DE102004014355A1 - Verfahren zur Herstellung eines optoelektronischen Bauelements durch Ur- und Umformen - Google Patents

Verfahren zur Herstellung eines optoelektronischen Bauelements durch Ur- und Umformen Download PDF

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Publication number
DE102004014355A1
DE102004014355A1 DE102004014355A DE102004014355A DE102004014355A1 DE 102004014355 A1 DE102004014355 A1 DE 102004014355A1 DE 102004014355 A DE102004014355 A DE 102004014355A DE 102004014355 A DE102004014355 A DE 102004014355A DE 102004014355 A1 DE102004014355 A1 DE 102004014355A1
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DE
Germany
Prior art keywords
component
main body
prototyping
opto
reshaping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102004014355A
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English (en)
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DE102004014355B4 (de
Inventor
Markus Kamp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ODELO GMBH, 71409 SCHWAIKHEIM, DE
Original Assignee
Odelo Led GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Odelo Led GmbH filed Critical Odelo Led GmbH
Priority to DE102004014355A priority Critical patent/DE102004014355B4/de
Publication of DE102004014355A1 publication Critical patent/DE102004014355A1/de
Application granted granted Critical
Publication of DE102004014355B4 publication Critical patent/DE102004014355B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur Herstellung eines optoelektronischen Bauelements. Dazu wird durch Urformen ein Bauelementgrundkörper erzeugt. Anschließend wird der Bauelementgrundkörper in einen Bauelementkörper umgeformt. Beim Umformen wird die die optischen Abstrahleigenschaften bestimmende geometrische Gestalt des optoelektronischen Bauelements erzeugt. DOLLAR A Mit der vorliegenden Erfindung wird ein Herstellungsverfahren für optoelektronische Bauelemente entwickelt, das kostengünstig die Herstellung einer Vielzahl von Varianten der Bauelementgestalt ermöglicht.
DE102004014355A 2004-03-24 2004-03-24 Verfahren zur Herstellung eines optoelektronischen Bauelements durch Ur- und Umformen Expired - Fee Related DE102004014355B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102004014355A DE102004014355B4 (de) 2004-03-24 2004-03-24 Verfahren zur Herstellung eines optoelektronischen Bauelements durch Ur- und Umformen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004014355A DE102004014355B4 (de) 2004-03-24 2004-03-24 Verfahren zur Herstellung eines optoelektronischen Bauelements durch Ur- und Umformen

Publications (2)

Publication Number Publication Date
DE102004014355A1 true DE102004014355A1 (de) 2005-10-20
DE102004014355B4 DE102004014355B4 (de) 2010-07-29

Family

ID=35033870

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004014355A Expired - Fee Related DE102004014355B4 (de) 2004-03-24 2004-03-24 Verfahren zur Herstellung eines optoelektronischen Bauelements durch Ur- und Umformen

Country Status (1)

Country Link
DE (1) DE102004014355B4 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017123798A1 (de) * 2017-10-12 2019-04-18 Osram Opto Semiconductors Gmbh Halbleiterlaser und Herstellungsverfahren für optoelektronische Halbleiterbauteile

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2437581A1 (de) 2010-09-30 2012-04-04 Odelo GmbH Leuchtdiode auf Keramiksubstratbasis
DE102010047002A1 (de) 2010-09-30 2012-04-05 Odelo Gmbh Verfahren zur Herstellung belinster SMD-Leuchtdioden
DE102013106689B4 (de) * 2013-06-26 2022-02-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
DE102013212393A1 (de) * 2013-06-27 2014-12-31 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10163117C1 (de) * 2001-12-24 2003-01-16 Reitter & Schefenacker Gmbh Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei zeitlich getrennten Stufen
DE10135190A1 (de) * 2001-07-19 2003-02-06 Osram Opto Semiconductors Gmbh Lumineszenzdiode und Verfahren zu deren Herstellung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10159522A1 (de) * 2001-12-05 2003-06-26 G L I Global Light Ind Gmbh Verfahren zur Herstellung von LED-Körpern

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10135190A1 (de) * 2001-07-19 2003-02-06 Osram Opto Semiconductors Gmbh Lumineszenzdiode und Verfahren zu deren Herstellung
DE10163117C1 (de) * 2001-12-24 2003-01-16 Reitter & Schefenacker Gmbh Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei zeitlich getrennten Stufen

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017123798A1 (de) * 2017-10-12 2019-04-18 Osram Opto Semiconductors Gmbh Halbleiterlaser und Herstellungsverfahren für optoelektronische Halbleiterbauteile
DE102017123798B4 (de) 2017-10-12 2022-03-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterlaser und Herstellungsverfahren für optoelektronische Halbleiterbauteile
US11735887B2 (en) 2017-10-12 2023-08-22 Osram Oled Gmbh Semiconductor laser and method of production for optoelectronic semiconductor parts
US11870214B2 (en) 2017-10-12 2024-01-09 Osram Oled Gmbh Semiconductor laser and method of production for optoelectronic semiconductor parts

Also Published As

Publication number Publication date
DE102004014355B4 (de) 2010-07-29

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: ODELO GMBH, 71409 SCHWAIKHEIM, DE

8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20141001