DE10137713B4 - Method for producing an adhesive bond - Google Patents

Method for producing an adhesive bond Download PDF

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Publication number
DE10137713B4
DE10137713B4 DE10137713A DE10137713A DE10137713B4 DE 10137713 B4 DE10137713 B4 DE 10137713B4 DE 10137713 A DE10137713 A DE 10137713A DE 10137713 A DE10137713 A DE 10137713A DE 10137713 B4 DE10137713 B4 DE 10137713B4
Authority
DE
Germany
Prior art keywords
component
adhesive
interface layer
bond
adhesive bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10137713A
Other languages
German (de)
Other versions
DE10137713A1 (en
Inventor
Heinz Huber
Johannes Vlcek
Werner Dipl.-Phys. Zimmermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Defence and Space GmbH
Original Assignee
EADS Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EADS Deutschland GmbH filed Critical EADS Deutschland GmbH
Priority to DE10137713A priority Critical patent/DE10137713B4/en
Publication of DE10137713A1 publication Critical patent/DE10137713A1/en
Application granted granted Critical
Publication of DE10137713B4 publication Critical patent/DE10137713B4/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/3404—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint
    • B29C65/346—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint being a coating or being printed, e.g. being applied as a paint or forming a printed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
    • B29C65/3608—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements
    • B29C65/3612—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements comprising fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
    • B29C65/366—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint being a coating or being printed, e.g. being applied as a paint or forming a printed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/76—Making non-permanent or releasable joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/022—Mechanical pre-treatments, e.g. reshaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/026—Chemical pre-treatments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/836—Moving relative to and tangentially to the parts to be joined, e.g. transversely to the displacement of the parts to be joined, e.g. using a X-Y table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1409—Visible light radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1412—Infrared [IR] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1425—Microwave radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/3472—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the composition of the heated elements which remain in the joint
    • B29C65/3476—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the composition of the heated elements which remain in the joint being metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/3472—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the composition of the heated elements which remain in the joint
    • B29C65/3484—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the composition of the heated elements which remain in the joint being non-metallic
    • B29C65/3492—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the composition of the heated elements which remain in the joint being non-metallic being carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3672—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint
    • B29C65/3676—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/008—Presence of polyolefin in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/008—Presence of halogenated polymer in the pretreated surface to be joined

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Verfahren zur Herstellung einer Klebeverbindung zwischen einem ersten Bauteil, das insbesondere aus einem schwer verklebbaren Kunststoff besteht, und einem zweiten Bauteil, dadurch gekennzeichnet, dass an der Oberfläche (2) des ersten Bauteils (1) eine verklebbare Interfaceschicht (3) mittels kinetischem Kaltkompaktieren unter Verwendung von pulverförmigem metallischem, keramischem, organischem oder thermoplastischem Material aufgebracht wird; dass auf dem ersten Bauteil (1) und/oder auf dem zweiten Bauteil (4), oder zwischen diesen, ein Klebstoff (5) aufgebracht wird; und dass die Bauteile (1, 4) zusammengefügt werden.method for producing an adhesive bond between a first component, which consists in particular of a plastic that is difficult to bond, and a second component, characterized in that on the surface (2) of the first component (1) by means of a bondable interface layer (3) kinetic cold compacting using powdered metallic, applied ceramic, organic or thermoplastic material becomes; that on the first component (1) and / or on the second component (4) or between which an adhesive (5) is applied; and that the components (1, 4) are joined together.

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Figure 00000001

Description

Die Erfindung betrifft ein Verfahren zur Herstellung einer Klebeverbindung zwischen einem ersten Bauteil, das insbesondere aus einem schwer verklebbaren Kunststoff besteht, und einem zweiten Bauteil. Vorteilhafterweise ist die Klebeverbindung lösbar, so dass ein Lösen der verklebten Bauteile auf einfache Weise möglich ist.The The invention relates to a method for producing an adhesive bond between a first component, in particular a heavy one glued plastic, and a second component. advantageously, is the adhesive bond detachable, so that a release the glued components is possible in a simple manner.

Zunehmend werden Bauteile, insbesondere solche die aus einem schwer verklebbaren Kunststoff bestehen, in einem großen Anwendungsbereich verwendet, insbesondere beim Bau von Kraftfahrzeugen und sonstigen Fahrzeugen. Die Verwendung von Kunststoffen als Strukturwerkstoff ist aus Gründen der Gewichts- und Kosteneinsparung vorteilhaft und nimmt immer mehr zu. Ein wesentliches Problem dabei ist die Verbindungstechnik, wobei ein Verkleben der Bauteile sowie auch die Lösbarkeit einer so hergestellten Verbindung von Bauteilen angestrebt wird. Die Verklebung ist aus Gründen etwa der Steifigkeit vorteilhaft, die Lösbarkeit der Klebeverbindung ist vorteilhaft in Hinblick auf Reparatur und Recycling. Besonders schwierig ist die Verklebung unterschiedlicher Werkstoffe, insbesondere die Verklebung von Polyolefinen.Increasingly be components, especially those from a difficult to bond Plastic, used in a wide range of applications, especially in the construction of motor vehicles and other vehicles. The use of plastics as structural material is for the sake of Weight and cost savings are beneficial and increasing to. A major problem here is the connection technology, wherein a bonding of the components as well as the solubility of a thus produced The aim is to connect components. The bonding is over establish about the stiffness advantageous, the solubility of the adhesive bond is advantageous in terms of repair and recycling. Especially difficult is the bonding of different materials, in particular the bonding of polyolefins.

Eine Vielzahl von Verfahren zum Auftragen von Schichten unterschiedlicher Eigenschaften sind aus dem Stand der Technik bekannt. Aus EP 0 484 533 B1 ist ein Verfahren zur Anbringung von Beschichtungen auf die Oberfläche eines Produkts bekannt, welches aus einem Material hergestellt ist, das aus der Gruppe bestehend aus Metallen, Legierungen und isolierenden Materialien gewählt ist, wobei in einen Gasfluss ein Pulver aus einem Material eingeführt wird, welches aus der Gruppe bestehend aus Metallen, Legierungen, deren mechanischen Mischungen oder isolierenden Materialien gewählt ist, um eine Gas- und Pulvermischung zu bilden, die auf die Oberfläche eines Produkts hingerichtet wird, und ist dadurch gekennzeichnet, dass das verwendete Pulver eine Partikelgröße von 1 bis 50 μm in einer Menge aufweist, die eine Flussratendichte der Partikel zwischen ungefähr 0,05 und ungefähr 17 g/s cm2 sicherstellt, wobei auf den Gasfluss eine Ultraschallgeschwindigkeit ausgeübt wird und ein Ultraschallstrahl mit einem vorgegebenen Profil gebildet wird, der eine Geschwindigkeit des Pulvers in der Gas- und Pulvermischung von 300 bis 1200 m/s sicherstellt.A variety of methods for applying layers of different properties are known in the art. Out EP 0 484 533 B1 For example, there is known a method of applying coatings to the surface of a product made of a material selected from the group consisting of metals, alloys and insulating materials, wherein a gas flow is introduced with a powder of a material comprising The group consisting of metals, alloys, their mechanical mixtures or insulating materials is chosen to form a gas and powder mixture which is executed on the surface of a product, and is characterized in that the powder used has a particle size of 1 to 50 microns in an amount that ensures a flow rate density of the particles between about 0.05 and about 17 g / s cm 2 , wherein on the gas flow an ultrasonic velocity is exerted and an ultrasonic beam is formed with a predetermined profile, the speed of the powder in the gas and powder mixture from 300 to 1200 m / s ensures.

Aus DE 199 59 515 A1 ist ein Verfahren zur Kunststoffbeschichtung mittels Spritzvorgang sowie eine entsprechende Vorrichtung bekannt. Das Spritzverfahren ist beispielsweise ein Hochgeschwindigkeits-Flammspritzverfahren oder ein Hochgeschwindigkeits-Kaltspritzverfahren. Beim Hochgeschwindigkeits-Flammspritzverfahren (HVOF-Verfahren) ist jedoch zu beachten, dass aufgrund der zur Beschleunigung eines Spritzwerkstoffes ausgenutzten Expansion eines Brenngases Gastemperaturen bis zu 3500°C auftreten, was für manche Anwendungen von Nachteil ist, da die Pulverpartikel des Spritzwerkstoffes bei diesen Temperaturen anschmelzen.Out DE 199 59 515 A1 is a method for plastic coating by means of injection and a corresponding device known. The spraying method is, for example, a high-speed flame spraying method or a high-speed cold spraying method. In the case of the high-speed flame spraying method (HVOF method), however, it should be noted that gas temperatures of up to 3500 ° C. occur due to the expansion of a fuel gas used to accelerate a spray material, which is disadvantageous for some applications because the powder particles of the spray material melt at these temperatures ,

Daneben sind aus dem Stand der Technik unterschiedliche Methoden zum Lösen geklebter Verbindungen bekannt. EP 0 492 786 A2 beschreibt beispielsweise das Erhitzen eines Klebstoffes, der ein leitendes und ein nicht leitendes Bauteil bindet, durch das Anlegen eines Hochfrequenzfeldes.In addition, different methods for releasing glued joints are known from the prior art. EP 0 492 786 A2 describes, for example, the heating of an adhesive that binds a conductive and a non-conductive component by the application of a high-frequency field.

EP 0 521 825 A2 beschreibt die Verwendung eines leitfähigen Trennelements in Verklebungen zum Erzeugen einer lösbaren Klebeverbindung. EP 0 521 825 A2 describes the use of a conductive separator in bonds to produce a releasable adhesive bond.

Beim Verfahren nach WO 06/17737 wird eine verklebte Scheibe mittels elektromagnetischer Strahlung, einbringbar unter anderem durch Laser, im UV-, NIR oder im sichtbaren Bereich gelöst.At the Method according to WO 06/17737 is a bonded disc by means of electromagnetic Radiation, inter alia by laser, in the UV, NIR or dissolved in the visible range.

DE 199 24 138 A1 sowie DE 199 51 599 A1 nennen Klebestoffe und Verfahren zum Lösen von Klebeverbindungen, wobei das Lösen der Verbindung beispielsweise durch elektromagnetische Strahlung erfolgt. DE 199 24 138 A1 such as DE 199 51 599 A1 call adhesives and methods for releasing adhesive bonds, wherein the release of the compound, for example, by electromagnetic radiation.

Die Aufgabe der Erfindung ist es ein Verfahren zur Herstellung einer Klebeverbindung anzugeben, mit welchem auch Bauteile, die aus schwer verklebbaren Materialien, insbesondere aus Kunststoff bestehen, zuverlässig verklebt werden können. Weiterhin soll die Klebeverbindung aber auch lösbar sein.The The object of the invention is a process for producing a Specify adhesive bond with which even components made of heavy bondable materials, in particular made of plastic, reliable can be glued. Furthermore, the adhesive bond should also be solvable.

Gemäß einem ersten Aspekt der Erfindung wird die Aufgabe gelöst durch ein Verfahren zur Herstellung einer Klebeverbindung gemäß dem Anspruch 1.According to one In the first aspect of the invention, the object is achieved by a method for Production of an adhesive bond according to claim 1.

Jeweilige vorteilhafte Ausgestaltungen und Weiterbildungen sind in den Unteransprüchen angegeben.Respective advantageous embodiments and further developments are specified in the subclaims.

Gemäß dem ersten Aspekt der Erfindung wird ein Verfahren zur Herstellung einer Klebeverbindung zwischen einem ersten Bauteil, das insbesondere aus einem schwer verklebbaren Kunststoff besteht, nicht aber auf ein solches beschränkt ist, und einem zweiten Bauteil, geschaffen. Erfindungsgemäß ist es vorgesehen, dass an der Oberfläche des ersten Bauteils eine verklebbare Interfaceschicht mittels kinetischem Kalkompaktieren unter Verwendung von pulverförmigem metallischem, keramischem, organischem oder thermoplastischem Material aufgebracht wird. Auf dem ersten Bauteil und/oder auf dem zweiten Bauteil, oder zwischen diesen, wird ein Klebstoff aufgebracht. Die Bauteile werden zusammengefügt.According to the first aspect of the invention, a method for producing an adhesive bond between a first component, which is in particular made of a difficult to bond plastic, but not limited to such, and a second component, is provided. According to the invention, it is provided that a bondable interface layer is applied to the surface of the first component by means of kinetic compacting using powdered metallic, ceramic, organic or thermoplastic material. On the first component and / or on the second component, or between these, an adhesive is applied. The components are zusammenge added.

Gemäß einer vorteilhaften Weiterbildung der Erfindung wird auch an der Oberfläche des zweiten Bauteils eine verklebbare Interfaceschicht nach dem oben beschriebenen Verfahren hergestellt.According to one advantageous development of the invention is also on the surface of the second component, a bondable interface layer after the top prepared method described.

Das erste und das zweite Bauteil können aus den gleichen Werkstoffen bestehen.The first and the second component can consist of the same materials.

Alternativ können das erste und das zweite Bauteil aus verschiedenen Werkstoffen bestehen.alternative can the first and the second component consist of different materials.

Gemäß einer Ausführungsform der Erfindung kann das Bauteil aus einem Polyolefin bestehen.According to one embodiment According to the invention, the component may consist of a polyolefin.

Gemäß einer anderen Ausführungsform der Erfindung kann das Bauteil aus Teflon bestehen.According to one another embodiment According to the invention, the component may consist of Teflon.

Gemäß einer weiteren Ausführungsform der Erfindung kann das Bauteil aus PE bestehen.According to one another embodiment invention, the component may consist of PE.

Gemäß einer bevorzugten Ausführungsform der Erfindung ist das erste Bauteil und/oder das zweite Bauteil transparent oder IR-transparent, d.h. transparent für sichtbare oder zumindest für infrarote elektromagnetische Strahlung.According to one preferred embodiment of Invention, the first component and / or the second component is transparent or IR-transparent, i. transparent for visible or at least for infrared electromagnetic radiation.

Gemäß einer bevorzugten Ausführungsform des erfindungsgemäßen Verfahrens ist der Beschichtungswerkstoff und/oder der Kleber elektrisch leitend.According to one preferred embodiment of inventive method the coating material and / or the adhesive is electrically conductive.

Gemäß einer anderen bevorzugten Ausführungsform des erfindungsgemäßen Verfahrens ist der Beschichtungswerkstoff und/oder der Kleber ein Mikrowellen absorbierendes Material.According to one another preferred embodiment the method according to the invention the coating material and / or the adhesive is a microwave absorbent material.

Hierbei kann es insbesondere vorgesehen sein, dass der Beschichtungswerkstoff und/oder der Kleber Mikrowellen absorbierende Füllstoffe enthält.in this connection In particular, it may be provided that the coating material and / or the adhesive contains microwave-absorbent fillers.

Als Füllstoffe können Carbonyleisen und/oder Nickelpulver und/oder Ruß verwendet werden.When fillers can Carbonyl iron and / or nickel powder and / or carbon black are used.

Dabei ist es insbesondere vorteilhaft, dass die Klebeverbindung unter Freisetzung von Wärme in der Interfaceschicht und/oder im Kleber durch thermische Degradation oder durch Aufschmelzen der Klebung gelöst werden kann.there it is particularly advantageous that the adhesive bond under Release of heat in the interface layer and / or in the adhesive due to thermal degradation or can be solved by melting the bond.

Gemäß einer Ausführungsform erfolgt das Freisetzen von Wärme durch induktives Einleiten von elektrischem Strom in die Interfaceschicht und/oder in den Kleber.According to one embodiment the release of heat takes place by inductively introducing electrical current into the interface layer and / or in the glue.

Gemäß einer anderen Ausführungsform erfolgt das Freisetzen von Wärme durch galvanisches Einleiten von elektrischem Strom in die Interfaceschicht und/oder in den Kleber.According to one another embodiment the release of heat takes place by galvanic introduction of electrical current into the interface layer and / or in the glue.

Gemäß noch einer weiteren vorteilhaften Ausführungsform erfolgt das Freisetzen von Wärme durch Absorption von infraroter oder sichtbarer elektromagnetischer Strahlung in der Interfaceschicht und/oder im Kleber.According to one more further advantageous embodiment the release of heat takes place Absorption of infrared or visible electromagnetic radiation in the interface layer and / or in the adhesive.

Gemäß noch einer weiteren vorteilhaften Ausführungsform erfolgt das Freisetzen von Wärme durch Absorption von elektromagnetischer Mikrowellenstrahlung in der Interfaceschicht und/oder im Kleber.According to one more further advantageous embodiment the release of heat takes place Absorption of electromagnetic microwave radiation in the interface layer and / or in the glue.

Im folgenden werden Ausführungsbeispiele der Erfindung anhand der Zeichnung erläutert. Es zeigen:in the Following are embodiments of Invention explained with reference to the drawing. Show it:

1 eine schematisierte vergrößerte Querschnittsdarstellung einer Klebeverbindung, die nach dem erfindungsgemäßen Verfahren hergestellt ist, gemäß einem ersten Ausführungsbeispiel der Erfindung; 1 a schematic enlarged cross-sectional view of an adhesive bond, which is produced by the method according to the invention, according to a first embodiment of the invention;

2a) bis c) schematisierte perspektivische Darstellungen von Verfahren zum Lösen einer Klebeverbindung. 2a ) to c) schematic perspective views of methods for releasing an adhesive bond.

In 1 ist ein erstes Bauteil 1 dargestellt, welches mittels eines Klebers 5 mit einem zweiten Bauteil 4 verbunden werden soll. Das erste Bauteil 1 besteht aus einem schwer verklebbaren Material, etwa aus einem schwer verklebbaren Kunststoff, wie einem Polyolefin, Teflon oder PE. Das zweite Bauteil 4 besteht bei dem dargestellten Ausführungsbeispiel aus einem beliebigen anderen Material. Die Oberfläche 2 des ersten Bauteils 1, die ohne weitere Maßnahmen nicht oder nur unbefriedigend verklebbar wäre, ist durch Aufbringen eines Beschichtungswerkstoffs mit einer verklebbaren Interfaceschicht 3 versehen.In 1 is a first component 1 represented by means of an adhesive 5 with a second component 4 to be connected. The first component 1 consists of a difficult to bond material, such as a hard-to-bond plastic, such as a polyolefin, Teflon or PE. The second component 4 consists in the illustrated embodiment of any other material. The surface 2 of the first component 1 which would not or only unsatisfactorily bond without further measures, is by applying a coating material with a bondable interface layer 3 Mistake.

Die Interfaceschicht 3 wird an der Oberfläche 2 des Bauteils 1 durch kinetisches Kaltkompaktieren gebildet. Die verklebbare Interfaceschicht 3 kann aus verschiedenen verklebbaren Materialien gebildet sein, insbesondere aus einem metallischen, keramischen oder organischen Beschichtungswerkstoff. Durch das kinetische Kaltkompaktieren dringt der die Interfaceschicht 3 bildende Beschichtungswerkstoff unter Ausbildung eines Gradienten mit adhäsiver und mechanischer Verzahnung verhältnismäßig tief in den Strukturwerkstoff des Bauteils 1 ein. An der die Klebefläche bildenden Oberfläche bildet der Beschichtungswerkstoff der Interfaceschicht 3 eine zusammenhängende dichte Schicht, die abhängig von dem beim Kaltkompaktieren verwendeten Pulvermaterial eine große Oberfläche aufweisen kann. Insbesondere kann die verklebbare Interfaceschicht 3 aus einem verklebbaren thermoplastischen Beschichtungswerkstoff gebildet sein.The interface layer 3 gets on the surface 2 of the component 1 formed by kinetic cold compacting. The bondable interface layer 3 may be formed of various bondable materials, in particular of a metallic, ceramic or organic coating material. The kinetic cold compacting penetrates the interface layer 3 forming coating material to form a gradient with adhesive and mechanical gearing relatively deep in the structural material of the component 1 one. At the surface forming the adhesive surface, the coating material forms the interface layer 3 a continuous dense layer which may have a large surface area depending on the powder material used in cold compaction. In particular, the bondable interface layer 3 from a bondable thermoplastic coating be formed.

Durch Aufbringen eines Klebers 5 auf dem ersten Bauteil 1 und/oder auf dem zweiten Bauteil 4 bzw. allgemein zwischen den Bauteilen 1, 4 und Zusammenfügen derselben wird die Klebeverbindung hergestellt.By applying an adhesive 5 on the first component 1 and / or on the second component 4 or generally between the components 1 . 4 and joining them together, the adhesive bond is made.

Falls das zweite Bauteil 4 ebenfalls aus einem schwer verklebbaren Material besteht, kann auch an der Oberfläche 6 desselben eine verklebbare Interfaceschicht 3' in entsprechender Weise hergestellt werden. Das erste und das zweite Bauteil 1, 4 können aus den gleichen Werkstoffen bestehen, oder sie können aus verschiedenen Werkstoffen bestehen.If the second component 4 also made of a difficult to bond material, can also on the surface 6 the same a bondable interface layer 3 ' be prepared in a similar manner. The first and the second component 1 . 4 can be made of the same materials or they can be made of different materials.

Die 2a) bis c) zeigen drei Ausführungsbeispiele zum Lösen einer Klebeverbindung, die in der vorstehend beschriebenen Art hergestellt worden ist.The 2a ) to c) show three embodiments for releasing an adhesive joint, which has been prepared in the manner described above.

Allgemein erfolgt das Lösen der Klebeverbindung unter Freisetzen von Wärme in der Interfaceschicht 3 und/oder im Kleber 5 unter thermischer Degradation oder durch Aufschmelzen der Klebung.In general, the release of the adhesive bond takes place with the release of heat in the interface layer 3 and / or in the glue 5 under thermal degradation or by melting the bond.

Gemäß dem in 2a) dargestellten Ausführungsbeispiel erfolgt das Freisetzen der Wärme durch induktives Einleiten von elektrischem Strom in die Interfaceschicht 3 und/oder in den Kleber 5 mittels einer Induktionsspule 7, die an einen HF-Generator angeschlossen ist. Der die Interfaceschicht 3 bildende Beschichtungswerkstoff und/oder der Kleber 5 ist elektrisch leitend, so dass die Induktion von Strömen in der Klebung möglich ist und auf Grund von ohm'schen Verlusten die Interfaceschicht 3 und/oder der Kleber aufgeschmolzen oder thermisch degradiert werden kann. Hierdurch ist es möglich, die Bauteile 1 und 4 wieder voneinander zu trennen.According to the in 2a ) illustrated embodiment, the release of heat by inductively introducing electrical current takes place in the interface layer 3 and / or in the glue 5 by means of an induction coil 7 which is connected to an RF generator. The the interface layer 3 forming coating material and / or the adhesive 5 is electrically conductive, so that the induction of currents in the bond is possible and due to ohmic losses, the interface layer 3 and / or the adhesive can be melted or thermally degraded. This makes it possible, the components 1 and 4 to separate again from each other.

Bei dem in 2b) dargestellten Ausführungsbeispiel erfolgt das Lösen der Klebeverbindung wiederum durch ohm'sche Verluste von elektrischen Strömen, die in der Interfaceschicht 3 und/oder in dem Kleber 5 fließen, von welchen wiederum einer oder beide elektrisch leitend sind. Das Einleiten des elektrischen Stroms erfolgt hier jedoch auf galvanischem Wege mittels zweier Elektroden 9, 10, die an eine Stromquelle 8 angeschlossen sind.At the in 2 B ) illustrated embodiment, the release of the adhesive bond in turn takes place by ohmic losses of electrical currents in the interface layer 3 and / or in the glue 5 flow, of which in turn one or both are electrically conductive. The introduction of the electric current takes place here, however, by galvanic means of two electrodes 9 . 10 connected to a power source 8th are connected.

Bei dem in 2c) dargestellten Ausführungsbeispiel besteht das zweite Bauteil 4 aus einem transparenten oder IR-transparenten Material und das Freisetzen von Wärme erfolgt durch Absorption von infraroter elektromagnetischer Strahlung in der Interfaceschicht 3 und/oder im Kleber 5 mittels einer IR-Quelle 11. Die IR-Quelle 11 kann beispielsweise ein Laser sein.At the in 2c ) illustrated embodiment, the second component 4 From a transparent or IR-transparent material and the release of heat takes place by absorption of infrared electromagnetic radiation in the interface layer 3 and / or in the glue 5 by means of an IR source 11 , The IR source 11 For example, it can be a laser.

Der die Interfaceschicht 3 bildende Beschichtungswerkstoff und/oder der Kleber 5 können auch ein Mikrowellen absorbierendes Material sein und anstelle der IR-Quelle 11 kann auch eine Quelle 11' für elektromagnetische Mikrowellenstrahlung verwendet werden, so dass das Freisetzen von Wärme durch Absorption von Mikrowellenstrahlung erfolgt. Auch hier wird die Klebung durch Freisetzen von Wärme aufgeschmolzen oder thermisch degradiert, so dass die Bauteile 1, 4 wieder auseinander genommen werden können.The the interface layer 3 forming coating material and / or the adhesive 5 may also be a microwave absorbing material and instead of the IR source 11 can also be a source 11 ' be used for electromagnetic microwave radiation, so that the release of heat by absorption of microwave radiation takes place. Again, the bond is melted by releasing heat or thermally degraded, so that the components 1 . 4 can be taken apart again.

Bei dem in 2b) dargestellten Ausführungsbeispiel erfolgt das Lösen der Klebeverbindung wiederum durch ohm'sche Verluste von elektrischen Strömen, die in der Interfaceschicht 3 und/oder in dem Kleber 5 fließen, von welchen wiederum einer oder beide elektrisch leitend sind. Das Einleiten des elektrischen Stroms erfolgt hier jedoch auf galvanischem Wege mittels zweier Elektroden 9, 10, die an eine Stromquelle 8 ange-schlossen sind.At the in 2 B ) illustrated embodiment, the release of the adhesive bond in turn takes place by ohmic losses of electrical currents in the interface layer 3 and / or in the glue 5 flow, of which in turn one or both are electrically conductive. The introduction of the electric current takes place here, however, by galvanic means of two electrodes 9 . 10 connected to a power source 8th are connected.

Bei dem in 2c) dargestellten Ausführungsbeispiel besteht das zweite Bauteil 4 aus einem transparenten oder IR-transparenten Material und das Freisetzen von Wärme er-folgt durch Absorption von infraroter elektromagnetischer Strahlung in der Interface-schicht 3 und/oder im Kleber 5 mittels einer IR-Quelle 11. Die IR-Quelle 11 kann bei-spielsweise ein Laser sein.At the in 2c ) illustrated embodiment, the second component 4 From a transparent or IR-transparent material and the release of heat er-follows by absorption of infrared electromagnetic radiation in the interface layer 3 and / or in the glue 5 by means of an IR source 11 , The IR source 11 may be for example a laser.

Der die Interfaceschicht 3 bildende Beschichtungswerkstoff und/oder der Kleber 5 kön-nen auch ein Mikrowellen absorbierendes Material sein und anstelle der IR-Quelle 11 kann auch eine Quelle 11' für elektromagnetische Mikrowellenstrahlung verwendet wer-den, so dass das Freisetzen von Wärme durch Absorption von Mikrowellenstrahlung erfolgt. Auch hier wird die Klebung durch Freisetzen von Wärme aufgeschmolzen oder thermisch degradiert, so dass die Bauteile 1, 4 wieder auseinander genommen werden können.The the interface layer 3 forming coating material and / or the adhesive 5 may also be a microwave absorbing material and instead of the IR source 11 can also be a source 11 ' used for electromagnetic microwave radiation wer-the, so that the release of heat by absorption of microwave radiation takes place. Again, the bond is melted by releasing heat or thermally degraded, so that the components 1 . 4 can be taken apart again.

11
Bauteil, erstes Bauteilcomponent first component
22
Oberflächesurface
33
Interfaceschicht, BeschichtungswerkstoffInterface layer Coating material
3'3 '
Interfaceschicht, BeschichtungswerkstoffInterface layer Coating material
44
zweites Bauteilsecond component
55
KleberGlue
66
Oberflächesurface
77
Induktionsspuleinduction coil
88th
Stromquellepower source
99
Elektrodeelectrode
1010
Elektrodeelectrode
1111
IR-QuelleIR source
11'11 '
Mikrowellenquellemicrowave source

Claims (9)

Verfahren zur Herstellung einer Klebeverbindung zwischen einem ersten Bauteil, das insbesondere aus einem schwer verklebbaren Kunststoff besteht, und einem zweiten Bauteil, dadurch gekennzeichnet, dass an der Oberfläche (2) des ersten Bauteils (1) eine verklebbare Interfaceschicht (3) mittels kinetischem Kaltkompaktieren unter Verwendung von pulverförmigem metallischem, keramischem, organischem oder thermoplastischem Material aufgebracht wird; dass auf dem ersten Bauteil (1) und/oder auf dem zweiten Bauteil (4), oder zwischen diesen, ein Klebstoff (5) aufgebracht wird; und dass die Bauteile (1, 4) zusammengefügt werden.Method for producing an adhesive bond between a first component, which consists in particular of a plastic that is difficult to bond, and a second component, characterized in that on the surface ( 2 ) of the first component ( 1 ) a bondable interface layer ( 3 ) is applied by means of kinetic cold compacting using powdered metallic, ceramic, organic or thermoplastic material; that on the first component ( 1 ) and / or on the second component ( 4 ), or between these, an adhesive ( 5 ) is applied; and that the components ( 1 . 4 ). Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass auch an der Oberfläche (6) des zweiten Bauteils (4) eine verklebbare Interfaceschicht (3') durch kinetisches Kaltkompaktieren hergestellt wird.Method according to claim 1, characterized in that also on the surface ( 6 ) of the second component ( 4 ) a bondable interface layer ( 3 ' ) is produced by kinetic cold compaction. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das erste und das zweite Bauteil (1, 4) aus den gleichen Werkstoffen bestehen.Method according to claim 1 or 2, characterized in that the first and the second component ( 1 . 4 ) consist of the same materials. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das erste und das zweite Bauteil (1, 4) aus verschiedenen Werkstoffen bestehen.Method according to claim 1 or 2, characterized in that the first and the second component ( 1 . 4 ) consist of different materials. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass das erste Bauteil (1) und/oder das zweite Bauteil (4) transparent oder IR-transparent ist.Method according to one of claims 1 to 4, characterized in that the first component ( 1 ) and / or the second component ( 4 ) is transparent or IR transparent. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass der Beschichtungswerkstoff (3) und/oder der Kleber (5) elektrisch leitend oder ein Mikrowellen absorbierendes Material ist.Method according to one of claims 1 to 4, characterized in that the coating material ( 3 ) and / or the adhesive ( 5 ) is electrically conductive or a microwave absorbing material. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass der Beschichtungswerkstoff (3) und/oder der Kleber (5) Mikrowellen absorbierende Füllstoffe enthält.Method according to one of claims 1 to 4, characterized in that the coating material ( 3 ) and / or the adhesive ( 5 ) Contains microwave-absorbing fillers. Verfahren nach Anspruch 7, dadurch gekennzeichnet, dass als Füllstoff Carbonyleisen und/oder Nickelpulver und/oder Ruß verwendet wird.Method according to claim 7, characterized in that that as a filler Carbonyl iron and / or nickel powder and / or carbon black is used. Verfahren nach einem der Ansprüche 6 bis 8, dadurch gekennzeichnet, dass die Interfaceschicht (3) und/oder der Kleber (5) unter Freisetzung von Wärme aufschmelzbar und somit die Klebeverbindung lösbar ist.Method according to one of claims 6 to 8, characterized in that the interface layer ( 3 ) and / or the adhesive ( 5 ) can be melted with the release of heat and thus the adhesive bond is releasable.
DE10137713A 2001-08-06 2001-08-06 Method for producing an adhesive bond Expired - Fee Related DE10137713B4 (en)

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