DE102007041926A1 - Method for electrical insulation of unpackaged electronic construction element, particularly high power element or semiconductor high power element, involves fastening or electrical contacting of connection surface on lower surface - Google Patents
Method for electrical insulation of unpackaged electronic construction element, particularly high power element or semiconductor high power element, involves fastening or electrical contacting of connection surface on lower surface Download PDFInfo
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- DE102007041926A1 DE102007041926A1 DE102007041926A DE102007041926A DE102007041926A1 DE 102007041926 A1 DE102007041926 A1 DE 102007041926A1 DE 102007041926 A DE102007041926 A DE 102007041926A DE 102007041926 A DE102007041926 A DE 102007041926A DE 102007041926 A1 DE102007041926 A1 DE 102007041926A1
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- electrically insulating
- substrate
- insulating mass
- electrical
- electrically
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 238000010276 construction Methods 0.000 title abstract description 4
- 238000010292 electrical insulation Methods 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000004020 conductor Substances 0.000 claims abstract description 45
- 238000005538 encapsulation Methods 0.000 claims abstract description 18
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 7
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 7
- 239000004696 Poly ether ether ketone Substances 0.000 claims abstract description 7
- 239000004033 plastic Substances 0.000 claims abstract description 7
- 229920003023 plastic Polymers 0.000 claims abstract description 7
- 229920002530 polyetherether ketone Polymers 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 12
- 238000001746 injection moulding Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 7
- 238000002679 ablation Methods 0.000 claims description 6
- 238000000608 laser ablation Methods 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000007750 plasma spraying Methods 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 230000000930 thermomechanical effect Effects 0.000 claims description 3
- 238000001020 plasma etching Methods 0.000 claims description 2
- 238000005137 deposition process Methods 0.000 claims 1
- 238000010329 laser etching Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000012777 electrically insulating material Substances 0.000 description 7
- 238000010030 laminating Methods 0.000 description 6
- 238000005266 casting Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 239000002991 molded plastic Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Abstract
Description
Die vorliegende Erfindung betrifft ein Verfahren gemäß dem Oberbegriff des Hauptanspruchs, sowie eine Vorrichtung gemäß dem Oberbegriff des Nebenanspruchs.The The present invention relates to a method according to the The preamble of the main claim, and a device according to the Generic term of the secondary claim.
Bei der elektrischen Isolierung von einem oder mehreren ungehäusten Chips und/oder passiven Bauelementen, insbesondere in der Leistungselektronik, werden herkömmlicher Weise DCB-Keramiken („direct copper bonding") als Substrat verwendet. Bei der Erzeugung einer DCB-Keramik werden auf Ober- und Unterseite einer Keramik Kupferbleche aufgelegt und bei ca. 1040°C mit dieser formschlüssig verbunden. Anschließend wird zumindest eine der beiden Kupferseiten nasschemisch strukturiert. Ein bekannter Hersteller derartiger Keramiken heißt „Curamik".at the electrical insulation of one or more unhoused ones Chips and / or passive components, in particular in power electronics, Conventionally, DCB ceramics ("direct Copper bonding ") used as a substrate DCB ceramics are placed on top and bottom of a ceramic copper sheets and connected at about 1040 ° C with this form-fitting. Subsequently, at least one of the two copper sides structured wet-chemically. A well-known manufacturer of such ceramics is called "Curamik".
Die
Bauelemente sind mit ihrer Rückseite flächig auf
der DCB-Keramik- Substratplatte aufgelötet. Das Kontaktieren
kann mittels Dickdrahtbonden und Silikonverguss oder alternativ
mittels des sogenannten planaren Kontaktierens gemäß der
Es ist Aufgabe der vorliegenden Erfindung eine kostengünstige elektrische Isolierung beziehungsweise eine einfache elektrische Kontaktierung mindestens eines ungehäusten elektronischen Bauelements oder passiven elektronischen Bauelements, insbesondere eines Leistungsbauelements oder Halbleiterleistungsbauelements, insbesondere für den Hochspannungsbereich größer als 1000 Volt, mit jeweils mindestens einer Anschlussfläche zur Befestigung und/oder zur elektrischen Kontaktierung auf einer Oberseite und/oder Unterseite bereit zu stellen. Des Weiteren soll eine hohe Zuverlässigkeit bei elektrischer und thermischer Zykelbeanspruchung geschaffen sein. Ebenso sollen thermisch und mechanisch hochstabile Kunststoffe verwendbar sein, die sich nicht in Folien- oder Lackform verarbeiten lassen, wie es beispielsweise PEEK (Polyetheretherketon), LCP (Liquid Crystal Polymer) oder Moldmassen und dergleichen sind.It The object of the present invention is a cost-effective electrical insulation or a simple electrical Contacting at least one unhoused electronic Component or passive electronic component, in particular a power device or semiconductor power device, especially larger for the high voltage range as 1000 volts, each with at least one pad for attachment and / or for electrical contact on one To provide top and / or bottom. Furthermore, should a high reliability in electrical and thermal Zykelbeanspruchung be created. Likewise, thermally and be used mechanically highly stable plastics that are not can be processed in film or paint form, as for example PEEK (polyether ether ketone), LCP (liquid crystal polymer) or molding compounds and are the like.
Elektrische Zykelbeanspruchung bedeutet das abwechselnde Aussetzen unter eine niedrige elektrische Leistung und eine hohe elektrische Leistung mit einer bestimmten Anzahl von Lastwechseln. Thermische Zykelbeanspruchung bedeutet das abwechselnde Aussetzen unter eine niedrige Temperatur, beispielsweise –40°C, und eine hohe Temperatur, beispielsweise +125°C, mit einer bestimmten Anzahl von Temperaturwechseln, beispielsweise 100 bis 1000 Zykeln.electrical Zykelbeanspruchung means the alternating exposure to a low electrical power and high electrical power with a certain number of load changes. Thermal Zykelbeanspruchung means alternating exposure to a low temperature, for example, -40 ° C, and a high temperature, for example + 125 ° C, with a certain number of temperature changes, for example, 100 to 1000 cycles.
Die Aufgabe wird durch ein Verfahren gemäß dem Hauptanspruch in eine Vorrichtung gemäß dem Nebenanspruch gelöst.The Task is by a method according to the main claim solved in a device according to the independent claim.
Mittels der vorgeschlagenen Lösung kann ein kostengünstiges Aufbringen sowie Verdrahten ungehäuster elektronischer Bauelemente auf Substraten, insbesondere auf DCB-Keramiken ausgeführt werden, wobei als Isolationsmaterial ein leicht zu erzeugender spritzgegossener Kunststoff als Isolationsmaterial verwendet werden kann.through The proposed solution can be a cost effective Applying as well as wiring unhoused electronic Components are carried out on substrates, in particular on DCB ceramics, as an insulating material, an easy-to-produce injection-molded Plastic can be used as insulation material.
Gemäß der vorliegenden Erfindung wird ein kostengünstiger Moldprozess zur Isolierung und Strukturierung von elektronischen Modulen bereitgestellt. Des Weiteren sind große Isolationsdicken an besonderen Schwachstellen, wie Kanten, Ecken von elektronischen Bauelementen und Gräben bereitstellbar. Es ist zudem besonders vorteilhaft möglich, während des Moldprozesses zusätzliche Leiterbahnebenen, beispielsweise Leadframe-Strukturen, in die elektrisch isolierende Masse zu integrieren. Während des Moldprozesses können insbesondere aktive und/oder passive Bauelemente integriert werden. Des Weiteren können während des Moldprozesses Lastanschlusskontakte zur Kontaktierung nach außen in die elektrisch isolierende Masse integriert werden. Es werden besonders vorteilhafte Strukturierprozesse zur Strukturierung der elektrisch isolierenden Masse, beispielsweise mittels Laserablation vermieden. Eine Strukturierung der elektrisch isolierenden Masse erfolgt besonders vorteilhaft mittels des Formwerkzeugs.According to the present invention is a cost-effective molding process provided for the isolation and structuring of electronic modules. Furthermore, large insulation thicknesses are special Weak points, such as edges, corners of electronic components and ditches available. It is also very advantageous possible during the molding process additional Circuit traces, such as leadframe structures, into the electrical integrate insulating material. During the molding process In particular, active and / or passive components to get integrated. Furthermore, during of the molding process Load connection contacts for contacting to the outside be integrated into the electrically insulating mass. It will Particularly advantageous structuring processes for structuring the electrically insulating mass, avoided for example by means of laser ablation. A structuring of the electrically insulating mass is particularly advantageously by means of the molding tool.
Weitere vorteilhafte Ausgestaltungen finden sich in den Unteransprüchen.Further advantageous embodiments can be found in the subclaims.
Gemäß einer vorteilhaften Ausgestaltung erfolgt ein Erzeugen der strukturierten Verkapselung mittels Molden mit einem Moldwerkzeug als Formwerkzeug oder mittels Spritzgießen mit einem Spritzgusswerkzeug als Formwerkzeug. Damit können kostengünstige Mold- und Vergussprozesse genutzt werden.According to one advantageous embodiment is a generating the structured Encapsulation by Molden with a mold tool as a mold or by injection molding with an injection molding tool as a mold. This can be cost-effective Mold and casting processes are used.
Gemäß einer weiteren vorteilhaften Ausgestaltung können hochbeständige isolierende Kunststoffe, insbesondere PEEK (Polyetheretherketon), LCP (Fluessigkristall-Polymer), Moldmassen und dergleichen als elektrisch isolierende Masse verwendet werden. Besonders vorteilhaft kann thermomechanisch vorteilhaft angepasstes Moldmaterial verwendet werden, wobei dessen Wärmeausdehnungskoeffizient (CTE: coefficient of thermal expansion), an den des elektrisch leidenden Materials angepasst ist.According to a further advantageous embodiment, highly resistant insulating art materials, in particular PEEK (polyether ether ketone), LCP (liquid crystal polymer), molding compositions and the like can be used as an electrically insulating mass. Particularly advantageous thermomechanically advantageous adapted molding material can be used, wherein the coefficient of thermal expansion (CTE), is adapted to that of the electrically-suffering material.
Gemäß einer weiteren vorteilhaften Ausgestaltung können mittels des Formwerkzeugs in der elektrisch isolierten Masse Aussparungen zur Bereitstellung von Zugängen zu Anschlussflächen des elektronischen Bauelements, zu auf dem Substrat und/oder in und/oder auf der elektrisch isolierenden Masse ausgebildeten elektrischen Leitern und/oder zur Vereinzelung von Modulen erzeugt werden. Bei auf der elektrisch isolierenden Masse ausgebildeten elektrischen Leitern können mittels des Formwerkzeugs Gräben als Aussparungen auf der Oberseite der elektrisch isolierenden Moldmaterialmasse zur Aufnahme von oben liegenden elektrischen Leitern erzeugt sein. Derartige Gräben sind besonders vorteilhaft. Die auf der elektrisch isolierenden Masse erzeugten Leiter werden erst nach dem Erzeugen der, die erzeugten Zugänge aufweisenden strukturierten, Verkapselung ausgebildet. Die in der elektrisch isolierenden Masse erzeugten Leiter werden während des Erzeugens der strukturierten Verkapselung ausgebildet. Auf dem Substrat erzeugte Leiter werden vor dem Erzeugen der strukturierten Verkapselung ausgebildet. Das heißt, durch den Moldprozess in einer strukturierten Form werden sowohl Durchkontaktierungen von elektronischen Bauelementen und auf dem Substrat liegenden Leiterbahnen, als auch zu im Moldmaterial beziehungsweise der elektrisch isolierenden Masse, eingebetteten Leiterbahnen bereitgestellt. Des Weiteren können auf der Oberseite des Moldmaterials bzw. der elektrisch isolierenden Masse, Gräben zur Aufnahme von oben liegenden Leiterbahnen bereitgestellt werden.According to one further advantageous embodiment can by means of Forming tool in the electrically isolated mass recesses for Provision of access to connection surfaces of the electronic component, to on the substrate and / or in and / or on the electrically insulating mass formed electrical Ladders and / or for separating modules are generated. At on the electrically insulating mass formed electrical conductors can use the mold trenches as recesses on top of the electrically insulating molding material mass be generated for receiving overhead electrical conductors. Such trenches are particularly advantageous. The on the electrically insulated mass generated conductors are only after generating the structured encapsulation having the acquired accesses educated. The generated in the electrically insulating mass Ladder become while creating structured Encapsulation formed. Conductors produced on the substrate become prominent formed generating the structured encapsulation. This means, both through the Mold process in a structured form Through holes of electronic components and on the Substrate lying conductor tracks, as well as in the mold material or the electrically insulating ground, embedded tracks provided. Furthermore, on top of the mold material or the electrically insulating mass, trenches for receiving be provided from overhead tracks.
Gemäß einer weiteren vorteilhaften Ausgestaltung soll das Formwerkzeug genau ausgebildet sein und/oder das elektronische Bauelement auf dem Substrat in Bezug zu dem Formwerkzeug genau positioniert werden. Auf diese Weise können genaue Zugänge zu den Anschlussflächen des Bauelements erzeugt werden und ebenso Reste von elektrisch isolierender Masse auf den Anschlussflächen vermieden werden.According to one Another advantageous embodiment of the mold is exactly be formed and / or the electronic component on the substrate be accurately positioned with respect to the mold. To this Way, accurate access to the pads of the device are generated and also residues of electrically insulating Mass on the pads are avoided.
Gemäß einer weiteren vorteilhaften Ausgestaltung werden vorhandene Reste der elektrisch isolierenden Masse auf den An schlussflächen und/oder elektrischen Leitern in den Zugängen mittels Ablation, insbesondere Laserablation, entfernt.According to one Another advantageous embodiment of existing remains of electrically insulating mass on the contact surfaces and / or electrical conductors in the entrances by means of ablation, especially laser ablation, removed.
Gemäß einer weiteren vorteilhaften Ausgestaltung weist die elektrisch isolierende Masse einen an das Substrat angepasstem thermischen Ausdehnungskoeffizienten und/oder ein hoch temperaturfestes Material auf. Es ist also besonders vorteilhaft wenn die thermischen Ausdehnungskoeffizienten von Substrat und elektrisch isolierender Masse gleich sind. Mittels der Anpassung von Ausdehnungskoeffizienten von Substrat und Isolator kann eine hohe thermomechanische und elektrische Zuverlässigkeit geschaffen werden.According to one further advantageous embodiment, the electrically insulating Mass adapted to the substrate thermal expansion coefficient and / or a high temperature resistant material. So it's special advantageous if the thermal expansion coefficient of substrate and electrically insulating mass are the same. By means of adaptation of expansion coefficient of substrate and insulator can be a created high thermomechanical and electrical reliability become.
Gemäß einer weiteren Vorteilhaften Ausgestaltung wird in die elektrisch isolierenden Masse und/oder auf dem Substrat eine Einrichtung zur Kühlung, insbesondere ein Kühlkanal, eine Wärmesenke und/oder ein Heatpipe, eingegossen und/oder auf dem Substrat positioniert. Auf diese Weise sind besonders wirksame Kühlungsmöglichkeiten beispielsweise mittels Kühlkanäle, Wärmesenken und/oder Heatpipes bereitstellbar.According to one Further advantageous embodiment is in the electrically insulating Mass and / or on the substrate means for cooling, in particular a cooling channel, a heat sink and / or a heat pipe, cast and / or positioned on the substrate. In this way, particularly effective cooling options for example by means of cooling channels, heat sinks and / or heatpipes available.
Gemäß einer
weiteren Vorteilhaften Ausgestaltung wird ein planares elektrisches
Kontaktieren von Anschlussflächen auf der Oberseite ausgeführt, wobei
die Zugänge aufweisende elektrisch isolierende Masse einer Öffnung
aufweisende Folie gemäß der
Gemäß einer weiteren vorteilhaften Ausgestaltung erfolgt ein Erzeugen der elektrisch leitendes Material aufweisenden Schicht mittels flächigem, insbesondere ganzflächigem, Sputtern und Erzeugen einer flächigen galvanischen Verstärkung oder alternativ mittels Abscheide-Verfahren wie beispielsweise Plasmaspritzen oder Coldspray-Verfahren. Die Kontaktierung der Bauelemente und Leiterbahnen erfolgt insbesondere über einen ganzflächigen Sputterschritt und eine ganzflächige galvanische Verstärkung oder alternativ mittels Abscheide-Verfahren wie Plasmaspritzen oder Coldspray-Verfahren.According to one Further advantageous embodiment is a generating the electrical conductive material layer by means of planar, in particular ganzflächigem, sputtering and generating a planar galvanic reinforcement or alternatively by means of deposition methods such as plasma spraying or Cold spray method. The contacting of the components and conductor tracks takes place in particular over a whole area Sputtering step and a whole-area galvanic reinforcement or alternatively by means of deposition methods such as plasma spraying or Cold spray method.
Gemäß einer weiteren vorteilhaften Ausgestaltung erfolgt ein Strukturieren der flächigen elektrisch leitendes Material aufweisenden Schicht mittels von der dem Substrat abgewandten Seite erfolgendes Abtragen der Oberfläche bis zur Ebene der elektrisch isolierenden Masse. Eine Strukturierung der ganzflächig erzeugten Metallisierung beziehungsweise elektrisch leitendes Material aufweisenden Schicht mittels Fototechnikprozesse kann vermieden werden, da durch ein Nachholen des Abschleifens oder Abtragens der Oberfläche bis auf die Moldebene beziehungsweise auf die Ebene der elektrisch isolierenden Masse, eine automatische Trennung der Leiterbahnen erfolgt, das heißt, auf diese Weise werden fototechnische Prozesse zur Strukturierung der elektrisch leitendes Material aufweisenden Schicht vermieden.According to another advantageous embodiment staltung takes place structuring the sheet-like electrically conductive material having layer by means of the side facing away from the substrate ablation of the surface to the plane of the electrically insulating material. A structuring of the entire surface generated metallization or electrically conductive material having layer by means of phototechnical processes can be avoided, since by catching up the Abschleifens or ablation of the surface to the molar plane or to the plane of the electrically insulating material, an automatic separation of the tracks takes place, that is , Phototechnical processes for structuring the electrically conductive material layer are avoided in this way.
Gemäß einer weiteren vorteilhaften Ausgestaltung erfolgt ein elektrisches Kontaktieren der Anschlussflächen auf der Oberseite mittels Dickdrahtbonden unter Verwendung von Silikonverguss.According to one Further advantageous embodiment, an electrical contact the pads on the top by means of thick wire bonding using silicone potting.
Zum Schutzbereich der vorliegenden Anmeldung gehören ebenso Vorrichtungen die nach den erfindungsgemäßen Verfahren hergestellt worden sind.To the The scope of the present application also includes Devices according to the inventive method have been produced.
Gemäß einer
weiteren vorteilhaften Ausgestaltung weist eine erfindungsgemäße
Vorrichtung in der elektrisch isolierenden Masse erzeugte Aussparungen
zur Bereitstellung von Zugängen zu Anschlussflächen
des elektronischen Bauelements, zu auf dem Substrat (
Gemäß einer
weiteren vorteilhaften Ausgestaltung ist die Vorrichtung gemäß der
Gemäß einer weiteren vorteilhaften Ausgestaltung weist mindestens ein elektrischer Leiter ein thermomechanisches Profil derart auf, dass auftretende mechanische Spannungen und Verformungen vorteilhaft beeinflusst werden. Dabei kann der thermische Ausdehnungskoeffizient eines Leiters an den einer elektrisch isolierenden Masse angepasst sein. Leiterbahnen weisen bereits ein thermomechanisch günstiges Profil auf, welches insbesondere auftretende Spannungen und Verformungen vorteilhaft beeinflusst.According to one further advantageous embodiment has at least one electrical Ladder on a thermo-mechanical profile such that occurring mechanical stresses and deformations influenced advantageous become. In this case, the thermal expansion coefficient of a conductor be adapted to an electrically insulating mass. conductor tracks already have a thermomechanically favorable profile, which particular occurring stresses and deformations advantageous affected.
Die vorliegende Erfindung wird anhand von Ausführungsbeispielen in Verbindung mit den Figuren näher beschrieben. Es zeigen:The The present invention will be described with reference to exemplary embodiments described in more detail in connection with the figures. Show it:
Bezugszeichen
Mit
einem sich daran anschließenden Schritt S2 erfolgt ein
Erzeugen einer strukturierten Verkapselung mittels einer elektrisch
isolierenden Masse
Mit
einem Schritt S3 erfolgt das elektrische Kontaktieren von Anschlussflächen
Grundlage
der vorliegenden Erfindung ist die strukturierte Verkapselung von
insbesondere auf DCB-Substraten
Dazu
wird auf eine mit Chips beziehungsweise mit elektronischen Bauelementen
Der
isolierende Kunststoff
Etwaiges
dünnstes Restmaterial, welches sich zwischen den Aussparungen
und den Kontaktieröffnungen befinden kann, wird mittels
Ablation, beispielsweise mittels Laserablation, oder durch Ätzprozesse,
beispielsweise mittels Plasmaätzen, entfernt. Je genauer
die für diesen Prozess notwendigen Werkzeuge
Bei
Bedarf können Funktionsbauteile wie beispielsweise Kühlröhren
oder Stabilisatoren in das elektrisch isolierende Material
Die
weitere elektrische Kontaktierung der elektronischen Bauteile
Durch
das kostengünstige strukturierte Aufbringen von Spritzgegossenem
Kunststoff
Mit
dem Schritt S2 erfolgt ein Erzeugen einer strukturierten Verkapselung
mittels einer elektrisch isolierenden Masse
Mit
dem Schritt S3 erfolgt das elektrische Kontaktieren von Anschlussflächen
Bei
auf der elektrisch isolierenden Masse
ZITATE ENTHALTEN IN DER BESCHREIBUNGQUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
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Claims (16)
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DE102007041926A DE102007041926B4 (en) | 2007-09-04 | 2007-09-04 | Method for electrical insulation or electrical contacting of unhoused electronic components with structured encapsulation |
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DE102007041926A DE102007041926B4 (en) | 2007-09-04 | 2007-09-04 | Method for electrical insulation or electrical contacting of unhoused electronic components with structured encapsulation |
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