DE102007020290A1 - Housing for e.g. power capacitor, has cup made of conductive material and including wall and base and provided with cupreous layer, where cup includes inner side whose surface is made of aluminum - Google Patents

Abstract

The housing has a cup (2) made of a conductive material and including a wall (3) and a base (4), where an inner side of the cup has a surface that is made of aluminum. The cup is partially provided with a cupreous layer (5) on an outer side in an area of an open end (6) and the wall. An outer side of the base is provided with a thickened area. A wire e.g. tin-plated copper wire, is mechanically connected with the thickened area. A flange is formed from the open end of the cup. A plate is mechanically connected with the flange and an edge area of the base. An independent claim is also included for a method of manufacturing a housing.

Description

From the publication US 6,603,653 For example, a capacitor with a cup-shaped housing is known.

A to be solved task is a housing indicate for an electrical component, which is light can be produced and easy mounting options offering.

It becomes a housing for an electrical component specified, which consists of conductive material and preferred cup-shaped. The inside of the cup is preferred an aluminum surface. On the outside of the cup is a copper-containing layer in at least one area applied.

The Housing is preferably used to accommodate capacitor windings. The copper-containing layer which can be arranged in an area in which the cup is contacted restricts the growth of Tin whiskers when attaching connecting wires or Mounting plates via a welding process one.

In In one embodiment, the outer wall of the cup provided with a copper-containing layer in the area of the upper end be. Preferably, the upper third is with a copper-containing layer Mistake.

In Another embodiment is the whole outer wall provided with a copper-containing layer.

Of the Bottom of the mug may be on the outside entirely or only be partially provided with a copper-containing layer.

Of the Bottom of the cup may have a central area in terms of the average wall thickness is thickened. In the Thickening may be in a preferred embodiment act a pin.

This thickened area may be completely or partially outward be covered with copper-containing material.

To Contacting the electrical component to the outside can preferably in the field of thickening of the soil a wire mechanically be attached. This wire may be in a preferred Embodiment to act around a tinned copper wire, which may contain a steel core in a preferred variant.

to Contacting the electrical component to the outside can provide the upper end of the cup with a crimp be. The outside of the flange can be a copper-containing Have layer.

Of the Mug can in the area of the flange with a disc, for example, a rubberized hard cardboard disc, closed be. In one embodiment, a first panel may be exterior be attached to the copper-coated cup bottom. Another Plate can be attached to the outside of the flange. These plates can be made of copper-plated steel and have a tinned surface.

In In another embodiment, the copper-clad Bottom or a portion of the flange of the aluminum cup be connected to a soldering star. This solder star can be made of copper-plated steel with tinned surface.

to Fixing the wire or the plate or the soldering rod on the cup is in a preferred embodiment a mechanical connection made by an arc welding process. In a further embodiment, the mechanical Connection made by a resistance welding process. The mechanical connection is used to make contact with the capacitor outward.

At the Welding of wires made of tinned copper sheath wire with steel core on aluminum surfaces can undefined mixtures of copper, aluminum, tin and iron arise. Such whiskers are particularly easy for assemblies, which were and can be processed with lead-free tin solders Short circuits between the electrical connections of components. Furthermore, can be broken off Parts of whiskers also elsewhere on a circuit board shorts cause.

By the combination of a copper-containing layer on an aluminum cup and a welded joint with tinned surfaces copper-coated wire, steel plates or soldering stars, It is possible to increase the growth of tin whiskers to one limit maximum size of 30 μm, or even completely curb it.

Prefers the housing is suitable for capacitors, here especially for Al electrolytic capacitors. However, it is also to be used as housing for galvanic elements. The housing can also be used for more electrical or electrochemical devices are used.

The following is a method for producing a capacitor case is specified On the outside of the cup-shaped housing has a layer of copper-containing material.

In A preferred method is the capacitor housing produced by an extrusion process. At a Extrusion molding processes are in a mold, the inner profile the desired outer shape of the to be generated Housing corresponds, one or more metal pieces on each other placed. With a stamp that is slightly smaller in cross section as the recess in the mold, will be on one or more Metal slugs placed in the recess of the mold Pressure exerted. Excessive flows through the pressure Material past the sides of the stamp. This excess Material forms the side walls of the housing. By using two different materials in the Press mold can be produced a housing in which the first inserted material a layer in areas of the outer wall of the housing forms. By appropriate choice of shape, both the first placed material, as well as the other material, The formation of the layer can be achieved in different areas become.

One Another preferred method to a copper-containing layer Material on a cup-shaped capacitor housing made of aluminum, is the electroplating. Another Possibility is the copper-containing material through Spraying or steaming on the outside of a Apply aluminum housing. In a preferred method First, a slug, a ring or a disk of copper-containing Material placed in the recess of the mold. On this coppery Material is then placed a slug of aluminum.

In Another preferred embodiment, the used Aluminum trims on the bottom one or more recesses so that a previously placed in the mold ring containing copper Material in terms of its dimensions in the area of Recesses corresponds.

The electrical component and the process for its preparation is in the following with reference to embodiments and the associated figures explained in more detail.

The The drawings described below are not to scale specific. Rather, for better representation, individual Dimensions enlarged, reduced or even be shown distorted.

Elements, the same or the same function, are designated by the same reference numerals.

1 shows the housing of an exemplary electrical component

2 shows an embodiment of the electrical component in the external view with external contacts

3 shows a further embodiment of the electrical component in the external view with external contact via a plate

4 shows a further embodiment of the electrical component in the external view with external contact via a solder star

5a - 5c show various steps in the manufacture of a housing by means of extrusion molding

5d shows the finished cup after the steps 5a - 5c

6a - 6c show various steps in the production of a further embodiment of the housing by means of extrusion molding

6d shows the finished cup after the steps 6a - 6c

7a - 7c show various steps in the production of a further embodiment of the housing by means of extrusion molding

7d shows the finished cup after the steps 7a - 7c

8a - 8c show various steps in the production of a further embodiment of the housing by means of extrusion molding

8d shows the finished cup after the steps 8a - 8c

In 1 is the housing of an exemplary device 1 shown. In this case, the component comprises 1 a cup 2 that's from a wall 3 that consists of a ground 4 rises. The wall 3 may be on the outside in areas with a copper-containing layer 5 be provided. The cup 2 preferably has a copper-containing layer on the outside 5 on that in areas of the wall 3 of the mug 2 or in peripheral areas 7 of the soil 4 is present. By the ground 4 towering wall 3 has the cup 2 an opening to one side 6 on.

In 2 is an embodiment of the device 1 shown in which the cup 2 With External contacts is shown. The outside of the floor 4 of the mug 2 preferably has a thickened area in the center 8th on. At this thickened area 8th can over welds 19 a wire 9 for contacting the device 1 be attached.

In 3 is another embodiment of the device 1 represented in which the contacting of the housing via a plate 11 he follows. This plate 11 is preferred on both sides of the cup 2 over welds 19 contacted.

At the open side 6 of the mug 2 In one embodiment, which is not shown in detail, a flanging 10 educated. This curl 10 is preferably formed so that on the outside of a copper-containing layer 5 is present. For contacting the device 1 on a first page, the welded connection takes place 19 by means of a copper-containing layer 5 on the ground 4 , To a second side of the welded joint takes place 19 over another copper-containing layer 5 in the outer area of the flange 10 ,

Another embodiment is in 4 shown. Here the contacting takes place to the outside via a soldering star 12 , A soldering star 12 serves to provide a stable contact for electrical components, in which both contacts to one side of the device 1 take place. For this purpose, the soldering star 12 preferably in the center a recess 18 on, so that a second contact can be isolated against the first. The second contact of the housing is preferably via an internal contact of the in the cup 2 inserted electrical element. This may preferably be a capacitor winding, which is not shown here. This solder star 12 is preferred over the ground 4 opposite side of the mug 2 by means of a welded joint 19 connected to the housing. A first contact preferably takes place by means of a welded connection 19 between the copper-containing layer 5 in the outer area of the flange 10 and the soldering star 12 ,

For producing a first embodiment of a cup 2 in an extrusion molding process, is in 5a a first step is shown. Here is a mold 13 used the shape of the cup to be made 2 equivalent. In this mold 13 In a first step, it becomes a slug 14 made of copper-containing material. On this slug 14 will be another slug 17 made of aluminum.

In 5b a further step in the extrusion molding process is shown in which a stamp 20 on the Butzen stapel in the mold 13 exerts a pressure. The pressure forces the material into the mold 13 pressed. The last placed slug is made of aluminum 17 the inner wall of the mug 2 , The first placed slug 14 made of copper-containing material forms a copper-containing outer layer 5 on the resulting mug 2 ,

In 5c is shown as under the influence of even higher pressure on the stamp 20 the material flows back to the walls 3 of the mug 2 to build.

In 5d is the finished mug 2 , which by the embodiment according to the 5a - 5c was prepared, shown. The cup 2 is on the inside of aluminum and on the outside complete with a copper-containing layer 5 Mistake. Through a depression in the mold 13 has itself on the outside of the soil 4 a thickened area 8th educated. This is on the outside with a copper-containing layer 5 Mistake.

For producing a second embodiment of a cup 2 is in 6a a first step in an extrusion molding process shown. In this mold 13 becomes a ring in a first step 15 made of copper-containing material. On this ring 15 becomes a slug 17 made of aluminum. This slug 17 made of aluminum can at the bottom recesses 18 exhibit. These recesses 18 preferably have the shape of the previously in the mold 13 inlaid rings 15 made of copper-containing material. In another embodiment, not shown, may be in the opening of the ring 15 first a small slug of aluminum be laid. As another may be another slug 17 made of aluminum on the ring 15 and the first slug to be positioned. This second slug 17 made of aluminum corresponds in diameter approximately to the outer diameter of the ring 15 made of copper-containing material.

In 6b a further step in the extrusion molding process is shown in which a stamp 20 on the Butzen stapel in the mold 13 exerts a pressure. The first placed ring 15 made of copper-containing material forms a copper-containing outer layer 5 on the resulting mug 2 , By choosing a copper-containing ring 15 is the copper-containing layer 5 only in the area of the wall 3 and not in the area of the soil 4 ,

In 6c is shown as under the application of even higher pressure on the stamp 20 the material flows back to the walls 3 of the mug 2 to build.

In 6d is the finished mug 2 , which by the embodiment according to the 6a - 6c was prepared, shown. The thickened area 8th on the ground 4 is not with a copper-containing layer 5 overdrawn.

For producing a further possible embodiment of a cup 2 is in 7a a first step in an extrusion molding process shown. In the mold 13 becomes in a first step a little smaller ring 15 as in 6a made of copper-containing material. On this ring 15 becomes a slug 17 made of aluminum. This slug 17 Made of aluminum has recesses at the bottom 18 on. These recesses 18 preferably have the shape of the previously in the mold 13 inlaid rings 15 made of copper-containing material.

In 7b a further step in the extrusion molding process is shown in which a stamp 20 on the Butzen stapel in the mold 13 exerts a pressure. The first placed slug 14 made of copper-containing material forms a copper-containing outer layer 5 on the resulting mug 2 , By choosing a smaller copper-containing ring 15 is the copper-containing layer 5 only in the upper part of the wall 3 and not in the area of the soil 4 ,

In 7c is shown as under the application of higher pressure on the stamp 20 the material flows back to the walls 3 of the mug 2 to build.

In 7d is the finished mug 2 , which by the embodiment according to the 7a - 7c was prepared, shown. The thickened area 8th on the ground 4 and a lower wall area are not with a copper-containing layer 5 overdrawn.

For producing a further possible embodiment of a cup 2 is in 8a a first step in an extrusion molding process shown. In the mold 13 becomes a ring in a first step 15 made of copper-containing material. On this ring 15 becomes a slug 17 made of aluminum.

In 8b a further step in the extrusion molding process is shown. The first placed ring 15 made of copper-containing material forms a copper-containing outer layer 5 on the resulting mug 2 , By choosing a copper-containing ring 15 is the copper-containing layer 5 in the area of the wall 3 and in the outer edge area 7 of the soil 4 ,

In 8c is shown as under the application of higher pressure on the stamp 20 the material flows back to the walls 3 of the mug 2 to build.

In 8d is the finished mug 2 , which by the embodiment according to the 8a - 8c was prepared, shown. The thickened area 8th on the ground 4 and an area around this thickened area 8th is not with the copper-containing layer 5 overdrawn.

Although only a limited number of possible developments of the invention could be described in the embodiments, the invention is not limited to these. It is possible in principle, the copper-containing outer layer 5 of the housing to influence by other forms of copper-containing material, or the copper-containing layer 5 by other methods on the aluminum housing. The invention is not limited to the number of schematically illustrated elements.

The Description of the objects and methods specified here is not on the individual specific embodiments limited. Rather, the characteristics of each Embodiments - as far as technically reasonable - arbitrary be combined with each other.

1

module

2

cups

3

wall

4

ground

5

copper-containing layer

6

Restricted End of the mug

7

border area of the soil

8th

thickened Area

9

wire

10

flanging

11

plate

12

solder star

13

mold

14

slugs from Cu

15

ring from Cu

16

disc from Cu

17

slugs from Al

18

recess of Al-Butz

19

welded joint

20

stamp

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - US 6603653 [0001]

Claims (33)

Housing for electrical components ( 1 ), - with a cup ( 2 ) made of a conductive material that has a wall ( 3 ) and a floor ( 4 ), - wherein the inside of the cup ( 2 ) Aluminum, - wherein the cup ( 2 ) on the outside at least partially with a copper-containing layer ( 5 ) is provided. Housing according to one of the preceding claims, in which the outside of the cup ( 2 ) in the region of the open end ( 6 ) with a copper-containing layer ( 5 ) is provided. Housing according to one of the preceding claims, in which the outside of the cup ( 2 ) in the area of the wall ( 3 ) over the entire surface with a copper-containing layer ( 5 ) is provided. Housing according to one of the preceding claims, wherein the floor ( 4 ) at the edge ( 7 ) with a copper-containing layer ( 5 ) is provided. Housing according to one of the preceding claims, in which the outside of the floor ( 4 ) with a copper-containing layer ( 5 ) is provided. Housing according to one of the preceding claims, in which the outside of the floor ( 4 ) a thickened area ( 8th ) having. Housing according to one of the preceding claims, in which the thickened area ( 8th ) with a copper-containing layer ( 5 ) is provided. Housing according to one of claims 6 or 7, in which a wire ( 9 ) with the thickened area ( 8th ) is mechanically connected. Housing according to Claim 8, in which the wire ( 9 ) is a tinned copper wire. Housing according to Claim 9, in which the wire ( 9 ) is a tinned copper sheath wire with steel core. Housing according to one of the preceding claims, wherein from the open end ( 6 ) of the cup ( 2 ) a flange ( 10 ) is formed. Housing according to one of the preceding claims, in which a plate ( 11 ) with the flanging ( 10 ) is mechanically connected. Housing according to one of the preceding claims, in which a plate ( 11 ) with the edge area ( 7 ) of the soil ( 4 ) is mechanically connected. Housing according to Claim 13, in which the plate ( 11 ) is a copper-plated steel plate with tin upper layer. Housing according to one of the preceding claims, in which a soldering star ( 12 ) with the flanging ( 10 ) is mechanically connected. Housing according to one of the preceding claims, in which the soldering star ( 12 ) with the ground ( 4 ) is mechanically connected. Housing according to Claim 15 or 16, in which the soldering star ( 12 ) is a copper soldering star made of steel with tin upper layer. Housing according to one of the preceding claims, in which the mechanical connection in a resistance welding consists. Housing according to one of the preceding claims, in which the mechanical connection in an arc welding consists. Housing according to one of the preceding claims, in which in the region of the welded connection ( 19 ) Tin whiskers are present with a maximum size of 30 microns. Housing according to one of the preceding claims, in which the welded connection ( 19 ) is free of tin whiskers. Housing according to one of the preceding claims, in which the housing for capacitors, power capacitors, galvanic cells or other electrochemical devices formed is. Process for producing a housing according to at least one of Claims 1 to 22, in which the copper-containing layer ( 5 ) on the cup ( 2 ) is applied by electroplating. Process for producing a housing according to at least one of Claims 1 to 22, in which the copper-containing layer ( 5 ) by steaming on the cup ( 2 ) is applied. Process for producing a housing according to at least one of Claims 1 to 22, in which the copper-containing layer ( 5 ) by spraying on the cup ( 2 ) is applied. Method for producing a housing according to at least one of claims 1 to 22, wherein the housing is produced by means of a F1ießpressverfahrens. A method according to claim 26, wherein in carrying out the extrusion molding process by means of a Stamp ( 20 ) to one or more in a mold ( 13 ) placed pieces of metal pressure is applied. Method according to one of Claims 26-27, in which a slug ( 14 ) of copper-containing material in the mold ( 13 ) is placed. Process according to claims 26-27, wherein a ring ( 15 ) of copper-containing material in the mold ( 13 ) is placed. The method of claim 29, wherein in an opening of the copper-containing ring ( 15 ) a slug ( 17 ) is made of aluminum. Process according to claims 26-27, wherein a disc ( 16 ) of copper-containing material in the middle of the mold ( 13 ) is placed. Process according to claims 26-31, wherein the copper-containing slug ( 14 ), the copper-containing ring ( 15 ) or the copper-containing disk ( 16 ) a slug ( 17 ) is placed from aluminum. Process according to claims 26-32, wherein the slug ( 17 ) made of aluminum a recess ( 18 ) for the copper-containing ring ( 15 ) having.