DE102007019438B3 - Method and device for producing ceramic films - Google Patents

Abstract

The invention relates to processes for producing ceramic films and devices for carrying out these processes. Large-area thin ceramic components are produced in the film casting process, wherein the casting compound is a ceramic so-called slurry (suspension). The invention relates to that part of the manufacturing process of ceramic films, which comprises the slip casting and the solidification of the cast film, wherein the solidification is carried out by crosslinking under UV exposure. This type of solidification should be made ready for production. For this purpose, the thickness setting of the slurry during the casting process by adjusting the distance of the substrate (carrier film 4) to a plane-parallel extending cover 14 is made. The cover is at least partially UV-transparent, whereby the UV exposure takes place. To create patterns, the exposure through a mask is made only on patches. As the exposure source, a semiconductor UV source 21 is provided.

Description

The The invention relates to a method and an apparatus for the production ceramic foils.

The film casting process is used for the industrial production of large-area, thin ceramic components. This is described for. For example, in Chapter 4.1.3 "Original Design", section "Film Casting" of the "Brevier Technical Ceramics" of the Association of the Ceramic Industry eV - Information Center Technical Ceramics, Selb, November 15, 2003 and here in 1 shown.

When casting serves a ceramic slurry (suspension) with various organic additives.

Of the continuously from a reservoir through one of a scraper, (in technical language called "doctor blade") adjustable Casting gap liquid slurry leaking onto an endless belt becomes a layer on a carrier medium applied and then solidified by drying. The result is the so-called. Green body (or. the green sheet), one self-supporting flexible, reworkable ceramic foil, ultimately can be fired.

object The present invention is that part of the manufacturing process ceramic films, which slip-casting and solidifying the cast Includes film.

The Adjustment of the casting gap through the doctor blade, which is determined in empirical experiments, is very difficult and requires a lot of experience, because the thickness the leaking slurry behind the doctor blade hangs beside the casting gap height too from other parameters, such as B. fill level in the reservoir, solids content, Viscosity and Shearing behavior of the slurry, belt speed, etc.

The Drying of the applied slurry takes place in conventional Solidification process through Evaporation of the solvents under supply of air, heat and / or infrared radiation. This requires in addition to a considerable Energy expenditure (partly over 100 kW) long drying times ranging from several minutes to to half an hour. Because of the continuous strip production the Therefore, conventional drying systems have a large length. As with the drying process as well Shrinkage of the film is connected, there is a risk of cracking. Furthermore be great Amounts of organic solvents free, which are not only explosive, but also consuming recovered or disposed of in an environmentally sound manner.

Laboratory tests have become known which aimed in particular at overcoming the above-mentioned disadvantages of the conventional solidification process by drying:
For example: Griffith, L and Halloran, John W .: "Ultraviolet Curing of Highly Loaded Ceramic Suspensions for Stereolithography of Ceramics", published in the proceedings: "Solid Freeform Fabrication Proceedings", The University of Texas at Austin, September 1994 p. 396-403 known to apply films of specially developed, polymer-based ceramic slips doped with photoinitiators (at least largely without solvent) on a (fixed) glass and to crosslink by UV exposure to form a flexible, self-supporting film.

At It should be noted that in the case of the traditional one described at the outset Production process with solvent-based slips, usually in the solidification process is spoken of a drying process while it is in the solidification process by UV exposure a networking process. Both terms are here insofar Although separated, assigned to the respective method used, as far as this possible However, it is clear that they are synonymous in the general context For example, commonly used in UV-exposed crosslinked flexible, self-supporting ceramic film spoken by a "dry" film. In English is for both terms use only the word "cure".

For the UV exposure in the above-mentioned prior art, high-pressure mercury arc lamps having a broadband spectrum of about 230 to about 430 nm with a plurality of peaks are used, cf. 10 , The film is exposed for up to approx. 10 s with a radiation intensity of approx. 2.5 W / cm ² . The material thickness of the film is limited because of the achievable penetration depth of the UV radiation and decreases with increasing concentration and density of the solid fraction (to about 330 microns in the desired range of higher solids contents).

One Pattern could be generated by using partial coverage with a mask only partial areas of the film were exposed.

The scientific publication:
Smith, Deborah, J. et. al.: "UV Curable System for Ceramic Tape Casting", published in the conference proceedings of the IEEE 7th International Symposium: "Applications of Ferroelectrics", Urbana-Champain, IL, USA, June 1990, pp. 426-428, is particularly concerned with The behavior of various Schlicker compositions These are applied with doctor blade technology on a fixed glass plate and then UV-exposed, wherein the Obtaining patterns A mask was used for partial coverage. The UV source is a high-pressure mercury / xenon lamp.

A Summary of the known from the prior art gives that Book: Mistler, Richard E., Twiname, Eric R .: "Tape Casting, Theory and Practice, eds. American Ceramic Society, Westerville, Ohio, USA, 2000, pp. 124-126. In this source is - without closer up To give details, a brief reference to that also the solidification process by UV exposure is a common, conventional casting process can precede what the skilled person as a reference to a production line casting more common Type (using a doctor blade) interpreted.

From Starting from this prior art, the present invention the task of casting and solidification process the special features and possibilities adapt and optimize the UV exposure.

These Task is a method as well as a device for Preparation of ceramic films with the features of the independent claims.

These solutions The task is to make use of the knowledge that, in contrast to the conventional Drying process, the conveyor belt due to UV exposure only short for the solidification required while only a small amount of time Way back. Used to adjust the defined thickness of the liquid slurry instead of a doctor blade, a cover that is UV-transparent and exposed through this cover, so leaves the cast ceramic foil the covered area already as solid Foil. The liquid Schlicker has, unlike using a doctor blade, not the possibility itself due to secondary Influences like Viscosity, Filling level of the reservoir etc. to a thicker or thinner Strength to develop as desired.

advantageous Further developments of the solution according to the method claim 1 are in the claims 2 to 5, the solution according to the device claim 13 in the claims 14 to 17 marked.

The Cover may preferably consist of a solid plate.

As well Advantageously, the cover of a taut, synchronized with the carrier film running Cover, or from under a fixed plate synchronously with the carrier foil accompanying cover sheet. In the latter case, the cover needs not to be curious.

When Material for the cover film is advantageously a plastic film made of polyethylene all possible Types (PE-HD, PE-LD, PE-LLD, PE-HMW, PE-UHMW, PE-X) or polyethylene terephthalate (PET).

The advantageous embodiments according to the method claim 6 and the content of the same device claim 18 makes the -isolated for already from o. g. Research reports known knowledge take advantage of it by exposing only parts of the ceramic Foil is possible just to network and solidify these parts. The mask Covered and uncrosslinked surface parts can then be washed out so that it is possible is, pattern z. For example To create vias, etc.

At the Conventional drying process is not possible, only surface parts to dry the ceramic film.

Thereby that the mask according to the invention either is designed as a synchronously moving endless film, or as a rigid, clocked reciprocating mask, whose movement in the tape direction synchronously with the carrier foil is done, it becomes possible pattern also on the assembly line manufacture.

The advantageous embodiments according to the method claim. 7 and the identical device claim 19 is based on the Realization that with the in o. G. State of the art for networking exclusively used high-pressure mercury lamps, although the above-explained Disadvantages of the previously industrially exclusively related conventional Heat-drying method can be avoided but there are other disadvantages: mercury UV lamps emit electromagnetic radiation, generate ozone, and contain toxic mercury. About that need out a warm-up, so that pulse operation is not possible is. Cost of acquisition and maintenance due to limited life the light source (200-2,000 h) and required cleaning work z. B. the reflectors are not insignificant.

From the Internet homepage of the US company Phoseon (www.phoseon.com), in particular from the page "www.phoseon.com/applications/rx_uv_light_system" from 10.04.2007, it is known for itself, mercury UV lamps to replace their disadvantages, for example: crosslinking of clearcoats (protective coatings), inks, adhesives in the lithography and in the medical field to kill microorganisms are given.

The use according to the invention of semiconductor UV sources for the production of ceramic films but not named.

There with UV radiation namely basically that Problem of only low penetration in suspensions with ceramic or / and metal particles in the required higher Concentration range exists, as already in the o. G. research reports has been found, the application of UV radiation for the production of ceramic films so far on laboratory scale Limited use of high-pressure mercury lamps, so that the use of semiconductor UV sources has not even been considered.

at Using semiconductor UV sources, the o. G. disadvantage of high-pressure mercury UV lamps: Semiconductor-based UV sources are cheaper in terms of their cost and have a much higher, about 5 to 10 times longer life and maintenance-free (no cleaning work required).

at up to 80% lower heat development their energy consumption is up to 75% lower.

by virtue of uniform Radiation intensity over the Lifetime as well as over the irradiated area is no readjustment (process parameter setting) required.

by virtue of less heat on the ceramic foil during the cross-linking process again improved shrinkage cracking behavior is achieved.

The radiated light spectrum is narrow band with only one peak, thus only in the for the networking authoritative Wavelength range radiated.

There no electromagnetic radiation is emitted, no ozone formation done and no mercury for the UV source is needed is given a better environmental compatibility.

By Immediate operational readiness without warm-up time pulse operation is possible.

preferred Further developments of the advantageous embodiments according to the method claim 7 are in the subclaims 8 to 10, according to the same Device claim 19 characterized in the subclaims 20 to 22

The Semiconductor UV source advantageously consists of a plurality of linear or flat attached UV LEDs.

Prefers the exposure takes place with a narrowband peak within one Wavelength Range between 200 and 450 nm.

Advantageous is pulsed exposure.

Especially Cheap it is, if, as in the claims 11 and 23, also the ceramic film supporting substrate UV-permeable formed is. Thus, double-sided exposure of the film is possible and it can at the same Penetration depth of UV radiation the advantage of a larger networked Cross section can be achieved.

When Material for the carrier film is according to claims 12th and 24 advantageously a plastic film of polyethylene all possible Types (PE-HD, PE-LD, PE-LLD, PE-HMW, PE-UHMW, PE-X) or polyethylene terephthalate (PET) used.

Further Advantages and details of the invention will become apparent from the following Description of an embodiment with reference to a drawing.

It demonstrate:

1 : A schematic diagram of the industrial manufacturing process of ceramic foils according to the prior art.

2 : A schematic diagram of the manufacturing method according to the invention and the device according to the invention using a thickness adjustment of the liquid slurry according to the invention.

3 A second embodiment of the thickness adjustment device of the slurry.

4 A third embodiment of the thickness adjustment device of the slurry.

5 : A schematic diagram of the manufacturing method according to the invention and the device according to the invention using a rigid mask according to the invention.

6 : A schematic diagram of the manufacturing method according to the invention and the device according to the invention using an endless film according to the invention as a mask.

7 : A schematic diagram of the preparation process according to the invention and of the invention A device using a continuous film as a mask in conjunction with the second embodiment of the thickness adjustment of the slurry as an exemplary combination

8a . 8b Two exemplary ways of arranging the UV LEDs when using the inventive semiconductor UV source for exposure.

9a . 9b : A schematic representation of the crosslinking process under UV exposure.

10 : Radiation spectra of mercury arc lamp and semiconductor UV source.

At the in 1 An endless conveyor belt runs on the basis of a schematic diagram of an industrial production process of ceramic foils according to the prior art 3 via a drive roller 1 and a pulley 2 from. To the top of the conveyor belt 3 becomes a carrier film 4 fed and on the conveyor belt 3 hung up. conveyor belt 3 and carrier film 4 run under a reservoir open at the bottom 6 from, with the so-called slip 5 is filled. Slips are flowable ceramic suspensions with various organic additives: solids (ceramics), binders, plasticizers, dispersants. In addition, slurries used for conventional film casting according to the prior art still contain organic solvents (up to 50% by volume) which are required for the casting process and which have to be removed again by evaporation after the molding process of the casting.

By means of a height adjustment 8th adjustable scraper 7 (in technical language referred to as a "Doctor Blade") is the size of a gap 9 set, by the running on the tape slip is applied in a defined thickness to the carrier film.

After this job, the slurry film goes through a drying line 10 a drying process. In the drying section 10 , which may have up to 30 m in length, is usually in countercurrent via a Zulufteintritt 11 Hot air injected, with the aid of the solvents are expelled from the slurry. The solvent saturated exhaust air is via an exhaust air outlet 12 aspirated. In the 1 shown drying section 10 can consist in the systems known today only from one, but also from several zones in which IR radiation, contact heat and heated air is used individually or in any combination for drying.

The dry, flexible and self-supporting so-called green foil 13 can then be wound up or processed immediately.

In the production process according to the invention, which in 2 is exemplified, the device for adjusting the defined thickness of the carrier film 4 leaking liquid slip 5 through a cover 14 formed, which are plane-parallel to the carrier film 4 , and a supporting sub-plate 15 runs.

The carrier foil 4 is one on the side in contact with the slurry with silicone coated, UV-permeable plastic film, which also forms the conveyor belt. Suitable materials for the plastic film are: polyethylene (in all types: PE-HD, PE-LD, PE-LLD, PE-HMW, PE-UHMW, PE-X) or polyethylene terephthalate (PET).

The carrier foil 4 is from a unwinding roll 16 unwound and on a take-up roll 17 wound.

The reservoir in the process direction limiting wall 18 of the reservoir 6 is open at the bottom, so that the slip can leak. The cover 14 is according to the embodiment shown here as integral with the wall 18 trained plate 19 provided, wherein the two narrow sides of the wall are then slidably sealed guided on the two side walls of the reservoir. But it can also be the plate 19 sealed sliding on the wall 18 be guided. By means of a firm with the plate 19 connected height adjustment device 8th is the cover 14 in their distance to the carrier film 4 adjustable.

The plate 19 is either completely made of UV-transparent material, such as glass or plastic, or has at least in the exposure area an upper zone 20 made of UV-transparent material. Over the cover 14 is a UV source 21 arranged so that these through the upper zone 20 through the ceramic film can expose.

To double the cross-linked cross-section, a double-sided exposure is provided. This is also the bottom plate 5 at least in a lower zone 22 UV-permeable. At the bottom is the upper UV source 21 opposite, another UV source 21 appropriate.

By double-sided exposure are twice as thick ceramic films producible, as with only one-sided exposure.

By matching the tape speed with the extent of the exposed area, the required exposure time can be realized. Due to the only in seconds range, required for the networking exposure time, the entire drying or cross-linking process requires only a small conveyor belt length, as out 2 seen.

The height accurately fixed area under the cover 14 leaves a solid, due to the solidification by UV crosslinking also shrinkage and crack-free ceramic film of absolutely constant strength, which is independent of influence parameters such as properties of the slip itself (viscosity, shear behavior, solid state concentration) and other conditions (eg filling level of the sludge in the reservoir).

In 3 an alternative embodiment for adjusting the thickness of the ceramic film is shown. The cover, whose adjustable distance from the substrate defines the thickness of the ceramic foil, consists of a taut and synchronized with the carrier foil 4 accompanying cover sheet 23 , As a cover foil 23 is also a one-sided coated with silicone and UV-permeable plastic film of the same materials possible, as in the carrier film 4 described, provided. The cover foil 23 is from a cover sheet unwinding 24 unwound and onto a cover roll take-up roll 25 wound. In between, the cover sheet runs over a front adjustment roller 26 and a rear adjustment roller 27 in height, each by means of a height adjustment 8th are adjustable. The synchronous adjustment of these two rolls can be used to specify the thickness of the ceramic foil. It is irrelevant whether between the here obliquely formed wall 18 of the reservoir 6 and the inlet section of the film 23 a seal is provided or not, which is why this detail is not detailed in the figure representing a schematic diagram. If no seal is provided, at most a small bead of the liquid slurry can form here.

The Exposure is the same as in the previous embodiment already explained.

4 shows a further alternative adjustment possibility of the thickness of the ceramic film. Exactly as in the embodiment explained above is a cover 23 intended. However, this is under a UV-permeable, thickness adjustment plate 28 (made of glass or plastic), with height adjustment 8th is firmly connected. This requires the cover 23 not to be taut. In addition, in this type of thickness adjustment of the ceramic sheet is merely a device for height adjustment 8th required over two in the previous embodiment.

The given with UV exposure possibility to expose only certain surface parts of the ceramic film and solidify is for the assembly line process in the following with reference to 5 to 7 shown.

It should be noted that this option is independent of the type of adjustment of the thickness of the ceramic film. This can, as in 5 shown, by conventional method using scraper 7 (Doctor Blade), or by any other method. Exemplary is in 7 , which will be discussed later, presented the thickness adjustment of the ceramic film by means of tightly stretched cover sheet. The strength adjustment can also be done by means of the methods as in the 2 or 4 are disclosed.

According to 5 is to cover unexposed surface parts a rigid mask 30 intended. This can be a stencil or a photographic mask. The conveyor belt is operated continuously. The procedure is the following: The mask 30 is in an initial position a. Conveyor belt and mask 30 are driven synchronously, under the UV source, the exposure takes place through the mask 30 through, until the entire mask 30 and the zone of the ceramic film covered by it has left the exposure area indicated by arrows and the mask 30 has arrived in the final position b. After that, the mask stops 30 and will quickly return to its initial position a. Thereafter, the process described begins again.

In the washout station 31 Finally, the non-crosslinked parts of the ceramic film are washed out.

Becomes used for exposure to a UV semiconductor source, it may while of driving back the mask are turned off. The moving in this period, but not exposed Schlicker therefore does not network and can collected and reused as needed.

For simplicity, the exposure method is in 5 shown only as a one-sided exposure method. However, it is clear that the double-sided exposure described above is also possible if, in addition to the second UV source arranged at the bottom, there is also a second, rigid mask arranged at the bottom 30 is provided, which is moved synchronously with the first.

Alternatively, the only partial exposure of the ceramic film also by means of a continuous endless film 33 be realized, as in 6 shown. The correspondingly exposed endless film 33 runs over circulation rollers 32 continuously and at synchronous speed as the conveyor belt off.

Also Here is a double-sided exposure possible, albeit below of the conveyor belt, a same continuous film runs synchronously.

In 7 there is a combination of the exposure method of faces according to 6 with the method for adjusting the thickness of the ceramic film according to 3 , It should be noted that the tightly stretched cover simultaneously performs the function of protecting the continuous film from contamination by the slip. Because theoretically conceivable use of the continuous film for adjusting the thickness of the ceramic film would be to fear that possibly slip particles adhere to it and destroy the mask function.

Also Here a double-sided exposure is possible.

The exposure of the ceramic film is carried out according to a further inventive solution by a semiconductor UV source 35 , This is based on a multitude or variety of lines ( 8a ) or flat ( 8b ) arranged single powerful UV LEDs 34 (Light-emitting diodes), each of which is provided with an optical system that focuses and directs the beam.

The semiconductor UV source 35 can be designed as over the entire transport bandwidth going array. Alternatively, however, other geometric shapes can be used with any number of UV LEDs 34 are fitted, find application, for. B. square, round, triangular, etc.

Schlicker for UV exposure are of a different composition than the thermal drying process used: the solvents at least largely eliminated, newly added photoinitiators, the binders are different. The exact composition of the slip however, is not part of the invention.

In the 9a and 9b the cross-linking process is outlined in a sketch: The liquid slip contains, in addition to the ceramic particles and other excipients (such as dispersants, defoamers, etc.), oligomers (O), monomers (M), and photoinitiators (P), 9a , Under UV irradiation, the photoinitiators are cleaved into free radicals. These initiate a polymerization. In the solidified state, the ceramic film consists of crosslinked polymer chains, 9b ,

In 10 are emission spectra of a mercury arc lamp and an example of a semiconductor UV source 35 (blackened). That of a mercury arc lamp has a large bandwidth with multiple peaks. In contrast, the emission spectrum of a semiconductor UV source used in the invention 35 just one peak up, the semiconductor UV source 35 emits only in a narrow-band waveband, here in the example between about 390 nm to 410 nm. This is the slip 5 only charged with the wavelength required for crosslinking. Other, possibly disturbing UV wavelengths do not occur.

For semiconductor UV sources 35 In addition, the wavelength in which is emitted, selectable. Available are UV LEDs 34 which radiate with approximately 20 nm bandwidth within a selectable wavelength range from about 200 nm to 450 nm. Since the active region of photoinitiators can be influenced by changes in the chemical composition, the wavelength required for crosslinking and the wavelength of the semiconductor UV source can also be influenced 35 be tailored to each other.

Since UV LEDs, in contrast to UV lamps, do not require a warm-up time and react extremely quickly, the cross-linking process can be carried out in pulse mode. Depending on the material (ceramic slurry 5 , but also carrier foil 4 - and / or cover 23 ) and the desired property, the performance profile can be adapted to the specific material.

Height Performance is often desired leads however in many cases to material damage. By The pulsed operation can be applied to a very high power density. In the subsequent Without UV radiation, the material can 'relax' and cool again in the next Phase again to be charged with very high performance, without doing damage to experience.

The pulsed operation makes it possible to selectively control the crosslinking behavior depending on the material and to work with higher intensities than in continuous operation, without losing the material (ceramic slip 5 , Carrier film 4 , Cover film 23 ) to harm.

1

capstan

2

idler pulley

3

conveyor belt

4

support film

5

Schlicker

6

reservoir

7

scraper

8th

height adjustment

9

gap

10

drying section

11

supply air inlet

12

exhaust outlet

13

green film

14

cover

15

lower plate

16

unwinding

17

up roll

18

wall

19

plate

20

upper Zone

21

UV source

22

lower Zone

23

cover

24

Cover sheets-off roller

25

Sealers take-up roll

26

Front setting role

27

Rear setting role

28

Thickness adjustment plate

29

leadership

30

rigid mask

a

starting position

b

end position

31

Auswaschstation

32

revolving roller

33

endless film

34

UV LED

35

Semiconductor UV source

Claims (23)

Process for the production of ceramic films, - in which a liquid slip ( 5 ) from a reservoir ( 6 ) is applied to a substrate with a defined, adjustable thickness, which is continuously applied to a lower plate ( 15 ) running carrier film ( 4 ), - in which the slip ( 5 ) then undergoes a crosslinking process under UV exposure in which the slip ( 5 ) to a dry ceramic foil (green foil 13 ), characterized in that - the adjustment of the defined thickness of the liquid slip ( 5 ) by adjusting the distance of the substrate to a plane-parallel extending cover ( 14 ), and - that the cover ( 14 ) is UV transmissive, at least in part of its area, whereby UV exposure occurs. Method according to claim 1, characterized in that the cover ( 14 ) from a fixed plate ( 19 ) consists. Method according to claim 1, characterized in that the cover ( 14 ) from a tensioned, synchronously with the carrier film ( 4 ) running cover ( 23 ) consists. Method according to claim 1, characterized in that the cover ( 14 ) from one below a fixed plate ( 19 ) synchronously with the carrier foil ( 4 ) running cover ( 23 ) consists. A method according to claim 3 or 4, characterized in that the cover ( 23 ) is a plastic film made of polyethylene of all possible types (PE-HD, PE-LD, PE-LLD, PE-HMW, PE-UHMW, PE-X) or polyethylene terephthalate (PET). Method according to one of claims 1 to 5, characterized in that - the exposure takes place only on surface parts, wherein non-exposed surface parts through a mask ( 30 ) and then washed out, - that the mask ( 30 ) either as a continuous film ( 33 ) is formed, which synchronously with the carrier film ( 4 ) or as a rigid, clocked reciprocating mask ( 30 ), in the strip running direction synchronously with the carrier film ( 4 ) runs along. Method according to one of claims 1 to 6, characterized in that the UV exposure by a semiconductor UV source ( 35 ) he follows. Method according to claim 7, characterized in that the semiconductor UV source ( 35 ) from a multiplicity of linear or areally mounted UV LEDs ( 34 ) consists. Method according to claim 7 or 8, characterized that the UV exposure with a narrowband peak within a Wavelength range between 200 nm and 450 nm takes place. Method according to one of claims 7 to 9, characterized that the exposure is pulsed. Method according to one of claims 1 to 10, characterized that the substrate is UV-permeable is and that the exposure is double-sided. Method according to one of claims 1 to 11, characterized in that the carrier film 4 a plastic film made of polyethylene of all possible types (PE-HD, PE-LD, PE-LLD, PE-HMW, PE-UHMW, PE-X) or polyethylene terephthalate (PET). Apparatus for producing ceramic films, by means of which a liquid slip ( 5 ) from a reservoir ( 6 ) is applied to a substrate with a defined, adjustable thickness, which is continuously applied to a lower plate ( 15 ) running carrier film ( 4 ), - by means of which the slip ( 5 ) is then subjected to a crosslinking process under UV exposure, in which the slip ( 5 ) to a dry ceramic foil (green foil 13 ), characterized in that - a height-adjustable, plane-parallel to the substrate extending cover ( 14 ) is provided, by means of which the adjustment of the defined strength of the liquid slip ( 5 ) by adjusting the distance of the substrate to the cover ( 14 ), and - that the cover ( 14 ) is UV transmissive, at least in part of its area, whereby UV exposure occurs. Device according to claim 13, characterized in that the cover ( 14 ) from a fixed plate ( 19 ) consists. Device according to claim 13, characterized in that the cover ( 14 ) from a tensioned, synchronously with the carrier film ( 4 ) running cover ( 23 ) consists. Device according to claim 13, characterized in that the cover ( 14 ) from one below a fixed plate ( 19 ) synchronously with the carrier foil ( 4 ) running cover ( 23 ) consists. Apparatus according to claim 15 or 16, characterized in that the cover ( 23 ) is a plastic film made of polyethylene of all possible types (PE-HD, PE-LD, PE-LLD, PE-HMW, PE-UHMW, PE-X) or polyethylene terephthalate (PET). Device according to one of claims 13 to 17, characterized in that - a mask ( 30 ) is provided which covers non-exposed surface parts, so that the exposure takes place only on surface parts and that the unexposed surface parts are subsequently washed out, and - that the mask ( 30 ) either as a continuous film ( 33 ) is formed, which synchronously with the carrier film ( 4 ) or as a rigid, clocked reciprocating mask ( 30 ), in the strip running direction synchronously with the carrier film ( 4 ) runs along. Device according to one of claims 13 to 18, characterized in that a semiconductor UV source ( 35 ) is provided, by means of which the UV exposure takes place. Device according to claim 19, characterized in that the semiconductor UV source ( 35 ) from a multiplicity of linear or areally mounted UV LEDs ( 34 ) consists. Device according to claim 19 or 20, characterized in that a semiconductor UV source ( 35 ) which emits light in a narrow-band peak within a wavelength range between 200 nm and 450 nm. Device according to one of claims 13 to 21, characterized that the substrate is UV-permeable is and that the exposure is double-sided. Device according to one of claims 13 to 22, characterized in that the carrier film 4 a plastic film made of polyethylene of all possible types (PE-HD, PE-LD, PE-LLD, PE-HMW, PE-UHMW, PE-X) or polyethylene terephthalate (PET).