DE102010027516A1 - Apparatus for high-precision structuring of the thin film solar cell modules, comprises a transport device for receiving and transporting a thin film solar cell module to a process unit in a transport direction, and a track detection unit - Google Patents
Apparatus for high-precision structuring of the thin film solar cell modules, comprises a transport device for receiving and transporting a thin film solar cell module to a process unit in a transport direction, and a track detection unit Download PDFInfo
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- DE102010027516A1 DE102010027516A1 DE102010027516A DE102010027516A DE102010027516A1 DE 102010027516 A1 DE102010027516 A1 DE 102010027516A1 DE 102010027516 A DE102010027516 A DE 102010027516A DE 102010027516 A DE102010027516 A DE 102010027516A DE 102010027516 A1 DE102010027516 A1 DE 102010027516A1
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000001514 detection method Methods 0.000 title claims abstract description 11
- 230000007704 transition Effects 0.000 description 11
- 239000002346 layers by function Substances 0.000 description 10
- 239000011295 pitch Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003708 edge detection Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012567 pattern recognition method Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
- B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Die Erfindung betrifft eine Vorrichtung zur Strukturierung von Dünnschichtsolarzellenmodulen, wie sie gattungsgemäß aus der
Dünnschichtsolarzellenmodule bestehen aus einem starren oder flexiblen Substrat, welches als Träger für darauf aufgebrachte dünne Funktionsschichten dient.Thin film solar cell modules consist of a rigid or flexible substrate which serves as a support for thin functional layers applied thereon.
Zur Herstellung von Dünnschichtsolarzellenmodulen wird typischerweise nach dem flächigen Aufbringen einer ersten Funktionsschicht auf das Substrat diese linienförmig in vorbestimmten Abständen zueinander abgetragen, wodurch p1-Spuren mit einer Tiefe gleich der Dicke der ersten Funktionsschicht gebildet werden.In order to produce thin-film solar cell modules, after the planar application of a first functional layer to the substrate, it is typically removed linearly at predetermined distances from one another, whereby p1 traces having a depth equal to the thickness of the first functional layer are formed.
Anschließend wird eine zweite Funktionsschicht flächig aufgetragen, mit der die p1-Spuren verfüllt werden. Möglichst nahe der p1-Spuren werden hierzu parallel p2-Spuren erzeugt, in denen die zweite Funktionsschicht, nicht jedoch die erste Funktionsschicht abgetragen wird. Nach dem flächigen Auftragen einer dritten Funktionsschicht, welche die p2-Spuren verfüllt, werden nahe der p2-Spuren und der p1-Spuren jeweils sogenannte p3-Spuren erzeugt, in denen die zweite und dritte Funktionsschicht, nicht jedoch die erste Funktionsschicht abgetragen wird.Subsequently, a second functional layer is applied flat, with which the p1-traces are filled. As close as possible to the p1 tracks, parallel p2 tracks are generated for this, in which the second functional layer, but not the first functional layer, is removed. After the planar application of a third functional layer, which fills the p2 tracks, so-called p3 traces are generated near the p2 tracks and the p1 tracks, in which the second and third functional layer, but not the first functional layer, is removed.
Jeweils in verschiedenen Bearbeitungsebenen liegende, zueinander benachbarte p1,- p2,- und p3-Spuren bilden gemeinsam einen Übergangsbereich, der die einzelnen Funktionsbereiche des Dünnschichtsolarzellenmoduls voneinander trennt.Mutually adjacent p1, p2, and p3 traces, which lie adjacent to each other in different processing planes, together form a transition region which separates the individual functional regions of the thin-film solar cell module.
Zum Einbringen der Spuren sind unterschiedliche Technologien bekannt, die auf mechanischen, chemischen oder thermischen Effekten beruhen können. Dabei sollen die Spuren innerhalb eines Übergangsbereiches, ohne sich zu überlappen oder gar zu überkreuzen, einen möglichst geringen Abstand zueinander aufweisen, um die Übergangsbereiche so schmal wie möglich zu gestalten.For the introduction of the tracks different technologies are known, which can be based on mechanical, chemical or thermal effects. In this case, the tracks within a transition region, without overlapping or even crossing, have the smallest possible distance from each other to make the transition areas as narrow as possible.
Unabhängig von der Technologie des Einbringens der Spuren wird das Substrat wenigstens beim Aufbringen der Funktionsschichten thermisch belastet, was zu dessen Verformung und damit zur Verformung bereits eingebrachter Spuren führen kann.Regardless of the technology of introducing the tracks, the substrate is subjected to thermal stress at least when applying the functional layers, which can lead to its deformation and thus to the deformation of already introduced tracks.
Aus diesem Grund ist bei fest eingestellten Spurabständen der Größe des Abstandes benachbarter Spuren nach unten hin eine Grenze gesetzt, die gewährleistet, dass sich die Spuren in den unterschiedlichen Schichtebenen trotz maximal möglicher Verformung nicht überlappen oder kreuzen.For this reason, at fixed track pitches, the size of the spacing of adjacent tracks toward the bottom has a limit that ensures that the tracks in the different layer planes do not overlap or intersect despite maximum possible deformation.
Eine Anordnung, mit der gleichzeitig mehrere zueinander parallele Spuren z. B. in Wafer eingebracht werden können, ist aus der
Bei einer Verwendung dieser Anordnung zum Einbringen von Spuren in Dünnschichtsolarzellenmodule ist es von Nachteil, dass sie nicht geeignet ist, Spurabstandsschwankungen bereits erzeugter Spuren bei der Erzeugung von weiteren Spuren zu beachten, weshalb die Übergangsbereiche so breit gewählt werden müssen, dass diese Spurabstandsschwankungen nicht zur Überlappung von benachbarten Spuren führt.When using this arrangement for introducing tracks in thin-film solar cell modules, it is disadvantageous that it is not suitable to observe track pitch variations of already generated tracks in the generation of further tracks, so the transition areas must be chosen so broad that these track pitch variations do not overlap leads from adjacent tracks.
Bei einer üblichen Ausrichtung der Spurverläufe anhand einer Außenkante eines Dünnschichtsolarzellenmoduls werden daher Sicherheitsabstände von ca. 100–200 μm für den Sollverlauf der Spuren zueinander vorgegeben. Das heißt das Strukturierungswerkzeug wird für die Spuren innerhalb eines Übergangsbereiches mit Abständen parallel zur Außenkante geführt, die sich zueinander je nach Spurbreite um ca. 100–200 μm unterscheiden. Dadurch entsteht eine Mindestbreite für einen Übergangsbereich von größer 200–400 μm.In a conventional alignment of the tracks on the basis of an outer edge of a thin-film solar cell module therefore safety distances of about 100-200 microns for the desired course of the tracks are given to each other. That is, the patterning tool is guided for the tracks within a transition region with distances parallel to the outer edge, which differ from each other depending on the track width by about 100-200 microns. This creates a minimum width for a transition region of greater than 200-400 microns.
Um ein Dünnschichtsolarzellenmodul mit schmaleren Übergangsbereichen und damit einem verbesserten Wirkungsgrad zur Verfügung zu stellen, wird in der
Gleich dem in der
In der
Eine solche Strukturierungsvorrichtung weist eine Spurerfassungseinheit mit einer Kamera auf, mit der bereits zuvor eingebrachte und damit vorhandene Spuren hinsichtlich ihres Spurverlaufes und ihrer Lage erfasst werden. Mit einer der Kamera nachgeschalteten Bildverarbeitungseinheit wird das aufgenommene, die Spuren zeigende Digitalbild mit an sich bekannten Mustererkennungsverfahren (z. B. Kantendetektionsverfahren) ausgewertet. Die ausgewerteten Informationen, insbesondere die entlang der Spurverläufe unterschiedlicher Spurengruppen zueinander oder jeweils zur ersten Spurengruppe (Referenzgruppe) variierenden Abstände werden in einer Speichereinheit der Spurerfassungseinheit abgespeichert.Such a structuring device has a track detection unit with a camera, with which previously introduced and thus existing tracks are detected with regard to their track course and their position. With an image processing unit connected downstream of the camera, the recorded digital image showing the tracks is evaluated by per se known pattern recognition method (eg edge detection method). The evaluated information, in particular the distances that are varying along the track courses of different track groups relative to one another or to the first track group (reference group) in each case, are stored in a memory unit of the track detection unit.
Die abgespeicherten Informationen werden dann einer mit der Spurerfassungseinheit verbundenen Spursteuereinheit zugeführt, welche die Einbringung weiterer Spuren gruppenweise steuert.The stored information is then supplied to a tracking control unit connected to the track detection unit, which controls the introduction of further tracks in groups.
Des Weiteren weist eine Strukturierungsvorrichtung gemäß der
Die Strukturierungseinheiten sind jeweils mit einer beweglichen Halterung an einer quer zur Transporteinrichtung angeordneten Schiene aufgehängt und sind somit entlang der Schienenachse voneinander beabstandet in einer Reihe angeordnet. Jede Halterung ist mit einem Antrieb versehen, welcher durch die Spursteuereinheit angesteuert wird.The structuring units are each suspended with a movable support on a rail arranged transversely to the transport device and are thus arranged spaced apart along the rail axis in a row. Each holder is provided with a drive which is controlled by the tracking control unit.
Die Strukturierungswerkzeuge können z. B. mechanische Ritznadeln sein.The structuring tools can, for. B. be mechanical scoring needles.
Es erschließt sich dem Fachmann, dass eine Vorrichtung gemäß der
Die Offenbarung der
Es ist die Aufgabe der Erfindung, eine Vorrichtung zum Strukturieren von Dünnschichtsolarzellenmodulen vorzuschlagen, mit der, ohne dass der technische Aufwand für die Vorrichtung erhöht wird, die weiteren Spuren mit Spurverläufen erzeugt werden, die genauer auf die Spurverläufe bereits eingebrachter Spuren abgestimmt sind.It is the object of the invention to propose a device for structuring thin-film solar cell modules, with which, without increasing the technical complexity of the device, the further tracks are generated with track curves, which are more precisely tuned to the tracks of already introduced tracks.
Die Aufgabe wird für eine Vorrichtung zur hochgenauen Strukturierung von Dünnschichtsolarzellenmodulen mit einer Transporteinrichtung zur Aufnahme und zum Transport eines Dünnschichtsolarzellenmoduls in eine Transportrichtung senkrecht zur Breite eines aufgenommenen Dünnschichtsolarzellenmoduls, einer Prozesseinheit, die eine Vielzahl von Strukturierungswerkzeugen und an einer Schiene senkrecht zur Transportrichtung voneinander unabhängig ansteuerbare bewegliche Halterungen aufweist, sowie einer Spurerfassungseinheit zum Erfassen und Abspeichern der Spurverläufe und der Lage bereits eingebrachter Spuren und einer Spursteuereinheit, mit der in Abhängigkeit der abgespeicherten Informationen vorhandene Linearantriebe angesteuert werden, die jeweils mit einer Halterung in Verbindung stehen, dadurch gelöst, dass jede Halterung genau ein Strukturierungswerkzeug trägt, die Schiene an einer zu dieser parallel angeordneten Haupt-Schiene senkrecht zur Transporteinrichtung beweglich ist und ein zusätzlicher mit der Schiene in Verbindung stehender Haupt-Linearantrieb vorhanden ist, um die Schiene über die Breite eines aufgenommenen Dünnschichtsolarzellenmoduls entlang der Haupt-Schiene versetzen zu können.The object is for a device for highly accurate structuring of thin film solar cell modules with a transport device for receiving and transporting a thin film solar cell module in a transport direction perpendicular to the width of a recorded thin film solar cell module, a process unit, the plurality of structuring tools and on a rail perpendicular to the transport direction independently controllable movable Has holders, and a track detection unit for detecting and storing the track characteristics and the location of already introduced tracks and a tracking control unit, with the existing depending on the stored information linear actuators are triggered, each of which is in connection with a holder, achieved in that each holder carries exactly one structuring tool, the rail is movable on a parallel to this arranged main rail perpendicular to the transport device and an additional associated with the rail main Linear drive is available to move the rail across the width of a recorded thin film solar cell module along the main rail can.
Vorteilhaft weisen die Linearantriebe einen gemeinsamen passiven Teil auf, der als Magnetbahn entlang der Schiene ausgebildet ist.Advantageously, the linear drives on a common passive part, which is designed as a magnetic path along the rail.
Weiterhin ist es vorteilhaft, wenn eines der Strukturierungswerkzeuge ein Referenz-Strukturierungswerkzeug ist, das vorteilhaft über die ihm zugeordnete Halterung fest mit der Schiene verbunden ist.Furthermore, it is advantageous if one of the structuring tools is a reference structuring tool, which is advantageously fixedly connected to the rail via the holder assigned to it.
Anhand der Zeichnung wird die Vorrichtung im Folgenden beispielhaft näher erläutert.Reference to the drawing, the device will be explained in more detail below by way of example.
Es zeigen:Show it:
Eine erfindungsgemäße Vorrichtung, gezeigt in
Auch wenn es sich bei dem Werkstück noch nicht um ein fertiggestelltes Dünnschichtsolarzellenmodul
Die Transporteinrichtung
Mittels der Transporteinrichtung
Die Transporteinrichtung
Die Ausführung der Prozesseinheit
Mit den Begriffen der
Die Haupt-Schiene
Das Referenz-Strukturierungswerkzeug
Gleich dem Stand der Technik ist eine Spurerfassungseinheit
Das integrierte Führungssystem umfasst eine Vielzahl von Halterungen
Um die Position einer jeden Halterung
Die Linearantriebe
Das integrierte Führungssystem ist über einen zusätzlich vorhandenen Haupt-Linear-Antrieb
Die Strukturierungswerkzeuge
Jedes einzelne mechanische Strukturierungswerkzeug
Grundsätzlich ist der notwendige Bauraum, wie er pro Halterung
BezugszeichenlisteLIST OF REFERENCE NUMBERS
- 11
- DünnschichtsolarzellenmodulThin film solar cell module
- 22
- Transporteinrichtungtransport means
- 33
- Strukturierungswerkzeugstructuring tool
- 3.13.1
- Referenz-StrukturierungswerkzeugReference structuring tool
- 44
- Halterungbracket
- 55
- Schienerail
- 66
- SpurerfassungseinheitTrack detection unit
- 77
- Spurtrack
- 88th
- SpursteuereinheitTracking control unit
- 99
- Linearantrieblinear actuator
- 1010
- Haupt-SchieneMain rail
- 1111
- Haupt-LinearantriebMain linear drive
- 1212
- Prozesseinheitprocess unit
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- DE 102006051555 B3 [0001, 0013] DE 102006051555 B3 [0001, 0013]
- DE 19840936 B4 [0009, 0020, 0021, 0035] DE 19840936 B4 [0009, 0020, 0021, 0035]
- DE 102006051555 B4 [0012, 0014, 0017, 0020] DE 102006051555 B4 [0012, 0014, 0017, 0020]
Claims (3)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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DE102010027516A DE102010027516A1 (en) | 2010-07-15 | 2010-07-15 | Apparatus for high-precision structuring of the thin film solar cell modules, comprises a transport device for receiving and transporting a thin film solar cell module to a process unit in a transport direction, and a track detection unit |
PCT/DE2011/075166 WO2012062296A2 (en) | 2010-07-15 | 2011-07-15 | Device for structuring thin-film solar cell modules in a highly accurate manner |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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DE102010027516A DE102010027516A1 (en) | 2010-07-15 | 2010-07-15 | Apparatus for high-precision structuring of the thin film solar cell modules, comprises a transport device for receiving and transporting a thin film solar cell module to a process unit in a transport direction, and a track detection unit |
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Publication Number | Publication Date |
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DE102010027516A1 true DE102010027516A1 (en) | 2012-01-19 |
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DE102010027516A Ceased DE102010027516A1 (en) | 2010-07-15 | 2010-07-15 | Apparatus for high-precision structuring of the thin film solar cell modules, comprises a transport device for receiving and transporting a thin film solar cell module to a process unit in a transport direction, and a track detection unit |
Country Status (2)
Country | Link |
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DE (1) | DE102010027516A1 (en) |
WO (1) | WO2012062296A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013184171A (en) * | 2012-03-06 | 2013-09-19 | Toray Eng Co Ltd | Marking device and method |
DE102012223289A1 (en) | 2012-12-14 | 2014-06-18 | 3D-Micromac Ag | Multi-stage production of electronic components with coated substrate, comprises e.g. processing portion of substrate at first laser processing station and transporting portion to second laser processing station |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104923994A (en) * | 2015-06-17 | 2015-09-23 | 陈幸 | Solar module battery piece single-soldering device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE19840936B4 (en) | 1998-09-08 | 2005-03-10 | Hell Gravure Systems Gmbh | Arrangement for multi-channel cutting and scoring of materials by means of laser beams |
DE102006033296A1 (en) * | 2006-07-17 | 2008-01-31 | Manz Automation Ag | Plant for structuring solar modules |
DE102008032555B3 (en) * | 2008-07-10 | 2010-01-21 | Innolas Systems Gmbh | Structuring device for the structuring of plate-shaped elements, in particular of thin-film solar modules, corresponding structuring method and use thereof |
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JPS6310073A (en) * | 1986-06-27 | 1988-01-16 | Shin Meiwa Ind Co Ltd | Cutting device |
IT250346Y1 (en) * | 1998-05-05 | 2003-09-03 | Atom Spa | MULTIPLE HEAD WATER JET CUTTING GROUP. IN PARTICULAR LEATHER, LEATHER AND SYNTHETIC MATERIALS. |
TW201002466A (en) * | 2008-04-10 | 2010-01-16 | Applied Materials Inc | Laser-scribing platform |
DE102008022449A1 (en) * | 2008-05-08 | 2009-11-12 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laser processing machine with extended working space |
-
2010
- 2010-07-15 DE DE102010027516A patent/DE102010027516A1/en not_active Ceased
-
2011
- 2011-07-15 WO PCT/DE2011/075166 patent/WO2012062296A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE19840936B4 (en) | 1998-09-08 | 2005-03-10 | Hell Gravure Systems Gmbh | Arrangement for multi-channel cutting and scoring of materials by means of laser beams |
DE102006033296A1 (en) * | 2006-07-17 | 2008-01-31 | Manz Automation Ag | Plant for structuring solar modules |
DE102008032555B3 (en) * | 2008-07-10 | 2010-01-21 | Innolas Systems Gmbh | Structuring device for the structuring of plate-shaped elements, in particular of thin-film solar modules, corresponding structuring method and use thereof |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013184171A (en) * | 2012-03-06 | 2013-09-19 | Toray Eng Co Ltd | Marking device and method |
DE102012223289A1 (en) | 2012-12-14 | 2014-06-18 | 3D-Micromac Ag | Multi-stage production of electronic components with coated substrate, comprises e.g. processing portion of substrate at first laser processing station and transporting portion to second laser processing station |
DE102012223289B4 (en) * | 2012-12-14 | 2021-02-11 | 3D-Micromac Ag | Process and manufacturing plant for the manufacture of electronic components |
Also Published As
Publication number | Publication date |
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WO2012062296A2 (en) | 2012-05-18 |
WO2012062296A3 (en) | 2012-08-30 |
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