DE1004019B - Process for producing a layer on metallic workpieces that prevents soft solder from sticking - Google Patents
Process for producing a layer on metallic workpieces that prevents soft solder from stickingInfo
- Publication number
- DE1004019B DE1004019B DEB34085A DEB0034085A DE1004019B DE 1004019 B DE1004019 B DE 1004019B DE B34085 A DEB34085 A DE B34085A DE B0034085 A DEB0034085 A DE B0034085A DE 1004019 B DE1004019 B DE 1004019B
- Authority
- DE
- Germany
- Prior art keywords
- producing
- layer
- soft solder
- sticking
- workpieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/224—Anti-weld compositions; Braze stop-off compositions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Motor Or Generator Current Collectors (AREA)
Description
Verfahren zum Erzeugen einer das .Anhaften von Weichlot hindernden Schicht auf metallischen Werkstücken Die Erfindung bezieht sich auf ein Verfahren zum Erzeugen einer das Anhaften von Weichlot verhindernden Schicht auf metallischen, insbesondere aus Kupfer oder Kupferlegierungen bestehenden Werkstücken. Derartige Schichten sind beispielsweise zum örtlichen Begrenzen der Lötstellen an Kettengliedern und an Stromwendern bekannt, deren Stege unter Vermeidung von Lötbrücken mit den Enden der Ankerwicklungen durch Tauc'hlöten verbunden werden sollen.Method for producing a .Adhesion of soft solder preventing Layer on metallic workpieces The invention relates to a method to create a layer that prevents soft solder from sticking to metallic, in particular workpieces made of copper or copper alloys. Such Layers are used, for example, to locally delimit the soldering points on chain links and known to commutators, whose webs avoiding solder bridges with the Ends of the armature windings are to be connected by rope soldering.
Die Erfindung besteht darin, daß die Werkstücke in eine wäßrige Lösung getaucht werden, die Kaliumpermanganat und Bariumnitrat enthält. Zweckmäßigerweise wird die Lösung, die etwa 15 g Kaliumpermanganat und 30 g Bariumnitrat in 1 1 Wasser enthält, auf 80 bis 85° C erhitzt, um eine Niederschlagsbildung im Tauchbad zu vermeiden. Der beim Eintauchen des Werkstückes entstehende Überzug, der aus einer intermediären Barium-Mangan-Verbindung besteht, haftet auf den Werkstücken wesentlich fester als die bisher für diesen Zweck gebräuchlichen Überzüge aus Schwefelverbindungen, die aus Schwefelleherlösungen niedergeschlagen sind. Diesen bekannten Überzügen gegenüber hat der gemäß der Erfindung erzeugte Überzug auch noch den Vorteil, daß er keine physiologischen Wirkungen ergibt. Ein weiterer Vorteil des Verfahrens gemäß der Erfindung besteht darin, daß die Werkstücke nur einmal in die Lösung eingetaucht und danach nicht mehr durch einen Waschvorgang von etwa noch anhaftenden Rückständen gereinigt zu werden brauchen. Die entstandene Schicht ist auch sehr temperaturbeständig und widersteht den beim Löten gebräuchlichen Flußmitteln.The invention consists in that the workpieces in an aqueous solution which contains potassium permanganate and barium nitrate. Appropriately the solution is about 15 g of potassium permanganate and 30 g of barium nitrate in 1 1 of water contains, heated to 80 to 85 ° C in order to avoid precipitation in the immersion bath. The coating that occurs when the workpiece is immersed, which consists of an intermediate Barium-manganese connection, adheres to the workpieces much more firmly than the coatings of sulfur compounds previously used for this purpose, the are precipitated from sulfuric solutions. Opposite these known coatings the coating produced according to the invention also has the advantage that it does not have gives physiological effects. Another advantage of the method according to Invention consists in the fact that the workpieces are only immersed once in the solution and then no longer by washing any residues that may still be adhering to them need to be cleaned. The resulting layer is also very temperature-resistant and withstands the fluxes used in soldering.
Diejenigen Teile des Werkstückes, an denen Lot anhaften soll, werden in der Regel durch nachträgliehe Bearbeitung, bei Stromwendern vorzugsweise durch nachträgliches Einsägen der für das Anschließen der Wicklungsenden benötigten Sehlitze freigelegt.Those parts of the workpiece to which solder is supposed to adhere will be Usually by subsequent processing, in the case of commutators, preferably by Subsequent sawing in of the braided wire required for connecting the winding ends exposed.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEB34085A DE1004019B (en) | 1955-01-13 | 1955-01-13 | Process for producing a layer on metallic workpieces that prevents soft solder from sticking |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEB34085A DE1004019B (en) | 1955-01-13 | 1955-01-13 | Process for producing a layer on metallic workpieces that prevents soft solder from sticking |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1004019B true DE1004019B (en) | 1957-03-07 |
Family
ID=6964217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEB34085A Pending DE1004019B (en) | 1955-01-13 | 1955-01-13 | Process for producing a layer on metallic workpieces that prevents soft solder from sticking |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE1004019B (en) |
-
1955
- 1955-01-13 DE DEB34085A patent/DE1004019B/en active Pending
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