DE102005032741A1 - Production process for organic LED component, such a component and an active matrix organic LED display and production process - Google Patents

Abstract

A production process for an organic LED (OLED) comprises placing a pixel element (120) on a substrate (110) followed by an organic light-emitting material (131) and a second pixel element (134). An organic thin film transistor (151-154) is applied to a second substrate (160) and a conductive contact (140) applied to an electrode of the transistor or the second pixel electrode. This electrode is connected to the drain (151) of the transistor through the conductive contact (140) to firmly join the two substrates. Independent claims are also included for the following: (A) An OLED component; (B) An active matrix display;and (C) A method of making an active matrix display.

Description

The The invention relates to an OLED device, an active matrix OLED display and a process for their preparation.

One essential aspect in the manufacture of flat screens the cost factor. The aim of many manufacturers is to provide high quality Realizing displays based on low cost processes. A promising approach for new display technologies is the use of organic light emitting diodes (OLED) with organic thin-film transistors (OTFT) for active control.

Currently A variety of drive circuits are used to form active matrix OLED displays (AMOLED displays). The OLEDs are based on short-chain molecules or long-chain molecules (Polymer). The existing active matrix pixel circuits are based on inorganic silicon transistors or on organic transistors (OTFT). In the term organic thin film transistors (organic thin film transistor - OTFT) the term "organic" preferably refers to the organic semiconductor material used. Therefore are also transistors meant, in addition to organic semiconductor materials also inorganic Materials or combinations of both materials. Preferably It uses materials that process from solution leave and need low process temperatures.

Kodak ( EP 0 717 445 ) describes an active matrix display with organic electroluminescent pixels. Samsung Electronics (WO 2003/071511) describes an AMOLED display with vertically stacked capacitors to increase the fill factor of the display. In the above-mentioned devices, the transistors of the driving circuits are always arranged next to the display elements, resulting in a small filling factor.

The pixel circuits used are often based on n-channel or p-channel MOSFETs. Polycrystalline, amorphous or monocrystalline silicon is used. Basic structures (two-transistor circuits) are for example off US 6,157,356 known. These inorganic transistor technologies disadvantageously require expensive semiconductor manufacturing processes.

Farther are display technologies, such as electrophoretic, electrochromic or liquid crystal displays known, which can be operated with an organic transistor matrix. From WO99 / 53371 a display is known, which encapsulated display media, the controlled by OTFTs.

Basically, transistors with carrier mobilities of about 1 to 10 cm ² / Vs are currently required to operate OLED displays. The charge carrier mobilities of the best organic transistors are currently around 5cm ² / Vs. With these transistors, OLED displays could be manufactured in the near future. The use of organic transistors has the advantage that low-temperature processes and direct-structuring technologies, such as the ink-jet printing technique, can be used to fabricate the OTFT substrates (ie, substrates having the OTFT functional layers). This allows a significant reduction in production costs. Circuit fabrication methods for electro-optic devices using inkjet technology are known, for example, from WO 2003/098696.

The Use of OTFT switching or driver elements for OLED displays is already out of some publications known.

WHERE 2003/056640 presents a display architecture in the OLED and OTFT are arranged on the same substrate. The OLED is under arranged the OTFT. Because of the sensitive OLED materials are the processes for OTFT production is limited (e.g., low temperatures only possible; the means a limited OTFT material selection).

WHERE 99/54936 describes an integrated circuit with a semiconducting one Polymer material for the switching element. The organic display element is directly on the electrode of the switching element (TFT) attached.

EP 1 246 244 describes an active matrix display with OLEDs. A vertical TFT structure such as the static induction transistor (SIT) can be used. The TFT and the display element may share the same electrode and are disposed on the same substrate.

little one OTFT OLED pixel circuits based on short-chain Pentacene material are from M. Kitamura, APL Vol. 83, No. 16, 2003-10-20 known.

was standing The technique of OTFT OLED pixel architectures is that the OLEDs on the same substrate as the OTFTs are applied. The OLED pixel is either over, processed under or next to the OTFT on the same substrate.

by virtue of of the above the manufacturing processes for OTFTs and OLEDs take place one after the other. OTFT and OLEDs can disadvantageously not be manufactured and tested at the same time.

Farther is created an elevated Space required for the OTFTs, if they are arranged next to the OLEDs. A lower one fill factor is the consequence.

Especially However, it is disadvantageous that according to the known production methods for OTFT-based Active matrix OLED displays only a limited selection of manufacturing processes to disposal stands. OLED and OTFT manufacturing processes can be Negatively affect each other when OLED and OTFT on the same Substrate are produced. There are some high-temperature processes for the OLED required (e.g., for a pixel definition layer by baking a lacquer layer or by the application of a common OLED pixel electrode Sputtering). These processes can the organic material of the (previously applied) OTFTs damage, which would result in a degradation of the TFT performance.

US 6,091,194 describes an active matrix display in which the OLED material is disposed between an upper substrate and a lower substrate. The lower substrate contains the switching elements, but on the outer surface of the substrate. As a result, an additional electrical through hole in the lower substrate is needed for the connection of the switching units to the inner contact. In the case of using organic transistors, additional encapsulation is required to protect the OTFT against moisture, oxygen and dust.

US 2002/0079494 describes an AM-OLED display based on conventional TFTs and a production method with a stacking architecture. The electrical connection between the transistors and the OLEDs is realized by an anisotropic conductive film, the said Area covers. He must be completely compatible with the materials used be. An extensive substrate preparation process is included required (conductive Between the support surface and applying a conductive Survey). The actual process of assembling the OLEDs and OTFTs is also expensive, e.g. Vacuum, heat, pressure or UV light are required. There are neither organic transistors nor inkjet technologies used. Disadvantageously, an additional protective layer for the OLED necessary.

It is therefore an object of the present invention, an active matrix display indicate based on organic light emitting diodes and an OLED device, which by means of a thin-film transistor structure are actively controllable and in which the functional layers of OLED component as well as the functional layers of the OTFT component (thin-film transistor) can be produced and tested simultaneously. This should the production time for the inventive OLED devices can be reduced compared to the prior art. Farther should the components of the invention or the display according to the invention cost-effective as components / displays according to the prior art produced be. In particular, only low-temperature processes to Manufacture of the device / display may be required.

These Tasks are achieved by the features of the claims 1 (method), 9 (OLED component), 19 (active matrix OLED display) and 20 (method). Preferred embodiments of the invention are in the subclaims contain.

• – Aufbringen einer ersten Pixelelektrode auf ein erstes Substrat,
• – Aufbringen von organischem, lichtemittierendem Material auf die erste Pixelelektrode,
• – Aufbringen einer zweiten Pixelelektrode auf das organische lichtemittierende Material,
• – Aufbringen einer organischen Dünnfilmtransistorstruktur auf ein zweites Substrat,
• – Aufbringen eines elektrisch leitenden Kontaktes auf eine Elektrode (Drainelektrode) der organischen Dünnfilmtransistorstruktur oder auf die zweite Pixelelektrode und
• – Verbinden der zweiten Pixelelektrode mit der Elektrode (Drainelektrode) der organischen Dünnfilmtransistorstruktur über den leitenden Kontakt, wobei die beiden Substrate (mit dem darauf angeordneten OLED-/OTFT-Funktionsschichten) dauerhaft miteinander verbunden werden.

The idea of the invention is to build the individual pixels of an active matrix display, which have an active drive circuit with at least one organic thin-film transistor (OTFT) and a display element (OLED), on two separate substrates and these components (OTFT substrate and OLED substrate) then join together. According to the invention, the method for producing an OLED component comprises the following method steps:

• Applying a first pixel electrode to a first substrate,
• Applying organic light-emitting material to the first pixel electrode,
• Applying a second pixel electrode to the organic light-emitting material,
• Depositing an organic thin-film transistor structure on a second substrate,
• - Applying an electrically conductive contact on an electrode (drain electrode) of the organic thin film transistor structure or on the second pixel electrode and
• - Connecting the second pixel electrode to the electrode (drain electrode) of the organic thin film transistor structure via the conductive contact, wherein the two substrates (with the OLED / OTFT functional layers disposed thereon) are permanently connected to each other.

In a preferred embodiment, a conductive epoxy is used as the electrically conductive contact, which is applied by means of a dispensing technology. In an alternative embodiment, the electrically conductive contact is a dried suspension of metallic particles used, which is applied by means of ink jet printing and dried. In a further, alternative embodiment variant, a conductive rubber is used as the electrically conductive contact.

Conductive epoxy are metal-containing (e.g., silver), electrically conductive 2-component adhesives on an epoxy basis. Generally suitable as an electrically conductive contact all based on metal or carbon containing adhesive materials of epoxies, acrylates, urethanes or silicones.

To the Printing is particularly suitable aqueous or organic solvents based metal-containing solutions or suspensions (inks) consisting of: metal compounds ionic compounds or complex compounds.

The Action of elevated Temperature after printing leads to the destruction of the Bindings and thus to a conductivity of the metal layer (or coated metal nanoparticles). The polymer shell of these particles becomes under temperature influence destroyed the printing process, causing a sintering of the material and thus a conductivity the layer is caused. The following metals may be preferred can be used: Ag, Au, Pt, Pd, Cu, Ni.

conductive rubber preferably consist of alternating layers of more electrically conductive and non-conductive, closely spaced lamellae. conductive rubber offer a cost effective, quick solution, because conductive rubber strip only between OTFT substrate and OLED substrate must be positioned. A soldering, Gluing or printing can be omitted within the active display area. Further Advantages of this solution are corrosion resistant and a vibration and shock absorbing Effect. Material for Conductive rubber is generally silicone.

Of the electrically conductive contact covers only part of the OLED / OTFT electrodes (or the OLED / OTFT functional layers). Preferably covers the electrically conductive contact ranges between 1% and 50% the corresponding pixel area (whose size (lateral Dimensions), for example, by the pixel electrodes or a Pixel definition layer is set). In a particularly preferred variant the electrically conductive contact covers a range between 1% and 25% of the corresponding pixel area. In a further preferred Design variant covers the electrically conductive contact ranges between 5% and 20% the corresponding pixel area from.

The Advantages of the materials preferably used for the electrical conductive contact (epoxy, conductive ink, conductive rubber) in that these materials are flexible at the moment of their processing are what beneficial for the joining of the Substrates is. Slight substrate unevenness could thus be compensated. Simple metal contacts do not show this property. Epoxy and ink can be cost-effective Direct structuring procedures, such as dispensing technology or printing apply to the substrate. For all three materials (epoxy, conductive ink, conductive rubber) is in contrast to metal contacts no mask technology or photolithography required.

Preferably Low temperature processes are used to produce the organic semiconductor materials for OTFT and process OLED. The organic light-emitting materials for the Component (or the display) can both from short-chain molecules as well as organic polymers. Thermal evaporation processes or solution-based Process technologies, e.g. the ink-jet printing technique or spinning techniques, can used to apply the OLED materials to the first substrate (OLED substrate). These methods can be used in addition to other direct structuring methods can also be used to the transistor layers on the OTFT substrate (second substrate) cost applied.

hereby it is advantageously possible that OTFT substrate (second substrate) and the OLED substrate (first substrate) to produce separately. Subsequently can both substrates (with the functional layers on top) together become.

to Connection of the first substrate (OLED substrate) on which the first Pixel electrode, the light emitting material, and the second pixel electrode are arranged, with the second substrate (OTFT substrate), on the the organic thin film transistor structure are arranged, are preferably drops of a pasty, conductive epoxy directly on the drain electrode of the organic thin film transistor structure for Formation of an electrically conductive contact filed and the Both substrates are subsequently aligned and placed on top of each other.

To avoid damaging the sensitive organic functional layers by environmental influences such as air or moisture, it is provided in a preferred embodiment variant that the enclosed by the two substrates interior is encapsulated. The two substrates (each having the OTFT or OLED functional layers) are aligned and placed on top of each other so that all the functional layers for the OLED and the OTFT are located in the enclosed space of both substrates. The encapsulation of the interior is preferably realized by an encapsulation adhesive applied in the edge region of the substrates. For this purpose, the two substrates preferably have the same dimensions. Preferably, spacers are positioned in the edge region of the substrates prior to the application of the encapsulation adhesive in order to be able to permanently ensure the desired spacing of the two substrates. Preferably, spacers made of glass or plastic are used. The spacers can remain permanently on the display or be removed. It is also advantageous to interfere with small spacers in the encapsulant to ensure a defined distance of the substrates.

The inventive OLED device has a first substrate, a first pixel electrode, light emitting Material, a second pixel electrode, an organic thin film transistor structure and a second substrate, wherein the organic thin film transistor structure a source electrode, a drain electrode, an organic semiconductor, an insulator and a gate electrode, wherein between the Drain electrode of the organic thin film transistor structure and the second pixel electrode is an electrically conductive contact is arranged. The electrically conductive contact is preferably a conductive one Epoxy, a dried suspension of metallic particles or a conductive rubber. The electrically conductive contact preferably has Dimensions in the μm range (e.g., a few μm) to mm range (e.g., a few mm). Preferably, the between the substrates enclosed interior of the device an encapsulation on, which is arranged in the edge region of the substrates. In a special preferred embodiment spacers are arranged between the substrates in their edge regions. In a further preferred embodiment are between the first pixel electrode and the light-emitting material a Pixel definition layer and a hole transport layer arranged. The first pixel electrode preferably forms the anode and the second one Pixel electrode from the cathode. Preferably, the organic Thin film transistor structure additionally a storage capacitor on.

• – Aufbringen einer Schichtstruktur mit einer Vielzahl von ersten Pixelelektroden auf ein erstes Substrat,
• – Aufbringen von organischem, lichtemittierendem Material auf jede der Vielzahl von ersten Pixelelektroden,
• – Aufbringen einer Vielzahl von zweiten Pixelelektroden auf das organische lichtemittierende Material,
• – Aufbringen einer Vielzahl von organischen Dünnfilmtransistoren auf ein zweites Substrat und Aufbringen jeweils eines elektrisch leitenden Kontaktes auf jede der Drainelektroden der organischen Dünnfilmtransistoren oder auf jeweils jede zweite Pixelelektrode und
• – Verbinden jeweils einer zweiten Pixelelektrode mit jeweils einer Drainelektrode der organischen Dünnfilmtransistoren über jeweils einen leitenden Kontakt, wobei die beiden Substrate dauerhaft miteinander verbunden werden.

Analogous to the OLED component according to the invention, an active matrix display consists of a large number of OLED components, which are preferably arranged in the form of a matrix. The process for producing the active matrix OLED display comprises the following process steps:

• Applying a layer structure having a multiplicity of first pixel electrodes to a first substrate,
• Applying organic light-emitting material to each of the plurality of first pixel electrodes,
• Applying a plurality of second pixel electrodes to the organic light-emitting material,
• Depositing a plurality of organic thin film transistors on a second substrate and respectively applying an electrically conductive contact to each of the drain electrodes of the organic thin film transistors or to each second pixel electrode and
• - Each connecting a second pixel electrode, each having a drain electrode of the organic thin-film transistors via a respective conductive contact, wherein the two substrates are permanently connected to each other.

The inventive method, which the OTFT structure and the OLED structure initially on two different Apply substrates (first and second substrate) and these two Substrate subsequently by means of an electrically conductive contact permanently connected, has the advantage that no additional Passivation layers for protecting the OLED or OTFT structures (as is necessary in the preparation on only one substrate) is necessary are. Preferably, the plurality of OLED devices are on the first one Substrate and the plurality of OTFT elements on the second substrate in matrix form arranged, with the individual OTFT elements as well as the individual OLED elements have the same distance to adjacent elements. Another advantage is that in addition to the aforementioned encapsulation (in the edge region of both substrates) no further encapsulation of the Displays or the component is required. Both OLED substrate (first substrate) and OTFT substrate (second substrate) act as encapsulation and protect the organic functional layers against moisture, oxygen and other harmful ones Particles. Only in the edge region of the two substrates still has one Encapsulation can be realized. In contrast, at the Production of a conventional OLED device or a conventional one Active matrix OLED displays an additional encapsulation layer necessary, which not only captures the peripheral areas.

A further advantage of the method according to the invention is that the yield in the production process can be increased by the separate production of OLED and OTFT substrate and the possibility of separate functional testing, since only functional sub-substrates (first substrate and second substrate) are joined together. Furthermore, cost effective direct patterning techniques such as inkjet printing technology can be used to fabricate the OTFTs, the OLEDs and the interconnection between OLED and OTFT substrates. The OLED functional layers can (After joining the substrates) are positioned according to the invention directly over the OTFT functional layers, whereby a large filling factor can be achieved. Since the light is preferably radiated through the OLED substrate (first substrate), the second substrate (OTFT substrate) may preferably be made of inexpensive, non-transparent material such as metal, ceramic or plastic. A further advantage of the separate processing of the OTFT substrate and OLED substrate is that no high-temperature processes (such as can be used, for example, for the production of the pixel definition layer or the application of the common OLED pixel electrodes) are required on the OTFT substrate. Such processes could damage the organic material of the OTFT, which would result in degradation of the TFT performance. Due to the separate processing, protective layers or passivation layers can be avoided.

The Invention will be described below with reference to FIGS Embodiments explained in more detail. It demonstrate:

1a FIG. 2 shows a sectional view of an active matrix OLED display according to the invention before the two substrates are joined together, FIG.

1b FIG. 2 shows a sectional view of an active matrix OLED display according to the invention after joining the two substrates, FIG.

2 FIG. 2 shows a sectional, schematic illustration of an OLED component according to the invention, FIG.

3 : A schematic representation of the drive circuit for the OLED device according to the invention when using a transistor, and

4 : A schematic representation of a drive circuit for the OLED device according to the invention when using two transistors.

To produce an active matrix OLED display according to the invention, first the OLED substrate 110 (first substrate) and the OTFT substrate 160 (second substrate) processed separately from each other. On the OLED substrate 110 , which may consist of glass or plastic, for example, all OLED functional layers, ie the first pixel electrode 120 as well as the other OLED functional layers 130 (for example, a pixel definition layer, a hole transport layer, light emitting material, and a second pixel electrode), see 1a , In addition, on the OTFT substrate 160 (second substrate) per pixel a complete thin-film transistor structure 150 applied. Such a thin film transistor structure 150 consists for example of a source electrode, a drain electrode, an organic semiconductor material (channel), an insulating layer and a gate electrode. The two substrates 110 and 160 with the functional layers on top 120 . 130 . 150 can advantageously be processed separately and simultaneously, but also one after the other. The following will apply to each thin film transistor structure 150 a senior contact 140 applied. As a senior contact 140 For example, a conductive epoxy, conductive ink or conductive rubber is preferably used. In the case of a conductive epoxy, drops of the pasty conductive epoxy are respectively deposited on the drain electrode of the thin film transistor structure 150 filed and subsequently become the two substrates 110 . 160 aligned and hung up ( 1b ). In the case of using conductive ink, reference is made to the drain electrodes of the individual thin-film transistor structures 150 conductive ink is applied by means of an ink jet printer. The curing of the conductive ink takes place after joining the two substrates 110 . 160 below room temperature, elevated temperature or UV light. In the case of using a conductive rubber, this is at the desired points, preferably directly on the electrodes of the individual thin-film transistors 150 applied and fixed. Subsequently, the two substrates are connected to each other ( 1b ). The substrates 110 . 160 are always connected so that the respective OLED and OTFT functional layers 120 . 130 . 150 within the space enclosed by the substrates, ie on the inside of the substrates 110 . 160 are located.

Let's use a continuous, unstructured first electrode layer 120 For example, the individual pixels of the active matrix display can be replaced by using an insulating pixel definition layer (layer 131 ) are structured (consisting of source and drain electrode 151 , organic semiconductor 152 , Gate insulator 153 and gate electrode, ( 2 ). The individual layers of the individual thin-film transistors 150 (consisting of source and drainelectode 151 , organic semiconductors 152 , Gate insulator 153 and gate electrode 154 ) and the individual OLEDs (consisting of the first pixel electrode 120 , Pixel definition layer 131 , Hole transport layer 132 , light-emitting material 133 and second pixel electrode 134 ) are applied by thermal evaporation in a high vacuum. Shadow masks serve for structuring. In the present case, the senior contact 140 on the drain electrode 151 applied. Alternatively, it is also possible that the senior contact 140 to next to the electrode layer 134 is applied and then the two substrates 110 . 160 be joined together.

One possible drive circuit for a one-transistor pixel circuit is shown in FIG 3 shown schematically. The display is addressed line by line by selecting the selected activation line 30 with a negative voltage (eg -20 V) is activated. The switching transistor 33 is turned on and a negative data voltage on the data line 31 (eg -30 V), the OLED display element 36 turn on and will continue to be the capacitor 32 charge. The common OLED anode connection cable 37 and non-activated lines of the active matrix display are switched to ground. The storage capacitor 32 stores the OLED supply voltage for the OLED display element 36 during the entire drive cycle. The refresh rate for such a display can be between 10 Hz and 200 Hz.

4 shows a basic circuit of a two-transistor pixel circuit, which can also be used for the OLED device according to the invention or an active matrix OLED display according to the invention. Unlike the in 3 As shown, this circuit consists of a switching transistor 33 and a driver transistor 35 that supplies the OLED power.

The The invention is not limited to a two-transistor design. Also can other pixel circuits with more transistors or more capacitors used to realize the idea of the present invention.

30

activation line

31

data line

32

storage capacitor

33

switching transistor

34

Supply voltage connection

35

driver transistor

36

OLED display element

37

common OLED electrodes connecting cable

100

light

110

OLED substrate

120

first pixel electrode

130

OLED functional layers (except first pixel electrode)

131

Pixel defining layer

132

Hole transport layer

133

light emitting material

134

second pixel electrode

140

electrical Leading connection

150

Thin film transistor structure

151

Source electrode / drain electrode

152

organic semiconductor

153

gate insulator

154

gate electrode

160

OTFT substrate

170

Verkapselungskleber

Claims (20)

Method for producing an OLED component with the following method steps: application of a first pixel electrode ( 120 ) on a first substrate ( 110 ), - application of organic light-emitting material ( 133 ) to the first pixel electrode ( 120 ), - applying a second pixel electrode ( 134 ) to the organic light-emitting material ( 133 ), - applying an organic thin-film transistor structure ( 150 ) on a second substrate ( 160 ), - applying an electrically conductive contact ( 140 ) on an electrode of the organic thin film transistor structure ( 150 ) or on the second pixel electrode ( 134 ), - connecting the second pixel electrode ( 134 ) with the drain electrode ( 151 ) of the organic thin film transistor structure ( 150 ) via the executive contact ( 140 ), the two substrates ( 110 . 160 ) are permanently connected. Method according to claim 1, characterized in that as electrically conductive contact ( 140 ) a conductive epoxy is used which is applied by means of a dispensing technology. Method according to claim 1, characterized in that as electrically conductive contact ( 140 ) a dried suspension of metallic particles is used, which is applied by means of ink jet printing and dried. Method according to claim 1, characterized in that as electrically conductive contact ( 140 ) a conductive rubber is used. A method according to claim 1 or 2, characterized in that for the connection of the first substrate ( 110 ) on which the first pixel electrode ( 120 ), the light-emitting material ( 133 ) and the second pixel electrode ( 134 ) are arranged with the second substrate ( 160 ) on which the organic thin-film transistor structure ( 150 ), directly on the drain electrode ( 151 ) of the organic thin film transistor structure ( 150 ) Drops of pasty, conductive epoxy to form an electrically conductive contact ( 140 ) and the two substrates ( 110 . 160 ) and placed on top of each other. Method according to one of the preceding Claims, characterized in that by the two substrates ( 110 . 160 ) Enclosed interior is encapsulated for protection against environmental influences. A method according to claim 6, characterized in that the encapsulation of the interior by a in the edge region of the substrates ( 100 . 160 ) applied encapsulation adhesive ( 170 ) is realized. A method according to claim 7, characterized in that before applying the encapsulating adhesive ( 170 ) Spacers in the edge region of the substrates ( 100 . 160 ). OLED device with a first substrate ( 110 ), a first pixel electrode ( 120 ), light-emitting material ( 133 ), a second pixel electrode ( 134 ), an organic thin film transistor structure ( 150 ) and a second substrate ( 160 ), wherein the organic thin-film transistor structure ( 150 ) a source electrode ( 151 ), a drain electrode ( 151 ), an organic semiconductor ( 152 ), an isolator ( 153 ) and a gate electrode ( 154 ), characterized in that between the drain electrode ( 151 ) of the organic thin film transistor structure ( 150 ) and the second pixel electrode ( 134 ) an electrically conductive contact ( 140 ) is arranged. OLED device according to claim 9, characterized in that the electrically conductive contact ( 140 ) consists of a conductive epoxy, a dried suspension of metallic particles or a conductive rubber. OLED device according to claim 9 or 10, characterized in that the electrically conductive contact ( 140 ) Has dimensions between 1 μm and 10 mm. OLED device according to one of claims 9 to 11, characterized in that between the substrates ( 100 . 160 ) enclosed interior of the device encapsulation ( 170 ), which in the edge region of the substrates ( 100 . 160 ) is arranged. OLED device according to claim 12, characterized in that between the substrates ( 100 . 160 ) are arranged in the common edge region spacers. OLED device according to one of claims 9 to 13, characterized in that between the first pixel electrode ( 120 ) and the light-emitting material ( 133 ) a pixel definition layer ( 131 ) and / or a hole transport layer ( 132 ) are arranged. OLED device according to one of Claims 9 to 14, characterized in that the first pixel electrode ( 120 ) the anode and the second pixel electrode ( 134 ) forms the cathode. OLED device according to one of claims 9 to 15, characterized in that the component additionally comprises a storage capacitor ( 32 ) having. OLED device according to one of Claims 9 to 16, characterized in that the first pixel electrode ( 120 ), the light-emitting material ( 133 ), the second pixel electrode ( 134 ), the source electrode ( 151 ), the drain electrode ( 151 ), the organic semiconductor ( 152 ), the insulator ( 153 ) and the gate electrode ( 154 ) between the first substrate ( 110 ) and the second substrate ( 160 ) are arranged. OLED device according to one of claims 9 to 17, characterized in that the electrically conductive contact ( 140 ) covers a range between 1% and 50% of the corresponding pixel area. Active matrix OLED display characterized by a Variety of OLED devices according to at least one of the claims 9 to 18. Method for producing an active matrix OLED display with the following method steps: application of a layer structure having a multiplicity of first pixel electrodes ( 120 ) on a first substrate ( 110 ), - application of organic light-emitting material ( 133 ) on the first pixel electrodes ( 120 ), - application of second pixel electrodes ( 134 ) to the organic light-emitting material ( 133 ), - applying a structure of a plurality of organic thin-film transistors ( 150 ) on a second substrate ( 160 ), - applying in each case an electrically conductive contact ( 140 ) each have a drain electrode ( 151 ) of the organic thin film transistors ( 150 ) or on a respective second pixel electrode ( 134 ), - each connecting a second pixel electrode ( 134 ) each having a drain electrode ( 151 ) of the organic thin film transistors ( 150 ) via a respective conductive contact ( 140 ), the two substrates ( 110 . 160 ) are permanently connected.