DE102010043627A1 - Method for cleaning polishing cloth used in double-sided silicon wafer polishing machine, involves arranging brush discs on carrier discs, for cleaning polishing cloths while supplying cleaning agent in presence of carrier discs - Google Patents

Method for cleaning polishing cloth used in double-sided silicon wafer polishing machine, involves arranging brush discs on carrier discs, for cleaning polishing cloths while supplying cleaning agent in presence of carrier discs Download PDF

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Publication number
DE102010043627A1
DE102010043627A1 DE201010043627 DE102010043627A DE102010043627A1 DE 102010043627 A1 DE102010043627 A1 DE 102010043627A1 DE 201010043627 DE201010043627 DE 201010043627 DE 102010043627 A DE102010043627 A DE 102010043627A DE 102010043627 A1 DE102010043627 A1 DE 102010043627A1
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DE
Germany
Prior art keywords
polishing
disc
brush
discs
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE201010043627
Other languages
German (de)
Inventor
Johannes Staudhammer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic AG filed Critical Siltronic AG
Priority to DE201010043627 priority Critical patent/DE102010043627A1/en
Publication of DE102010043627A1 publication Critical patent/DE102010043627A1/en
Ceased legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools, brushes, or analogous members
    • B08B1/04Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools, brushes, or analogous members
    • B08B1/007Cleaning by methods involving the use of tools, brushes, or analogous members having means to clean the cleaning members before, during or after use
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/28Work carriers for double side lapping of plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/02Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007Cleaning of grinding wheels
    • AHUMAN NECESSITIES
    • A46BRUSHWARE
    • A46BBRUSHES
    • A46B13/00Brushes with driven brush bodies or carriers
    • A46B13/008Disc-shaped brush bodies

Abstract

The method involves removing workpieces from recesses of carrier discs (11) after polishing the workpieces between upper and lower polishing plates covered with polishing cloths. The carrier discs are remained on the lower polishing plate. The brush discs (10) are arranged on the carrier discs. The polishing cloths are cleaned by using the brush discs while supplying cleaning agent in the presence of carrier discs. The carrier disc is made of plastic material. An independent claim is included for brush disc for cleaning polishing cloth.

Description

  • The invention relates to a method for cleaning polishing cloths after polishing workpieces between two covered with the polishing cloths lower and upper polishing plates. The invention also provides a device for cleaning polishing cloths for use in polishing machines for polishing workpieces between two lower and upper polishing plates covered with the polishing cloths.
  • Workpieces such as silicon wafers are typically subjected to a polish known as double-side polishing (DSP). During a DSP, both side surfaces of a workpiece are polished simultaneously between two upper and lower polishing plates covered with polishing cloths by supplying a polishing agent. As a rule, then several workpieces are in recesses of several carriers ("carrier"), so that a plurality of workpieces can be polished at the same time. The carriers have on the outer circumference teeth, by means of which they are placed during a polishing in a rotational movement, which guides the workpieces along a cycloidal trajectory on the polishing cloths of the rotating polishing plate. Typically, pins of an outer and an inner pin collar of the polishing machine engage in the gaps between the teeth of the carriers. A drive, which rotates the inner pin collar, rotates the carriers into their own center and around the center of the polishing plates.
  • The US 2002/0115387 A1 contains the description of a DSP process, which illustrates the principle of this type of polishing using the example of semiconductor wafers.
  • Over time, abrasion from the workpieces and lodged in the pores of the polishing cloths will affect the serviceability of the polishing cloths. In particular, the period required to achieve a specific material removal by means of the polish is thus extended. To counteract this effect, the runners are replaced by an operator by brush discs, and the brush discs moved by supplying a cleaning agent in a similar manner as the carriers over the polishing cloths. The pores are cleaned by the action of the cleaning agent and the bristles of the brush disks penetrating into the pores of the polishing cloths.
  • If the cleaning of the polishing cloths has to be done comparatively frequently or even after every polishing of workpieces, it takes a considerable amount of time, which has an adverse effect on the productivity of the polishing.
  • To solve this problem is in the US 2010/0130111 A1 proposed to automate the process of replacing the carriers by brush discs. However, this solution requires a relatively high capital expenditure, which can hardly compensate for the associated productivity gain.
  • Object of the present invention is to provide a more advantageous solution of the problem described.
  • The object is achieved by a method for cleaning polishing cloths after polishing workpieces between two covered with the polishing cloths lower and upper polishing plates, wherein
    the polished workpieces are removed from recesses of carriers and the carriers remain on the lower polishing plate,
    Brush disks are placed on a number of rotor disks, and
    the polishing cloths are cleaned by means of the brush discs by supplying a cleaning agent in the presence of the carrier discs.
  • The object is further achieved by a brush disk for cleaning polishing cloths, which cover a lower and an upper polishing plate, comprising
    a carrier disc having a lower and an upper side surface, the periphery of which is provided with teeth;
    Bristles which are anchored in the support disc and which rise from the planes of the lower and upper side surfaces, wherein the lower side surface of the support disc has locations which are free of bristles to the direct contact of the carrier disc with a rotor disc after the disc has been deposited to allow on the rotor for the purpose of cleaning the polishing cloths.
  • The proposed solution can be realized without high investment requirements, because the brush discs can be made comparatively simple and inexpensive. In addition, the solution is characterized by the fact that the time required for cleaning the polishing cloths is significantly shorter, because the comparatively time-consuming removal of the carrier discs from the lower polishing plate before cleaning and covering the rotor discs on the lower polishing plate after cleaning is eliminated. It is inventively replaced by the time-saving storage of brush discs on a number of carriers before cleaning the polishing cloths and removing the discarded brush discs after cleaning the polishing cloths.
  • The invention will be described in more detail with reference to figures.
  • 1 shows in plan view a conventional rotor disc.
  • 2 shows in plan view an arrangement of five carriers on the lower polishing plate of a DSP machine.
  • 3 shows in plan view the upper side surface of the carrier disc of a preferred trained brush disc of the present invention.
  • 4 shows in plan view the lower side surface of the carrier disk of the preferred formed brush disk of the present invention.
  • 5 shows a section through the preferred trained brush disk of the present invention along in the 3 and 4 drawn section line AA.
  • 6 shows the arrangement according to 2 with three brush discs placed on rotor discs.
  • In the 1 illustrated typical rotor disc 1 is one on the perimeter with teeth 2 provided workpiece holder with recesses 3 , in which workpieces are inserted. Workpieces are for example semiconductor wafers, in particular silicon wafers with a diameter in the range of 200 to 450 mm. To protect the delicate edge of the workpieces, the recesses are 3 with frame 4 plastic lined. In addition, there are more recesses 5 present, which facilitate the distribution of the polishing agent during the polishing of the workpieces.
  • In the illustration according to 2 are five similar carriers 1 on a polishing pad covered lower polishing plate 7 a DSP machine stored. The carriers are located between an inner pin collar 8th and an outer pin collar 9 , The pencils 6 of the two pin rings reach into the gaps between the teeth 2 on the circumference of the carriers.
  • After polishing, the polished workpieces are lifted out of the recesses. If subsequently a cleaning of the polishing cloths is provided, the carriers remain according to the method according to the invention on the lower polishing plate 7 lie. 2 represents this situation. Brush discs are then placed on a number of carriers according to the invention.
  • A trained in a preferred manner brush disk is in the 3 to 5 presented in different views. 3 shows the upper side surface 15 the carrier disk 11 the brush disc 10 in the plan view. The carrier disk 11 is at its outer periphery with teeth 12 Mistake. The diameter and the toothing of the carrier disc 11 correspond to the diameter and the toothing of the rotor disc 1 , In the carrier disk 11 Bristles are anchored, resulting from the levels of the lower and the upper side surface of the carrier disc 11 rise. The bristles are preferably bristle tufts 13 grouped. The bristle tufts 13 are on the upper side surface 15 the carrier disk 11 arranged on an annular surface, preferably at regular intervals. In order to facilitate the correct positioning of the brush disc when placing the brush disc on a rotor disc and to control, orientation recesses are incorporated in the carrier disc. They are located in places where, if correctly positioned, corresponding recesses are present in the underlying rotor disc. The brush disc shown has Orientierungsausnehmungen 14 and 16 on the inner circumference and in the edge area of the inner circumference. The carrier disc is preferably made of a mechanically resistant plastic, for example of polyvinyl chloride (PVC) or of a plastic whose material properties are similar to those of PVC. It has a thickness in the range of preferably 10 to 20 mm.
  • The bristles are preferably made of a thermoplastic material with high resistance to chemicals, for example of polyamide (PA) or of a plastic whose material properties are similar to those of PA. The bristles preferably have a diameter in the range of 0.5 to 1.0 mm, the bristle tufts have a diameter in the range of preferably 5 to 12 mm. The bristles rise from the planes of the lower and upper side surfaces of the carrier disk over a length in the range of preferably 5 to 12 mm.
  • 4 shows the lower side surface 17 the carrier disk 11 the brush disc 10 in the plan view. The lower side surface differs in the distribution of bristle tufts 13 , There are places that are free of bristles to the direct contact of the carrier disc 11 with the rotor disc 1 after removing the brush disc 10 on the rotor disc for the purpose of cleaning the polishing cloths to allow.
  • The different distribution of bristle tufts 13 on the upper and the lower side surface 15 and 17 the carrier disc of the brush disc 10 also goes from the sectional view according to 5 out. bristles 18 are to bristle tufts 13 grouped.
  • According to a particular embodiment care is taken that the population density of the upper and lower side surfaces of the carrier disk of the brush disk with bristle tufts (bristle tufts per unit area) is essentially the same. If the approximately equal number of bristle tufts is present on both side surfaces of the carrier disk, the upper and lower polishing cloths are subjected during cleaning to the approximately same specific brush pressure.
  • In accordance with the method according to the invention, brush disks are placed on a number of the rotor disks lying on the lower polishing plate for cleaning the polishing cloths. The number of brush discs placed on the carriers is equal to the number of carriers located on the lower polishing plate, or the number is smaller than the number of carriers located on the lower polishing plate, and at least three brush discs are placed on the carriers.
  • The latter possibility is recommended if more than three carriers are on the lower polishing plate. In this case, three brush discs are sufficient for cleaning the polishing cloths, so that the time can be saved, to occupy more rotor discs with brush discs. On the other hand, at least three brush discs should be distributed as evenly as possible over the existing carriers to obtain a stable arrangement.
  • 6 shows such an arrangement, which results when three brush discs 10 distributed as evenly as possible on the lower polishing plate 7 lying rotor discs 1 according to 2 be placed.
  • According to a particular embodiment of the invention, the distribution of the bristle tufts on the upper and the lower side surface of the carrier disk is selected in each case such that the density of the bristle tufts becomes as uniform as possible relative to the surface of the lower polishing plate. This measure is also directed to distribute the brush pressure as evenly as possible over the polishing cloths.
  • After placing the brush discs on the carriers, the upper polishing plate is lowered onto the lower polishing plate, the polishing machine is closed, and the polishing cloths are cleaned by means of the brush discs while supplying a cleaning agent in the presence of the carriers. During the cleaning of the polishing cloths, the brush discs, together with the carrier discs, perform the same rotational movements as the carriers during the polishing of workpieces.
  • QUOTES INCLUDE IN THE DESCRIPTION
  • This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
  • Cited patent literature
    • US 2002/0115387 A1 [0003]
    • US 2010/0130111 A1 [0006]

Claims (8)

  1. A method of cleaning polishing cloths after polishing workpieces between two lower and upper polishing plates covered with the polishing cloths, wherein the polished workpieces are removed from recesses of carriers and the carriers remain on the lower polishing plate, Brush disks are placed on a number of rotor disks, and the polishing cloths are cleaned by means of the brush discs by supplying a cleaning agent in the presence of the carrier discs.
  2. The method of claim 1, wherein the number of brush discs placed on carrier discs is equal to the number of carriers located on the lower polishing plate, or wherein the number of brush discs placed on carriers is less than the number of carriers located on the lower polishing plate and at least three brush discs be placed on carriers.
  3. A brush disc for cleaning polishing cloths covering a lower and an upper polishing plate, comprising a carrier disk having a lower and an upper side surface whose outer periphery is provided with teeth; Bristles which are anchored in the support disc and which rise from the planes of the lower and upper side surfaces, wherein the lower side surface of the support disc has locations which are free of bristles to the direct contact of the carrier disc with a rotor disc after the disc has been deposited to allow on the rotor for the purpose of cleaning the polishing cloths.
  4. A brush disc according to claim 3, wherein the bristles rise from the planes of the lower and upper side surfaces of the carrier disc over a length of 5 to 12 mm.
  5. Brush disc according to claim 3 or claim 4, wherein the carrier disc and the bristles are made of plastic.
  6. A brush disc according to any one of claims 3 to 5, wherein the bristles are grouped into bristle tufts.
  7. A brush disc according to claim 6, wherein the density of the bristle tufts relative to a side surface of the carrier disc is substantially equal on the lower and upper side surfaces of the carrier disc.
  8. Brush disc according to one of claims 3 to 7, comprising orientation recesses for positioning the brush disc when placing the brush disc on a rotor disc.
DE201010043627 2010-11-09 2010-11-09 Method for cleaning polishing cloth used in double-sided silicon wafer polishing machine, involves arranging brush discs on carrier discs, for cleaning polishing cloths while supplying cleaning agent in presence of carrier discs Ceased DE102010043627A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE201010043627 DE102010043627A1 (en) 2010-11-09 2010-11-09 Method for cleaning polishing cloth used in double-sided silicon wafer polishing machine, involves arranging brush discs on carrier discs, for cleaning polishing cloths while supplying cleaning agent in presence of carrier discs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201010043627 DE102010043627A1 (en) 2010-11-09 2010-11-09 Method for cleaning polishing cloth used in double-sided silicon wafer polishing machine, involves arranging brush discs on carrier discs, for cleaning polishing cloths while supplying cleaning agent in presence of carrier discs

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DE102010043627A1 true DE102010043627A1 (en) 2012-05-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109048629A (en) * 2018-09-04 2018-12-21 抚州联创恒泰光电有限公司 Polissoir

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020115387A1 (en) 2000-12-07 2002-08-22 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Double-side polishing process with reduced scratch rate and device for carrying out the process
US20100130111A1 (en) 1999-05-17 2010-05-27 Akira Horiguchi Double side polishing method and apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100130111A1 (en) 1999-05-17 2010-05-27 Akira Horiguchi Double side polishing method and apparatus
US20020115387A1 (en) 2000-12-07 2002-08-22 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Double-side polishing process with reduced scratch rate and device for carrying out the process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109048629A (en) * 2018-09-04 2018-12-21 抚州联创恒泰光电有限公司 Polissoir
CN109048629B (en) * 2018-09-04 2020-04-24 抚州联创恒泰光电有限公司 Polishing equipment

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R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final
R003 Refusal decision now final

Effective date: 20150212