DE102006023321A1 - Process to monitor laser beam in laser ablation process for the manufacture e.g. of a display with an amorphous silicon film on glass - Google Patents
Process to monitor laser beam in laser ablation process for the manufacture e.g. of a display with an amorphous silicon film on glass Download PDFInfo
- Publication number
- DE102006023321A1 DE102006023321A1 DE102006023321A DE102006023321A DE102006023321A1 DE 102006023321 A1 DE102006023321 A1 DE 102006023321A1 DE 102006023321 A DE102006023321 A DE 102006023321A DE 102006023321 A DE102006023321 A DE 102006023321A DE 102006023321 A1 DE102006023321 A1 DE 102006023321A1
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- DE
- Germany
- Prior art keywords
- monitoring
- laser
- laser beam
- substrate
- focus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/16—Beam splitting or combining systems used as aids for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/144—Beam splitting or combining systems operating by reflection only using partially transparent surfaces without spectral selectivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/145—Beam splitting or combining systems operating by reflection only having sequential partially reflecting surfaces
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Die Erfindung betrifft ein System zur Fokusüberwachung bei der Bearbeitung eines reflektierenden Substrates mittels eines Lasers nach dem Oberbegriff von Anspruch 1.The The invention relates to a system for monitoring the focus during processing a reflective substrate by means of a laser according to the preamble of claim 1.
Laserstrahlen werden zur Bearbeitung diverser Materialien in einer Vielzahl von technischen Bereichen eingesetzt. Insbesondere Hochleistungslaser werden eingesetzt, um Substrate abzutragen, wie dies bei der Laser-Ablation erfolgt, Oberflächen von Substraten aufzuschmelzen, ein Beispiel hierfür ist die Laserkristallation von amorphen Siliziumfilmen auf Glas, wie sie für die Displayherstellung eingesetzt werden oder hochpräzise Löcher in Substrate zu bohren, was beispielsweise zum Bohren von μm-kleinen Tintenstrahldüsen genutzt wird, sowie einer Vielzahl von anderen, auch medizinischen Anwendungen.laser beams are used to process diverse materials in a variety of ways technical areas used. In particular, be high-power laser used to ablate substrates, as in laser ablation done, surfaces melt of substrates, an example of which is the Laser crystallization of amorphous silicon films on glass, as they are for the Display fabrication or to drill high-precision holes in substrates, which used for example for drilling of micron-sized inkjet nozzles will, as well as a variety of other, including medical applications.
Insbesondere dann, wenn eine Oberfläche zur Kristallisation aufgeschmolzen werden soll, in sogenannten Annealingsystemen, ist von herausragender Bedeutung, dass die Energiestabilität, die Gleichmäßigkeit des Strahles und die hohe Leistung des Lasers über den gesamten Prozess der Substratbearbeitung hin gewährleistet werden. Von ebenso fundamentaler Bedeutung ist hierbei, dass der Fokus in der Substrat-, also in der Arbeitsebene, erhalten bleibt.Especially then, if a surface to Crystallization is to be melted, in so-called annealing systems, is of paramount importance that the energy stability, the uniformity of the beam and the high power of the laser throughout the process of Substrate processing guaranteed become. Of equally fundamental importance here is that the Focus in the substrate, ie in the working plane, is maintained.
Von
Verfahren zum Kristallisieren amorpher Siliziumschichten mittels
Excimer-Lasern wie dem in der
Anschließend wird
der Laserstrahl
Werkstück
workpiece
Es
hat sich jedoch gezeigt, dass dieses System insbesondere bei starken
Temperaturänderungen
des Objektivs
Der Erfindung liegt die Aufgabe zugrunde, ein System zur Fokusüberwachung bei der Bearbeitung eines reflektierenden Substrats mittels eines Lasers bereitzustellen, das den aktuellen Fokuszustand in der Bildebenenposition unabhängig von Temperaturänderungen bestimmt.Of the Invention is based on the object, a system for focus monitoring in the processing of a reflective substrate by means of a Laser provide the current focus state in the image plane position independently of temperature changes certainly.
Gelöst wird die Aufgabe gemäß der Erfindung durch ein System zur Fokusüberwachung bei der Bearbeitung eines reflektierenden Substrats mittels eines Lasers mit den Merkmalen von Anspruch 1.Is solved the task according to the invention through a system for focus monitoring in the processing of a reflective substrate by means of a Laser with the features of claim 1.
Erfindungsgemäß wird zur Überwachung des Fokus des Laserstrahls des vorzugsweise ultravioletten Arbeitslasers, der zur Bearbeitung des Substrats eingesetzt wird, ein Laserstrahl desselben Wellenlängenbereichs wie der Arbeitsstrahls selbst, bzw. eines ähnlichen Lasers verwendet. Hierdurch kann sichergestellt werden, dass der Arbeitsstrahl und der zur Fokusüberwachung verwendete Überwachungsstrahl dieselben Strahleigenschaften haben und damit denselben Temperaturschwankungen und anderen Einflüssen ausgesetzt sind und diese sich auch bei beiden Strahlen gleich auswirken. Hierdurch wird die Zuverlässigkeit des Systems zur Fokusüberwachung maßgeblich erhöht. Driftet der Fokus des Arbeitslasers nämlich beispielsweise durch Temperaturverschiebungen im Abbildungsobjektiv weg, so passiert dasselbe mit dem zur Fokusüberwachung eingesetzten Überwachungsstrahl, der dieselben Eigenschaften und Empfindlichkeiten wie der Arbeitsstrahl aufweist, durch das selbe Abbildungsobjektiv hindurchgeleitet wird und damit der selben Fokusverschiebung ausgesetzt ist, die damit stellvertretend für den Arbeitslaser an ihm nachgewiesen werden kann. Unter Wellenlängenbereich wird hier ein Spektralbereich verstanden, der im Wesentlichen den gleichen optischen Eigenschaften unterliegt. Dies sind beispielsweise der Infrarotbereich, die optischen Bereiche und der ultraviolette Bereich.According to the invention, to monitor the focus of the laser beam of the preferably ultraviolet working laser used for processing the substrate, a laser beam of the same wavelength range as the working beam itself or a similar laser is used. In this way it can be ensured that the working beam and the monitoring beam used for focus monitoring have the same beam properties and thus the same temperature fluctuations and others are exposed to influences and these also have the same effect on both beams. As a result, the reliability of the system for focus monitoring is significantly increased. For example, if the focus of the working laser drifts away, for example due to temperature shifts in the imaging lens, the same happens to the monitoring beam used for focus monitoring, which has the same properties and sensitivities as the working beam through which the same imaging objective is passed and thus exposes itself to the same focus shift, thus representing it for the working laser can be proved on him. Wavelength range is here understood to mean a spectral range which is subject to essentially the same optical properties. These are, for example, the infrared range, the optical ranges, and the ultraviolet range.
Besonders vorteilhaft kann dieses System zur Fokusüberwachung für Laserstrahlen zur Bearbeitung eines Substrats eingesetzt werden, deren Arbeitswellenlänge im ultravioletten Bereich liegt. Hier verändert sich nämlich der Einfluss der Temperatur exponentiell mit der Wellenlänge. So ist es in diesem Bereich besonders wichtig, dass Arbeitsstrahl und Überwachungsstrahl nahe beieinander liegende Wellenlängen aufweisen.Especially This system can advantageously be used to monitor the focus of laser beams be used for processing a substrate whose working wavelength in the ultraviolet Area is located. Changed here Namely the influence of temperature exponentially with the wavelength. So In this area it is particularly important that working beam and monitoring beam Have close lying wavelengths.
In einer weiteren bevorzugten Ausführungsform der Erfindung wird als Überwachungsstrahl ein Anteil des Arbeitsstrahles selbst verwendet. Ein entscheidender Vorteil hiervon ist, dass es damit sichergestellt ist, dass die beiden Strahlen exakt dieselbe Reaktion auf äußere Einflüsse zeigen. So ist ihre Temperaturabhängigkeit sowie die daraus folgende Wellenverschiebung und damit Fokusverschiebung identisch. Ferner hat dies den Vorteil, dass eine weitere Lichtquelle eingespart werden kann, wenn ein Teil des Arbeitsstrahles selbst zur Erzeugung des Überwachungsstrahles aus dem Strahlengang des Arbeitslasers ausgekoppelt wird.In a further preferred embodiment The invention is used as a monitoring beam a proportion of the working beam itself is used. A decisive one The advantage of this is that it ensures that the Both rays show exactly the same reaction to external influences. Such is their temperature dependence as well as the resulting wave shift and thus focus shift identical. Furthermore, this has the advantage that saved another light source can be, if a part of the working beam itself to produce the monitoring beam is decoupled from the beam path of the working laser.
In einer bevorzugten Ausführungsform der Erfindung basiert das System zur Fokusüberwachung auf der Abbildung der Struktur eines Überwachungsstrahls, die unterhalb der Auflösungsgrenze des Systems liegt, einer sogenannten Spot-Abbildung. Der Durchmesser des abzubildenden Überwachungsstrahls liegt vorzugsweise im μm-Bereich. Hierdurch kann gewährleistet werden, dass der Lichtkegel des abzubildenden Überwachungsstrahls die Eingangsapertur des Abbildungsobjektives überstrahlt, und sie damit möglichst homogen ausleuchtet.In a preferred embodiment In the invention, the system for focus monitoring is based on the figure the structure of a monitoring beam, below the resolution limit of the Systems lies, a so-called spot image. The diameter of the monitoring beam to be imaged is preferably in the micron range. hereby can be guaranteed be that the light cone of the monitoring beam to be imaged the Eingangsapertur of the picture lens outshines, and use it as much as possible illuminated homogeneously.
In einer bevorzugten Ausführungsform der Erfindung wird der Überwachungsstrahl vor der Maske des Laserbearbeitungssystems ausgekoppelt. Hierdurch kann die Maske zur Spot-Bildung des Überwachungsstrahls verwendet werden, es ist keine weitere optische Einheit hierfür notwendig. Außerdem wird dabei der Laserstrahl des Arbeitslasers durch das Auskoppeln des Überwachungsstrahls am wenigsten negativ beeinflusst. Vorzugsweise weist die Maske eine μm-große punktförmige Öffnung auf, durch die der ausgekoppelte Überwachungsstrahl geführt wird, so dass hierdurch der abzubildende Spot gebildet wird.In a preferred embodiment The invention is the monitoring beam decoupled before the mask of the laser processing system. hereby For example, the mask can be used to spot the surveillance beam be, there is no further optical unit necessary for this. Furthermore while the laser beam of the working laser by decoupling the monitoring beam least negatively affected. Preferably, the mask has a μm-sized punctiform opening, through which the decoupled monitoring beam is guided, so that thereby the spot to be imaged is formed.
Der auf das Substrat abgebildete Spot des Überwachungsstrahls wird vom Substrat reflektiert, durchläuft in umgekehrtem Weg das Abbildungsobjektiv und wird von einer dafür vorgesehenen Optikeinheit auf eine Aufnahmeeinheit wie eine CCD-Kamera abgebildet. Vorzugsweise wird der Spot von der Optikeinheit doppelt abgebildet, was Idealerweise durch ein Zylinderlinsen-Array erfolgt. Auf der CCD-Kamera ergeben sich somit als Abbild des Spots des Überwachungsstrahls wenigstens zwei Linien. Der Abstand der Linien ist gemäß dem Shack-Hartmann-Prinzip ein Maß für die Fokusposition des Überwachungsstrahls und damit auch für die Fokusposition des Laserstrahls des Arbeitslasers, wenn beide entsprechend justiert sind.Of the Spot of the monitoring beam imaged on the substrate is detected by the Substrate reflects, passes through in the opposite way the imaging lens and is provided by a designated Optical unit shown on a recording unit such as a CCD camera. Preferably, the spot is duplicated by the optical unit, which is ideally done by a cylindrical lens array. On the CCD camera thus arise at least as an image of the spot of the monitoring beam two lines. The distance of the lines is according to the Shack-Hartmann principle a measure of the focus position the monitoring beam and therefore also for the focus position of the laser beam of the working laser when both adjusted accordingly.
Weitere Einzelheiten und Vorteile der Erfindung ergeben sich aus den Unteransprüchen im Zusammenhang mit der Beschreibung eines Ausführungsbeispiels, das anhand der Zeichnungen eingehend erläutert wird. Es zeigen:Further Details and advantages of the invention will become apparent from the dependent claims In connection with the description of an embodiment based on the drawings explained in detail becomes. Show it:
ein Beleuchtungsmuster
umgeformt wird, welches über
einen Umlenkspiegel
a lighting pattern is formed, which via a deflection mirror
Hierbei
ergibt sich der in
- 11
- Excimer-LaserExcimer laser
- 22
- ultravioletter Laserstrahlultraviolet laser beam
- 33
- optisches Strahlführungssystemoptical Beam guidance system
- 44
- Maskemask
- 55
- Abbildungsobjektivimaging lens
- 66
- Werkstück aus amorphem SiliziumWorkpiece made of amorphous silicon
- 77
- Umlenkspiegeldeflecting
- 88th
- Überwachungslaserstrahlmonitoring laser beam
- 99
- rote LaserdiodeRed laser diode
- 1010
- Strahlteilerbeamsplitter
- 1111
- Optikoptics
- 1212
- CCD-KameraCCD camera
- 1313
- Strahlteilerbeamsplitter
- 1414
- Umlenkspiegeldeflecting
- 1515
- kleines Lochsmall hole
- 1616
- Umlenkspiegeldeflecting
- 1717
- Umlenkspiegeldeflecting
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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DE102006023321A DE102006023321B4 (en) | 2006-05-18 | 2006-05-18 | System for monitoring the focus during processing of a reflective substrate by means of a laser beam |
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DE102006023321A DE102006023321B4 (en) | 2006-05-18 | 2006-05-18 | System for monitoring the focus during processing of a reflective substrate by means of a laser beam |
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DE102006023321A1 true DE102006023321A1 (en) | 2007-11-22 |
DE102006023321B4 DE102006023321B4 (en) | 2011-08-18 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101893751A (en) * | 2010-06-25 | 2010-11-24 | 深圳市大族激光科技股份有限公司 | Focusing lens group and laser processing applied optics system |
DE102013008774B3 (en) * | 2013-05-23 | 2014-09-04 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Analysis device installed in laser processing machine for analyzing laser radiation, has beam sensor that analyzes laser radiation in main beam path, and optical devices that analyzes respective analysis beam aligned on beam sensor |
CN107655422A (en) * | 2017-09-19 | 2018-02-02 | 中国地质大学(武汉) | Nsec resolution ratio recording laser degrades the system and method for thing dynamic change |
CN112222609A (en) * | 2020-09-22 | 2021-01-15 | 中国科学院上海光学精密机械研究所 | Method for positioning high peak power laser focus |
DE102020003944B3 (en) | 2020-06-26 | 2021-07-29 | Rheinmetall Waffe Munition Gmbh | Laser beam device with coupling of an illuminating laser beam into an effective laser beam |
DE102021106492A1 (en) | 2020-06-26 | 2021-12-30 | Rheinmetall Waffe Munition Gmbh | Laser beam device with coupling of an illuminating laser beam into an effective laser beam |
CN114888429A (en) * | 2022-06-10 | 2022-08-12 | 星控激光科技(上海)有限公司 | Device for laser processing of engine flame tube air film hole based on five-axis numerical control machine tool |
Family Cites Families (4)
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EP0459394B1 (en) * | 1990-05-30 | 1995-12-13 | Hitachi, Ltd. | Laser machining apparatus and method of the same |
US5841125A (en) * | 1997-06-06 | 1998-11-24 | Trw Inc. | High energy laser focal sensor (HELFS) |
DE10207535B4 (en) * | 2002-02-22 | 2006-07-06 | Carl Zeiss | Device for processing and measuring an object and method therefor |
DE10301482A1 (en) * | 2003-01-16 | 2004-07-29 | Microlas Lasersystem Gmbh | Process and device to crystallize amorphous semiconductor especially amorphous silicon layers uses at least two successive melting radiation pulses separated by one microsecond |
-
2006
- 2006-05-18 DE DE102006023321A patent/DE102006023321B4/en active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101893751A (en) * | 2010-06-25 | 2010-11-24 | 深圳市大族激光科技股份有限公司 | Focusing lens group and laser processing applied optics system |
DE102013008774B3 (en) * | 2013-05-23 | 2014-09-04 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Analysis device installed in laser processing machine for analyzing laser radiation, has beam sensor that analyzes laser radiation in main beam path, and optical devices that analyzes respective analysis beam aligned on beam sensor |
CN107655422A (en) * | 2017-09-19 | 2018-02-02 | 中国地质大学(武汉) | Nsec resolution ratio recording laser degrades the system and method for thing dynamic change |
DE102020003944B3 (en) | 2020-06-26 | 2021-07-29 | Rheinmetall Waffe Munition Gmbh | Laser beam device with coupling of an illuminating laser beam into an effective laser beam |
DE102021106492A1 (en) | 2020-06-26 | 2021-12-30 | Rheinmetall Waffe Munition Gmbh | Laser beam device with coupling of an illuminating laser beam into an effective laser beam |
CN112222609A (en) * | 2020-09-22 | 2021-01-15 | 中国科学院上海光学精密机械研究所 | Method for positioning high peak power laser focus |
CN114888429A (en) * | 2022-06-10 | 2022-08-12 | 星控激光科技(上海)有限公司 | Device for laser processing of engine flame tube air film hole based on five-axis numerical control machine tool |
CN114888429B (en) * | 2022-06-10 | 2023-07-14 | 星控激光科技(上海)有限公司 | Device for processing flame tube air film hole of engine based on five-axis numerical control machine tool |
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DE102006023321B4 (en) | 2011-08-18 |
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