DE102004020642A1 - Cooling device for electronic microprocessors operates with a gravity cooling element with a flow of liquid expanding during heating and a radiator for contracting liquid - Google Patents

Abstract

A cooling device (CD) operates by means of a cooling element (1), in which flow required for operating the CD is generated by bubbling up liquids that expand during heating. The CD also operates by means of a radiator (2), in which the flow for operating the CD is also generated by falling off as contracting liquids cool down. An independent claim is also included for a cooling system for a computer with a main processor and a graphics card processor.

Description

A. General description

The The invention relates to a device for cooling electronic components, preferably for cooling of microprocessors.

It is conventional It is known that the processors used in computers have a not inconsiderable Develop heat. The heat development and operation of the processors are in an immediate and compelling connection. To protect against overheating of these components is a cooling indispensable component for the proper functioning of the computer system. It is known and corresponds to the state of the art, especially for high-performance computers special cooling problems occur. The field of application of the invention is therefore a relevant one and necessary area when using computers.

It is more common Prior art that cooling of electronic components, in particular in computer systems Air fan systems is made. Here are thermally conductive cooling elements with the heating surfaces brought in contact with the components and the heat dissipated with blowers.

newer Developments in computer systems exist in the use of cooling systems using water cooling.

The technical construction of conventional water cooling systems is solved which promotes a pump water through the heat sink and thereby the waste heat of Main processor and other heat sources. Then arrives the liquid through hoses to a water / air heat exchanger, called in the following radiator. His pipes and possibly with it heat up the connected fins yourself. cooler Air is streaming, usually by means of additional Fan, through the radiator and takes over a part of the heat energy. The cycle closes yourself by the cooled Water back to Pump flows.

disadvantage the air cooling by means of fans are the relatively high noise and the due the low specific heat capacity of the air limited efficiency. Fan consume energy and constitute a technical weak point. In case of failure or failure, the system may overheat and damage the hardware cause.

The The object of the invention is to provide cooling for electronic components create that meets the technical requirements and noiseless and reliable is working. Furthermore, the invention is based on the object, a simple and inexpensive cooling system to give, which works without energy consumption and so the application of computer systems for optimized the consumer.

The The object is achieved in that a liquid cooling under Use of physical properties of fluids by thermodynamic effective components is used. For cooling, a uniform, closed and easy to install system developed.

According to the invention Accordingly, a so-called gravity cooling is used.

at gravity cooling are the components according to the thermodynamically necessary requirements designed to use the effect of the rotation of the cooling liquid on the principle of gravity to be able to without a pump being used.

Cooler and Radiators are newly developed and have a special, on the Field of application defined form. The cooling system is also through a special arrangement of all components marked.

Cables, Cable cross-sections, cable routing, Compounds and the amount of liquid are for the Gravity principle defines and differs significantly from all conventional pump based Systems.

When coolant is named in the following water, which due to its high specific heat capacity and the low cost benefits. Water is only here an example, but according to the invention also other coolants be used.

The principle of gravity cooling can be described using the example of water cooling as follows (see 1 ):
In the cooler 1 The energy through heat transfer and heat conduction from the electronic component to be cooled 5 transferred to the water. The water expands when heated and reduces its density. It rises as a result of the lesser Ge weight of resulting lift.

The shape of the radiator must allow the warmer water to rise and exit at the top of the heat sink. That from the radiator 2 coming cooler water enters as possible at the lower end of the radiator to ensure the maximum buoyancy. The operation of the radiator can be further improved with inserts that prevent circulation within the radiator.

Of the Cooling circuit thus reaches without the help of circulating pumps (forced convection) in circulation.

Via cables 3 The heated water enters the radiator. There is a heat transfer from the water to the radiator, a heat conduction in the radiator and a heat transfer to the surrounding air instead.

Of the Radiator supported by its construction also the principle of gravity. The heated water get as possible up in the radiator and cool off. This increases the density and water decrease due to the higher weight downward. By one possible size height and one down running water supply within the radiator the effect is optimized.

to further increase the cooling capacity the radiator can do this with cooling plates and possibly an additional one Fan be equipped.

The cooled Water occurs as possible at the bottom of the radiator and passes through lines back to the heat sink.

There the flow rate in the gravity system is lower than in cooling systems with pumps, The cable cross-section is increased and ensured many times over so the necessary Water changes.

Since, in order to allow circulation, no air in the cooling circuit may be and the relatively large amount of water expands more when heated, a venting device and an expansion vessel are advantageous. These functions may be from a filler neck, preferably at the highest point of the system 4 , in which a sufficiently large air space for pressure equalization should be available, be adopted. Ideally, for optimal venting, all lines are provided with a slight slope from the lowest point of the cooling circuit to the breather.

A cooling other components such as those used in computers e.g. Graphics card, motherboard, power supply or drives by integration of further heat sink in the cooling circuit, by connecting additional coolers to the same radiator or separate cooling circuits above-mentioned Principle. Thus, a silent cooling of a complete computer system (electrical equipment) without additional power consumption be achieved.

in this connection enough it, in every refrigeration cycle only at least one thermodynamically effective cooler and at least one thermodynamically effective radiator. Thus, other components such as e.g. a video card will be cooled by integrating additional heat sinks even then if the construction of the computer thermodynamically effective execution of this additional Heat sink not allows. The first thermodynamically effective radiator and thermodynamically effective radiator generated flow enough here for the operation of this additional Cooling elements.

The Radiators according to the invention can directly in the case be mounted by electrical equipment. To hold the Radiators come well-known connecting means such. screws Springs, clamps, clamps or tape for use. For better Dissipation of heat but it has proven itself the radiators outside the housing to be placed.

meaningful appears e.g. the mounting on the outer sides of the housing of Computers. With double-walled, watertight execution, the Side panels of computer housings visually appealing be used as a radiator.

The Outside dimensions of the heat sink can be used for a cost effective installation to the dimensions of standard heat sinks or the respective component (for example, the motherboard).

advantageously, are the cooling units with the to be cooled detachably connected to electronic components. Thus, if necessary, the component can be replaced (e.g. Gear up or defect). The detachable Connection should have an intimate thermal contact between component and coolers to ensure. This may possibly with thermal grease or Wärmeleitpads be improved.

at certain arrangement of the components and appropriate dimensioning and shape of the radiator can if necessary, several components are cooled with a cooling device.

Of the necessary thermal contact can also be achieved by using this of heat conducting elements such as. Heatpipes, Peltier elements and Wärmeleitblechen be formed.

to Mounting the radiator known connecting means such as e.g. Screws, springs, clamps or adhesive tape for use.

From a use of different noble metals should be avoided because the water triggers electrolytes and it oxidizes the of less noble metal.

to Prevention of corrosion can the coolant Corrosion protection additives added become. Likewise, the cooling effect by special coolant with higher Heat capacity as water or Additives are improved.

at Use of plastic hoses comes it causes water loss in the long term due to diffusion, so that the system has reserves feature and easy to fill should be.

following The invention is based on an embodiment as a cooling device for the main processor and the graphics card of a computer system using drawings explained in more detail.

The painting 2 and 3 show in a schematic representation in detail:
When in the 2 and 3 The arrangement shown is the reference numeral 1 a total, according to the invention, thermodynamically effective cooling unit. The reference number 2 is an inventive, thermodynamically effective radiator associated with a total.

The 4 and 5 put the cooling unit 1 in detail

The cooling unit 1 includes a rectangular hollow body with the dimensions of approximately 83 × 68 × 40 mm (H × W × D) adapted to the standard dimensions of an Intel Pentium 4 cooler for ease of mounting. The cooler according to the invention 1 This is like conventional standard heatsink attached by means of clips releasably on the motherboard and is in direct surface contact with the component to be cooled 5 (here main processor). The contact surface is additionally provided with thermal compound.

The dimensions and shape of the radiator 1 may vary depending on the application, but in order to ensure thermodynamic effectiveness, it is only necessary to ensure that sufficient warming and warming water is available for ascending.

ever the heat is better in the cooler distributed and the higher the water rises during the heating process can, the more effective the cooler generates the necessary flow. As a material is therefore preferably copper with a thickness of 3 mm as suggested.

Designs in other materials are also possible, but should at least the one with the component to be cooled 5 in flat, thermal contact standing (s) surface (s) made of a good heat conducting material.

In order to improve the dissipation of heat from the component surface and the heat distribution in the radiator, which is with the component to be cooled 5 in flat, thermal contact side wall as a cooling plate 13 designed with an increased material thickness of suggestive 8 mm. (See also 4 and 5 )

As with the component to be cooled 5 in flat, thermal contact side wall 13 the heat sink heated more than that of the component 5 opposite side 14 , it can be used in simple, hollow heat sinks ( 6 and 7 ) come due to the principle of gravity to a circulation of the cooling liquid in the heat sink. (See also 6 and 7 )

The coolant on the warmer side wall 13 expands stronger and rises.

On the opposite side 14 it comes to a cooling due to heat transfer to the air surrounding the radiator. The coolant loses heat and sinks.

The resulting rotation 15 the coolant in the radiator has the desired effect of vertical flow through the radiator 16 counter and reduces the desired formation of the coolant flow into the radiator in or out 17 ( 5 and 7 ).

To prevent circulation of the coolant within the radiator, an insert is inserted inside the radiator 9 placed, which favors the directed vertical flow of the radiator ( 4 and 5 ).

Preferably, this use 9 made of a good heat-conducting material and thus supports the advantageous heat distribution within the heat sink.

It has also proved to be advantageous to use in good thermal contact with the component to be cooled 5 in flat, thermal contact side wall 13 bring to. When running all side walls of the radiator in good heat conducting materials is a good thermal Contact of these elements with the insert also advantageous.

At the top and bottom of the cooling unit 1 In each case, a pipe stub of approx. 20 mm length and an inner diameter of approx. 10 mm is mounted watertight. These are used to attach the pipes leading to the radiator 2 or further heat sinks ( 2 and 3 ).

For example, the attachment of the cables 3 by simply pushing on smooth pipe stub and possibly locking done by hose clamps. Here, however, numerous other options such as threads, plug systems, etc. can be applied. The design of these compounds also depends on the shape, the diameter and the material of the lines 3 , The connections in computer systems are advantageously easy and reliable to lock and easily detachable to allow the replacement of components.

however also rigid compounds such as e.g. Glued, soldered or welded joints, especially if the pipes are also made of metal, are in certain cases conceivable.

To ensure easy installation and high flexibility, it has proven to be advantageous to the lines 3 made of plastic. It is important to ensure sufficient thermal stability.

Through the pipes 3 The heated water enters the radiator 2 , This consists in the selected cost-effective design of a multi-curved copper tube 8th with a thickness of about 1 mm and an inner diameter of about 10 mm. This has the advantage that the connecting lines 3 on the same simple principle as the cooler 1 can be attached.

By means of cooling fins 7 which with the pipe 8th are in thermal contact and increase the contact surface with the air, the heat transfer to the air is improved. The water cools, contracts and sinks downwards due to the higher density until it finally leaves the radiator at the lowest point.

to better dissipation of heat the radiator will be outside on the housing side of the computer. The dimensions are with suggestion 400 × 400 × 40 mm (H × W × T) the dimension of the side surfaces more common Tower Chassis oriented. The lines pass through holes to the inside the case located heat sinks.

to Holder of the radiators are known connecting means such. Screws, springs, clamps, or clamps for use.

At the highest point of the pipe 8th , which at the same time represents the highest point of the entire pipeline system, is the deaerator 4 on a tee branching upwards 17 attached. This allows the system to be easily filled and the air to escape easily and completely.

The deaerator is made of copper pipe 18 manufactured with an inner diameter of approx. 40 mm ( 8th ) Its height is about 50 mm. At the top is the tube 18 provided with an external thread on which a matching cap 19 with integrated seal 20 is screwed watertight. With this design, the breather also fulfills the function of a surge tank, however, the level should be only slightly above the bottom of the breather in the cold state that the water expands when heated and there should always be enough air to compress in the breather / expansion tank.

From the radiator 2 the cooled water flows over lines 3 to the radiator 10 the graphics card 12 ( 2 and 3 ). This one is like cooler 1 designed as a rectangular hollow body with the above-mentioned pipe stubs. Due to the construction-related horizontal position of the graphics card processor to be cooled 6 , this heat sink is performed in the selected example as not thermally effective. Water inlet and outlet are at the same level, so there is no effective resulting buoyancy path available to the warming water. The first thermodynamically effective cooler 1 and the thermodynamically effective radiator 2 generated flow is sufficient for the operation of this additional cooler 10 , Because the processor 6 the graphics card 12 usually far less waste heat than the main processor 5 produces, this cooler is 10 as a simple hollow body (without inserts) with the dimensions of about 30 × 40 × 30 (H × W × D) and a material thickness of about 3 mm made of copper. The water flows through the radiator, absorbs the relatively low heat loss of the graphics card and heats up slightly before it via lines 3 back in the main cooler 1 entry.

There it heats up further and expands further and generates due to the thermodynamically optimized design of the radiator 1 the desired flow.

The complete cooling system is waterproof (with screwed-on, closed breather cap).

To improve safety and over monitoring sensors, temperature, water level or flow sensors can be attached. Furthermore, sensitive circuits of the computer system or circuits with hazardous voltages can be specially protected. In addition, non-conductive cooling liquids can be used instead of water.

By special housing (e.g., computer case) which for the use of gravity cooling are optimized (e.g., by convection surfaces, bores, air-vis and inspection openings, overall height, special Materials, air line, protection) can improve the effect and the look will be upgraded.

In 9 to 12 further examples of inventive thermodynamically effective radiators are shown. Depending on whether a simple and cost-effective production, visual focus or optimal flow generation and thus the cooling behavior in the foreground, the design can vary.

9 and 10 represent an example of a simple and inexpensive radiator.

This Radiator consists only of tubes, preferably copper, the by means of tees or angles connected to each other.

The water flows in at the top, is distributed over a horizontal pipe 22 on the vertical tubes 23 , cools and sinks down. It collects in the horizontally running lower tube 24 and resigns in this case right below.

Here, as with all radiators according to the invention, it is of little importance at which position of the tubes 22 and 24 the connections of the lines are made to the radiator, for example, a central connection would be conceivable. For the flow generation, it is only necessary that the inlet of the warm water is above the outflow of the cold water.

to increase the convection surface can do this thermally conductive Elements, such as e.g. Cooling plates or Slats, which are in thermal contact with the pipes, attached become. The dimensioning of the radiator can here with 400 × 400 mm the side surface a tower case be adjusted.

11 and 12 represent the example of a flat radiator with increased convection surface.

This radiator consists of 2 copper sheets 25 , which are mounted congruently with a distance of 5 mm to each other. This is done by a 5 mm wide copper strip welded around the outer edges of the sheets 26 reached. tape 26 and sheets 25 in this case have a thickness of about 1 mm.

In order to prevent circulation and direct the water as vertically as possible during the cooling process, 5 mm wide webs are created between the two sheets 27 assembled.

Due to the illustrated positioning of the webs 27 This may be due to the inflow 28 distribute incoming warm water horizontally above and cool down between the bars 27 sink down. In this case, a flow is generated according to the above-mentioned principle. The cooled water enters the bottom mounted drain 29 out.

By appropriate dimensioning with about 400 × 400 mm, this radiator through its closed, flat execution the side wall of a computer case form.

The Examples according to the invention thermodynamically effective radiators are shown here without expansion tank / deaerator, since these functions are not necessarily of the radiators Fulfills Need to become, but also taken over by components arranged separately in the system can be.

However, it is also conceivable that the shape of the cooler are tailored specifically to the space or a production process. So it is not necessary to follow a certain form or as in the in 4 and 5 shown examples an enclosing housing to arrange an insert. Even a component separation of radiator and radiator is not absolutely necessary.

Around a cooling to achieve by the principle of gravity, it is only necessary that in the area of the cooling device, which heat from one to be cooled Component absorbs the coolant during their warming can ascend and to cool off Area of the cooling device stream can. The heat donating area, as the cooling liquid cools down her the opportunity to sink. The cooled Liquid now flows through the pumpless circulation again to the warming Area back.

It is possible, several warming and cooling oneself Areas in a cooling circuit too combine.

It is possible to use the principle of gravity in only part of the refrigeration cycle and, there as well by the rise in the heating as well as by the decrease in the cooling, a sufficient flow can occur.

For example it can suffice in a computer system, just a thermodynamic one effective cooler use. For example, if the design of the computer a thermodynamically effective design the radiator is not enabled or a low cooling capacity is necessary.

Drawing overview

1 Schematic representation of the principle of gravity

2 Example of a cooling system for computer vertical section

3 Example of a cooling system for computer horizontal section

4 Detail of the heat sink used in the example Horizontal section

5 Detail of the heat sink used in the example Vertical section

6 Representation of unwanted circulation within a cooler without thermodynamically effective inserts Horizontal section

7 Representation of unwanted circulation within a cooler without thermodynamically effective inserts Vertical section

8th Example of a compensating vessel with breather function Vertical section

9 and 10 Example of a thermodynamically effective radiator in vertical section ( 9 ) and in horizontal section ( 10 )

11 and 12 Example of a thermodynamically effective radiator in vertical section ( 11 ) and in horizontal section ( 12 )

Claims (16)

The invention relates to a device for cooling electronic components, preferably for cooling of microprocessors ( 5 . 6 ), characterized in that the cooling device works with the principle of gravity cooling pumpless. Cooling device according to claim 1, characterized in that it by means of a cooling element according to the invention ( 1 ), in which the flow necessary for operating the cooling device is generated by the rising when heating expansive liquids. So that the pumpless cooling during operation of the electronic component ( 5 . 6 ) is guaranteed. Cooling device according to one of the preceding claims, characterized in that it by means of a radiator according to the invention ( 2 ) operates, in which the flow necessary for the operation of the cooling device is generated by the decrease in the cooling of contracting liquids. So that the pumpless cooling during operation of the electronic component ( 5 . 6 ) is guaranteed. Cooling device according to one of the preceding claims, characterized in that it is provided with a cooling element according to the invention ( 1 ) and a radiator according to the invention ( 2 ), which are both connected together to form a closed system. Preferably, this is done by flexible hoses ( 3 ). Cooling device according to one of the preceding claims, characterized in that it is provided with a compensating vessel ( 4 ) is equipped for the resulting pressure. Cooling device according to one of the preceding claims, characterized in that it is provided with a deaerator ( 4 ) is equipped for easy venting of the system. Cooling device according to one of the preceding claims, characterized in that it is provided with a filler neck ( 4 ) is equipped for easy filling. Cooling device according to claims 5, 6 or 7, characterized in that it is equipped with a device which performs several or all of these tasks. (Such as the in 8th shown deaerator) Cooling device, according to one of the preceding claims, characterized in that with the flow generated by the gravity principle further cooling elements ( 10 ) or radiators can be operated without pumpless. Cooler, according to one of the preceding claims, characterized that for measurable securing the cooling sensors, preferably Temperature, humidity, or flow sensors are used. cooler according to claim 1, characterized in that instead of water another coolant is used. Cooling device, after one of vorge existing claims, characterized in that the component to be cooled is a drive, preferably a hard drive. Cooler, according to one of the preceding claims, characterized that to be cooled Component is a power supply. Cooling system for a computer that has a main processor ( 5 ) and a graphics card processor ( 6 ), characterized in that the main processor ( 5 ) and the graphics card processor ( 6 ) is in thermal contact with at least one cooling unit according to one of the preceding claims. Cooling system for a computer, according to one of the preceding claims, characterized in that one of the components according to the invention, preferably the radiator ( 2 ), the computer housing or a part of the computer housing forms. cooling system for one Computer according to one of the preceding claims, characterized that the calculator free of blowers is.