just reached by the previously proposed printed circuit board.

The above proposed approach to building a printed circuit board therefore offers several advantages over the prior art. For example, a low-impedance bus design can be realized, in which an ideal connection of the DC link capacitor is possible. Furthermore, low loss can be realized in the busbar system, so that it comes only to a lower heat generation than approaches in the prior art. At the same time, the improved positioning possibility of the components of the circuit enables improved heat dissipation. Since now also lower AC components are to be expected on the DC conductor, also a battery connected to the circuit presented here is also spared. Due to the above-described layer structure also results in an additional capacity in the power supply of the printed circuit board, which is characterized in an over the prior art improved EMC performance. This advantageously allows the use of future higher clock frequencies.

6 shows a flowchart of an embodiment of the method according to the invention 600 for producing a printed circuit board for the supply of at least one power electronics component. The method has a step of providing 610 a board main body which comprises a first contact area and a second contact area electrically insulated from the first contact area. Furthermore, the method comprises 600 at least one step of arranging 620 an electrically conductive first layer in an overlap region bounded by the first and second contact regions, the first layer being contactable from the first contact region and extending from the first contact region toward the second contact region. Furthermore, the method comprises 600 a step of applying 630 an insulating layer on the first layer, wherein the insulating layer is applied such that the first layer is electrically insulated from the second contact region. Finally, the process includes 600 a step of introducing an electrically conductive second layer on the insulating layer, wherein the second layer is electrically contactable from the second contact region and extends from the second contact region towards the first knock region, the second layer being inserted such that it partially overlaps the first layer.

LIST OF REFERENCE NUMBERS

200

printed circuit board

205

first contact area

210

second contact area

215

overlap area

220

first supply conductor

225

second supply conductor

230a

first press-in pin

230b

second press-in pin

235

Power electronics component, IGBT

240a

first location

240b

second location

240c

third location

240d

fourth location

240e

fifth location

240f

sixth location

245

Insulation area, insulation layer

250

Metal layer, shielding layer

400

High-voltage battery

410

Link capacitor

420

engine

600

Method for producing a printed circuit board

610

Step of providing a board main body

620

Step of disposing an electrically conductive first layer

630

Step of applying an insulating layer to the first layer

640

Step of introducing an electrically conductive second layer

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 202007003815 U1 [0003]

Claims (14)

Printed circuit board ( 200 ) for supplying at least one power electronic component ( 235 ), wherein the printed circuit board ( 200 ) at least a first contact area ( 205 ) and one from the first contact area ( 205 ) isolated second contact area ( 210 ), characterized in that the printed circuit board ( 200 ) an overlap area ( 215 ) defined by the first ( 205 ) and second contact area ( 210 ) is bounded laterally, wherein in the overlap region ( 215 ) inside the printed circuit board ( 200 ) at least one electrically conductive first layer ( 240a ) and an electrically conductive second layer ( 240b ), the first layer ( 240a ) from the first contact area ( 205 ) is electrically contactable and from the first contact area ( 205 ) out in the direction of the second contact region ( 210 ) and wherein the second layer ( 240b ) from the second contact area ( 210 ) is electrically contactable and from the second contact area ( 210 ) out in the direction of the first contact area ( 205 ), and where the first ( 240a ) and the second layer ( 240b ) partially overlap. Printed circuit board ( 200 ) according to claim 1, characterized in that the overlapping area ( 215 ) on a first side through the first contact area ( 205 ) and on a second side opposite the first side through the second contact region ( 210 ) is limited. Printed circuit board ( 200 ) according to one of the preceding claims, characterized in that the printed circuit board ( 200 ) an isolation area ( 245 ) between the first ( 240a ) and second layer ( 240b ) and in the overlap area ( 215 ) the first situation ( 240a ) laterally against the second contact area ( 210 ) and the second layer ( 240b ) laterally against the first contact area ( 205 ) isolated. Printed circuit board ( 200 ) according to one of the preceding claims, characterized in that in the overlapping area ( 215 ) an isolation area ( 245 ) at least between the first ( 240a ) and second layer ( 240b ) is provided, which has a recess into which the first layer ( 240a ) or the second layer ( 240b ) is embedded. Printed circuit board ( 200 ) according to one of the preceding claims, characterized in that the printed circuit board ( 200 ) in the overlapping area ( 215 ) at least a third electrically conductive layer ( 240c ) extending from the first contact area ( 205 ) is electrically contactable and from the first contact area ( 205 ) out in the direction of the second contact region ( 210 ), the third layer ( 240c ) on one of the first layer ( 240a ) opposite side of the second layer ( 240b ), and wherein the second ( 240b ) and third layer ( 240c ) partially overlap. Printed circuit board ( 200 ) according to claim 5, characterized in that the printed circuit board ( 200 ) in the overlapping area ( 215 ) at least a fourth electrically conductive layer ( 240d ) extending from the second contact area ( 210 ) is electrically contactable and from the second contact area ( 210 ) out in the direction of the first contact area ( 205 ), the fourth layer ( 240c ) on one of the second layer ( 240b ) opposite side of the third layer ( 240c ), and wherein the third ( 240c ) and fourth layer ( 240d ) partially overlap. Printed circuit board ( 200 ) according to one of claims 5 or 6, characterized in that in the overlapping area ( 215 ) an electrical isolation area ( 245 ), which extends from the direction of a first main surface of the printed circuit board ( 200 ) in the direction of one of the first main surface opposite the second main surface of the printed circuit board ( 200 ) and at least the first ( 240a ), second ( 240b ) and third layer ( 240c ) meanders around. Printed circuit board ( 200 ) according to one of the preceding claims, characterized in that on or on at least one main surface of the printed circuit board ( 200 ) in the overlapping area ( 215 ) an electrically conductive ground layer ( 250 ) arranged by the first ( 240a ) and / or second layer ( 240b ) is electrically isolated. Printed circuit board ( 200 ) according to one of the preceding claims, characterized in that in the first contact area ( 205 ) with at least the first layer ( 240a ) electrically conductively connected first supply conductor ( 220 ), wherein in the second contact region ( 210 ) with at least the second layer ( 240b ) electrically connected second supply conductor ( 225 ), wherein the first supply conductor ( 220 ) has a greater thickness than the first layer ( 240b ) and / or wherein the second supply conductor ( 225 ) has a greater thickness than the second layer ( 240b ). Printed circuit board ( 200 ) according to claim 9, characterized in that the first supply conductor ( 220 ) has a longitudinal extent which corresponds to a longitudinal extent of the first layer ( 240a ) substantially and / or that the second supply conductor ( 225 ) has a longitudinal extent which is substantially a longitudinal extension of the second layer ( 240b ) corresponds. Printed circuit board ( 200 ) according to one of claims 9 or 10, characterized in that at least one connection pin ( 230a . 230b ) provided in the first supply conductor ( 220 ) or embedded in the second supply conductor ( 225 ) is embedded or pressed in, wherein by the at least one connection pin ( 230a . 230b ) an electrical contact of the first ( 220 ) or second ( 225 ) Supply conductor from a main surface of the printed circuit board ( 200 ) is feasible. Power electronics circuit with at least one power electronic component ( 235 ) and at least one capacity ( 410 ), characterized in that further comprises a printed circuit board ( 200 ) according to one of the preceding claims, wherein the at least one power electronics component ( 235 ) on a first main surface of the printed circuit board ( 200 ) on the printed circuit board ( 200 ) and with the first layer ( 240a ) and wherein the capacity ( 410 ) on one of the first main surface opposite the second main surface of the printed circuit board ( 200 ) and with the second layer ( 240b ) is electrically connected. Procedure ( 600 ) for producing a printed circuit board for supplying at least one power electronics component, the method ( 600 ) a step of providing ( 610 ) of a board main body having a first contact area and a second contact area electrically isolated from the first contact area, characterized in that the method ( 600 ) comprises at least the following steps: - arranging ( 620 ) an electrically conductive first layer in an overlap region bounded by the first and second contact regions, the first layer being contactable from the first contact region and extending from the first contact region toward the second contact region; - application ( 630 ) an insulating layer on the first layer, wherein the insulating layer is applied such that the first layer is electrically isolated from the second contact region; and - introducing ( 640 ) of an electrically conductive second layer on the insulating layer, wherein the second layer is electrically contactable from the second contact region and extends from the second contact region in the direction of the first Kotaktbereichs, wherein the second layer is introduced such that it partially the first Location overlaps. Procedure ( 600 ) according to claim 14, characterized in that the method ( 600 at least one placing step in which a first supply conductor is placed in the first contact region and a second supply conductor in the second contact region, the method further comprising a step of electrically contacting in which the first supply conductor is contacted with the first layer and in which the second supply conductor is contacted with the second layer.

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