DE10100142A1 - Improvement of the heat-dissipative structure of a flip chip module involves covering the module completely with an epoxy resin to provide direct contact between the module and resin - Google Patents

Improvement of the heat-dissipative structure of a flip chip module involves covering the module completely with an epoxy resin to provide direct contact between the module and resin

Info

Publication number
DE10100142A1
DE10100142A1 DE10100142A DE10100142A DE10100142A1 DE 10100142 A1 DE10100142 A1 DE 10100142A1 DE 10100142 A DE10100142 A DE 10100142A DE 10100142 A DE10100142 A DE 10100142A DE 10100142 A1 DE10100142 A1 DE 10100142A1
Authority
DE
Germany
Prior art keywords
module
epoxy resin
flip
chip
chip module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10100142A
Other languages
German (de)
Inventor
Wen Lo Shieh
Yung Cheng Chuang
Ning Huang
Hui Pin Chen
Hua Wen Chiang
Chuang Ming Chang
Feng Chang Tu
Fu Yu Huang
Hsuan Jui Chang
Chia Chieh Hu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orient Semiconductor Electronics Ltd
Original Assignee
Orient Semiconductor Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orient Semiconductor Electronics Ltd filed Critical Orient Semiconductor Electronics Ltd
Publication of DE10100142A1 publication Critical patent/DE10100142A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

A heat-dissipative structure for a flip-chip module (1) comprises an epoxy resin (41) which completely surrounds the module (1). Direct contact is thus achieved between the epoxy resin (41) and the module (1) so that heat transfer is improved. The heat-dissipative structure of a flip-chip module (1) uses an epoxy resin (41) for completely surrounding the module (1). The module (1) is encased on the topside of a substrate (11) having solder balls (111) on its underside. Solder beads (211) between the chip (21) and the substrate (11) are completely surrounded by a filling material (31). The module (1) is covered with an epoxy resin (41) having conducting particles so that direct contact between the epoxy resin (41) and the module (1) is able to reduce the length of the heat transfer path, thus improving the efficiency of heat transfer. The substrate can be replaced by a lead frame.

Description

Die Erfindung betrifft das Gebiet der Kühlanordnungen und insbesondere eine Kühlanordnung eines Flip-Chip-Moduls.The invention relates to the field of cooling arrangements and in particular one Cooling arrangement of a flip-chip module.

Fig. 1A erläutert die herkömmliche Kühlanordnung eines Flip-Chip-Moduls. Wie gezeigt ist, besitzt das Flip-Chip-Modul 1' ein Substrat 11', das an der Unterseite mit mehreren Lötmittelkugeln 111' versehen ist. Auf der Oberseite des Substrats 11' ist ein Flip-Chip 12' durch Einschließen der metallischen Lötperlen 121' und des Chips 12' in Kunstharz 13' montiert. Auf dem Chip 12' ist eine Kühlabdeckung 16' durch ein Kühlmittel/Haftmittel 14' an der inneren Oberseite und durch ein Kühlmittel/Haftmittel 15' an der Unterseite der Kühl­ abdeckung 16' angebracht. Fig. 1A illustrates the conventional cooling structure of a flip-chip module. As shown, the flip-chip module 1 'has a substrate 11 ' which is provided on the underside with a plurality of solder balls 111 '. A flip chip 12 'is mounted on the top of the substrate 11 ' by enclosing the metallic solder bumps 121 'and the chip 12 ' in synthetic resin 13 '. On the chip 12 ', a cooling cover 16 ' is attached by a coolant / adhesive 14 'on the inner top and by a coolant / adhesive 15 ' on the underside of the cooling cover 16 '.

Fig. 1B erläutert eine weitere herkömmliche Kühlanordnung eines Flip-Chip- Moduls. Wie dargestellt ist, ist ein Flip-Chip 22' auf der Oberseite eines Sub­ strats 21' durch Einschließen der metallischen Lötperlen 221' und des Chips 22' mit Kunstharz 23' montiert. Eine ebene Deckplatte 27' ist an der Oberseite des Chips 22' durch ein Kühlmittel/Haftmittel 24' befestigt. Ein Kühlrahmen 271' ist unter der ebenen Deckplatte 27' angeordnet und durch ein Kühl­ harz/Haftmittel 25' mit der Unterseite der ebenen Deckplatte 27' verbunden. Ferner ist die Unterseite des Kühlrahmens 271' durch ein Kühlharz/Haftmittel 26' an der Oberseite eines Substrats 21' befestigt. FIG. 1B illustrates another conventional cooling structure of a flip-chip module. As shown, a flip chip 22 'is mounted on the top of a substrate 21 ' by including the metallic solder bumps 221 'and the chip 22 ' with resin 23 '. A flat cover plate 27 'is attached to the top of the chip 22 ' by a coolant / adhesive 24 '. A cooling frame 271 'is arranged under the flat cover plate 27 ' and connected by a cooling resin / adhesive 25 'to the underside of the flat cover plate 27 '. Further, the bottom of the cooling frame 271 'is fixed to the top of a substrate 21 ' by a cooling resin / adhesive 26 '.

Fig. 1C erläutert eine dritte herkömmliche Kühlanordnung eines Flip-Chips. Wie gezeigt ist, ist ein Flip-Chip 32' auf der Oberseite eines Substrats 31' durch Einschließen der metallischen Lötperlen 321' und des Chips 32' durch Kunstharz 33' montiert. Eine Kühlplatte 35' ist durch ein Kühlmittel 34' auf der Oberseite des Chips 32' befestigt. Fig. 1C illustrates a third conventional cooling structure of a flip chip. As shown, a flip chip 32 'is mounted on top of a substrate 31 ' by enclosing the metallic solder bumps 321 'and the chip 32 ' by resin 33 '. A cooling plate 35 'is attached to the top of the chip 32 ' by a coolant 34 '.

Obwohl die obenerwähnten herkömmlichen Anordnungen die durch den Chip erzeugte überschüssige Wärme ableiten können, ist es unmöglich, die Kühlan­ ordnung am Chip auf derselben Arbeitsplattform anzubringen, wodurch es notwendig ist, das gesamte Flip-Chip-Modul zu einer anderen Produktions­ straße umzusetzen, wodurch sich der Ablauf sehr kompliziert gestaltet. Über­ dies muß die durch den Chip erzeugte überschüssige Wärme zwischen dem Chip und der Kühlanordnung mit Hilfe eines Kühlmittels zur Kühlanordnung übertragen werden. Mit anderen Worten, weitere Abschnitte des Chips sind mit der Kühlanordnung nicht in Kontakt, wodurch es unmöglich ist, die durch den Chip erzeugte überschüssige Wärme schnell abzuführen. Da die Kühlan­ ordnung am Chip durch ein Kühlmittel befestigt ist und sogar die Elemente der Kühlanordnung miteinander durch ein Kühlmittel verbunden sind, so daß die Kühlanordnung aus Werkstoffen mit unterschiedlichen Ausdehnungskoef­ fizienten hergestellt ist, ist die Längenzunahme oder die Längenabnahme der Elemente der Kühlanordnung unterschiedlich, wodurch ernsthafte Probleme an der Kühlanordnung verursacht werden.Although the above-mentioned conventional arrangements are those through the chip generated excess heat can dissipate, it is impossible to the Kühlan  order on the chip on the same work platform, making it is necessary to move the entire flip chip module to another production implement road, which makes the process very complicated. about this must be the excess heat generated by the chip between the Chip and the cooling arrangement with the aid of a coolant for the cooling arrangement be transmitted. In other words, there are other sections of the chip not in contact with the cooling arrangement, which makes it impossible to get through quickly dissipate excess heat generated by the chip. Since the Kühlan order is attached to the chip by a coolant and even the elements the cooling arrangement are connected to one another by a coolant, so that the cooling arrangement made of materials with different expansion coefficients is produced is the increase or decrease in length of the Elements of the cooling arrangement differ, causing serious problems caused at the cooling arrangement.

Der Erfindung liegt daher die Aufgabe zugrunde, eine verbesserte Kühlanord­ nung eines Flip-Chip-Moduls zu schaffen, die die obenerwähnten Nachteile nicht besitzt.The invention is therefore based on the object of an improved cooling arrangement tion of a flip-chip module to create the disadvantages mentioned above does not own.

Die Aufgabe wird erfindungsgemäß gelöst durch eine Kühlanordnung nach Anspruch 1. Weiterbildungen der Erfindung sind im abhängigen Anspruch angegeben.The object is achieved according to the invention by a cooling arrangement Claim 1. Further developments of the invention are in the dependent claim specified.

Weitere Merkmale und Vorteile der Erfindung werden deutlich beim Lesen der folgenden Beschreibung bevorzugter Ausführungsformen, die auf die Zeichnung Bezug nimmt; Es zeigenFurther features and advantages of the invention will become clear when reading the following description of preferred embodiments based on the Drawing reference; Show it

Fig. 1A-1C verschiedene Kühlanordnungen des Standes der Technik eines Flip-Chip-Moduls; und Fig. 1A-1C, various cooling arrangements of the prior art of a flip-chip module; and

Fig. 2 eine Schnittansicht der erfindungsgemäßen Kühlanordnungen eines Flip-Chip-Moduls. Fig. 2 is a sectional view of the cooling arrangements of a flip-chip module according to the invention.

Wie in Fig. 2 gezeigt ist, verwendet die erfindungsgemäße Kühlanordnung eines Flip-Chip-Moduls Epoxidharz, um das Flip-Chip-Modul vollständig ein­ zuschließen. Wie gezeigt ist, enthält das Flip-Chip-Modul 1 ein Substrat 11, das eine mit mehreren Lötmittelkugeln 111 versehene Unterseite und eine Oberseite aufweist, auf der das Flip-Chip-Modul 1 montiert ist, wobei die Lötperlen 211 von einer Füllung 31 vollständig eingeschlossen sind.As shown in FIG. 2, the cooling arrangement according to the invention of a flip-chip module uses epoxy resin in order to completely enclose the flip-chip module. As shown, the flip-chip module 1 contains a substrate 11 which has a lower side provided with a plurality of solder balls 111 and an upper side on which the flip-chip module 1 is mounted, the solder balls 211 being completely filled with a filling 31 are included.

Dann ist das Flip-Chip-Modul durch Epoxidharz, das gut leitende Partikel, wie etwa Kupfer, Gold, Aluminium, Silber usw. enthält, bedeckt, so daß der di­ rekte Kontakt zwischen dem Epoxidharz 41 und dem Chip 21 die Länge des Wärmeübertragungswegs reduziert, wodurch der Kühlwirkungsgrad vergrö­ ßert ist.Then the flip-chip module is covered by epoxy resin, which contains highly conductive particles such as copper, gold, aluminum, silver etc., so that the direct contact between the epoxy resin 41 and the chip 21 reduces the length of the heat transfer path , whereby the cooling efficiency is increased.

Die Kühlanordnung kann auf dem Flip-Chip-Modul auf derselben Arbeits­ plattform, die zum Montieren des Flip-Chips dient, gebildet werden, wodurch es nicht notwendig ist, das Flip-Chip-Modul zu einer anderen Produktions­ straße umzusetzen und Herstellungszeit eingespart wird. Da der Chip vollstän­ dig in Epoxidharz eingeschlossen ist, sind ferner die Befestigung und die Kühlung des Chips verbessert. Da die Kühlanordnung außerdem lediglich aus einem einzigen Werkstoff, d. h. Epoxidharz, hergestellt ist, wird die Kühlan­ ordnung nicht durch unterschiedliche Ausdehnungskoeffizienten beeinflußt. Es sollte jedoch angemerkt werden, daß das Substrat 11 bei Bedarf durch ei­ nen Verdrahtungsrahmen ersetzt werden kann.The cooling arrangement can be formed on the flip-chip module on the same working platform that is used to mount the flip-chip, making it unnecessary to convert the flip-chip module to another production line and to save manufacturing time. Since the chip is completely enclosed in epoxy resin, the mounting and cooling of the chip are also improved. Since the cooling arrangement is also made from a single material, ie epoxy resin, the cooling arrangement is not influenced by different expansion coefficients. However, it should be noted that the substrate 11 can be replaced with a wiring frame if necessary.

Claims (2)

1. Kühlanordnung eines Flip-Chip-Moduls (1), das ein Substrat (11) mit einer Unterseite, die mit mehreren Lötmittelkugeln (111) versehen ist, und mit einer Oberseite, auf der das Flip-Chip-Modul (1) montiert ist, aufweist, wobei Lötperlen (211) auf einem Substrat (11) von einer Füllung (31) vollständig eingeschlossen sind,
dadurch gekennzeichnet, daß
sie Epoxidharz (41) enthält, das das Flip-Chip-Modul (1) vollständig umschließt, und
das Flip-Chip-Modul (1) von Epoxidharz, das leitende Partikel enthält, bedeckt ist, so daß der direkte Kontakt zwischen dem Epoxidharz (41) und dem Chip-Modul (1) die Länge des Wärmeübertragungswegs reduzieren kann, wodurch der Kühlwirkungsgrad erhöht ist.1. Cooling arrangement of a flip-chip module ( 1 ), which has a substrate ( 11 ) with an underside, which is provided with a plurality of solder balls ( 111 ), and with an upper side, on which the flip-chip module ( 1 ) is mounted having solder beads ( 211 ) on a substrate ( 11 ) are completely enclosed by a filling ( 31 ),
characterized in that
it contains epoxy resin ( 41 ) which completely encloses the flip-chip module ( 1 ), and
the flip chip module ( 1 ) is covered with epoxy resin containing conductive particles, so that the direct contact between the epoxy resin ( 41 ) and the chip module ( 1 ) can reduce the length of the heat transfer path, thereby increasing the cooling efficiency is. 2. Kühlanordnung nach Anspruch 1, dadurch gekennzeichnet, daß das Sub­ strat (11) durch einen Anschlußrahmen ersetzt ist.2. Cooling arrangement according to claim 1, characterized in that the sub strate ( 11 ) is replaced by a lead frame.
DE10100142A 2000-08-21 2001-01-03 Improvement of the heat-dissipative structure of a flip chip module involves covering the module completely with an epoxy resin to provide direct contact between the module and resin Withdrawn DE10100142A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89214600 2000-08-21

Publications (1)

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DE10100142A1 true DE10100142A1 (en) 2002-03-07

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Publication number Priority date Publication date Assignee Title
JP4881337B2 (en) 2008-03-12 2012-02-22 ルネサスエレクトロニクス株式会社 Semiconductor device
KR101023874B1 (en) 2008-10-22 2011-03-22 삼성에스디아이 주식회사 Protective circuit module and rechargeable battery including protective circuit module
CN109727935A (en) 2016-04-08 2019-05-07 Oppo广东移动通信有限公司 A kind of chip-packaging structure, terminal device and method

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