DE102006035749A1 - Method for producing at least one component and component - Google Patents

Abstract

The invention relates to different methods for producing at least one component which comprises at least two layers structured using at least one washcoat, and to components obtainable therewith. The processes according to the invention in each case use at least one washcoat layer (50), which is especially multifunctional.

Description

The The invention relates to different processes for the production at least a component which has at least two structured layers includes. The invention further relates to components that after these Method available are, in particular electrical components or electrical circuits and security elements for securing value documents, such as Banknotes, identity cards, identification cards, certificates and the like.

components which comprise at least two structured layers and in particular made of thin, electric Functional layers are constructed, with u.a. organic functional layers are used, are known. When building such components or electrical components must the electrical functional layers structured and also to each other be adjusted precisely to the functionality and the desired one capacity to ensure the component.

According to DE 103 49 963 A1 the patterning of an electrical functional layer takes place by means of a radiation-crosslinkable washcoat layer applied in pattern form to a film substrate. The washcoat layer is applied in pattern form to a base film, cured by irradiation, coated with the electrical functional layer and then removed the washcoat layer in a washing process. Simultaneously with the washcoat layer, the regions of the electrical functional layer that are located on the washcoat layer are removed, while the regions of the electrical functional layer that are arranged on the basecoat remain on the basecoat and form a structured functional layer. This in DE 103 49 963 A1 described method is suitable for producing a film having at least one electrical component, which in particular comprises at least one layer of an organic semiconductor material.

The DE 101 30 992 A1 describes a method of making a polymer-free region on a substrate using an exfoliating layer. The scrub layer is applied in pattern form to the substrate, dried and then coated with a polymeric functional layer, for example, to form an organic light-emitting diode (OLED), in the spin coating process. Thereafter, the scrub layer is removed from the substrate by stripping and / or vacuum, forming a polymer-free region on the substrate. The polymer-free area is used as a bonding area or as an adhesive area for attaching diode protective caps.

at The known methods are the layers of a component in succession formed and individually structured, thereby adjusting error in the arrangement of the layers give each other.

So causes the order of further layers of the component and their Structuring regularly Warping a flexible substrate, usually made of flexible Foil material exists and both in electrical components such as also with security elements frequently as a carrier for in particular thin layers is used. This results for each other to be formed Layer another base and the arrangement and sizing with regard to the layers already formed on the substrate becomes more difficult with each new layer formed.

Of the The invention is based on the object, the production of components, which comprise at least two structured layers which are related to one another should be positioned to improve. The invention is still the task of specifying available components.

• – Bereitstellen eines Substrats;
• – Auftragen von mindestens zwei Schichten des mindestens einen Bauteils auf das Substrat, wobei die mindestens zwei Schichten senkrecht zur Ebene des Substrats gesehen zumindest bereichsweise überlappen und/oder parallel zur Ebene des Substrats gesehen zumindest bereichsweise aneinander angrenzen;
• – musterförmiges Auftragen mindestens einer ätzenden oder ätzresistenten Waschlackschicht zwischen den mindestens zwei Schichten derart dass die mindestens eine Waschlackschicht senkrecht zur Ebene des Substrats gesehen zwischen den mindestens zwei Schichten in mindestens einem Bereich angeordnet wird, in welchem die mindestens zwei Schichten überlappen oder aneinander angrenzen, und
• – Strukturieren der mindestens zwei Schichten, wobei unterschiedliche Funktionen der mindestens einen Waschlackschicht gleichzeitig oder nacheinander zur Strukturierung verwendet werden.

The object is achieved by a first method for producing at least one component, which comprises at least two structured layers, with the following steps:

• - Providing a substrate;
• Applying at least two layers of the at least one component to the substrate, wherein the at least two layers, viewed at right angles to the plane of the substrate, overlap at least in regions and / or adjoin one another at least in regions parallel to the plane of the substrate;
• Patterned application of at least one etching or etching-resistant washcoat layer between the at least two layers such that the at least one washcoat layer perpendicular to the plane of the substrate is arranged between the at least two layers in at least one region in which the at least two layers overlap or adjoin one another, and
• - Structuring the at least two layers, wherein different functions of the at least one washcoat layer are used simultaneously or sequentially for structuring.

• – Bereitstellen eines Substrats;
• – Auftragen vom mindestens zwei Schichten des mindestens einen Bauteils auf das Substrat, wobei die mindestens zwei Schichten senkrecht zur Ebene des Substrats gesehen zumindest bereichsweise überlappen und/oder parallel zur Ebene des Substrats gesehen zumindest bereichsweise aneinander angrenzen;
• – musterförmiges Auftragen mindestens einer Waschlackschicht zwischen dem Substrat und den mindestens zwei Schichten, wobei die mindestens eine Waschlackschicht derart angeordnet wird, dass beim Abwaschen der Waschlackschicht(en) eine gleichzeitige Strukturierung der mindestens zwei Schichten erfolgt; und
• – Abwaschen der mindestens einen Waschlackschicht, wobei die Bereiche der Schicht(en) des Bauteils, die auf der dem Substrat abgewandten Seite der mindestens einen Waschlackschicht angeordnet sind, entfernt werden.

The object is further achieved by a second method for producing at least one component, which comprises at least two structured layers, with the following steps:

• - Providing a substrate;
• Applying at least two layers of the at least one component to the substrate, wherein the at least two layers, viewed at right angles to the plane of the substrate, overlap at least in regions and / or adjoin one another at least in regions parallel to the plane of the substrate;
• Pattern-wise application of at least one washcoat layer between the substrate and the at least two layers, wherein the at least one washcoat layer is arranged such that simultaneous washing of the washcoat layer (s) takes place of the at least two layers; and
• Washing off the at least one washcoat layer, wherein the regions of the layer (s) of the component which are arranged on the side of the at least one washcoat layer facing away from the substrate are removed.

The Task is for a component which has at least two structured layers a substrate, each perpendicular to the plane of Seen substrate have at least one layer edge, characterized solved, that the layer edges the at least two structured layers in at least one line-shaped area Seen perpendicular to the plane of the substrate congruent with a Tolerance of a maximum of ± 5 μm, in particular with a maximum tolerance of ± 100 nm. Such a component is in particular obtainable by one of the methods according to the invention.

The inventive production process enable the exact structuring of several layers of a component, in particular a simultaneous or nearly simultaneous structuring of different layers of the component with at least one washcoat layer. At the same time, the structured layers are precisely aligned in a simple manner exactly positioned to each other. A distortion of the substrate in the Formation of the individual layers is no longer disturbing Weight, since due to the method according to the invention in the structuring several layers of the component by means of at least one washcoat layer of the Default for every layer alike considered becomes. The number of washing and etching processes is also reduced.

components according to the invention are characterized by a very small footprint, since The design takes no or almost no register tolerances into account Need to become.

As a result, particularly high-quality components, in particular high-performance electrical components or particularly forgery-proof security elements can be generated. In an embodiment of a plurality of identical components next to each other on a substrate is achieved in the case of electrical components, that on the one hand, the size of the individual electrical components can be reduced. With a reduction of the conventional register tolerance of ± 500 microns of the individual layers of a component to each other to a register tolerance of ± 5 microns, the length and the width of a device can be reduced by almost 1 mm to a device size of 100 microns x 100 microns, which a reduction in area of 1 mm ² to 0.01 mm ² corresponds.

Also the distance between the individual components can be clearly in particular to 5 to 20 μm, be reduced. The minimization of the space requirements of the components themselves and their distances brings advantages when using the components of the invention in electronic Circuits with it.

A Accuracy in the structuring and positioning of different Layers, as achieved by the methods according to the invention, is by successively formed and individually structured layers so far not achieved.

For the first inventive method has it proven if at least one corrosive washcoat layer is used, and when washing the at least one corrosive Washcoat layer, the areas of a layer of at least two Layers on a side facing the substrate at least a corrosive Washcoat layer are arranged to be removed by etching, and the Areas of at least one further layer of the at least two layers, on a side facing away from the substrate of the at least one etching Washcoat layer are arranged to be removed by washing.

For the first method according to the invention, it has further proved useful if at least one first layer is applied to the substrate, if a first etching washcoat layer containing the first Etched layer, patterned at least partially applied to the first layer and dried when at least a second layer is at least partially applied to the first etching washcoat layer and further overlapping with the first layer, and then washed off the patterned, first etching washcoat layer, wherein together with the first etching washcoat layer, the regions of the first layer lying below the first etching washcoat layer perpendicular to the plane of the substrate and the regions of the at least one second layer lying above the first etching washcoat layer are removed.

For the first inventive method has it continued to prove itself if at least one etch resistant Washcoat layer on at least one layer of the at least two Layers is applied when the at least one layer in Areas not covered by the at least one etch-resistant washcoat layer covered by etching is removed if at least one more layer of at least two layers is applied such that the at least one further layer at least partially overlaps with the etch-resistant washcoat layer, and if the at least one etch resistant Washcoat layer is washed off, wherein the areas of at least another layer on the side facing away from the substrate the at least one etch-resistant Washcoat layer are arranged to be removed.

there it is preferred if the at least one etch-resistant washcoat layer resistant to at least one etchant is trained.

It has proved its worth, when at least a first layer is applied to the substrate is when a first etch resistant Washcoat layer patterned at least partially applied to the at least one first layer and dried when the at least one first layer by means of etching in Removed areas that are not with the at least one etch resistant Washcoat layer are covered, if at least a second layer the at least one component is applied such that the at least one second layer at least in regions with the first etch-resistant Washcoat overlaps, and the first etch-resistant Washcoat layer is washed off, wherein the areas of at least a second layer on the side facing away from the substrate the first etch-resistant Washcoat layer are arranged to be removed.

For the second inventive method For example, the at least one washcoat can be used as a conventional washcoat or as a corrosive or more resistant to etching Wash lacquer be formed.

The the first and the second inventive method can in the formation of a component used in any combination become. In addition, it has proven itself if still patterned at least one etch resist is applied, which after drying and / or curing optionally insoluble is. Independently from the formation of a structuring by the at least one Wash-lacquer layer can thereby be structured by etching at least one further layer become.

As an etch resist is preferably a thermally drying paint, a radiation-crosslinking Paint or a photostrukturierbarer paint applied.

It It is advantageous that the methods according to the invention make it possible to that the order of at least one layer to be structured of Component over the entire surface can be done. The large-scale, unstructured order of layers has been proven especially for Metals, inorganic materials and also organic electrical Functional layers, since organic layers are usually used very low-viscosity media be formed, which tend to bleed. In addition, in the Edge regions of a layer formed from such a medium After drying unevenness can be determined, so that the layer thickness of the formed layer is not constant.

Of the Application of at least one layer of the component to be structured but can also be done only partially. This is possible especially for sputtered, evaporated or printed layers well.

It has proved to be particularly favorable proven when the at least one washcoat layer arranged such is that they at least on their side facing away from the substrate partially covered by at least two layers of the component becomes. When washing the washcoat layer, the simultaneous structuring takes place and exact adjustment of the at least two layers arranged thereon in a simple, time-saving and cost-effective way.

Farther has it proven when a first washcoat layer and at least one further washcoat layer be applied, wherein the first washcoat layer on its the Substrate side facing away at least partially from at least a layer of the component is covered and the at least one further washcoat layer on its side facing away from the substrate at least in some areas of at least one further layer of the Component is covered. When washing off the first washcoat all areas of the layers arranged thereon are removed, whereas washing the second washcoat layer only removes it the areas of the layers which are facing away from the substrate Side of the second washcoat layer are arranged. For example after the patterned first washcoat layer applied two layers over the entire surface, then become an at least partially offset to the first washcoat layer arranged pattern-shaped second washcoat layer and two further full-surface layers formed, so arise after washing the two washcoat layers structured and aligned layers. Congruent, Structures adjusted to one another are created in all four layers due to the first washcoat layer and matching, to each other adjusted structuring of the two last applied layers arise due to the second washcoat layer. By suitable Selection of the number of washcoat layers, their type, their patterning As well as their orientation to each other, results in a variety of Design options.

Farther has it proven if at least two regionally arranged layers are formed, which are made of different material and parallel At least partially to each other seen at the level of the substrate adjacent, wherein a boundary line is formed, and wherein perpendicular At least one such borderline is seen to the plane of the substrate on the side facing away from the substrate of the at least one washcoat layer is arranged. By such a procedure can be also defined distances between arranged in a plane, different layer materials, the be formed one after the other, set exactly, without any elaborate Positioning of the substrate would be necessary or the exact dimensions of the layers would be critical in the area of the borderline. So the two different Layers in the area above the washcoat layer directly to each other abut, overlap each other or spaced from each other. In each of these cases is after washing off the washcoat between the two different Layers of the same distance have been formed, since only the Width of the washcoat layer determines this distance.

moreover It has proven to be advantageous if at least two washcoat layers be applied, which are soluble in a washing bath, and that the washing off the at least two washcoat layers simultaneously in the wash bath he follows. The inventive method This can be done very quickly and inexpensively.

in the With regard to the layer structure of the component to be formed, it can also cheap be when at least two layers of washcoat are applied, in different baths soluble are, and that the washing off of the at least two washcoat layers successively done in the different washing baths. In this way For example, after washing a first washcoat layer another order is made by one or more layers, the following when washing another, still existing Washcoat layer are structured.

When washing liquid for a Washing bath have water, different alkalis, different acids or organic solvents proven.

It is advantageous when viewed perpendicular to the plane of the substrate each layer on the side facing away from the substrate Washcoat layer is arranged, permeable to at least one washing liquid is, which dissolves the respective washcoat. A dissolving of the washcoat layer (s) However, it can also be laterally arranged by placing recesses in layers of the component.

Is appropriate a layer thickness of a to be structured by means of a washcoat layer Layer of <1 μm. A surface roughness a washcoat layer is preferably> 1 micron. This will cause the peeling accelerates the at least one washcoat layer. Alternatively, you can but also a use of ultrasound or a mechanical treatment while the washing process done to the complete washing off the at least a washcoat layer and layer areas disposed thereon guarantee.

The method according to the invention can be further varied in that, viewed perpendicularly to the plane of the substrate, at least one layer which is arranged on the side of a washcoat layer facing away from the substrate is permeable to at least one first wash liquid containing the respective washcoat layer dissolves, and is impermeable to a second washing liquid, which also dissolves the respective washcoat layer.

Thereby can selectively wash away areas of a washcoat layer, the under a permeable Layer are arranged while other areas of the same washcoat layer under an impermeable layer are arranged, not at the same time, but only in another Washing bath can be washed off. In between can additional layers are applied so that the layer structure of the component can be made even more versatile.

It has proven to be advantageous if the substrate of a flexible Foil, in particular a plastic film is formed. Under "flexible" here is flexible understood, wherein the flexibility of a winding of the substrate on a roll and a transport of the substrate from a roll allows for another role. The plastic film preferably has a thickness in the range of 6 to 200 μm on. Suitable materials for the plastic films are PET, PP or PE, among others. Farther the substrate may be formed in one or more layers, wherein Layers of different materials are combined with each other can. Furthermore the substrate can be transparent. This is especially true for bilateral Use of the substrate advantageous.

It has continued to prove itself when the substrate and the at least one component formed thereon a Form transfer film, wherein between the substrate and the at least a component a release layer is arranged. The release layer allows a detachment the at least one component from the substrate and the carry to another carrier. The layers of the at least one component correspond to a conventional transfer layer a transfer film, in particular by means of hot or Cold glue on the other carrier is fixed.

Especially it is preferred if the substrate is formed band-shaped and at execution of the process is transported from roll to roll. It will the substrate is unwound continuously from a roll, at least a coating unit for applying the layers of the component, the washcoat layers and optionally the Ätzresists supplied, then at least a wash bath and optionally other baths or treatment facilities supplied dried and finally wound up on another roll. It can on the finished roll material individual components or interconnected components are present, wherein subsequently a separation of components or component groups he follows.

Washcoats which are suitable for a process according to the invention have in particular at least one polymeric binder with acidic or alkaline groups, so that the dried washcoat is soluble in the corresponding wash bath. Polymeric binders that are soluble in aqueous solutions include acrylates with acid groups as functional groups (-SO ₃ H ,; -COOH) or amines with basic groups (-N ₂ H). Conventional washcoats without corrosive or etch-resistant additional function are already sufficiently known. With regard to possible etching and etch-resistant washcoats, which are accordingly designed to be multifunctional, a few examples are listed below.

It has proven useful if the at least one etching washcoat is formed from a washcoat of the following composition: 0.5-40% by weight etching medium 5-40% by weight polymeric binder 2-80% by weight water 0.1-5% by weight filler

A first etching washcoat composition has proven to be particularly effective as follows: 5-20% by weight Iron (III) chloride 15-25% by weight polyvinyl alcohol 52-77% by weight water 3% by weight silica

This first corrosive Washcoat is preferably printed on a copper layer pattern, dried, the copper layer and the first washcoat are steamed with aluminum and finally washed the first washcoat with water. The copper and The aluminum layer are structured in register with each other.

The now patterned structured present aluminum layer can again with pattern another corrosive Washcoat be printed and the process with one or more be repeated more layers.

For the pattern-shaped printing of the aluminum layer, the following corrosive further washcoat composition has proven suitable: 2-10% by weight sodium hydroxide 15-25% by weight polyvinylpyrrolidone 63-80% by weight water 2-3% by weight Silica (highly dispersed)

Of the further corrosive Wash is dried, the layer system, for example, with Copper steams and finally washed off the further washcoat with water.

It has proven useful if the at least one etching-resistant washcoat layer is formed from a lacquer of the following composition: 12-30% by weight Polymer binders with acid groups (carbonyl groups) 70-88% by weight solvent 0-2% by weight filler

It has proven useful if at least one first etching-resistant washcoat layer is formed from a paint of the following composition: 18-25% by weight Polyacrylic acid dispersant 75-82% by weight water 0-2% by weight silica

Furthermore, it has proven useful if at least one second etching-resistant washcoat layer is formed from a paint of the following composition: 12-20% by weight Styrene-maleic anhydride 50% by weight ethanol 2% by weight butanol 26-34% by weight ethyl acetate 0-2% by weight silica

Furthermore, it has proven useful if at least one third etching-resistant washcoat layer is formed from a coating of the following composition: 20-30% by weight Phenolic resin with an acid number greater than 20, preferably greater than 50 70-80% by weight butyl acetate 0-2% by weight silica

Of the first, second or third etch-resistant Wash lacquer is applied in particular pattern-wise on a copper layer and dried. There is an etching with an iron (III) chloride solution (50%). Subsequently In particular, a silver layer is vapor-deposited and the etch-resistant Washcoat with 5-10% Washed off sodium hydroxide solution.

Farther has it proven the second or third etch resistant Apply washcoat in particular pattern on an aluminum layer and to dry. There is an etching with phosphoric acid (1%). Subsequently In particular, a copper layer is vapor-deposited and the etch-resistant Washcoat with 5-10 Washed% sodium hydroxide solution.

For applying the at least two layers of the component, the following methods have proven useful: sputtering, vapor deposition, printing, spraying, casting and painting, or during painting usually used methods. The individual layers can be formed by the same or different methods. As a structuring process, in particular printing processes such as Gravure printing, flexographic or offset printing processes, but also proven by photolithographic methods.

To structuring layers of a component can generally electrically conductive, be electrically insulating or semiconducting layers. In the area Electrical components are above all the electrical characteristics of such a layer of interest, while in security elements or only the visual effect comes into play.

It is preferred when electrically conductive layers of the component a metal-based material or an organic one Material are formed. So have for electrical components as well for security elements electrically conductive materials such as gold, silver, copper or alloys proven from it. As organic electrically conductive materials for electrical components or Security elements are, for example, polyaniline, polypyrrole or doped polyethylene suitable. If a security element a have reflective layer, aluminum layers have proven.

Farther has it proven when semiconducting layers of the component formed of organic material become. But also the use of inorganic semiconducting materials is possible. So have conjugated as organic semiconducting materials Polymers such as polythiophenes, polythienylenevinylenes or polyfluorene derivatives proven. As organic semiconductive layer are also suitable layers so-called "small molecules, i. Oligomers such as sexithiophene or pentacene.

It is preferred if electrically insulating layers of organic or inorganic material are formed. As inorganic electrically insulating functional layer material, silica has proven itself. As electrically insulating organic material, for example, polyvinylphenol is suitable. For security elements, non-metallic, high-index materials such as ZnS, TiO ₂ and the like, as well as adhesive layers and paint layers are used, which may be transparent, opaque and / or colored.

advantageously, is after washing the at least one washcoat layer, and if necessary after implementation of etching processes, Seen at least one electrically perpendicular to the plane of the substrate conductive connection between at least two of the at least two now formed structured layers present. Thereby can be individual electrical components or safety elements or electrical functional layers within an electrical component or a security element in a simple manner electrically with each other boarded.

For the component according to the invention is particularly preferred when the layer edges of the at least two structured Layers in at least one line-shaped area perpendicular to Level of the substrate seen congruent and without tolerance to each other run. Any position deviations are thus eliminated.

For the component has it continued to prove itself if the at least two structured layers are perpendicular to the Level of the substrate each have at least one pattern-shaped opening, the patterned openings congruent with a maximum tolerance of ± 5 microns, in particular with a tolerance of maximum ± 100 nm on top of each other are arranged.

For the component it has also proven itself when viewed perpendicular to the plane of the substrate, at least one of at least two structured layers has at least one pattern-shaped opening and that at least one more of the at least two layers in shape the patterned opening structured is, with the pattern-shaped opening congruent to the at least one further layer with a tolerance of maximum ± 5 μm, in particular are arranged one above the other with a maximum tolerance of ± 100 nm.

It has proved its worth, if the component is an electrical component which at least two structured layers in the form of electrical functional layers wherein the at least two structured electrical Functional layers are arranged on a flexible substrate.

One electrical according to the invention Device is preferably used as an organic field-effect transistor, an organic diode, an organic capacitor, a resistor or an antenna is formed. Also whole component groups in form electrical circuits can be educated.

It has been proven that the electrical component or the electrical circuit with min at least one organic functional layer is formed.

Preferably As a component, a security element for applying and / or Embedding on / in value documents to be secured or identification documents formed, wherein the structured layers of electrical functional layers and / or form decorative layers. It can be around act a transmissive and / or a reflective security element, especially a security thread, a label, an overlay, a window element or the like.

It is preferred if the security element is an optically variable Element having which from different angles one gives a different visual impression. Suitable are here optically variable elements comprising a diffractive optical effective Structure, in particular a hologram or a diffraction grating, or a viewing angle dependent Color-change effect generating elements, in particular a thin-film interference layer element or a layer containing interference pigments, liquid crystals or liquid crystal pigments.

• a) die Waschlackschicht als ätzende Waschlackschicht ausgebildet wird und zwischen den mindestens zwei Schichten angeordnet wird, wobei durch Abwaschen der ätzenden Waschlackschicht eine gleichzeitige Strukturierung der mindestens zwei Schichten erfolgt, und/oder indem
• b) die Waschlackschicht als ätzresistente Waschlackschicht ausgebildet wird, wobei nach einem Aufbringen der ätzresistenten Waschlackschicht auf eine erste Schicht der mindestens zwei Schichten die erste Schicht in Bereichen, die nicht von der ätzresistenten Waschlackschicht bedeckt sind, durch Ätzen entfernt wird, auf das Substrat mindestens eine zweite Schicht der mindestens zwei Schichten vollflächig aufgebracht wird, welche die ätzresistente Waschlackschicht bedeckt, und schließlich die ätzresistente Waschlackschicht abgewaschen wird, und/oder indem
• c) die mindestens eine Waschlackschicht musterförmig auf das, gegebenenfalls bereits mit weiteren Schichten versehene Substrat aufgebracht wird und die mindestens zwei Schichten auf der dem Substrat abgewandten Seite der Waschlackschicht vollflächig auf das Substrat aufgebracht werden, wobei durch Abwaschen der Waschlackschicht eine gleichzeitige Strukturierung der mindestens zwei Schichten erfolgt.

A use of at least one pattern-structured washcoat layer for structuring at least two layers on a substrate is ideal, wherein

• a) the washcoat layer is formed as a corrosive washcoat layer and is disposed between the at least two layers, wherein a simultaneous structuring of the at least two layers takes place by washing the etching washcoat layer, and / or by
• b) the washcoat layer is formed as an etching-resistant washcoat layer, wherein after the etching-resistant washcoat layer has been applied to a first layer of the at least two layers, the first layer is removed by etching in areas that are not covered by the etch-resistant washcoat layer second layer of at least two layers is applied over the entire surface, which covers the etch-resistant washcoat layer, and finally the etch-resistant washcoat layer is washed off, and / or by
• c) the at least one washcoat layer is applied in pattern form to the substrate, optionally already provided with further layers, and the at least two layers on the side of the washcoat layer facing away from the substrate are applied over the entire surface to the substrate, wherein a simultaneous structuring of the at least two by washing off the washcoat layer Layers done.

The 1a to 10d should illustrate the invention by way of example. To show:

1a to 1d a method according to the invention using a corrosive washcoat layer.

2a to 2d a method according to the invention using an etch-resistant washcoat layer;

2 ' to 2 dd ' the procedure according to 2a to 2d in the plan view;

2e to 2g '' a modified procedure in plan view;

3a and 3b a method according to the invention using a conventional washcoat layer;

4a and 4b a method according to the invention using a conventional washcoat layer;

5a to 5b a method according to the invention using two conventional washcoat layers;

6a to 6d a process according to the invention using two conventional washcoat layers which are soluble in different wash baths;

7a to 7b a method according to the invention using a conventional washcoat layer;

8a to 8b another inventive method using a conventional washcoat layer;

9a to 9f a method according to the invention using an etch-resistant washcoat layer; and

10a to 10d a method according to the invention using a corrosive washcoat layer.

1a shows a substrate 100 in cross section, on which a first layer 200 made of aluminum vapor deposited over its entire surface. On the first shift 200 is according to 1b patterned a corrosive washcoat 500 printed and dried.

The composition of the etching washcoat to form the etching washcoat 500 was chosen as follows: 10% by weight Iron (III) chloride 19% by weight polyvinyl alcohol 70% by weight water 1% by weight silica

Thereby, the areas of the first layer become 200 that is under the corrosive washcoat 500 be at least partially resolved. On it becomes according to 1c a second layer 300 made of gold evaporated over the entire surface.

1d shows the substrate 100 out 1c after a washing treatment in which the coated substrate 100 immersed in a water bath and the first layer 200 and the second layer 300 were removed in areas above or below the corrosive washcoat layer 500 are arranged. The pattern-structured first layer 200 is thus perfectly in register with the pattern-structured second layer 300 ,

The substrate 100 is dried and it may optionally be applied and patterned further layers, but this is not done here.

2a shows a substrate 10 in cross section, on which a first layer 20 made of aluminum vapor deposited over its entire surface. On the first shift 20 is patterned an etch resistant washcoat 50 printed.

The composition of the washcoat for forming the etching-resistant washcoat 50 was chosen as follows: 18% by weight Styrene-maleic anhydride 50% by weight ethanol 2% by weight butanol 30% by weight ethyl acetate

2 B shows the substrate 10 out 2a after an etching treatment in which the coated substrate 10 immersed in a caustic wash bath of phosphoric acid (50%) and the first layer 20 was removed in areas not covered by the etch-resistant washcoat 50 are covered.

The substrate 10 is dried and according to 2c then a second layer 3 made of copper over the entire surface in a layer thickness of 50 nm. On the second layer 3 becomes another layer 40 evaporated from gold. The thus coated substrate 10 is now immersed in a washing bath, in which 5% sodium hydroxide solution is as washing liquid, and according to 2d the etch resistant washcoat 50 washed. In doing so, the areas of the second layer become 3 as well as the further layer 40 detached, based on the washcoat layer 50 are located.

The patterned layers 3 . 40 are in perfect register with each other and perfectly in register with the openings in the first layer 20 , When using a transparent substrate 10 is the pattern-structured first layer 20 seen from above from the further layer 40 surrounded, seen from the bottom of the second layer 3 surrounded, which according to the invention no position deviations and therefore no transparent points occur, where only the substrate 10 occurs. This would be difficult to avoid in conventional methods with the usually occurring position tolerances.

2 ' shows the substrate 10 out 2a as well as the first layer applied thereto 20 in the plan view. 2a ' shows the illustration according to 2a in plan view, where the etch-resistant washcoat layer 50 patterned on the first layer 20 was applied. 2 B' shows the illustration according to 2 B in the plan view. Here were not from the washcoat 50 covered areas of the first layer 20 by etching from the substrate 10 away. Now it's time for the second shift 3 (please refer 2c ' ) and the other layer 40 (please refer 2cc ' ) evaporated over the entire surface. 2cc ' corresponds to the representation according to 2c in plan view. Now the washcoat layer 50 washed off, with the embodiment according to 2d results. 2d ' now shows in the plan view the result 2d from the top while 2 dd ' the result 2d seen from below shows.

Alternatively, to the transparent substrate 10 according to 2 B respectively. 2 B' patterned a conventional wash 5 according to 2e be applied before further process steps are carried out. Only the B-shaped structured area (with the layers 20 and 50 ) according to 2 B' and surrounding areas of the substrate 10 covered. Now, according to 2f the second layer 3 applied from copper. Now the two washcoat layers 5 . 50 washed off, with the embodiment according to 2g ' results. 2g '' now shows the transparent substrate 10 from the back, so the first layer 20 and the second layer 3 through the transparent substrate 10 therethrough. In this way, additionally pattern-structured, transparent areas can be created.

3a shows a substrate 1 in cross-section, on which a component, in this case an electrical component, is to be formed. It is patterned a layer of the device in the form of a first electrically conductive functional layer 2 as a bottom electrode of gold on the substrate 1 evaporated. On the first electrically conductive functional layer 2 becomes a water-soluble washcoat 5 applied in a pattern. On the washcoat 5 and free spaces of the first electrically conductive functional layer 2 and the substrate 1 becomes an organic semiconducting functional layer 3 applied over the entire surface in a layer thickness of 25 nm and on this further full surface another layer of the device, a second electrically conductive functional layer 4 evaporated to form a top electrode of gold in a layer thickness of 50 nm. The thus coated substrate 1 is now immersed in a washing bath in which water is as washing liquid, and the washcoat layer 5 washed. At the same time, the areas of the organic semiconductive functional layer become 3 and the second electrically conductive functional layer 4 detached, based on the washcoat layer 5 are located.

The result after the washing process is in 3b shown. It turns out that a structuring of the organic semiconducting functional layer 3 and the second electrically conductive functional layer 4 is carried out, wherein due to the method, the organic semiconducting functional layer 3 exactly matching the second electrically conductive functional layer 4 is structured. A deviation in the orientation of the structured second electrically conductive functional layer 4 to the structured organic semiconducting functional layer 3 does not occur but is perpendicular to the plane of the substrate 1 seen a congruent arrangement.

4a shows a substrate 1 in cross-section, on which a component, in this case an electrical component, is to be formed. On the substrate 1 is the entire surface of the first layer of the electrical component in the form of an electrically conductive functional layer 2 evaporated from gold. On the electrically conductive functional layer 2 becomes a layer of etch resist 6 pattern printed and exposed areas of the functional layer 2 removed by etching. A water-soluble washcoat 5 is then applied pattern-shaped. On the washcoat 5 and free portions thereof of the etching resist layer 6 and the electrically conductive functional layer 2 becomes an organic semiconducting functional layer 3 from pentacene over the entire surface in a layer thickness of 50 nm and applied to this further full surface further layers of the electrical component in the form of an electrically insulating layer 7 and a second electrically conductive functional layer 4 evaporated to form a top electrode of gold in a total thickness of 50 nm. The thus coated substrate 1 is now immersed in a washing bath in which water is as washing liquid, and the washcoat layer 5 washed. At the same time, the areas of the organic semiconductive functional layer become 3 , the electrically insulating layer 7 and second electrically conductive functional layer 4 detached, based on the washcoat layer 5 are located.

The result after the washing process is in 4b shown. It turns out that a structuring of the organic semiconducting functional layer 3 , the electrically insulating layer 7 and the second electrically conductive functional layer 4 is carried out, wherein due to the method, the organic semiconducting functional layer 3 perfectly fitting to the electrically insulating layer 7 and to the second electrically conductive functional layer 4 is structured. A deviation in the orientation of the structured electrically insulating layer 7 or second electrically conductive functional layer 4 to the structured organic semiconducting functional layer 3 does not occur but is perpendicular to the plane of the substrate 1 seen a register-accurate arrangement.

5a shows a substrate 1 in cross section, on which all over a copper layer 2 ' evaporated, patterned a first etch-resistant water-soluble washcoat layer 5a imprinted and then the exposed areas of the copper layer 2 ' were etched. On the first washcoat 5a is the entire surface of a layer of an electrical component in the form of a first organic electrically conductive functional layer 2 evaporated from gold in a layer thickness of 5 nm. Then a second water-soluble washcoat is applied 5b patterned, wherein the first and the second washcoat layer 5a . 5b have different patterns. On the second washcoat 5b and free spaces of the first electrically conductive functional layer 2 becomes a further layer of the device in the form of an organic semiconducting functional layer 3 applied over the entire surface in a layer thickness of 5 nm and on this another layer in the form of a second organic electrically conductive functional layer 4 of gold in a layer thickness of 5 nm vapor-deposited over the entire surface. The thus coated substrate 1 is now immersed in a washing bath in which water is as washing liquid, and the first and the second washcoat layer 5a . 5b washed off at the same time. At the same time, the areas of the organic semiconductive functional layer become 3 and the second electrically conductive functional layer 4 detached, based on the first and the second washcoat layer 5a . 5b are located.

The result after the washing process is in 5b shown. It turns out that a structuring of the first electrically conductive functional layer 2 , the organic semiconducting functional layer 3 and the second electrically conductive functional layer 4 has taken place, due to the patterning of the first and the second washcoat layer 5a . 5b the organic semiconducting functional layer 3 exactly matching the second electrically conductive functional layer 4 is structured. A deviation in the orientation of the structured second electrically conductive functional layer 4 to the structured organic semiconducting functional layer 3 does not occur but is perpendicular to the plane of the substrate 1 seen a congruent arrangement. In contrast, the structuring of the first electrically conductive functional layer 2 differing depending on the pattern of the first washcoat layer 5a he follows.

6a shows a substrate 1 in cross section, on which all over a copper layer 2 ' evaporated, patterned a first etch-resistant water-soluble washcoat layer 5a imprinted and then the exposed areas of the copper layer 2 ' were etched. On the first washcoat 5a becomes a full surface a first layer 2 made of gold evaporated in a layer thickness of 4 nm. Then a second, in a non-polar solvent-soluble washcoat layer 5b patterned, wherein the first and the second washcoat layer 5a . 5b have different patterns. On the second washcoat 5b and free areas of the first layer 2 becomes an organic semiconducting layer 3 applied over the entire surface in a layer thickness of 5 nm and on this further all over a second layer 4 evaporated from gold in a layer thickness of 5 nm.

The thus coated substrate 1 is now immersed in a first washing bath, in which there is a non-polar solvent as the washing liquid, and the second washcoat layer 5b washed. At the same time, the areas of the organic semiconducting layer become 3 as well as the second layer 4 detached, based on the second washcoat layer 5b are located.

The result after the first washing process is in 6b shown. It turns out that structuring of the organic semiconducting layer 3 as well as the second layer 4 is done, wherein due to the patterning of the second washcoat layer 5b the organic semiconducting layer 3 exactly to the second layer 4 is structured. A deviation in the orientation of the structured second layer 4 to the structured organic semiconducting layer 3 does not occur but is perpendicular to the plane of the substrate 1 seen a register-accurate arrangement.

Now, according to the substrate 6b an electrically insulating layer 7 of SiO _x in a layer thickness of 10 nm sputtered over the entire surface. The result is in 6c shown.

Then, the thus coated substrate 1 immersed in a second washing bath, in which alkaline water is present as washing liquid, and the first washcoat layer 5a washed. In this case, the areas of the first electrically conductive layer 2 , the organic semiconducting layer 3 , the second electrically conductive layer 4 and the electrically insulating layer 7 detached, based on the first washcoat layer 5a are located. Thus, a variety of different structuring generate in a simple and cost-effective manner.

7a shows a substrate 1 in cross section, on which pattern a water-soluble washcoat layer 5 was printed. It will be an electrically conductive layer 2 made of gold vapor deposited patternwise and next to an organic semiconducting layer 3 pattern applied in a layer thickness of 5 nm. The electrically conductive layer 2 and the organic semiconductive layer 3 each cover the washcoat layer 5 , It is immaterial whether the electrically conductive layer 2 and the organic semiconductive layer 3 directly adjacent to each other, overlapping each other or spaced apart. It is important only that the electrically conductive layer 2 and the organic semiconductive layer 3 in the area of the washcoat layer 5 meet. The thus coated substrate 1 is now immersed in a washing bath in which water is as washing liquid, and the washcoat layer 5 washed. At the same time, the areas of the organic semiconducting layer become 3 and the electrically conductive layer 2 detached, based on the washcoat layer 5 are located.

The result after the washing process is in 7b shown. It turns out that structuring of the organic semiconducting layer 3 and the electrically conductive layer 2 is carried out, wherein due to the method, the organic semiconductive layer 3 at a defined distance from the electrically conductive layer 2 is arranged. A deviation in the orientation of the patterned electrically conductive layer 2 to the structured organic semiconducting layer 3 does not occur but is perpendicular to the plane of the substrate 1 seen from the washcoat layer 5 predetermined, desired distance before. An elaborate positioning and dimensioning of the individual layers 2 . 3 can thus be omitted.

8a shows a substrate 1 in cross section, on which pattern a water-soluble washcoat layer 5 was printed. This is partially organic semiconducting layer 3 pattern applied in a layer thickness of 5 nm. Subsequently, an electrically conductive layer 2 made of gold evaporated over the entire surface. The electrically conductive layer 2 and the organic semiconductive layer 3 each cover the washcoat layer 5 at least partially. The thus coated substrate 1 is now immersed in a washing bath in which water is as washing liquid, and the washcoat layer 5 washed. At the same time, the areas of the organic semiconducting layer become 3 and the electrically conductive layer 2 detached, based on the washcoat layer 5 are located.

The result after the washing process is in 8b shown. It turns out that structuring of the organic semiconducting layer 3 and the electrically conductive layer 2 is done, due to the wash 5 at a defined distance from each other a structured electrically conductive layer 2 and two stacks of precisely organic structured semiconducting layers 3 and electrically conductive layers 2 are arranged. An elaborate positioning and dimensioning of the individual layers 2 . 3 can thus be omitted in this case.

9a shows a transparent substrate 10 in cross section, on which a first layer 20 made of aluminum vapor deposited over its entire surface. On the first shift 20 becomes a pattern-like etch-resistant washcoat 50 and an etch resist 60 printed.

9b shows the substrate 10 out 9a after an etching treatment in which the coated substrate 10 immersed in a caustic wash and the first coat 20 was removed in areas that neither the etch-resistant washcoat layer 50 still from Ätzresist 60 are covered.

The substrate 10 is dried and according to 9c then another layer 30 made of gold evaporated over the entire surface. The thus coated substrate 10 is now immersed in a washing bath in which alkaline water is as washing liquid, and according to 9d the etch resistant washcoat 50 washed. In doing so, the areas of the second layer become 30 detached, based on the washcoat layer 50 are located. 9d shows a section AA 'through the coated substrate 10 according to 9e ,

The resulting component, which is designed here as an optical security element, and its optical appearance after the washing process on the front and the back of the substrate 10 is in the 9e and 9f shown.

9e shows the coated substrate 10 according to 9d from above. It shows the second layer 30 facing the viewer as well as the first layer 20 registration accurate and without offset in a B-shaped recess of the second layer 30 , The letter "B", which is from the first layer 20 was formed fills the opening in the second layer 30 exact, so that no areas are visible in the edge area, the only the transparent substrate 10 demonstrate.

9f shows the coated substrate 10 according to 9d from below or the component 9e , which was tilted down about the cutting axis AA 'by 180 °. It shows the transparent substrate 10 facing the viewer, through which the structured first layer 20 as well as the structured second layer 30 can be seen. The letter B can thus be seen from both sides of the component, the positioning of the B-shaped adjacent opening in the second layer 30 accurate registration and without offset has occurred.

10a shows a transparent substrate 100 in cross section, on which a first layer 200 made of aluminum vapor deposited over its entire surface. On the first shift 200 is patterned a corrosive washcoat 500 and a conventional washcoat layer 5c printed and dried. It will be a second layer 300 made of gold evaporated over the entire surface.

10b shows the substrate 100 out 10a after a washing treatment in which the coated substrate 100 immersed in a wash bath of alkaline water and the first layer 200 and the second layer 300 was removed in areas above or below the caustic washcoat 500 were arranged and etched and the areas of the second layer 300 were removed, over the washcoat layer 5c were arranged. 10b shows a section BB 'through the formed component according to 10c ,

The substrate 100 is dried and it may optionally be applied more layers, but this is not done here.

The resulting component, which is designed here as an optical security element, and its optical appearance after the washing process on the front and the back of the substrate 100 is in the 10c and 10d shown.

10c shows the coated substrate 100 according to 10b from above. It shows the second layer 300 facing the viewer as well as the first layer 200 in a B-shaped recess of the second layer 300 , The first shift 200 fills the B-shaped opening in the second layer 300 exact, so that no areas are visible in the edge area, the transparent substrate 100 demonstrate.

10d shows the coated substrate 100 according to 10b from below or the component 10c , which was tilted down about the cutting axis BB 'by 180 °. It shows the transparent substrate 100 facing the viewer, through which the M-shaped structured first layer 200 can be seen. The letter "M" can thus be seen from both sides of the component, with the M once in the first layer 200 and once in the second shift 300 as a recess can be seen, the only transparent substrate 100 are filled and arranged exactly in register with each other. The exact register-accurate positioning of the M-shaped openings in the first layer 200 and the second layer 30 has a maximum offset of ± 5 μm.

in the With regard to the illustrated embodiments, it is added that it of course one Variety more, not shown here or described in detail options to form components by means of the inventive method or To structure layers. This is already apparent to a person skilled in the art aware of the present invention without being inventive Act would. A Combination of the methods of the invention is, as mentioned above, readily feasible.

Claims (46)

Method for producing at least one component which comprises at least two structured layers, comprising the following steps: - providing a substrate ( 10 . 100 ); - application of at least two layers ( 20 . 3 . 40 ; 20 . 30 ; 200 . 300 ) of the at least one component on the substrate ( 10 . 100 ), the at least two layers ( 20 . 3 . 40 ; 20 . 30 ; 200 . 300 ) perpendicular to the plane of the substrate ( 10 . 100 ) at least partially overlap and / or parallel to the plane of the substrate ( 10 . 100 ) are at least partially adjacent to each other; Pattern-wise application of at least one etching or etch-resistant wash-lacquer layer ( 50 . 500 ) between the at least two layers ( 20 . 3 . 40 ; 20 . 30 ; 200 . 300 ) such that the at least one washcoat layer ( 50 . 500 ) perpendicular to the plane of the substrate ( 10 . 100 ) seen between the at least two Layers ( 20 . 3 . 40 ; 20 . 30 ; 200 . 300 ) is arranged in at least one region in which the at least two layers ( 20 . 3 . 40 ; 20 . 30 ; 200 . 300 ) overlap or adjoin one another, and - structuring the at least two layers ( 20 . 3 . 40 ; 20 . 30 ; 200 . 300 ), wherein different functions of the at least one washcoat layer ( 50 . 500 ) can be used simultaneously or sequentially for structuring. A method according to claim 1, characterized in that at least one etching washcoat ( 500 ), and that during the washing of the at least one etching washcoat ( 500 ) the areas of a layer ( 200 ) of at least two layers ( 200 . 300 ) placed on a substrate ( 100 ) facing side of the at least one etching washcoat layer ( 500 ) are removed by etching, and the areas of at least one further layer ( 300 ) of at least two layers ( 200 . 300 ) placed on a substrate ( 100 ) facing away from the at least one etching washcoat ( 500 ) are removed by washing away. Method according to claim 2, characterized in that at least one first layer ( 200 ) on the substrate ( 100 ) is applied, that a first etching washcoat layer ( 500 ), which the first layer ( 200 ) etched, patterned at least partially on the first layer ( 200 ) is applied and dried, that at least a second layer ( 300 ) at least partially on the first etching washcoat ( 500 ) and still overlapping with the first layer ( 200 ) is applied, and then that the pattern-shaped first etching washcoat layer ( 500 ), wherein, together with the first etching washcoat layer ( 500 ) perpendicular to the plane of the substrate ( 100 ) seen under the first etching washcoat ( 500 ) lying areas of the first layer ( 200 ) and those above the first etching washcoat ( 500 ) lying portions of the at least one second layer ( 300 ) are removed. Method according to one of claims 1 to 3, characterized in that at least one etch-resistant washcoat layer ( 50 ) on at least one layer ( 20 ) of at least two layers ( 20 . 3 . 40 ; 20 . 30 ) is applied, that the at least one layer ( 20 ) in areas which are not compatible with the at least one etch-resistant washcoat ( 50 ) are removed, removed by etching, that at least one further layer ( 3 . 40 ; 30 ) of at least two layers ( 20 . 3 . 40 ; 20 . 30 ) is applied in such a way that the at least one further layer ( 3 . 40 ; 30 ) at least in regions with the etching-resistant washcoat layer ( 50 ) and that the at least one etch-resistant washcoat ( 50 ), the areas of the at least one further layer ( 3 . 40 ; 30 ), which are on the substrate ( 10 ) facing away from the at least one etch-resistant washcoat layer ( 50 ) are removed. A method according to claim 4, characterized in that the at least one etch-resistant washcoat layer ( 50 ) is formed resistant to at least one etchant. Method according to one of claims 4 or 5, characterized in that at least one first layer ( 20 ) on the substrate ( 10 ) is applied, that a first etching-resistant washcoat layer ( 50 ) patterned at least partially on the at least one first layer ( 20 ) is applied and dried, that the at least one first layer ( 20 ) is removed by means of etching in areas which are not compatible with the at least one etch-resistant washcoat layer (US Pat. 50 ), that at least one second layer ( 3 . 40 ; 30 ) of the at least one component is applied such that the at least one second layer ( 3 . 40 ; 30 ) at least in regions with the first etching-resistant washcoat layer ( 50 ) and that the first etching-resistant washcoat layer ( 50 ), wherein the regions of the at least one second layer ( 3 . 40 ; 30 ), which are on the substrate ( 10 ) facing away from the first etching-resistant washcoat layer ( 50 ) are removed. Method for producing at least one component which comprises at least two structured layers, comprising the following steps: - providing a substrate ( 1 ); - application of at least two layers ( 2 . 3 . 4 . 7 ) of the at least one component on the substrate ( 1 ), the at least two layers ( 2 . 3 . 4 . 7 ) perpendicular to the plane of the substrate ( 1 ) at least partially overlap and / or parallel to the plane of the substrate ( 1 ) are at least partially adjacent to each other; - patterned application of at least one washcoat layer ( 5 . 5a . 5b ) between the substrate ( 1 ) and the at least two layers ( 2 . 3 . 4 . 7 ), wherein the at least one washcoat layer ( 5 . 5a . 5b ) is arranged such that when washing the washcoat layer (s) ( 5 . 5a . 5b ) a simultaneous structuring of the at least two layers ( 2 . 3 . 4 . 7 ) he follows; and - washing the at least one washcoat layer ( 5 . 5a . 5b ), the areas of the layer (s) ( 2 . 3 . 4 . 7 ) of the component on the substrate ( 1 ) facing away from the at least one washcoat layer ( 5 . 5a . 5b ) are removed. A method according to claim 7, characterized in that the at least one washcoat as a caustic or etch resistant Wash lacquer is formed. Method according to one of claims 1 to 8, characterized in that furthermore pattern-shaped at least one Ätzresist ( 6 . 60 ) is applied, which is particularly insoluble after drying and / or curing. Process according to Claim 9, characterized in that the etching resist ( 6 . 60 ) a thermally drying lacquer, a radiation-curing lacquer or a photo-structurable lacquer is applied. Method according to one of claims 1 to 10, characterized that the order of at least one layer to be structured of Component over the entire surface he follows. Method according to one of claims 1 to 11, characterized that the order of at least one layer to be structured of Component takes place only partially. Method according to one of claims 1 to 12, characterized in that the at least one washcoat layer ( 5 . 5a . 5b . 5c . 50 . 500 ) is arranged in such a way that on its the substrate ( 1 . 10 . 100 ) facing away from at least partially covered by at least two layers of the component. Method according to one of claims 1 to 12, characterized in that a first washcoat layer ( 5a ) and at least one further washcoat layer ( 5b ), wherein the first washcoat layer ( 5a ) on its substrate ( 1 ) facing away from at least partially covered by at least one layer of the component and the at least one further washcoat layer ( 5b ) on its substrate ( 1 ) side is at least partially covered by at least one further layer of the component. A method according to claim 12, characterized in that at least two regionally arranged layers ( 2 . 3 ), which are formed of different material and parallel to the plane of the substrate ( 1 ) are at least partially adjacent to each other, wherein a boundary line is formed, and wherein perpendicular to the plane of the substrate ( 1 ) seen at least one such boundary line on the substrate ( 1 ) facing away from the at least one washcoat layer ( 5 . 5a . 5b ) is arranged. Method according to one of claims 1 to 15, characterized in that at least two washcoat layers ( 5a . 5b ), which are soluble in a washing bath, and that the washing off of the at least two washcoat layers ( 5a . 5b ) takes place simultaneously in the washing bath. Method according to one of claims 1 to 16, characterized in that at least two washcoat layers ( 5a . 5b ), which are soluble in different wash baths, and that the washing off of the at least two washcoat layers ( 5a . 5b ) takes place successively in the different washing baths. Method according to one of claims 1 to 17, characterized in that perpendicular to the plane of the substrate ( 1 ) seen each layer on the substrate ( 1 ) facing away from a washcoat layer ( 5 . 5a . 5b ), is permeable to at least one washing liquid which dissolves the respective washcoat layer. Method according to claim 18, characterized in that perpendicular to the plane of the substrate ( 1 ) seen at least one layer on the substrate ( 1 ) facing away from a washcoat layer ( 5 . 5a . 5b ), is permeable to at least a first washing liquid, the respective washcoat layer ( 5 . 5a . 5b ), and impermeable to a second washing liquid, the respective washcoat layer ( 5 . 5a . 5b ) also releases. Method according to one of claims 1 to 19, characterized in that the substrate ( 1 ) is formed from a flexible film, in particular a plastic film or coated plastic film. Method according to one of claims 1 to 20, characterized in that the substrate ( 1 ) tape is shaped and transported in carrying out the process from roll to roll. Method according to one of claims 1 to 3, characterized in that the at least one etching washcoat layer ( 500 ) is formed from a washcoat having the following composition: 0.5-40% by weight etching medium 5-40% by weight polymeric binder 22-80% by weight water 0.1-5% by weight filler A method according to claim 22, characterized in that the washcoat has the following composition: 5-20% by weight Iron (III) chloride 15-25% by weight polyvinyl alcohol 52-77% by weight water 3% by weight silica A method according to claim 22, characterized in that the washcoat has the following composition: 2-10% by weight sodium hydroxide 15-25% by weight polyvinylpyrrolidone 63-80% by weight water 2-3% by weight Silica (highly dispersed) A method according to claim 1 or any one of claims 4 to 6, characterized in that the at least one etch-resistant washcoat layer ( 50 ) is formed from a washcoat having the following composition: 12-30% by weight Polymer binders with acid groups (carbonyl groups) 70-88% by weight solvent 0-2% by weight filler A method according to claim 25, characterized in that the washcoat has the following composition: 18-25% by weight Polyacrylic acid dispersant 75-82% by weight water 0-2% by weight silica A method according to claim 25, characterized in that the washcoat has the following composition: 12-20% by weight Styrene-maleic anhydride 50% by weight ethanol 2% by weight butanol 26-34% by weight ethyl acetate 0-2% by weight silica A method according to claim 25, characterized in that the washcoat has the following composition: 20-30% by weight Phenolic resin with an acid number greater than 20 70-80% by weight butyl acetate 0-2% by weight silica Method according to one of claims 1 to 28, characterized in that the at least two layers ( 2 . 3 . 4 . 7 . 20 . 30 . 40 ) of the component are each formed by means of a method selected from the group of sputtering, vapor deposition, printing, spraying, casting and painting. Method according to one of claims 1 to 29, characterized in that electrically conductive layers ( 2 . 4 . 20 . 30 . 40 ) of the component are formed from a metal-based material and / or organic material. Method according to one of claims 1 to 30, characterized in that semiconducting layers ( 3 ) of the component are formed from organic and / or inorganic material. Method according to one of claims 1 to 31, characterized in that electrically insulating layers ( 7 ) of the component are formed from organic or inorganic material. Method according to one of claims 1 to 32, characterized that as an electrical component or an electrical component Circuit is formed, wherein the structured layers electrical Form functional layers. Method according to claim 33, characterized in that the electrical component or the electrical circuit with at least one organic functional layer ( 3 ) is formed. A method according to claim 33 or 34, characterized in that after washing the at least one washcoat layer ( 5 . 5a . 5b . 50 . 500 ), and optionally after etching, perpendicular to the plane of the substrate ( 1 . 10 . 100 ) seen at least one electrically conductive connection between at least two structured layers is formed. Method according to one of claims 1 to 35, characterized that as a component a security element for applying and / or Embedding on / in value documents to be secured or identification documents is formed, wherein the structured layers electrical Form functional layers and / or decorative layers. Component comprising at least two structured layers on a substrate ( 1 . 10 . 100 ), each perpendicular to the plane of the substrate ( 1 . 10 . 100 ) have at least one layer edge, characterized in that the layer edges of the at least two structured layers in at least one line-shaped region perpendicular to the plane of the substrate ( 1 . 10 . 100 ) seen congruent with a maximum tolerance of ± 5 microns, in particular with a maximum tolerance of ± 100 nm to each other. Component according to claim 37, characterized in that the layer edges of the at least two structured layers in at least one line-shaped region perpendicular to the plane of the substrate ( 1 . 10 . 100 ) are congruent and tolerant to each other. Component according to Claim 37 or Claim 38, characterized in that the at least two structured layers are perpendicular to the plane of the substrate ( 1 . 10 . 100 ) each have at least one pattern-shaped opening, wherein the pattern-shaped openings are arranged congruent with a tolerance of a maximum of ± 5 microns, in particular with a maximum tolerance of ± 100 nm. Component according to one of claims 37 to 39, characterized in that perpendicular to the plane of the substrate ( 1 . 10 . 100 ) at least one of the at least two structured layers has at least one pattern-shaped opening and that at least one further of the at least two layers is patterned in the form of the pattern-shaped opening, wherein the pattern-shaped opening coincides with the at least one further layer with a tolerance of a maximum of ± 5 microns , in particular with a tolerance of a maximum of ± 100 nm are arranged one above the other. Component according to one of claims 37 to 40, characterized in that the component is an electrical component having at least two structured layers in the form of electrical functional layers, which in particular comprise at least one organic functional layer, wherein the at least two structured electrical functional layers on a flexible Substrate ( 1 . 10 . 100 ) are arranged. Component according to claim 41, characterized that the electrical component is an organic field-effect transistor, an organic diode, an organic capacitor, a resistor or an antenna. Component according to one of Claims 37 to 39, characterized that the component is a security element for applying and / or Embedding on / in value documents to be secured or identification documents is, wherein the at least two structured layers of electrical Form functional layers and / or decorative layers. Component according to claim 42, characterized the security element has an optically variable element, which from different angles a different conveys visual impression. Component according to Claim 43, characterized that the optically variable element is a diffractive optical effective Structure, in particular a hologram or diffraction grating, or a viewing angle-dependent Color-changing effects generating element, in particular a thin-film interference layer element or a layer containing interference pigments, liquid crystals or liquid crystal pigments. Use of at least one pattern-structured washcoat for structuring at least two layers ( 20 . 3 . 40 ; 20 . 30 ; 200 . 300 ; 2 . 3 . 4 . 7 ) on a substrate ( 1 . 10 . 100 ), wherein a) the washcoat layer as a corrosive washcoat ( 500 ) and between the at least two layers ( 200 . 300 ) is arranged, wherein by washing the etching washcoat ( 500 ) a simultaneous structuring of the at least two layers ( 200 . 300 ), and / or by b) the washcoat layer as etch-resistant washcoat ( 50 ) is formed, wherein after application of the etching-resistant washcoat layer ( 50 ) on a first layer ( 20 ) of at least two layers ( 20 . 3 . 40 ; 20 . 30 ) the first layer ( 20 ) in areas not affected by the etch-resistant washcoat ( 50 ) are removed by etching, on the substrate ( 10 ) at least one second layer ( 3 . 40 ; 30 ) of at least two layers ( 20 . 3 . 40 ; 20 . 30 ) is applied over the entire surface, which the etching-resistant washcoat layer ( 50 ), and finally the etching-resistant washcoat ( 50 ) and / or by c) the at least one washcoat layer ( 5 . 5a . 5b ) patterned onto the substrate ( 1 ) and the at least two layers ( 2 . 3 . 4 . 7 ) on the substrate ( 1 ) facing away from the washcoat layer ( 5 . 5a . 5b ) over the entire surface of the substrate ( 1 ) are applied, wherein by washing the washcoat ( 5 . 5a . 5b ) a simultaneous structuring of the at least two layers ( 2 . 3 . 4 . 7 ) he follows.