DE102005046216A1 - Distributing device used in the photovoltaic industry for sorting silicon wafers comprises an eccentric unit for lifting a wafer/cell via an electric motor drive - Google Patents

Distributing device used in the photovoltaic industry for sorting silicon wafers comprises an eccentric unit for lifting a wafer/cell via an electric motor drive Download PDF

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Publication number
DE102005046216A1
DE102005046216A1 DE102005046216A DE102005046216A DE102005046216A1 DE 102005046216 A1 DE102005046216 A1 DE 102005046216A1 DE 102005046216 A DE102005046216 A DE 102005046216A DE 102005046216 A DE102005046216 A DE 102005046216A DE 102005046216 A1 DE102005046216 A1 DE 102005046216A1
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Germany
Prior art keywords
wafer
sorting
lifting
cell
electric motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102005046216A
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German (de)
Inventor
Rudolf Kesseler
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Hennecke Systems GmbH
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Individual
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Priority to DE102005046216A priority Critical patent/DE102005046216A1/en
Publication of DE102005046216A1 publication Critical patent/DE102005046216A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B65G47/53—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices between conveyors which cross one another
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Distributing device comprises an eccentric unit for lifting a wafer/cell via an electric motor drive. Preferred Features: Take-over belts are also provided for sorting subsequent wafers/cells.

Description

Siliziumwafer werden am Ende einer Produktionslinie gemessen und sortiert. Zum heutigen Zeitpunkt weisen die Wafer in der Photovoltaikindustrie eine Dicke von ca. 300 μm und eine Kantenlänge von max. 210 mm × 210 mm auf. Die Sortierung erfolgt in 5 Klassen, bei einem Platzbedarf von ca. 500 mm/Sortierklasse. Die Sortierung erfolgt zur Zeit durch eine Sortierklappe, die den Wafer, wenn dieser sich auf der Klappe befindet nach unten ausschleust und in eine Styroporbox einsortiert. Die Industrie verlangt das Handling von dünneren Wafern und platzsparenden Anlagen bei steigender Qualitätsvielfalt.silicon wafer are measured and sorted at the end of a production line. To the Today, the wafers point in the photovoltaic industry a thickness of about 300 microns and an edge length of Max. 210 mm × 210 mm up. The sorting takes place in 5 classes, with a space requirement of approx. 500 mm / sorting class. The sorting takes place at the moment a sorting flap that holds the wafer when it's on the flap located downwards and sorted into a styrofoam box. The industry demands the handling of thinner wafers and space-saving Plants with increasing quality diversity.

1.2 Aufbau und Vorteile der Erfindung:1.2 Structure and advantages the invention:

Die Sortierung erfolgt quer zur Transportrichtung durch Anliften eines Querbandes, wenn der Wafer/Zelle sich mittig zentriert über dem Querband befindet. Die Lifteinheit wird über einen Elektromotor mit Exenterantrieb nach oben befördert, wodurch eine sehr sanfte Bewegung erzielt wird. Dies ermöglicht auch die Sortierung von sehr dünnen Scheiben. Das Querband kann durch einen Elektromotorantrieb beidseitig angetrieben werden, wodurch eine platzsparende Ausschleusung in beide Querrichtungen zur Transportrichtung erzielt wird. Der Platzbedarf reduziert sich hierdurch erheblich.The Sorting takes place transversely to the transport direction by lifting a Transverse band, when the wafer / cell is centered over the center Cross strap is located. The lift unit is powered by an electric motor with eccentric drive transported to the top, whereby a very gentle movement is achieved. This also allows the sort of very thin Slices. The cross belt can be driven by an electric motor drive on both sides be driven, creating a space-saving discharge in both transverse directions to the transport direction is achieved. The space requirement This reduces considerably.

Durch die neuartige Anordnung der Lifteinheit ist es möglich, die Lücke zwischen 2 Wafern/Zellen zu minimieren.By The novel arrangement of the lift unit makes it possible to bridge the gap between 2 wafers / cells to minimize.

Claims (6)

Anliften des Wafers/Zelle über einen Elektromotorantrieb mit Exenter (ermöglicht schnelles Handling von dünnen Scheiben ohne Bruchgefahr durch sanftes Beschleunigen um Abbremsen im Nullpunkt).Lifting the wafer / cell via an electric motor drive with eccentric (allows fast handling of thin Discs without risk of breakage by gently accelerating to decelerate at zero). Beidseitiges Ausschleusen ohne vergrößerte Lücke zwischen 2 Wafern/Zellen durch Übereinanderschieben der Wafer/Zellen (ermöglicht kompakten Aufbau und höheren Durchsatz).Two-sided discharge without enlarged gap between 2 wafers / cells by sliding over each other the wafer / cells (allows compact construction and higher Throughput). Schnelle Umkehrung der Laufrichtung des QuertransportweichenbandesFast reversal of the running direction of the cross transfer point band Übernahmebänder hinter Sortierweiche mit jeweils eigenem Antrieb ermöglicht die Sortierung zweier nachfolgender Wafer/Zelle ohne größere Lücke.Transfer tapes behind Sorting point, each with its own drive, allows the sorting of two subsequent wafer / cell without large gap. Vor dem eigentlichem Liftvorgang kann der Vorwärtsantrieb über eine Rapenfunktion gestoppt werden (wenn sich der Wafer/Zelle mittig zentriert über dem Querband befindet) und das Querband auch über eine Rampenfunktion gestartet werden. Hierdurch wird ein reibungsfreier Sortiervorgang erzielt.Before the actual lifting process, the forward drive on a Rapeseed function are stopped (when the wafer / cell in the middle centered over the transverse band) and the transverse band also started via a ramp function become. This achieves a frictionless sorting process. Die Querbänder können ebenfalls gestoppt werden um den Wafer/Zelle auszurichtenThe transverse bands can also be stopped to align the wafer / cell
DE102005046216A 2005-09-28 2005-09-28 Distributing device used in the photovoltaic industry for sorting silicon wafers comprises an eccentric unit for lifting a wafer/cell via an electric motor drive Withdrawn DE102005046216A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102005046216A DE102005046216A1 (en) 2005-09-28 2005-09-28 Distributing device used in the photovoltaic industry for sorting silicon wafers comprises an eccentric unit for lifting a wafer/cell via an electric motor drive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005046216A DE102005046216A1 (en) 2005-09-28 2005-09-28 Distributing device used in the photovoltaic industry for sorting silicon wafers comprises an eccentric unit for lifting a wafer/cell via an electric motor drive

Publications (1)

Publication Number Publication Date
DE102005046216A1 true DE102005046216A1 (en) 2007-03-29

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010063263A1 (en) * 2008-12-01 2010-06-10 Grenzebach Maschinenbau Gmbh Method and device for fully automatically selecting and packing photovoltaic modules
ITUD20090156A1 (en) * 2009-09-03 2011-03-04 Applied Materials Inc SUBSTRATI PROCESSING DEVICE INCLUDING A DEVICE FOR THE MANIPULATION OF DAMAGED SUBSTRATES
DE202011000071U1 (en) * 2011-01-12 2012-04-17 Usk Karl Utz Sondermaschinen Gmbh Transport system for particular plate-shaped workpieces such as wafers / solar cells and the like
DE102011001646A1 (en) * 2011-03-29 2012-10-18 Ksl-Kuttler Automation Systems Gmbh Device for transverse- and forward transportation of wafers in intermediate station of wafer processing, has longitudinal transport band and rubber rolling element that is driven over circumference of longitudinal transport band
CN104022182A (en) * 2014-05-29 2014-09-03 浙江矽盛电子有限公司 Production control and sorting method of silicon chips
CN106219186A (en) * 2016-08-31 2016-12-14 江苏启澜激光科技有限公司 The jacking transmitting device of semi-finished product photovoltaic module
EP3514825A1 (en) 2018-01-22 2019-07-24 Hennecke Systems GmbH Wafer sorting apparatus
DE102018112706A1 (en) * 2018-05-28 2019-11-28 Hennecke Systems Gmbh Wafer train and method for conveying wafers
EP3758074A4 (en) * 2018-02-24 2021-11-24 Eging Photovoltaic Technology Co., Ltd Automated wafer separating equipment for solar cells

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010063263A1 (en) * 2008-12-01 2010-06-10 Grenzebach Maschinenbau Gmbh Method and device for fully automatically selecting and packing photovoltaic modules
US9379661B2 (en) 2008-12-01 2016-06-28 Grenzebach Maschinenbau Gmbh Method and device for fully automatically selecting and packing photovoltaic modules
ITUD20090156A1 (en) * 2009-09-03 2011-03-04 Applied Materials Inc SUBSTRATI PROCESSING DEVICE INCLUDING A DEVICE FOR THE MANIPULATION OF DAMAGED SUBSTRATES
DE202011000071U1 (en) * 2011-01-12 2012-04-17 Usk Karl Utz Sondermaschinen Gmbh Transport system for particular plate-shaped workpieces such as wafers / solar cells and the like
DE102011001646A1 (en) * 2011-03-29 2012-10-18 Ksl-Kuttler Automation Systems Gmbh Device for transverse- and forward transportation of wafers in intermediate station of wafer processing, has longitudinal transport band and rubber rolling element that is driven over circumference of longitudinal transport band
CN104022182A (en) * 2014-05-29 2014-09-03 浙江矽盛电子有限公司 Production control and sorting method of silicon chips
CN106219186A (en) * 2016-08-31 2016-12-14 江苏启澜激光科技有限公司 The jacking transmitting device of semi-finished product photovoltaic module
EP3514825A1 (en) 2018-01-22 2019-07-24 Hennecke Systems GmbH Wafer sorting apparatus
WO2019142032A1 (en) 2018-01-22 2019-07-25 Hennecke Systems Gmbh Wafer sorting apparatus
CN110065795A (en) * 2018-01-22 2019-07-30 亨内克系统有限责任公司 Chip sorting device
CN110065795B (en) * 2018-01-22 2022-10-21 梅耶博格有限责任公司 Wafer sorting equipment
EP3758074A4 (en) * 2018-02-24 2021-11-24 Eging Photovoltaic Technology Co., Ltd Automated wafer separating equipment for solar cells
DE102018112706A1 (en) * 2018-05-28 2019-11-28 Hennecke Systems Gmbh Wafer train and method for conveying wafers
DE102018112706B4 (en) * 2018-05-28 2021-03-04 Hennecke Systems Gmbh Wafer line and method for conveying wafers

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