DE102004001949A1 - Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis - Google Patents

Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis Download PDF

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Publication number
DE102004001949A1
DE102004001949A1 DE200410001949 DE102004001949A DE102004001949A1 DE 102004001949 A1 DE102004001949 A1 DE 102004001949A1 DE 200410001949 DE200410001949 DE 200410001949 DE 102004001949 A DE102004001949 A DE 102004001949A DE 102004001949 A1 DE102004001949 A1 DE 102004001949A1
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Germany
Prior art keywords
laser
focuses
lens unit
machining system
parallel axis
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DE200410001949
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German (de)
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Individual
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Individual
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Priority to DE200410001949 priority Critical patent/DE102004001949A1/en
Publication of DE102004001949A1 publication Critical patent/DE102004001949A1/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P25/00—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
    • B23P25/003—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress immediately preceding a cutting tool
    • B23P25/006—Heating the workpiece by laser during machining

Abstract

Five lens segments are spaced uniformly around a circular lens surface with the focal point directed onto a fibre guide. A laser is directed onto the lens. This achieves the best focussing of the laser onto an output point corresponding to the workpiece surface.

Description

Schonender Materialabtrag erfolgt wenn Tiefenrissbildung bei Spanbildung durch mechanischen Abtrag vermieden wird in dem Abzutragendes durch thermisches Vorbereiten weich gemacht wird und duktil entfernt wird wobei die Kristallverschiebung unterbleibt und sozusagen in Polierqualität abgetragen wird.gentle Material removal occurs when depth cracking during chip formation mechanical erosion is avoided in the Abzutragendes by thermal Preparing is softened and ductile is removed while the Crystal displacement is omitted and so to speak removed in polishing quality.

In der PCT-Anmeldung 03/00400 sind bereits Lasereinführungsmethoden beschrieben die auf Grinlinsen-, Trichter- und Freistrahl-Einführungen beruhen.In PCT Application 03/00400 are already laser introduction methods described the on grin lens, funnel and free jet introductions based.

Direkt vor weiterführende Elemente gesetzte Grinlinsen haben den Nachteil das viele Schnittstellen zwischen den Linsen entstehen, die problematisch sind, Trichter sind nur in einem sehr begrenzten Umfang verwendbar da nur max 2-3 Trichterwandberührungen möglich sind um eine Rückleitung des Laserstrahls zu vermeiden, Freistrahl-Einführungen sind nur bei sehr großen Werkzeugen möglich die Priorität duktilen Abtrags liegt jedoch bei kleinen Werkzeugen.Directly before continuing Elements set grin lenses have the disadvantage that many interfaces arise between the lenses that are problematic, funnels are usable only to a very limited extent since only max 2-3 Hopper wall touches possible are a return of the laser beam, free-jet entries are only possible with very large tools possible the priority ductile erosion is, however, in small tools.

Diese Einschränkungen sind mit vorliegender Erfindung zu umgehen.These restrictions are to be circumvented by the present invention.

Beschreibung nach Anwendungsbeispiel 1.Description according to application example 1 ,

Es werden z.B. fünf Sammellinsen 1 hergestellt und aus diesen fünf Segmente 2 erzeugt die auf einem Teilkreis hier 25mm angeordnet werden. Der Brennpunkt aller Linsen b.z.W. Linsensegmente 2 liegt auf einem Teilkreis hier 14mm im Abstand bei 5 Linsen von 72 Grad. Die Brennpunkte liegen außerdem am Anfang je eines weiterführenden Elements vornehmlich einer Hohlfaser mit sehrgeringem Innendurchmesser wegen der besten Focuszierung der Laserstrahls. Die weiterführenden Elemente werden achsparallel am Werkzeugschaft oder der Aufnahme so geformt das das Ende so im Spanbereich zwischen den Schneiden des Werkzeuges angeordnet ist das der austretende Laserstrahl den Werkstoff optimal trifft.For example, there will be five collective lenses 1 made and made from these five segments 2 generated on a pitch circle here 25mm can be arranged. The focal point of all lenses for lens segments 2 lies on a pitch circle here 14mm in the distance with 5 lenses of 72 degrees. The focal points are also at the beginning of each of a continuing element primarily a hollow fiber with very small inner diameter because of the best Focuszierung the laser beam. The further elements are formed axially parallel to the tool shank or the receptacle so that the end is arranged in the chip area between the cutting edges of the tool that the exiting laser beam optimally strikes the material.

Bei der Drehung des Werkzeuges im Uhrzeigersinn bewegt sich das Linsensegment 2 in gleicher Richtung unter dem stationären Laser der seinen Impuls über einen Bereich unterhalb 72 Grad durch das Segment 2 sendet fokussiert auf den Brennpunkt 3. Im gleichen Winkelbereich wird der Laserpuls auf den Werkstoff gestreut und das im Rhythmus einer Drehung hier fünf mal.As the tool rotates clockwise, the lens segment moves 2 in the same direction under the stationary laser its impulse over a range below 72 degrees through the segment 2 sends focused on the focal point 3 , In the same angular range, the laser pulse is scattered on the material and this in the rhythm of a rotation here five times.

Ein weitere Vorteil dieser Einführung ist das Spektrum von einem relativ großem Winkel hier 72 Grad auf dem der Laserstrahl wirkt dieser kann ohne Probleme auch noch größer oder bei Bedarf auch kleiner gewählt werden durch Änderung der Segmente Anzahl.One further advantage of this introduction is the spectrum from a relatively large angle here 72 degrees the laser beam works this can be larger or larger without problems if required also smaller be through change of the segments number.

Durch die genaue Focuszierung auf den Brennpunkt bietet sich eine Trennung des Werkzeugteils von der Optik der Einführung an genau dieser Stelle an.By the exact Focuszierung on the focal point offers a separation the tool part of the optics of the introduction at exactly this point at.

Claims (1)

Sammellinsen-Laser-Einführung über Brennpunkte in achsparallele weiterführende Elemente eines Werkzeug-Schaftes oder -Aufnahme zur Laserleitung in der Spanbereich der Bearbeitung dadurch gekennzeichnet, dass aus einer Anzahl Sammellinsen (1) Segmente (2) ausgeschnitten werden und auf einem Teilkreis angeordnet sind, so dass die Brennpunkte (3) in weiterführenden Elementen liegen welche annähernd achsparallel mit entsprechenden Biegungen an den Spanbereich eines Werkzeuges geführt sind um diesen für den spanenden Abtrag thermisch vor zu bereiten.Compound lens laser introduction via focal points in axially parallel further elements of a tool shank or receiving the laser line in the chip area of the machining, characterized in that from a number of converging lenses ( 1 ) Segments ( 2 ) are cut out and arranged on a pitch circle, so that the focal points ( 3 ) lie in further elements which are guided approximately parallel to the axis with corresponding bends to the chip area of a tool to prepare this for the cutting removal thermally before.
DE200410001949 2004-01-13 2004-01-13 Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis Withdrawn DE102004001949A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE200410001949 DE102004001949A1 (en) 2004-01-13 2004-01-13 Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200410001949 DE102004001949A1 (en) 2004-01-13 2004-01-13 Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis

Publications (1)

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DE102004001949A1 true DE102004001949A1 (en) 2005-08-11

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DE200410001949 Withdrawn DE102004001949A1 (en) 2004-01-13 2004-01-13 Laser machining system has a multi segment lens unit that focuses the laser output onto a parallel axis

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017216603A1 (en) 2016-06-14 2017-12-21 Evana Technologies, Uab Laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017216603A1 (en) 2016-06-14 2017-12-21 Evana Technologies, Uab Laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens

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