DE102004038280A1 - Process for refining and homogeneously distributing alloying partners and removing unwanted reaction products and slags into or from soft solders in the production of superlattice powder - Google Patents
Process for refining and homogeneously distributing alloying partners and removing unwanted reaction products and slags into or from soft solders in the production of superlattice powder Download PDFInfo
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- DE102004038280A1 DE102004038280A1 DE102004038280A DE102004038280A DE102004038280A1 DE 102004038280 A1 DE102004038280 A1 DE 102004038280A1 DE 102004038280 A DE102004038280 A DE 102004038280A DE 102004038280 A DE102004038280 A DE 102004038280A DE 102004038280 A1 DE102004038280 A1 DE 102004038280A1
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- reaction products
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- melt
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C11/00—Alloys based on lead
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F2009/065—Melting inside a liquid, e.g. making spherical balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/086—Cooling after atomisation
- B22F2009/0864—Cooling after atomisation by oil, other non-aqueous fluid or fluid-bed cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Abstract
Description
Die Erfindung betrifft ein Verfahren zum Raffinieren und homogenen Verteilen von Legierungspartnern sowie Entfernen unerwünschter Reaktionsprodukte wie Oxide und/oder Schlacken in bzw. aus Weichloten beim Herstellen von Feinstlotpulver, bei dem die Lotlegierung in einem hochtemperaturbeständigen pflanzlichen und/oder tierischen Öl aufgeschmolzen, die Schmelze in eine weitere Ölvorlage mit einer Temperatur von mindestens 20°C oberhalb der Liquidustemperatur verbracht, dort gerührt und einer mehrfachen Scherbehandlung durch Rotoren und Statoren zum Bilden einer aus Lotkugeln und Öl bestehenden Dispersion unterworfen wird, von der die Lotkugeln mittels anschließender Sedimentation abgeteilt werden.The The invention relates to a process for refining and homogeneous spreading from alloying partners as well as removing unwanted reaction products such as Oxides and / or slags in or from soft solders during manufacture from Feinstlotpulver, wherein the solder alloy in a high temperature resistant vegetable and / or animal oil melted the melt into another oil original with a temperature of at least 20 ° C spent above the liquidus temperature, stirred there and a multiple shearing treatment by rotors and stators to make one consisting of solder balls and oil Dispersion is subjected, separated from the solder balls by means of subsequent sedimentation become.
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Dieses bekannte bleifreie Weichlot verhält sich beginnend ab 214°C eutektisch, unterdrückt die Ausbildung von großen Zinndentriden, gewährleistet nach dem Aufschmelzen eine glatte und homogene Oberfläche und hat auch gute physikalische und chemische Eigenschaften wie beispielsweise eine sehr gute Benetzungsfähigkeit, hohe Wechselfestigkeit, eine gute Korrosionsbeständigkeit, Plastizität und Zähigkeit und auch einen geringen elektrischen Widerstand.This known lead-free soft solder behaves starting at 214 ° C eutectic, suppressed the education of big ones Tin dendrene, guaranteed after Melting a smooth and homogeneous surface and also has good physical and chemical properties such as a very good wetting ability, high resistance to change, good corrosion resistance, plasticity and toughness and also a low electrical resistance.
Die Erschmelzung der Legierung und auch die Verarbeitung dieser bekannten Legierung zu Feinstlotkugeln führt jedoch insbesondere durch die sehr hohe Reaktivität der Legierungsbestandteile Lanthan oder Neodym zu ernsten Problemen, die sich in einer Agglomeration von Reaktionsprodukten des Neodyms oder Lanthans in den Lotkugeln äußern. Neodym reagiert äußerst heftig, beispielsweise auch mit gebundenem Restsauerstoff in der Schmelze, der in Spuren immer vorhanden ist, und bildet Oxide, die in den Lotkugeln außerdem zu größeren Gebilden agglomerieren. Diese Oxide akkumulieren verhältnismäßig viel Neodym, das dann in der Matrix bzw. den Korngrenzen fehlt. Des weiteren können intermetallische Phasen der Zusammensetzung Ag3Sn und Cu6Sn5 auftreten.However, the melting of the alloy and also the processing of this known alloy to ultrafine ball leads in particular by the very high reactivity of the alloy components lanthanum or neodymium to serious problems that manifest themselves in an agglomeration of reaction products of neodymium or lanthanum in the solder balls. Neodymium reacts very violently, for example, with bound residual oxygen in the melt, which is always present in traces, and forms oxides, which also agglomerate in the solder balls to larger structures. These oxides accumulate relatively much neodymium, which then lacks in the matrix or grain boundaries. Furthermore, intermetallic phases of the composition Ag 3 Sn and Cu 6 Sn 5 can occur.
Die Verarbeitungsfähigkeit und die elektrischen Eigenschaften derartiger Weichlote werden durch diese harten Einschlüsse nachhaltig eingeschränkt.The processability and the electrical properties of such soft solders are these hard inclusions permanently restricted.
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Bei diesem Stand der Technik liegt der Erfindung die Aufgabe zugrunde, die Reaktion der reaktiver Legierungspartner mit Sauerstoff, Stickstoff und anderen Reaktionspartnern bei der Verarbeitung von bleifreien Weichlotlegierungen zu Feinstlotpulvern sicher zu verhindern, eine Agglomeration der Reaktionsprodukte in der Matrix der Lotkugeln zu vermeiden und die Legierungspartner feindispers und homogen in der Matrix der Lotkugeln zu verteilen.at In this prior art, the object of the invention is to provide the reaction of the reactive alloying partners with oxygen, nitrogen and other reactants in the processing of lead-free Soft Solder Alloys to Safely Prevent Solder Powders Agglomeration of the reaction products in the matrix of solder balls to avoid and the alloying partners finely dispersed and homogeneous in distribute the matrix of solder balls.
Diese Aufgabe wird durch ein Verfahren der eingangs genannten Gattung mit den Merkmalen des Anspruches 1, 10 und 11 gelöst.These Task is by a method of the type mentioned with the features of claim 1, 10 and 11 solved.
Vorteilhafte Ausgestaltungen des Verfahrens sind den Unteransprüchen entnehmbar.advantageous Embodiments of the method are the dependent claims.
Die erfindungsgemäße Lösung zeichnet sich dadurch aus, dass das zum Aufschmelzen des Lots eingesetzte Öl sowohl ein inertes Medium gegenüber den Legierungspartnern, beispielsweise Lanthan oder Neodym, in Weichlotlegierungen als auch ein Trennmedium zum Herauslösen der in der Lotlegierung enthaltenen Reaktionsprodukte wie Oxide und/oder Schlacken darstellt.The inventive solution draws characterized in that the oil used to melt the solder both an inert medium over the Alloying partners, for example lanthanum or neodymium, in soft solder alloys as well as a separation medium for dissolving out in the solder alloy contained reaction products such as oxides and / or slags.
Das erfindungsgemäße Verfahren gestattet es ferner, die Legierungspartner in der Lotlegierung gewissermaßen zu raffinieren und diese homogen sowie feindispers in der Legierung zu verteilen. Die komplexe Problematik dieser Vorgänge soll dadurch verdeutlicht werden, dass die abgescherten Lotkugeln selbst Dimensionen aufweisen, die dem Strukturaufbau der Elemente sehr nahe kommen.The inventive method also makes it possible, as it were, to refine the alloying partners in the solder alloy and distribute them homogeneously and finely dispersed in the alloy. The complex problem of these processes is thereby clarified be that the sheared solder balls themselves have dimensions, which are very close to the structure of the elements.
Durch das Herauslösen der mit dem Erschmelzungsprozeß oder der Verarbeitung dieser Lote zur Herstellung von Feinstlotpulvern gebildeten Oxideinschlüsse der Lanthanoide oder anderer reaktiver Metalle und der nachteiligen Schlacken gelingt die Bereitstellung eines Feinstlotpulvers, das alle Ansprüche für die Mikrokontaktierung erfüllt.By the dissolution the one with the fusion process or the processing of these solders for the production of Feinstlotpulvern formed oxide inclusions lanthanides or other reactive metals and the detrimental Slags succeed in providing a Feinstlotpulvers, the all claims for the Micro contacting fulfilled.
Weitere Vorteile und Einzelheiten ergeben sich aus der nachfolgenden Beschreibung unter Bezugnahme auf die beigefügten Zeichnungen.Further Advantages and details will become apparent from the following description with reference to the attached Drawings.
Die Erfindung soll nachstehend an einem Ausführungsbeispiel näher erläutert werden.The Invention will be explained in more detail below using an exemplary embodiment.
Es zeigen:It demonstrate:
Mit dem erfindungsgemäßen Verfahren sollen Feinstlotkugeln der bleifreien Legierung SnAg5Cu1In1Nd0,2 mit einem Durchmesser von 5 bis 15 μm (Typ 6) hergestellt werden.With the method according to the invention Superlead balls of the lead-free alloy SnAg5Cu1In1Nd0,2 with a diameter of 5 to 15 microns (type 6) are produced.
Die
Die Oxid-Einschlüsse haben einen Schmelzpunkt von 2.272°C, eine Dichte von 7,29 g/cm3 und sind hart, nicht duktil und spröde. Das Oxid akkumuliert außerdem verhältnismäßig viel elementares Neodym, so dass dieses an den Korngrenzen fehlt, wodurch die Temperaturwechselfestigkeit der Lötstellen durch Risse und schnelle Rissfortpflanzung negativ beeinflusst wird.The oxide inclusions have a melting point of 2,272 ° C, a density of 7.29 g / cm 3, and are hard, brittle and non-ductile. In addition, the oxide accumulates relatively much elemental neodymium so that it lacks the grain boundaries, thereby negatively affecting the thermal fatigue strength of the solder joints by cracks and rapid crack propagation.
Die Einschlüsse führen dann in der Lötverbindung zu Unterbrechungen und zu Unregelmäßigkeiten in den elektrischen Eigenschaften, so dass ein solches Lot für die Mikrokontaktierung nicht mehr besonders gut geeignet ist.The inclusions to lead then in the solder joint to interruptions and irregularities in the electrical Properties, so that such a solder for micro-contacting is not more particularly well suited.
Die
Hierzu werden 12 kg der bleifreien Lotlegierung SnAg5Cu1In1Nd0,2 als Massel oder Stange in einem mit 3 Liter Rizinusöl gefüllten Schmelzbehälter gegeben und das Öl zum Aufschmelzen der Lotlegierung auf mindestens 20°C oberhalb der Liquidustemperatur der Lotlegierung, beispielsweise 240°C, erhitzt. Das Öl verhält sich gegenüber dem Lot anaerob und schließt die Lotschmelze vollkommen gegenüber der Atmosphäre ab. Aus der Lotschmelze werden die Neodymoxide beim Aufschmelzen freigesetzt. Diese treiben infolge ihrer gegenüber der Schmelze geringeren Dichte in dem Öl auf und reichern sich dort innerhalb von 2 Stunden bis zum Erreichen der Prozeßtemperatur der Anlage an. Das Öl fungiert somit nicht nur als Wärmeträger und Dispergiermittel, sondern auch als Trennmedium.For this be 12 kg of the lead-free solder alloy SnAg5Cu1In1Nd0,2 as a pig or rod in a melt container filled with 3 liters of castor oil and the oil for melting the solder alloy to at least 20 ° C above the liquidus temperature of the solder alloy, for example 240 ° C, heated. The oil behave opposite the anaerobic and closes the Lot the molten solder completely opposite the the atmosphere from. From the molten solder, the neodymium oxides are melted released. These drive due to their lower compared to the melt Density in the oil and accumulate there within 2 hours to reach the process temperature the plant. The oil thus acts not only as a heat transfer medium and dispersant, but also as a separation medium.
Die verbleibende Lotschmelze wird durch ein Düsensystem in eine weitere Ölvorlage aus Rizinusöl abgelassen und somit von den ausgeschiedenen Verunreinigungen getrennt. Die Temperatur dieses Öls liegt ebenfalls mindestens 20°C über der Liquidustemperatur der Lotlegierung. Die Lotschmelze gelangt in einen Dispergierreaktor, in dem die Lotschmelze einer Scherbehandlung durch mit einer Umfangsgeschwindigkeit von 23 m/s an Statoren vorbeilaufenden Rotoren unterworfen wird, so dass die Lotschmelze in kleine Lotkugeln geteilt wird, wodurch eine Oberflächenvergrößerung der Schmelze auf das 2.500fache erfolgt und bisher eingeschlossene Verunreinigungen freigesetzt werden. Die abgeteilten Lotkugeln werden zusammen mit dem Öl mehrfach, d.h. mindestens 20mal im Kreislauf durch den Dispergierreaktor gefahren, bis die gewünschte Durchmesserverteilung der Lotkugeln erreicht wird und zugleich restliche Verunreinigungen aus der Lotschmelze ausgetrieben werden. Beim Dispergieren des Lots wird mit einem Volumenverhältnis von Lot zum Öl von 1:20 bis 1:50 und einer Dispergierzeit von 16 Minuten gearbeitet.The remaining molten solder is discharged through a nozzle system into another oil template of castor oil and thus separated from the excreted impurities. The temperature of this oil is also at least 20 ° C above the liquidus temperature of the solder alloy. The molten solder passes into a dispersing reactor in which the solder melt is subjected to a shearing treatment by rotors passing stators at a peripheral speed of 23 m / s so that the solder melt is divided into small solder balls, whereby the surface area of the melt is increased to 2,500 times and previously trapped impurities are released. The divided solder balls are repeatedly, together with the oil, ie at least 20 times circulated through the dispersing reactor until the desired diameter distribution of the solder balls is achieved and at the same time remaining impurities are expelled from the molten solder. When dispersing the solder is with a volume ratio of solder to the oil of 1:20 to 1:50 and a dispersion time of 16 minutes worked.
Nach Ablauf dieser Zeit wird das disperse Lotkugel-Öl-Gemisch in einen Absetzbehälter gegeben, wo die abgescherten Lotkugeln im Öl erstarren und sedimentieren. Die beim Dispergieren ausgeschiedenen Verunreinigungen sammeln sich infolge ihrer geringeren Dichte gegenüber dem Lot im Öl an. Öl und Verunreinigungen werden abgesaugt und damit von den Lotkugeln getrennt.To Expiration of this time, the disperse Lotkugel oil mixture is placed in a settling tank, where the sheared solder balls solidify in the oil and sediment. The precipitated during dispersion impurities accumulate due to their lower density compared to the solder in the oil. Oil and impurities are sucked off and thus separated from the solder balls.
Die
Claims (11)
Priority Applications (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004038280A DE102004038280B4 (en) | 2004-08-03 | 2004-08-03 | Process for the production of ultrafine powder |
TW094124734A TW200609072A (en) | 2004-08-03 | 2005-07-21 | Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder |
EP05076782A EP1623791B1 (en) | 2004-08-03 | 2005-07-27 | Procédé de raffinage et de répartition homogène de composants d'alliage, ainsi que d'élimination de produits de réaction indésirés et de scories dans un alliage de soudure tendre, lors de la production de poudre de soudure fine. |
AT05076782T ATE445478T1 (en) | 2004-08-03 | 2005-07-27 | METHOD FOR REFINING AND HOMOGENEOUSLY DISTRIBUTING ALLOY PARTNERS AS WELL AS REMOVAL OF UNDESIRABLE REACTION PARTNERS AND SLOGS IN OR FROM SOFT SOLDER IN PRODUCING FINE SOLDER POWDER |
PL05076782T PL1623791T3 (en) | 2004-08-03 | 2005-07-27 | Procédé de raffinage et de répartition homogène de composants d'alliage, ainsi que d'élimination de produits de réaction indésirés et de scories dans un alliage de soudure tendre, lors de la production de poudre de soudure fine. |
DK05076782.1T DK1623791T3 (en) | 2004-08-03 | 2005-07-27 | Process for refining and homogeneous distribution of alloy components, as well as removing unwanted reaction products and slag from a solder alloy, respectively, during production of brazed solder powder |
ES05076782T ES2332918T3 (en) | 2004-08-03 | 2005-07-27 | PROCEDURE FOR REFINING AND DISTRIBUTING HOMOGENEALLY COMPONENTS OF AN ALLOY, AND ELIMINATING REACTION PRODUCTS INDESATED AND ESCORIES IN OR PROCEDURES OF SOFT WELDING IN THE MANUFACTURE OF VERY FINE WELDING POWDER. |
SI200530849T SI1623791T1 (en) | 2004-08-03 | 2005-07-27 | Procede de raffinage et de repartition homogene de composants d'alliage, ainsi que d'elimination de produits de reaction indesires et de scories dans un alliage de soudure tendre, lors de la production de poudre de soudure fine. |
DE502005008305T DE502005008305D1 (en) | 2004-08-03 | 2005-07-27 | Process for refining and homogeneously distributing alloying partners and removing unwanted reactants and slags in or from soft solders in the production of ultrafine powder |
PT05076782T PT1623791E (en) | 2004-08-03 | 2005-07-27 | Procédé de raffinage et de répartition homogène de composants d`alliage, ainsi que d`élimination de produits de réaction indésirés et de scories dans un alliage de soudure tendre, lors de la production de poudre de soudure fine. |
US11/193,758 US7331498B2 (en) | 2004-08-03 | 2005-07-28 | Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder |
KR1020050070763A KR101243283B1 (en) | 2004-08-03 | 2005-08-02 | Method for refining and homogeneously distributing alloy-partners in soft solders as well as for removing undesirable reaction product and slags from soft solders while producing the finest soldering powder |
JP2005224205A JP2006045676A (en) | 2004-08-03 | 2005-08-02 | Method for refining and uniformly distributing alloy component, and removing undesired reaction product and sludge from soft solder at the time of producing fine solder |
CN200510023009A CN100574940C (en) | 2004-08-03 | 2005-08-03 | The method for preparing fine solder power |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004038280A DE102004038280B4 (en) | 2004-08-03 | 2004-08-03 | Process for the production of ultrafine powder |
Publications (2)
Publication Number | Publication Date |
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DE102004038280A1 true DE102004038280A1 (en) | 2006-02-23 |
DE102004038280B4 DE102004038280B4 (en) | 2006-07-27 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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DE102004038280A Expired - Fee Related DE102004038280B4 (en) | 2004-08-03 | 2004-08-03 | Process for the production of ultrafine powder |
DE502005008305T Active DE502005008305D1 (en) | 2004-08-03 | 2005-07-27 | Process for refining and homogeneously distributing alloying partners and removing unwanted reactants and slags in or from soft solders in the production of ultrafine powder |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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DE502005008305T Active DE502005008305D1 (en) | 2004-08-03 | 2005-07-27 | Process for refining and homogeneously distributing alloying partners and removing unwanted reactants and slags in or from soft solders in the production of ultrafine powder |
Country Status (13)
Country | Link |
---|---|
US (1) | US7331498B2 (en) |
EP (1) | EP1623791B1 (en) |
JP (1) | JP2006045676A (en) |
KR (1) | KR101243283B1 (en) |
CN (1) | CN100574940C (en) |
AT (1) | ATE445478T1 (en) |
DE (2) | DE102004038280B4 (en) |
DK (1) | DK1623791T3 (en) |
ES (1) | ES2332918T3 (en) |
PL (1) | PL1623791T3 (en) |
PT (1) | PT1623791E (en) |
SI (1) | SI1623791T1 (en) |
TW (1) | TW200609072A (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI465312B (en) * | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | A replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath |
DE102006047764A1 (en) * | 2006-10-06 | 2008-04-10 | W.C. Heraeus Gmbh | Lead-free soft solder with improved properties at temperatures> 150 ° C |
DE202006015429U1 (en) * | 2006-10-09 | 2008-02-21 | Innowatec Dipl.-Ing. Grieger & Englert Gmbh & Co. Kg | Device for cleaning a printing cylinder |
JP4375485B2 (en) * | 2008-02-22 | 2009-12-02 | 日本ジョイント株式会社 | Lead-free solder alloy manufacturing method and semiconductor device manufacturing method |
JP4375491B1 (en) | 2008-06-23 | 2009-12-02 | 日本ジョイント株式会社 | Electronic component soldering apparatus and soldering method |
JP4485604B1 (en) * | 2009-02-09 | 2010-06-23 | 日本ジョイント株式会社 | Manufacturing method, manufacturing apparatus, and solder alloy for tin or solder alloy for electronic parts |
WO2010089905A1 (en) * | 2009-02-09 | 2010-08-12 | 日本ジョイント株式会社 | Process and apparatus for producing tin or solder alloy for electronic part and solder alloy |
CN103221164B (en) | 2010-11-18 | 2016-06-15 | 同和控股(集团)有限公司 | The manufacture method of solder powder and solder powder |
CN104178655B (en) * | 2013-05-21 | 2016-06-01 | 西南科技大学 | A kind of middle temperature alloy solder containing rare earth La and its preparation method |
CN106271216A (en) * | 2016-08-31 | 2017-01-04 | 邓柳平 | A kind of nonhygroscopic welding powder and preparation method thereof |
CN107442965A (en) * | 2017-08-11 | 2017-12-08 | 东北大学 | A kind of Sn Bi serial alloy welding powder and preparation method thereof |
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SE8801894D0 (en) * | 1988-05-20 | 1988-05-20 | Alfa Laval Agri Int | FIBRONECT BINING PROTEIN |
JP2555715B2 (en) * | 1988-10-26 | 1996-11-20 | 三菱マテリアル株式会社 | Manufacturing method of solder alloy fine powder |
US5411602A (en) | 1994-02-17 | 1995-05-02 | Microfab Technologies, Inc. | Solder compositions and methods of making same |
US6231691B1 (en) * | 1997-02-10 | 2001-05-15 | Iowa State University Research Foundation, Inc. | Lead-free solder |
DE19830057C1 (en) * | 1998-06-29 | 2000-03-16 | Juergen Schulze | Method and device for the pressure-free production of soft solder powder |
US6517602B2 (en) * | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
JP2003166007A (en) * | 2001-03-28 | 2003-06-13 | Tamura Kaken Co Ltd | Method for manufacturing metal fine-particle, substance containing metal fine-particle, and soldering paste composition |
EP1453636B1 (en) | 2001-12-15 | 2006-08-02 | Pfarr Stanztechnik Gmbh | Lead-free soft solder |
JP2003268418A (en) | 2002-03-19 | 2003-09-25 | Tamura Kaken Co Ltd | Method for manufacturing metal powder |
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2004
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2005
- 2005-07-21 TW TW094124734A patent/TW200609072A/en unknown
- 2005-07-27 DE DE502005008305T patent/DE502005008305D1/en active Active
- 2005-07-27 DK DK05076782.1T patent/DK1623791T3/en active
- 2005-07-27 ES ES05076782T patent/ES2332918T3/en active Active
- 2005-07-27 EP EP05076782A patent/EP1623791B1/en active Active
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- 2005-07-27 AT AT05076782T patent/ATE445478T1/en active
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DE502005008305D1 (en) | 2009-11-26 |
PT1623791E (en) | 2009-12-29 |
CN100574940C (en) | 2009-12-30 |
US7331498B2 (en) | 2008-02-19 |
DE102004038280B4 (en) | 2006-07-27 |
CN1817508A (en) | 2006-08-16 |
ES2332918T3 (en) | 2010-02-15 |
SI1623791T1 (en) | 2010-02-26 |
KR101243283B1 (en) | 2013-03-13 |
TW200609072A (en) | 2006-03-16 |
EP1623791A3 (en) | 2007-08-22 |
DK1623791T3 (en) | 2010-03-01 |
EP1623791B1 (en) | 2009-10-14 |
PL1623791T3 (en) | 2010-06-30 |
TWI317671B (en) | 2009-12-01 |
KR20060049046A (en) | 2006-05-18 |
ATE445478T1 (en) | 2009-10-15 |
JP2006045676A (en) | 2006-02-16 |
EP1623791A2 (en) | 2006-02-08 |
US20060208042A1 (en) | 2006-09-21 |
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