DE102008047113A1 - System for lift-dip soldering of the components, comprises a first zone, in which a protective gas is introduced and the solder baths and scooping tools are present, and a unit for forming a second zone for the components to be soldered - Google Patents

Abstract

The lift-dip soldering system comprises a first zone (5), in which a protective gas is introduced and the solder baths and scooping tools (3) are present, and a unit for forming a second zone (14) for components (10a, 10b, 10c, 10d, 10e) to be soldered, where the second zone is flushable with the protective gas and the first and second zones are connected to a third zone (16) for soldering the components. A movable cover (4) is present between the first zone and the unit, and is horizontally moved away to connect the first and second zones to the third zone. The lift-dip soldering system comprises a first zone (5), in which a protective gas is introduced and the solder baths and scooping tools (3) are present, and a unit for forming a second zone (14) for components (10a, 10b, 10c, 10d, 10e) to be soldered, where the second zone is flushable with the protective gas and the first and second zones are connected to a third zone (16) for soldering the components. A movable cover (4) is present between the first zone and the unit, is horizontally moved away to connect the first and second zones to the third zone, and is present above a working level of the scooping tools. The unit for the formation of the second zone comprises an upper tool, the cover, an edge of the cover and/or an edge of a container for receiving the solder. The second zone is formed by a procedure of the upper tool in direction of the cover to an end with the edge, which surrounds the cover. The upper tool includes the components to be soldered. The first zone is flushable with the protective gas. The protective gas is nitrogen, argon or forming gas. The third zone comprises protective gas in an entire area between the components to be soldered. An independent claim is included for a method for lift-dip soldering.

Description

The The present invention relates to an apparatus and a method for lifting dip soldering.

The DE 44 25 260 A1 discloses a device comprising at least one solderable in a solder bath Lotträger and a lifting device for lifting the Lotträgers in a solder object adjacent to a solder joint. The solder carrier can be guided through an opening and a gas guide sleeve to the solder joint, wherein an annular gap for the passage of oxygen-reducing inert gas remains. As a result, and in that the free edge of the gas guide sleeve is located close to the solder joint, the quantity of solder transported by the solder carrier and the solder joint are flowed around by the oxygen-reduced protective gas.

In the DE 41 36 786 A1 the free surface of a solder bath is covered by means of a protective gas chamber, wherein the protective gas chamber has at least one each with a lid closable working opening and a supply opening for inert gas.

The DE 43 14 241 A1 discloses a soldering apparatus comprising a liquid solder pot, wherein there is overflowing inert gas over the solder. A soldering head connected to the container for flowing solder leaving at the soldering head is arranged in a protective gas flow which flows from the interior of the container into the open, wherein a protective gas guide channel forms an annular gap around the soldering head.

The Indian DE 44 25 260 A1 annular gap described for the Hub-Tauch-Löten allows a Schutzgaspurging the scooping tool and also the solder joint can be located in the region of the protective gas. For complex solder joints larger and partially connected openings for the scooping tools are required. Therefore, during transport of the scoop tool to the soldering point and during soldering, oxidation of the liquid solder surface as well as the solder joints may occur. As a result of oxidation, the solder defect rate may increase.

task It is the object of the present invention to provide an apparatus and a method specify, in a safer way, a brazing without oxidation the solder surface and the solder joints he possible. This object is achieved with a device according to claim 1, which comprises a first space, are introduced into the protective gas can and in which one or more solder baths and one or more scooping tools can be located and the means for forming a second space for a or more assemblies to be soldered, this being second space with inert gas is flushable and being used for soldering the one or more assemblies, the first space and the second Room can be connected to a third room. Farther the object is achieved by a method according to claim 11, in which protective gas is introduced into a first space and this first room has one or more solder baths and a or more scooping tools, wherein a second room is formed, which is for one or more soldering assemblies is provided and purged with inert gas is and wherein for soldering the one or more assemblies the first room and the second room connected to a third room become.

preferred Embodiments are in the subclaims disclosed.

A Hub plunger soldering apparatus comprises a first space which can be purged with inert gas and / or in the protective gas can be introduced. The first room may have one or more solder baths and one or more scooping tools. Thereby, that in the first room is inert gas, an oxidation avoided the liquid solder surface. Further The device comprises means for forming a second space for one or more assemblies to be soldered, this second Room with inert gas is flushable. Thus, it is possible the one or more assemblies under a protective gas atmosphere to keep. The assemblies to be soldered can solder joints and components. For soldering one or the other Multiple assemblies may be the first and the second space too be connected to a third room.

The Designation "third" space is used to distinguish from the first and from the second room, whereby the third room itself is not represents another space, but from the connection of the first and of the second space.

There for soldering the first and the second room, respectively Can contain inert gas and / or purged with shielding gas can be, can be connected in no step of the soldering ambient air with the Mix inert gas. In the second room can be exchanged penetrate ambient air from one or more modules. There this second space but can be flushed with inert gas can a protective gas atmosphere are created. preferably, has the first space above the one or more solder baths a protective gas atmosphere, so that when connecting the first and the second space each inert gas atmospheres can meet each other. In the third room, in which a Soldering can take place, so there is no Ambient air, so that thereby the soldering result is not negative can be influenced.

Of the first room may have one or more gas supplies and / or have one or more gas discharges. Are these closed, the first space is preferably gas-tight. The same goes for for the second room. Also with this can to Rinse one or more gas supply lines and / or one or be provided several gas discharges. To small leaks To prevent, a slight overpressure in the first and / or second Space of, for example, less than 20, 15, 10 or 5 mbar be.

Farther the device can between the first room and the means for Forming the second space have a movable cover, wherein This cover can be removed to the first room and the second room to join a third room. The usage a cover allows for easy subdivision into two rooms, which are also easy to remove to connect the cover to a room.

For example The cover can be moved horizontally to get out of the area to be removed, in which the first and the second room together bump. By removing the cover they can two rooms are connected to the third room.

The Cover may preferably be above a working plane of the one or more scooping tools are located. is the cover, which is used to perform a soldering process must be removed, above the working plane, so must the scooping tool to reach the working level, do not move so far upwards be like compared to the corresponding path when the cover would be below the work plane. This cools The scooping tool does not depend heavily, as it is little over the Lotbadspiegel must be raised out.

The Workplane represents a virtual level in which, for example the soldering process can take place. Ie. the work plane is not available through components of the device but arises, for example, by the relative arrangement of upper tool and scooping tool to each other.

In Further embodiments of the device can be provided be that the cover is below or at the working level located.

The Means for forming the second space may be an upper tool and cover. By using the upper tool for Formation of the second space may be due to the arrangement of the upper tool At the same time, the second room was created for soldering or closed.

Of the second space may be through a process of the upper tool in the direction on the cover to and through a conclusion with a border which the cover may be formed. The upper tool can for example, have a bell-shaped, the after is closed at the top and down towards the cover has an opening. Advantageously, the upper tool have a lid-shaped shape with, for example, a horizontal base and vertical or oblique Side faces. The upper tool can also be a flat base which form directly on a border of the cover to form of the second room. The border of the cover can be made to form serve the second room or be provided. moreover It is possible that the top tool has a separate lid comprises, corresponding to the border of the cover a second Can form space.

By such and / or similar forms of the upper tool is it possible that the top tool has a degree with a Border, which may include the cover may form. The space, the by the upper tool or by the upper tool belonging separate lid and the closed cover is formed, can be purged with inert gas, so that the assemblies, which can be covered by the upper tool, in one Protective gas atmosphere are located.

The Upper tool or belonging to the upper tool separate But lids can also do so on the edge of a container, which contains the solder, be put on that between Upper tool or cover, cover and edge of the solder bath container can form a second space. This second room can also be filled with protective gas and / or rinsed.

There the second room by an upper tool itself as well as the closed Cover can be formed, preferably Different top tools are used and still a room be generated together with the cover.

For example can the upper tool so in the opening of the border of the Cover retracted that with this height-adjustable upper tool the second room can be formed. In a further embodiment For example, the upper tool can have a depression which surrounds the border the cover receives when shutting down the upper tool and so forms the second room.

The Upper tool can be one or more to be soldered Pick up assemblies. For example, the upper tool can also comprise a workpiece holder which is shaped in this way, that it advantageously comprises recesses into which a or several boards, which are the assemblies to be soldered can be introduced. One Upper tool can be used several times, for example, soldered Assemblies can be replaced by assemblies to be soldered. To replace or replace assemblies can, the upper tool, for example, moved vertically become. An upper tool together with the soldered assemblies But it can also be removed and replaced with a new top tool soldering assemblies are replaced. For example It is possible that when exchanging one or more Assemblies the upper tool and / or assemblies of an atmosphere, the ambient air includes, may be exposed. To End of the exchange and creation of the second room is the second space advantageously flushed with inert gas and / or filled to remove the ambient air or their share to reduce. Thus, when connecting the first and the second Rooms of the device receive a protective gas atmosphere stay with it, and it can lead to no contamination of the first room Ambient air come.

The Rinsing of the second room, can be done by a switch, the operated by the upper tool in forming the second space will be triggered. Also, a controller may be provided be that detects or adjusts the position of the upper tool and after the positioning of the upper tool the second Space causing flushing of the second room.

Of the first room can be flushed with shielding gas. As a protective gas For example, nitrogen or argon or forming gas (gas mixture from nitrogen and hydrogen). The second room may be flushable with the same inert gas and / or this include. The two rooms can also with different Protective gas be flushed and / or this include.

For the soldering to be done can be a scooping tool move upwards in the direction of the assemblies to be soldered be done, wherein in a working plane the soldering done can. For example, it is also possible that the modules can be moved down to the scooping tool, until a working level is reached. Also, both Scooping tool and upper tool are moved, for example, to reach a working level. Preferably presents a work plane is a plane made by scooping tools and top tools appropriately by, for example vertical, method can be achieved, for example, a To be able to make soldering.

Of the third room can each be in an entire area between the one or more scooping tools and one or the plurality of components to be soldered inert gas. Since the cover can be completely removed from the area in which the first and the second space can meet the areas each completely for the one or the multiple scooping tools and for the one or more assemblies are available, wherein a protective gas atmosphere is present. Thereby a large area for soldering is available and this area also in one Inert gas atmosphere can be simple There are also complex, numerous and / or filigree solder joints be soldered.

In a method of lifting dip soldering, are used for soldering one or more modules to a first and a second room connected to a third room, wherein in the first room inert gas is introduced and wherein this first space one or more solder baths and contains one or more scooping tools and wherein the second space is formed, which for one or several assemblies to be soldered is provided and purged with inert gas becomes.

advantageous Embodiments of the invention will become apparent from the attached Figures explained. Showing:

1 : schematic representation of a device for Hub-Tauch-Löten with raised upper tool and submerged scooping tool;

2 : schematic representation of a device for Hub-Tauch-Löten with lowered upper tool and cover and immersed scooping tool;

3 : schematic representation of a device for Hub-Tauch-Löten with the cover removed;

4 : schematic representation of a device for Hub-Tauch-Löten with upper tool in a soldering position, lowered lid and immersed scooping tool;

5 : schematic representation of a device for Hub-Tauch-soldering during the soldering process.

1 shows a device for lifting dip soldering. The device shown here around holds a container 1 for holding liquid solder 2 , In the container 1 can be a movable scooping tool 3 which, as shown, in the solder bath 2 can be dipped. When dipping, the scooping tool can 3 in cup-like depressions, located in the upper regions of the abutments 3a . 3b of the scooping tool, carry along liquid solder. For example, in the container 1 also several scooping tools 3 are located. Also, the container can 1 be divided into several basins and / or include several basins, which can then each be filled with solder. In such a basin can be one or more scooping tools 3 enter and / or dive.

Above the shown solder bath 2 and below a cover 4 may be a protective gas atmosphere and / or this first room 5 can be rinsed with a protective gas. Through the use of the protective gas oxidation of the solder surface can be counteracted.

In addition, the in 1 shown device an upper tool 6 that has two boards as shown 9a . 9b with assemblies to be soldered 10a - 10e includes. The boards 9a . 9b be from a workpiece holder 8th held. The illustrated workpiece holder 8th is formed so that it includes recesses into which the boards 9a . 9b can be introduced. The illustrated upper tool 6 also includes a lid with a horizontal base 11 and vertical side surfaces 12 , For example, the vertical side surfaces 12 be provided so that these side surfaces 12 relative to the horizontal base 11 are vertically movable.

In 2 is the device for Hub-Tauch-Solten with lowered upper tool 6 and lowered lid shown. The lid is lowered so far that the lid with the border 13 the cover 4 a second room 14 forms. It can the side surfaces 12 the lid, for example, gas-tight with the border 13 to lock. It can be provided that the lid in the area in which he is in contact with the border 13 comes, includes one or more seals.

This second room 14 between the lid and the cover 4 can be purged with an inert gas and / or may include inert gas. Contains the second room 14 a sufficient concentration of protective gas, ie, for example, the proportion of ambient air was reduced or eliminated, so the cover 4 be removed, for example, to perform a soldering process.

As in 3 was shown by removing the cover 4 the first room 5 with the second room 14 to a third room 16 connected. The cover 4 can be moved to remove, for example, in the horizontal direction.

In 3 are the areas 15a . 15b pictured between the boards 9a . 9b and the scooping tool 3 are located and in which nothing more than inert gas, in particular no components of the device.

In 4 is shown that the upper tool 6 with the tool holder 8th and their comprehensive circuit boards 9a . 9b down towards the solder bath 2 was to proceed until, for example, a soldering position was reached.

For example, by a method of the scooping tool 3 up on the upper tool 6 to, the soldering of the assembly (s) 10a - 10e using the solder, which is the scooping tool 3 contains. Also, the top tool can 6 with the module (s) 10a - 10e additionally down towards the scooping tool 3 to proceed. This may be the upper tool 6 z. B. so in the opening of the border 13 the cover 4 retract that with height-adjustable upper tool the second room 14 is formed. Also, the top tool can 6 have a depression which the border 13 when shutting down the upper tool 6 takes up and so the second room 14 forms.

5 shows that from the solder bath 2 immersed and located in a soldering scooping tool 3 That in the constructions 3a . 3b liquid solder includes that for the soldering of the assemblies 10a - 10e is provided. The cup-like depressions are located at the positions in which a corresponding board has to be soldered assemblies.

After completion of the soldering process, the scooping tool 3 lowered again and / or in the solder bath 2 be immersed. The assemblies 10a - 10e can with the upper tool 6 go up as far as the cover 4 can be closed to each the first room 5 and the second room 14 restore. Then the top tool can 6 so far moved up that, for example, the brazed assemblies 10a - 10e can be removed and / or the upper tool 6 can be moved vertically further. These assemblies 10a - 10e can be exchanged for new components, for example. It is also possible, the entire upper tool 6 exchange.

Since the two processes filled with protective gas and / or flushed spaces are connected to the soldering process, in no step of the soldering process Mix ambient air with the inert gas, so that, for example, the soldering result would be adversely affected.

In a method of lift-dip soldering, a device 11 as in 1 - 5 shown to be used. In a first filled with inert gas and / or rinsed room can be a solder bath 2 are located, the room with a cover 4 closed is. A second space to be filled and / or purged with protective gas 14 can by lowering an upper tool 6 with the border 13 the cover 4 be formed. The upper tool 6 can in this case one or more assemblies to be soldered 10a - 10e include. By removing the cover 4 become the first room 5 and the second room 14 to a third room 16 connected. In this third room 16 may be soldering one or more assemblies 10a - 10e take place in a protective gas atmosphere.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - DE 4425260 A1 [0002, 0005]
• - DE 4136786 A1 [0003]
• - DE 4314241 A1 [0004]

Claims (11)

Device for lifting dip soldering with a first space ( 5 ), in which inert gas can be introduced and in which moreover one or more solder baths ( 2 ) and one or more scooping tools ( 3 ), characterized by means for forming a second space ( 14 ) for one or more assemblies to be soldered ( 10a - 10e ), this second space ( 14 ) is flushable with shielding gas, and wherein for soldering the one or more assemblies ( 10a - 10e ) the first room ( 5 ) and the second room ( 14 ) to a third room ( 16 ) can be connected. Apparatus according to claim 1, characterized in that between the first space ( 5 ) and the means for forming the second space ( 14 ) a movable cover ( 4 ), this cover ( 4 ) can be moved away to the first room ( 5 ) and the second room ( 14 ) to the third room ( 16 ) connect to. Device according to claim 2, characterized in that the cover ( 4 ) can be moved horizontally. Device according to claim 2 or 3, characterized in that the cover ( 4 ) above a working plane of the one or more scooping tools ( 3 ) can be located. Device according to one of claims 2 to 4, characterized in that the means for forming the second space ( 14 ) an upper tool ( 6 ) and / or the cover ( 4 ) and / or the border ( 13 ) of the cover ( 4 ) and / or an edge of a container ( 1 ) for receiving solder. Device according to claim 5, characterized in that the second space ( 14 ) by a method of an upper tool ( 6 ) towards the cover ( 4 ) to and a conclusion with a border ( 13 ), which the cover ( 4 ) can be formed. Apparatus according to claim 5 or 6, characterized in that the upper tool ( 6 ) the one or more assemblies to be soldered ( 10a - 10e ). Device according to one of claims 1 to 7, characterized in that the first space ( 5 ) is flushable with inert gas. Device according to one of claims 1 to 8, characterized in that nitrogen or argon as inert gas or forming gas can be used. Device according to one of claims 1 to 9, characterized in that the third space ( 16 ) each in an entire area ( 15a . 15b ) between the one or more scooping tools ( 3 ) and the one or more assemblies to be soldered ( 10a - 10e ) Inert gas. Hub plunger soldering method in which a first space ( 5 ) Inert gas is introduced and wherein this first space ( 5 ) one or more solder baths ( 2 ) and one or more scooping tools ( 3 ), characterized in that a second space ( 14 ) is formed, which for one or more assemblies to be soldered ( 10a - 10e ) and is purged with protective gas, and that for soldering the one or more assemblies ( 10a - 10e ) the first room ( 5 ) and the second room ( 14 ) to a third room ( 16 ) get connected.