DE102005062604A1 - Production of an electronic circuit carrier for circuit boards comprises applying a foil for covering a second partial region before a first partial region is processed - Google Patents

Abstract

Production of an electronic circuit carrier comprises applying a foil (13) for covering a second partial region (12) before a first partial region is processed. Independent claims are also included for the following: (1) Processing protection device for the circuit carrier; and (2) Circuit carrier produced by the above process. Preferred Features: The foil is combined with a flat adhesive layer (14). The adhesive layer is applied and then covered with the foil.

Description

State of technology

The The invention is based on a method for producing an electronic Circuit carrier, a finishing protection device of an electronic circuit board as well as a circuit carrier according to the generic terms of the independent Claims.

It It is well known that electronic circuit boards, for example be built on epoxy boards or on ceramic substrates. For specific Setup and connection techniques become active subareas of a surface of the circuit board refined to provide suitable surfaces for bond, Bonding and soldering processes manufacture. In surface finishing Especially wet-chemical processes are used. The inactive ones Subareas that are not ennoble should not be included contact the wet chemicals. Usually, the inactive ones Subareas by applying resistant protective coatings, for example a protective layer of Peterslack, covered.

adversely it is that the application and / or removal of such paint layers each consuming is. In particular, there is the risk that the active subregions contaminated or damaged become. In addition, there is a full area occupancy of the covered Inactive areas with the paint the risk that these surfaces irreversible changed which in turn affects the processability of the inactive ones Can have subareas. The problem is also that by a multiple Application of the protective lacquer layer with intermediate and final drying precisely, several times to be controlled process steps in various facilities in a clean room are required. In addition, at The individual drying steps arise organic outgassing, which the installation of protective devices for drying devices required. In addition, a series production due to the high investment costs for Machinery is only partially profitable. Also the space requirement with the associated room costs is not insignificant.

in addition comes that the purchase cost of the paint as a consumable relative are high. in that the paint contains, for example, PVC (polyvinyl chloride) is also its disposal problematic and associated with high costs.

Advantages of invention

It a method for producing an electronic circuit substrate is proposed, wherein a first portion of the circuit substrate for later arrangement of and / or Connection with electrical components is refined and at least a second sub-sector remains unprocessed, and where before a refining process the first portion of a film to cover the second portion is applied. It is advantageous that the application of the Film can be done by machine, for example, small labeling machines be used. As a result, it is no longer necessary, clearly larger print and use drying facilities, as previously for the protective coating were required. This is especially true in clean room production Cheap, where by the proposed solution an expensive footprint can be saved, so that a space requirement can be reduced can, what a cheap Reduction in room costs brings with it.

In A preferred development is the film with a flat adhesive layer combined. The film-adhesive combination provided thereby becomes, for example used in the labeling technology as a mass product. The achievable with it Series production brings a significant saving on the current Costs with you. In this respect leaves Another cost advantage of investment costs and maintenance achieve. Comes commercially Film material such as PP (polypropylene) or PET (polyethylene terephthalate) used, is expediently in combination with good environmentally friendly adhesive systems one simple and inexpensive disposal or preparation possible.

Becomes the film is detachable attached, an advantageous temporary protection of the second portion can be achieved be, for example a refining process of the active first portion of a surface of the Circuit carrier, to temporarily protect the inactive second partitions during this "plating process" Film is, for example by means of a removable adhesive on the second Part area applied. Possible would be too the application of the film by adhesion. The temporary protection achieved in this way can be used as a substitute for example Peterslack be used, reducing the high cost of purchase of the paint and the costs associated with disposal are saved can.

If the film is firmly joined to the second portion, appropriate durable protection of the back of the substrate or other suitable products can be achieved. For this purpose, a commercially available firmly adhering adhesive can be used in combination with suitable films. Both the film and the adhesive must be sufficiently resistant to the media used, for example, against the chemicals. In addition, occurring forces, for example caused by a temperature influence of the active baths on the film or the cover in the selective bonding, be taken into account in the selection of film and adhesive.

Prefers For example, by means of a suitable foil layout, an adaptation e.g. to a geometry of the substrate or to chemicals used in the plating process respectively. In this respect, depending on demand, either a common Protection of an entire substrate surface from single substrate elements or only a selective protection of the individual substrate elements respectively. If the adhesive layer is applied flat and with the Covered film, the entire substrate surface can be protected. When applying the adhesive layer on selected Areas and extensive coverage The film can be achieved selective protection. Conveniently, the adhesive can be left on the film in the areas where this is not needed becomes.

at a finishing protection device according to the invention an electronic circuit substrate having a first subregion, the later arrangement is refined by and / or connection with electrical components, and with a second subarea, which remains unrefined, is the second portion with a film having at least one adhesive layer covered.

One inventive circuit carrier has to protect a second portion of a film with at least an adhesive layer. The adhesive layer can be over the the whole area extend the film, or only over a selected portion the foil. When the film is applied, the selected subrange is preferably in an edge region of the substrate surface between an adhesive edge and the first portion, the edge portion being predominantly for the general handling during used in the refining process. Advantageously, can the edge area should be dimensioned so that a required sealing width can be produced. This can be done for example by a sufficient huge Distance between an adhesive edge to the medium on the one hand and through one to be protected realized second sub-area within the substrate on the other hand become.

Around an interaction of adhesive and the second subregions, in particular the elements on the back of the substrate, To prevent, the selectively adhesive area can also only between be arranged the individual substrate elements. It is also a mixed form conceivable, i. an arrangement of the adhesive layer in the edge region and between the single substrate elements. It can also be provided that the adhesive layer on the film is covered where no Glue needed or is desired, for example, by inserting or leaving paper or foil on the adhesive layer, for example in the active part of the surface of the circuit board.

All in all let yourself through a suitable combination of foil, adhesive and foil layout an efficient protection of the inactive subregions on the surface of the circuit carrier realize. With little effort can in particular by the inventive solution especially against electrical and electronic components aggressive media such as wet chemicals in plating baths.

drawing

Further Embodiments, Aspects and advantages of the invention are also independent of their summary in claims, without restriction the generality below with reference to one in a drawing illustrated embodiment the invention.

in the Show:

1a . 1b A preferred embodiment of a circuit carrier according to the invention in a view of a substrate back ( 1a ) and on a protected area ( 1b );

2a . 2 B . 2c 4 a view of an embodiment of a finishing protection device with a view onto a contact side of a film (FIG. 2a ), in a transparent representation on the outside of the film in conjunction with a elec tronic circuit carrier ( 2 B ) and a representation of a preferred adhesive layer on the film ( 2c );

3a . 3b . 3c an alternative embodiment according to 2 with a view on the contact side of the film ( 3a ), in a transparent representation on the outside of the film in conjunction with the electronic circuit substrate ( 3b ) and a representation of an alternative preferred adhesive layer on the film ( 3c );

4a . 4b . 4c . 4d a further alternative embodiment according to 2 with a view on the contact side of the film ( 4a ), a cover ( 4b ), in a transparent representation on the outside of the film in conjunction with the electronic circuit substrate ( 4c ) and a representation of an alternative preferred adhesive layer on the film ( 4d ); and

5a . 5b a schematic representation of a circuit carrier in an exploded view ( 5a ) as well as on average ( 5b ).

description the embodiments

Same Elements are denoted the same in the figures.

1 shows an inventive electronic circuit substrate 10 in a view on a contact page ( 1a ) and on an outside ( 1b ). A surface 15 of the circuit board 10 has a first active subarea 11 which is refined in a refining process or "plating process" for the arrangement of and / or connection to electrical components A second inactive subregion 12 the surface 15 remains unprocessed and should not come into contact with the media used during the refining process, for example wet chemicals, in order to avoid contamination or damage. According to the invention, the second subregion 12 during the refining process of the first subarea 11 with a foil 13 covered. In particular, the film 13 with a flat adhesive layer 14 combined, with the adhesive layer 14 can be dimensioned according to demand. Between a glue edge 18 and a substrate 20 is a border area 17 arranged wide enough to produce a required sealing width. The substrate 20 includes single substrate elements 19 ,

The foil 13 For example, it may be releasably secured with a removable adhesive to provide temporary protection for the second portion 12 manufacture. Alternatively, the film 13 also firm with the surface 15 be connected, creating a lasting protection for the substrate 20 will be produced. The area of the substrate to be protected 20 can individual single substrate elements 19 for which selective protection may also be provided. The back side of the substrate is preferred 20 protected while the front is undergoing refining.

In the 2 to 4 In each case alternative embodiments of the solution according to the invention are shown, wherein the 2a . 3a and 4a in each case a view of a contact side of the film 13 show the 2 B . 3b and 4c an outside of the on the circuit board 10 arranged film 13 , wherein in a transparent representation, the substrate 20 with single substrate elements 19 is shown, and the 2c . 3c and 4d a transparent view of the outside of the film 13 , wherein an adhesive layer 14 is illustrated. By a suitable combination of foil 13 , Adhesive layer 14 and slide layout may be an adaptation to the geometry of the substrate 20 or to the chemistry of the respective plating process.

In 2a is the foil 13 shown adhesive over the entire surface, with the adhesive layer 14 applied flat ( 2c ) and the substrate 20 is complete with the foil 13 is covered. It thus becomes a common protection of the entire substrate surface of individual substrate elements 19 achieved.

In the 3 the adhesive layer extends 14 over a selected subarea 16 the foil 13 , and the adhesive layer 14 has a recess 22 on. The adhesive layer 14 and the recess 22 be with the foil 13 covered. There is thus a selective protection of the individual substrate elements 19 achieved. When applied film 13 ( 3b ) is the selected subarea 16 in a border area 17 the surface 15 between a glue edge 18 and the area to be protected with the single substrate elements 19 arranged. An adhesive contact thus exists only in the edge region 17 ( 3c ). Alternatively or additionally, the adhesive layer may also be between the individual substrate elements 19 be arranged to an interaction of adhesive and the individual substrate elements 19 on the substrate back to prevent. The selected subarea 16 is then also between the individual substrate elements 19 arranged.

In 4 is the foil 13 formed over the entire surface adhesive. The adhesive layer 14 thus extends over the entire surface of the film 13 , In areas where no glue is needed or desired, is on the adhesive layer 14 a cover 21 arranged in the form of a paper or a foil ( 4b ). Thus, the entire substrate surface is protected from individual substrate elements 19 , like out 4c is recognizable. However, an adhesive contact is only in the area outside the cover 21 , In 4d this is the edge area 17 which is dimensioned so wide to realize a required sealing width.

5a shows an exploded view of the embodiment according to 4 with a foil 13 , an adhesive layer 14 , which is the same size as the foil 13 , a cover 21 and a back side of a circuit carrier 10 with a surface to protect 15 of the substrate 20 , 5b shows the embodiment according to 4 , where the film 13 in combination with the adhesive layer 14 and the cover 21 on the surface to be protected 15 lies.

Claims (12)

Method for producing an electronic circuit substrate ( 10 ), with a first subregion ( 11 ) of the circuit carrier ( 10 ) is refined for the later arrangement of and / or connection with electrical components and at least a second portion ( 12 ) remains unprocessed, characterized in that before a refining process of the first sub-region ( 11 ) a film ( 13 ) for covering the second subregion ( 12 ) is applied. Method according to claim 1, characterized in that the film ( 13 ) with a flat adhesive layer ( 14 ) is combined. Method according to claim 1 or 2, characterized in that the film ( 13 ) is releasably secured. Method according to claim 1 or 2, characterized in that the film ( 13 ) fixed to the second subregion ( 12 ) is connected. Method according to one of the preceding claims, characterized in that the adhesive layer ( 14 ) is applied flat and with the film ( 13 ) is covered. Method according to one of the preceding claims, characterized in that the adhesive layer ( 14 ) on selected areas, leaving other areas free and large area of the film ( 13 ) is covered. Refining protection device of an electronic circuit board ( 10 ), with a first subregion ( 11 ) of the circuit carrier ( 10 ) and a second subarea ( 12 ) remains unprocessed, characterized in that the second subregion ( 12 ) with a foil ( 13 ) with at least one adhesive layer ( 14 ) is covered. Circuit carrier with a first subregion ( 11 ) and a second subarea ( 12 ), characterized in that for the protection of the second subregion ( 12 ) a film ( 13 ) with at least one adhesive layer ( 14 ) is provided. Circuit carrier according to claim 8, characterized in that the adhesive layer ( 14 ) at least over a selected subregion ( 16 ) of the film ( 13 ). Circuit carrier according to claim 9, characterized in that when the film is applied ( 13 ) the selected subregion ( 16 ) in a peripheral area ( 17 ) between an adhesive edge ( 18 ) and the second subarea ( 12 ) is arranged. Circuit carrier according to claim 10, characterized in that the edge region ( 17 ) is dimensioned so that a required sealing width can be produced. Circuit carrier according to one of claims 8 to 11, characterized in that the selected subregion ( 16 ) between individual substrate elements ( 19 ) is arranged.