DE10125696A1 - Power semiconductor module for making an external electrical connection has active semiconductor components and external electrical connections. - Google Patents
Power semiconductor module for making an external electrical connection has active semiconductor components and external electrical connections.Info
- Publication number
- DE10125696A1 DE10125696A1 DE10125696A DE10125696A DE10125696A1 DE 10125696 A1 DE10125696 A1 DE 10125696A1 DE 10125696 A DE10125696 A DE 10125696A DE 10125696 A DE10125696 A DE 10125696A DE 10125696 A1 DE10125696 A1 DE 10125696A1
- Authority
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- Germany
- Prior art keywords
- power semiconductor
- semiconductor module
- external electrical
- external
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Die Erfindung liegt auf dem Gebiet der Leistungshalbleitermo dule, die meist mehrere verschaltete elektronische Bauelemen te, insbesondere aktive Leistungshalbleiterelemente, enthal ten. Die Erfindung betrifft ein Leistungshalbleitermodul mit mindestens einem aktiven Halbleiterbauelement und mit äußeren elektrischen Anschlüssen zur elektrischen Kontaktierung des Leistungshalbleitermoduls.The invention is in the field of power semiconductors dule, which is usually several interconnected electronic components te, in particular active power semiconductor elements, contain The invention relates to a power semiconductor module at least one active semiconductor component and with external electrical connections for electrical contacting of the Power semiconductor module.
Ein derartiges Leistungshalbleitermodul geht aus der DE 199 04 575 C1 hervor. Diese bekannte Leistungshalbleiter modul umfasst ein Halbleiterschaltelement, z. B. einen MOSFET. Das Halbleiterschaltelement und ggf. weitere Bauelemente, z. B. Steuerelemente oder Sensoren, sind mit Leitungen verbun den, die zum externen Anschluss des Moduls dienen und dazu Anschlusskontakte aufweisen.Such a power semiconductor module is based on the DE 199 04 575 C1. This well-known power semiconductor module comprises a semiconductor switching element, e.g. B. a MOSFET. The semiconductor switching element and possibly further components, z. B. controls or sensors are connected to lines those that are used for the external connection of the module and for this Have connection contacts.
Die externen Anschlüsse bzw. Anschlusskontakte bilden elekt rische Eingänge und Ausgänge, an die die zum Betrieb notwen digen Potentiale angelegt werden. An den Anschlusskontakten können Steuersignale, aber auch Nutzsignale mit hohen Leis tungen anliegen.The external connections or connection contacts form elect Inputs and outputs to which the necessary for operation potentials are created. At the connection contacts can control signals, but also useful signals with high leis concerns.
Als Anschlusskontakte werden üblicherweise metallische An schlüsse verwendet, die als Schraubverbindungen, Steckstift verbinder oder als Lötösen zum Einlöten ausgebildet sind. Diese Anschlussarten sind aufwendig.Metallic contacts are usually used as connection contacts conclusions used as screw connections, pin connector or are designed as solder lugs for soldering. These types of connections are complex.
Insbesondere bei sogenannten intelligenten Leistungshalblei termodulen ("Intelligent Power Modules"/IPM) sind ver gleichsweise viele externe Anschlüsse erforderlich. Diese müssen aber möglichst kompakt und kostengünstig realisiert werden.Especially in the case of so-called intelligent semi-power Term modules ("Intelligent Power Modules" / IPM) are ver equally many external connections required. This but must be as compact and inexpensive as possible become.
Der vorliegenden Erfindung liegt daher die Aufgabe zugrunde, ein Leistungshalbleitermodul zu schaffen, das auch bei einer Vielzahl erforderlicher Anschlusskontakte kostengünstig her stellbar und einfach anschließbar ist.The present invention is therefore based on the object to create a power semiconductor module that also with a Large number of required connection contacts inexpensively is adjustable and easy to connect.
Diese Aufgabe wird erfindungsgemäß bei einem Halbleitermodul der eingangs genannten Art gelöst durch eine Leiterkarte, die mit einem internen Abschnitt innerhalb eines Modulgehäuses und mit einem externen Abschnitt außerhalb des Modulgehäuses verläuft und auf der sich Leiterbahnen befinden, die die äu ßeren elektrischen Anschlüsse bilden.This object is achieved according to the invention in a semiconductor module of the type mentioned solved by a circuit board that with an internal section within a module housing and with an external section outside the module housing runs and on which there are conductor tracks that the outer Make external electrical connections.
Ein erster wesentlicher Aspekt der vorliegenden Erfindung be steht damit darin, dass die elektrischen Anschlüsse als Lei terbahnen auf einer Leiterkarte oder Platine realisiert sind.A first essential aspect of the present invention be stands in that the electrical connections as Lei tracks on a printed circuit board or circuit board.
Der oben im Zusammenhang mit bekannten Leistungshalbleitermo dulen beschriebene Anschluss mittels Schraubverbindungen, Steckstiftverbindern oder Lötösen ist nicht mehr erforderlich und die Montage des Moduls damit wesentlich vereinfacht.The above in connection with known power semiconductors dulen described connection using screw connections, Pin connectors or solder lugs are no longer required and the assembly of the module is thus considerably simplified.
Der damit mögliche Verzicht auf derartige zusätzliche An schlusselemente reduziert die Kosten für das Leistungshalb leitermodul und verringert die Montagekosten sowie die Kosten für die zur Montage notwendigen Werkzeuge.The possible waiver of such additional contracts closing elements reduces the cost of performance module and reduces assembly costs and costs for the tools required for assembly.
Ein weiterer wesentlicher Vorteil der vorliegenden Erfindung besteht darin, dass die Leiterkarte eine sehr kompakte Bau weise bei dennoch hoher Anschlusskontaktdichte erlaubt. Another significant advantage of the present invention is that the circuit board is a very compact construction wisely allowed with a high connection contact density.
Ferner kann eine notwendig werdende Änderung der Anschlussbe legung durch entsprechende Modifikation der Leiterbahnführung auf der Leiterkarte schnell und flexibel realisiert werden.Furthermore, a change in the connection through appropriate modification of the conductor track can be implemented quickly and flexibly on the circuit board.
Die Leiterbahnen bilden vorteilhafterweise mit ihren Enden auf dem externen Abschnitt die Anschlusskontakte. Der externe Abschnitt kann beim Anwender unmittelbar in die eigentliche Anwendungs- oder Systemplatine derart eingesteckt und/oder eingelötet werden, dass ein direkter Kontakt zwischen den leiterkartenseitigen Anschlusskontakten und den korrespondie renden Anschlüssen auf der Systemplatine entsteht.The conductor tracks advantageously form with their ends the connection contacts on the external section. The external The user can go straight to the actual section Application or system board plugged in and / or be soldered in that direct contact between the PCB-side connection contacts and the correspondie connections on the system board.
Die Anschlusskontaktdichte kann nach einer vorteilhaften Aus gestaltung der Erfindung dadurch weiter erhöht werden, dass die Leiterbahnen auf beiden Seiten der Leiterkarte ausgebil det sind. Ein weiterer Vorteil dieser Ausgestaltung der Er findung liegt darin, dass bei Verwendung beidseitig mit Lei terbahnen versehener Leiterkarten eine Potentialtrennung im Modulstecker realisierbar ist.The connection contact density can be according to an advantageous design of the invention can be further increased in that the conductor tracks on both sides of the circuit board det. Another advantage of this configuration of the Er is that when used on both sides with lei conductor tracks provided a potential separation in the Module connector is realizable.
Die Leiterkarte kann nach einer bevorzugten Weiterbildung der Erfindung in Doppelfunktion auch als Schaltungsträger zur in ternen Entflechtung von Leiterbahnen dienen, wenn der interne Abschnitt der Leiterkarte einen Entflechtungsbereich auf weist, in dem die Leiterbahnen entflochten sind.According to a preferred further development, the printed circuit board can Invention in double function as a circuit carrier for in internal unbundling of traces if the internal Section of the circuit board points in which the conductor tracks are unbundled.
Ein Ausführungsbeispiel der Erfindung wird nachfolgend anhand einer Zeichnung näher erläutert; es zeigen:An embodiment of the invention is described below a drawing explained in more detail; show it:
Fig. 1 ein Ausführungsbeispiel eines erfindungsgemäßen Leistungshalbleitermoduls ohne Gehäuse in perspek tivischer Ansicht und Fig. 1 shows an embodiment of a power semiconductor module according to the invention without a housing in a perspective view and
Fig. 2 ein komplettes Leistungshalbleitermodul in perspek tivischer Ansicht. Fig. 2 shows a complete power semiconductor module in perspective view.
Fig. 1 zeigt den inneren Aufbau mit wesentlichen Komponenten eines Leistungshalbleitermoduls, bevor die internen Komponen ten in einem weiteren Fertigungsschritt von einem Modulgehäu se umgeben worden sind (vgl. Fig. 2). Fig. 1 shows the internal structure with essential components of a power semiconductor module before the internal components have been surrounded by a module housing in a further manufacturing step (cf. FIG. 2).
Das Leistungshalbleitermodul umfasst mehrere Trägerelemente 1, 2, 3, 4, die aus Keramiksubstraten bestehen. Auf den Trä gerelementen sind mehrere Halbleiterbauelemente 5 bis 10 an geordnet. Daneben sind weitere, z. B. bei einem intelligenten Leistungshalbleitermodul ("Intelligent Power Modules"/IPM) erforderliche Logikbausteine 12, 13, 14 vorgesehen. Die Halb leiterbauelemente 5 bis 10 und die Logikbausteine 12, 13, 14 sind über nicht näher dargestellte Leiterbahnen und über Bonddrähte 15 untereinander elektrisch verbunden und ver schaltet.The power semiconductor module comprises a plurality of carrier elements 1 , 2 , 3 , 4 , which consist of ceramic substrates. On the Trä gerelemente several semiconductor devices 5 to 10 are arranged. In addition, other, e.g. B. in an intelligent power semiconductor module ("Intelligent Power Modules" / IPM) required logic modules 12 , 13 , 14 are provided. The semi-conductor components 5 to 10 and the logic modules 12 , 13 , 14 are electrically connected to one another via interconnects (not shown) and via bonding wires 15 and switches.
Rechtwinklig zu den Trägerelementen 1, 2, 3, 4 sind eine Lei terkarte 20 und eine Platine 21 angeordnet. Die Platine 21 trägt weitere elektronische Bauelemente 24, 25 und individu elle externe Anschlussstifte 26. Die Platine 21 ist über Bonddrähte 28 mit den Leiterbahnen auf den Trägerelementen 1, 2, 3, 4 verbunden.At right angles to the carrier elements 1 , 2 , 3 , 4 , a Lei terkarte 20 and a circuit board 21 are arranged. The circuit board 21 carries further electronic components 24 , 25 and individual external connecting pins 26 . The circuit board 21 is connected to the conductor tracks on the carrier elements 1 , 2 , 3 , 4 via bond wires 28 .
Die Leiterkarte 20 weist auf beiden Seiten 30, 31 nur andeu tungsweise dargestellte Leiterbahnen 35 auf. Die Leiterbahnen 35 verlaufen zwischen einem internen Abschnitt 36 und einem externen Abschnitt 38 der Leiterkarte 20. Die Leiterbahnen 35 enden im externen Abschnitt 38 an externen Anschlusskontakten 39. Im internen Abschnitt 36, der im fertiggestellten Halb leitermodul von einem Gehäuse umgeben ist, sind die Leiter bahnen 35 über Bonddrähte 40 mit den Halbleiterbauelementen 5 bis 10 bzw. den Leiterbahnen auf den Trägerelementen 1, 2, 3, 4 elektrisch verbunden. The printed circuit board 20 has on both sides 30, 31 only schematically illustrated conductor tracks 35 . The conductor tracks 35 run between an internal section 36 and an external section 38 of the printed circuit board 20 . The conductor tracks 35 end in the external section 38 at external connection contacts 39 . In the internal section 36 , which is surrounded by a housing in the finished semiconductor module, the conductor tracks 35 are electrically connected via bond wires 40 to the semiconductor components 5 to 10 or the conductor tracks on the carrier elements 1 , 2 , 3 , 4 .
Im internen Abschnitt 36 ist eine nicht näher dargestellte Entflechtungszone 42 vorgesehen, in der die Leiterbahnen so weit entflochten sind, dass eine gut separierte und dennoch möglichst dicht Führung der Leiterbahnen 35 zu dem externen Abschnitt 38 hin realisiert ist.Provided in the internal section 36 is an unbundling zone 42 ( not shown in more detail), in which the conductor tracks are braided to such an extent that the conductor tracks 35 are guided in a well-separated and yet as close a manner as possible to the external section 38 .
Fig. 2 zeigt ein komplettes erfindungsgemäßes Halbleitermo dul. Die in Fig. 1 im einzelnen dargestellten Komponenten sind unter Bildung eines Modulgehäuses 50 mit einem Kunst stoff umspritzt. Dabei ragen die individuellen externen An schlussstifte 26 und der externe Abschnitt 38 der Leiterkarte 20 senkrecht heraus. Der Abschnitt 38 mit den dort endenden externen Anschlusskontakten 39 kann beim Anwender unmittelbar in eine (hier nicht dargestellte) Anwendungs- oder Systempla tine derart eingesteckt und/oder eingelötet werden, dass ein direkter Kontakt zwischen den leiterkartenseitigen Anschluss kontakten und den korrespondierenden Anschlüssen auf der Sys templatine entsteht. Fig. 2 shows a complete semiconductor module according to the invention. The components shown in detail in FIG. 1 are molded with a plastic to form a module housing 50 . The individual external connection pins 26 and the external section 38 of the printed circuit board 20 protrude vertically. The section 38 with the external connection contacts 39 ending there can be plugged and / or soldered directly into an application or system board (not shown here) in such a way that a direct contact between the circuit card-side connection contacts and the corresponding connections on the sys templatine is created.
Mit Verwendung der Leiterkarte als externes Anschlusselement weist das Halbleitermodul eine kostengünstig herstellbare ex terne Kontaktierbarkeit auf, die einfach zu montieren ist und insbesondere eine hohe Anzahl von Anschlusskontakten und eine hohe Kontaktdichte realisiert. Using the circuit card as an external connection element the semiconductor module has an inexpensive to produce ex internal contactability, which is easy to assemble and especially a large number of connection contacts and one high contact density realized.
11
, .
22
, .
33
, .
44
Trägerelemente
support elements
55
, .
66
, .
77
, .
88th
, .
99
, .
1010
Halbleiterbauelemente
Semiconductor devices
1212
, .
1313
, .
1414
Logikbausteine
logic devices
1515
Bonddrähte
Bond wires
2020
Leiterkarte
PCB
2121
Platine
circuit board
2424
, .
2525
elektronische Bauelemente
Electronic Components
2626
Anschlussstifte
pins
2828
Bonddrähte
Bond wires
3030
, .
3131
Seiten
pages
3535
Leiterbahnen
conductor tracks
3636
interner Abschnitt
internal section
3838
externer Abschnitt
external section
3939
externe Anschlusskontakte
external connection contacts
4040
Bonddrähte
Bond wires
4242
Entflechtungszone
disengagement zone
5050
Modulgehäuse
module housing
Claims (4)
mit mindestens einem aktiven Halbleiterbauelement (5 bis 10) und
mit äußeren elektrischen Anschlüssen zur elektrischen Kontaktierung des Leistungshalbleitermoduls,
gekennzeichnet durch
eine Leiterkarte (20),
die mit einem internen Abschnitt (36) innerhalb eines Modulgehäuses (50) und mit einem externen Abschnitt (38) außerhalb des Modulgehäuses (50) verläuft und
auf der sich Leiterbahnen (35) befinden, die die äußeren elektrischen Anschlüsse (39) bilden.1. Power semiconductor module
with at least one active semiconductor component ( 5 to 10 ) and
with external electrical connections for electrical contacting of the power semiconductor module,
marked by
a printed circuit board ( 20 ),
which runs with an internal section ( 36 ) inside a module housing ( 50 ) and with an external section ( 38 ) outside the module housing ( 50 ) and
on which there are conductor tracks ( 35 ) which form the outer electrical connections ( 39 ).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10125696A DE10125696A1 (en) | 2001-05-25 | 2001-05-25 | Power semiconductor module for making an external electrical connection has active semiconductor components and external electrical connections. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10125696A DE10125696A1 (en) | 2001-05-25 | 2001-05-25 | Power semiconductor module for making an external electrical connection has active semiconductor components and external electrical connections. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10125696A1 true DE10125696A1 (en) | 2002-12-05 |
Family
ID=7686237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE10125696A Ceased DE10125696A1 (en) | 2001-05-25 | 2001-05-25 | Power semiconductor module for making an external electrical connection has active semiconductor components and external electrical connections. |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE10125696A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6802745B2 (en) * | 2000-05-17 | 2004-10-12 | Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh & Co. Kg | Housing for accomodating a power semiconductor module and contact element for use in the housing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19912441A1 (en) * | 1999-03-19 | 2000-09-21 | Elfo Ag Sachseln Sachseln | Multi-chip module |
| DE19924994A1 (en) * | 1999-05-31 | 2000-12-21 | Tyco Electronics Logistics Ag | Sandwich-structured intelligent power module for building into appliances includes a printed circuit board for a logical unit with a recess fitted with a power substrate on a cooling plate connected by a wire bonding technique. |
| DE19924993A1 (en) * | 1999-05-31 | 2000-12-21 | Tyco Electronics Logistics Ag | Intelligent power module in sandwich construction |
| DE19924991A1 (en) * | 1999-05-31 | 2000-12-21 | Tyco Electronics Logistics Ag | Sandwich-structured intelligent power module for building into appliances includes a printed circuit board for a logical unit with a recess fitted with a power substrate on a cooling plate connected by a wire bonding technique. |
-
2001
- 2001-05-25 DE DE10125696A patent/DE10125696A1/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19912441A1 (en) * | 1999-03-19 | 2000-09-21 | Elfo Ag Sachseln Sachseln | Multi-chip module |
| DE19924994A1 (en) * | 1999-05-31 | 2000-12-21 | Tyco Electronics Logistics Ag | Sandwich-structured intelligent power module for building into appliances includes a printed circuit board for a logical unit with a recess fitted with a power substrate on a cooling plate connected by a wire bonding technique. |
| DE19924993A1 (en) * | 1999-05-31 | 2000-12-21 | Tyco Electronics Logistics Ag | Intelligent power module in sandwich construction |
| DE19924991A1 (en) * | 1999-05-31 | 2000-12-21 | Tyco Electronics Logistics Ag | Sandwich-structured intelligent power module for building into appliances includes a printed circuit board for a logical unit with a recess fitted with a power substrate on a cooling plate connected by a wire bonding technique. |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6802745B2 (en) * | 2000-05-17 | 2004-10-12 | Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh & Co. Kg | Housing for accomodating a power semiconductor module and contact element for use in the housing |
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| Date | Code | Title | Description |
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| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8131 | Rejection |