DE10009509A1 - Connecting element for connecting two circuit boards, has contact pin for first board and contact element for second board connected by slightly springy distance element - Google Patents

Connecting element for connecting two circuit boards, has contact pin for first board and contact element for second board connected by slightly springy distance element

Info

Publication number
DE10009509A1
DE10009509A1 DE2000109509 DE10009509A DE10009509A1 DE 10009509 A1 DE10009509 A1 DE 10009509A1 DE 2000109509 DE2000109509 DE 2000109509 DE 10009509 A DE10009509 A DE 10009509A DE 10009509 A1 DE10009509 A1 DE 10009509A1
Authority
DE
Germany
Prior art keywords
element according
connecting element
contact
circuit boards
contact pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2000109509
Other languages
German (de)
Inventor
Werner Kallee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuerth Elektronik GmbH and Co KG
Original Assignee
Wuerth Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuerth Elektronik GmbH and Co KG filed Critical Wuerth Elektronik GmbH and Co KG
Priority to DE2000109509 priority Critical patent/DE10009509A1/en
Publication of DE10009509A1 publication Critical patent/DE10009509A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2428Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10848Thinned leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10856Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10871Leads having an integral insert stop
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308Adaptations of leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads

Abstract

The connecting element is made in one piece from sheet material by stamping and has a contact pin (5) near one end for pressing into an opening in a circuit board and a contact element (1) near the other end for connecting to a second circuit board using surface mounted device technology, so that both contact elements are connected by a distance element that is slightly springy.

Description

Bei Leiterplatten ist es bekannt, Bauelemente beispielsweise dadurch anzubringen, dass sie in Einpresstechnik in durchkon­ taktierte Bohrungen eingepresst werden. Dabei wird ein an dem Bauelement angebrachter scharfkantiger Kontakt-Stift verwen­ det, der sich beim Einpressen in die metallisierte Wand einer Bohrung einpresst. Dadurch entsteht eine leitende Verbindung und eine mechanische Befestigung.In the case of printed circuit boards, components are known, for example by attaching them in press-fit technology in through con clocked holes are pressed. Thereby one at the Use the component with a sharp-edged contact pin det, which is when pressed into the metallized wall of a Pressed hole. This creates a conductive connection and a mechanical attachment.

Ebenfalls bekannt ist es, Bauelemente in SMD-Technik anzu­ bringen.It is also known to use components using SMD technology bring.

Der Erfindung liegt die Aufgabe zugrunde, eine Möglichkeit zur Verbindung zweier Leiterplatten zu schaffen.The invention has for its object a possibility to connect two circuit boards.

Zur Lösung dieser Aufgabe schlägt die Erfindung ein Verbin­ dungselement mit den Merkmalen des Anspruchs 1 vor. Weiter­ bildungen der Erfindung sind Gegenstand der abhängigen Ansprüche, deren Wortlaut ebenso wie der Wortlaut der Zusam­ menfassung durch Bezugnahme zum Inhalt der Beschreibung gemacht wird. To achieve this object, the invention proposes a connection tion element with the features of claim 1. Next formations of the invention are the subject of the dependent Claims whose wording as well as the wording of the Co by reference to the content of the description is made.  

Das Verbindungselement lässt sich durch Stanzen aus einem ebenen Stück Blech herstellen. Es enthält ein Kontaktelement, mit dem es an einer Leiterplatte in SMD-Technik angebracht werden kann. Es enthält mit Abstand von diesem Kontaktelement einen scharfkantigen Kontaktstift, mit dem es in eine Bohrung einer Leiterplatte eingepresst werden kann. Falls es sich um eine durchkontaktierte Bohrung handelt, kann das Verbindungs­ element nicht nur eine mechanische Verbindung zwischen den beiden Leiterplatten herstellen, sondern auch eine elektri­ sche Verbindung. Der Abstand zwischen den beiden Leiterplat­ ten wird im Wesentlichen durch das Abstandselement definiert, an dessen beiden gegenüberliegen Enden die beiden Kontaktele­ mente angebracht sind. Zur Verbindung zweier Leiterplatten, die im Normalfall parallel zueinander verlaufen sollen, werden in der Praxis dann mehrere gleichartige Verbindungs­ elemente verwendet.The connecting element can be punched out of a Make a flat piece of sheet metal. It contains a contact element with which it is attached to a printed circuit board using SMD technology can be. It contains at a distance from this contact element a sharp-edged contact pin with which it is inserted into a hole can be pressed into a circuit board. In case it is is a plated-through hole, the connection element not just a mechanical connection between the produce two circuit boards, but also an electrical connection. The distance between the two circuit boards is essentially defined by the spacer element, at its two opposite ends the two contacts elements are attached. For connecting two circuit boards, which should normally run parallel to each other, in practice then several similar connections elements used.

In Weiterbildung der Erfindung kann vorgesehen sein, dass das Verbindungselement in der Verbindungsrichtung federnd ausge­ bildet ist, also in einer Richtung, die die beiden Verbin­ dungsstellen des Verbindungselements mit den Leiterplatten verbindet.In a development of the invention it can be provided that the Connecting element in the connecting direction spring out is, that is in a direction that connects the two junction points of the connecting element with the circuit boards connects.

In Weiterbildung der Erfindung kann dass Abstandselement so aufgebaut sein, dass es mindestens eine Öse oder anders ausgedrückt ein Ringelement aufweist, wobei die weiterfüh­ renden Teile, also beispielsweise die Kontaktelemente, an den voneinander abgewandten Rändern des Ringelements angeordnet sind. Ein solches Ringelement ist eine Möglichkeit, wie man das Verbindungselement in Verbindungsrichtung federnd ausge­ stalten kann.In a development of the invention, the spacer element can be so be built that there is at least one eyelet or otherwise expressed a ring element, the continuation renden parts, so for example the contact elements on the edges of the ring element facing away from one another are. Such a ring element is one way how the connecting element resilient in the connecting direction can design.

Insbesondere kann in Weiterbildung vorgesehen sein, dass das Abstandselement mehrere hintereinander angeordnete derartige Ringe bzw. Ösen aufweist. In particular, it can be provided in further training that the Spacer several such arranged one behind the other Has rings or eyelets.  

Die Ringelemente bzw. Ösen können eine von einer Kreisform abweichende Form aufweisen, beispielsweise eine langgestreck­ te rechteckige Form, wobei vorzugsweise die Längsrichtung der rechteckigen Form senkrecht zur Verbindungsrichtung zwischen den beiden Leiterplatten verläuft, also parallel zu den beiden Leiterplatten.The ring elements or eyelets can be of a circular shape have a different shape, for example an elongated one te rectangular shape, preferably the longitudinal direction of the rectangular shape perpendicular to the direction of connection between the two circuit boards runs, i.e. parallel to the two circuit boards.

Eine andere von der Erfindung vorgeschlagene Möglichkeit, das Verbindungselement etwas federnd auszubilden, besteht darin, dass das Abstandselement mäanderförmig oder zickzackförmig ausgebildet wird.Another possibility proposed by the invention is that To make the connecting element somewhat resilient is to that the spacer element is meandering or zigzag is trained.

In Weiterbildung der Erfindung kann vorgesehen sein, dass das Verbindungselement einen das Einpressen begrenzenden Quersteg aufweisen kann. Dieser Quersteg ist unmittelbar am Ende des Kontaktstifts für die Bohrung angeordnet, also zwischen dem Kontaktstift und dem Abstandselement.In a development of the invention it can be provided that the Connecting element a cross bar limiting the pressing can have. This crossbar is immediately at the end of the Contact pins arranged for the bore, that is between the Contact pin and the spacer.

In Weiterbildung der Erfindung kann vorgesehen sein, dass bei mehreren durch Stege verbundenen Ösen die Stege in Längsrich­ tung ausgerichtet sind.In a development of the invention it can be provided that at several eyelets connected by bars, the bars in the longitudinal direction direction.

Erfindungsgemäß kann vorgesehen sein, dass mindestens ein in Verbindungsrichtung verlaufender Randbereich des Abstandsele­ ments rechtwinklig umgebogen wird. Beispielsweise können die Enden der Ösen rechtwinklig umgebogen werden.According to the invention it can be provided that at least one in Edge area of the spacer element running in the direction of connection is bent at right angles. For example, the Ends of the eyelets are bent at right angles.

Besonders günstig ist es, wenn, was ebenfalls vorgeschlagen wird, beide in Verbindungsrichtung verlaufende Randbereiche umgebogen sind, wobei die Erfindung ein Umbiegen derart bevorzugt, dass das Abstandselement einen U-förmigen Quer­ schnitt aufweist.It is particularly favorable if what is also proposed both edge areas running in the connection direction are bent, the invention a bending such preferred that the spacer has a U-shaped cross cut has.

Weitere Merkmale, Einzelheiten und Vorzüge der Erfindung ergeben sich aus der folgenden Beschreibung einer bevorzugten Ausführungsform der Erfindung sowie anhand der Zeichnung. Hierbei zeigen:Further features, details and advantages of the invention emerge from the following description of a preferred  Embodiment of the invention and with reference to the drawing. Here show:

Fig. 1 eine Draufsicht auf ein Verbindungselement nach der Erfindung; Figure 1 is a plan view of a connecting element according to the invention.

Fig. 2 eine der Fig. 1 entsprechende Draufsicht mit einem Schnitt durch zwei Leiterplatten; FIG. 2 shows a plan view corresponding to FIG. 1 with a section through two printed circuit boards;

Fig. 3 einen Schnitt längs Linie III-III in Fig. 2; Fig. 3 is a section along line III-III in Fig. 2;

Fig. 4 einen Schnitt längs Linie IV-IV in Fig. 1 durch einen Kontaktstift. Fig. 4 shows a section along line IV-IV in Fig. 1 by a contact pin.

Die Fig. 1 zeigt das von der Erfindung vorgeschlagene Verbindungselement unmittelbar nach dem Ausstanzen aus einem ebenen Stück Blech. Das Verbindungselement ist langgestreckt ausgebildet, so dass es zwei Enden aufweist. Jedes Ende ist einer der beiden zu verbindenden Leiterplatten zugeordnet. Das in Fig. 1 untere Ende enthält ein Kontaktelement 1, das so ausgebildet ist, dass es sich mit einer der beiden Leiter­ platten in SMD Technik verbinden lässt. Dieses Kontaktelement 1 ist über einen etwas schmaleren Steg 2 mit dem Abstandsele­ ment 3 verbunden, das seinerseits an dem gegenüberliegenden Ende über einen ähnlich aufgebauten Steg 4 mit einem Kontakt­ stift 5 verbunden ist. Der Kontaktstift 5 ist so dimensio­ niert, dass er in eine Bohrung einer der beiden Leiterplat­ ten, die in Fig. 2 als zwei Leiterplatten 6 dargestellt sind, eingepresst werden kann. Am äußeren Ende des Kontakt­ stifts 5 kann noch ein Führungselement 7 angeordnet werden, um das Einpressen zu erleichtern. Fig. 1 shows the connecting element proposed by the invention immediately after punching out of a flat piece of sheet metal. The connecting element is elongated, so that it has two ends. Each end is assigned to one of the two circuit boards to be connected. The lower end in Fig. 1 contains a contact element 1 , which is designed so that it can be connected to one of the two circuit boards in SMD technology. This contact element 1 is connected via a somewhat narrower web 2 to the Spacer element 3 , which in turn is connected to a contact pin 5 at the opposite end via a similarly constructed web 4 . The contact pin 5 is dimensioned such that it can be pressed into a bore of one of the two printed circuit boards, which are shown in FIG. 2 as two printed circuit boards 6 . At the outer end of the contact pin 5 , a guide element 7 can be arranged to facilitate the pressing.

Zwischen dem Kontaktstift 5 und dem Steg 4 des Abstandsele­ ments 3 ist noch ein Quersteg 8 ausgebildet, der von beiden Seitenkanten 9 des Kontaktstifts 5 quer vorsteht. Die Länge des Quersteg 8 entspricht etwa der Breite des Abstandselements. Der Quersteg dient dazu, das Einpressen des Kontakt­ stifts 5 in die Leiterplatte 6 zu begrenzen bzw. eine defi­ nierte Position des Verbindungselements herzustellen. Eine solche definierte Position ist dann besonders wichtig, wenn mehrere Verbindungselemente nach der Erfindung dazu verwendet werden sollen, zwei Leiterplatten parallel zueinander anzu­ bringen.Between the contact pin 5 and the web 4 of the spacer element 3 , a transverse web 8 is also formed, which projects transversely from both side edges 9 of the contact pin 5 . The length of the crosspiece 8 corresponds approximately to the width of the spacer element. The crossbar serves to limit the pressing of the contact pin 5 into the circuit board 6 or to produce a defi ned position of the connecting element. Such a defined position is particularly important when several connecting elements according to the invention are to be used to bring two circuit boards parallel to one another.

Das Abstandselement 3 enthält im dargestellten Beispiel drei hintereinander bzw. nebeneinander angeordnete Ösen 10. Jede Öse ist als Rechteck ausgebildet, mit einer ebenfalls recht­ eckigen Innenöffnung 11. Die Ösen 10 sind mit Hilfe von Stegen 12 miteinander verbunden, die jeweils in der Mitte der langen Seite der Ösen 10 angebracht sind. Die Ösen 10 bzw. Ringelemente dienen dazu, eine gewisse Federung des Verbin­ dungselements in Richtung der Verbindungslinie zwischen den beiden zu verbindenden Leiterplatten herzustellen. Die Stege 12, die die einzelnen Ringelemente 10 miteinander verbinden, weisen etwa die gleiche Breite auf wie die übrigen Stege 2 und 4. Diese Breite entspricht auch etwa der Breite des Kontaktstifts 5.In the example shown, the spacer element 3 contains three eyelets 10 arranged one behind the other or next to one another. Each eyelet is designed as a rectangle, with a likewise quite square inner opening 11 . The eyelets 10 are connected to one another by means of webs 12 , which are each attached in the middle of the long side of the eyelets 10 . The eyelets 10 or ring elements serve to produce a certain springing of the connec tion element in the direction of the connecting line between the two circuit boards to be connected. The webs 12 which connect the individual ring elements 10 to one another have approximately the same width as the other webs 2 and 4 . This width also corresponds approximately to the width of the contact pin 5 .

Die beiden in Längsrichtung verlaufenden Randbereiche des Verbindungselements der Fig. 1 werden nach dem Stanzen dann so umgebogen, dass sie im Querschnitt etwa rechtwinklig zu den verbleibenden Teilen des Verbindungselements verlaufen, siehe Fig. 2. Dort sind die rechten und linken Ränder der Ösen 10, die das Abstandselement 3 bilden, um etwa 90° aus der Ebene der Stege herausgebogen dargestellt. Das Kontakt­ element 1 und der Quersteg 8, der die Einpresstiefe begrenzt, sind nicht umgebogen. Fig. 2 zeigt das Verbindungselement, wie es in eine Leiterplatte 6 bereits eingepresst ist. Es handelt sich im dargestellten Beispiel um eine zweitlagige Leiterplatte. The two longitudinal edge regions of the connecting element of FIG. 1 are then bent after the punching in such a way that their cross section is approximately perpendicular to the remaining parts of the connecting element, see FIG. 2. There are the right and left edges of the eyelets 10 , which form the spacer 3 , shown bent out by approximately 90 ° from the plane of the webs. The contact element 1 and the crossbar 8 , which limits the insertion depth, are not bent. Fig. 2 shows the connecting element as it is already pressed into a circuit board 6 . In the example shown, it is a two-layer circuit board.

Die Fig. 3 zeigt einen Querschnitt etwa längs Linie III-III in Fig. 2. Die beiden Randbereiche sind in die gleiche Richtung umgebogen, so dass ein Querschnitt in Form eines U entsteht. Die Innenöffnungen 11 der Ringelemente 10 verlaufen so, dass sie noch in dem Eckbereich vorhanden sind. FIG. 3 shows a cross section approximately along line III-III in FIG. 2. The two edge regions are bent in the same direction, so that a cross section in the form of a U is created. The inner openings 11 of the ring elements 10 run such that they are still present in the corner area.

Die Fig. 4 zeigt einen Querschnitt durch den Kontaktstift 5. Es ist zu sehen, dass vier scharfe Kanten 13 stehen bleiben, mit denen der Kontaktstift in die Bohrung eingepresst werden kann. Die Breite des Kontaktstifts 5 wird dabei je nach der Größe der Öffnung gewählt, so dass auch unterschiedlich große Öffnungen mit der gleichen Blechstärke behandelt werden können. FIG. 4 shows a cross section through the contact pin 5. It can be seen that four sharp edges 13 remain with which the contact pin can be pressed into the bore. The width of the contact pin 5 is selected depending on the size of the opening, so that openings of different sizes can be treated with the same sheet thickness.

Claims (11)

1. Verbindungselement zur Verbindung zweier Leiterplatten miteinander, das
  • 1. 1.1 aus einem Stück Blech durch Stanzen hergestellt ist,
  • 2. 1.2 im Bereich seines eines Endes einen Kontaktstift (5) zum Einpressen in eine Öffnung einer ersten Leiterplatte (6) aufweist,
  • 3. 1.3 im Bereich seines anderen Endes ein Kontaktelement (1) zum Verbinden mit einer zweiten Leiterplatte in SMD-Technik aufweist, wobei
  • 4. 1.4 die beiden Kontaktelemente durch ein Abstandsele­ ment (3) verbunden sind, das
  • 5. 1.5 geringfügig federnd ausgebildet ist.
1. Connection element for connecting two circuit boards together, the
  • 1. 1.1 is made from a piece of sheet metal by stamping,
  • 2. 1.2 has in the area of its one end a contact pin ( 5 ) for pressing into an opening of a first printed circuit board ( 6 ),
  • 3. 1.3 in the area of its other end has a contact element ( 1 ) for connecting to a second printed circuit board in SMD technology, wherein
  • 4. 1.4 the two contact elements are connected by a spacer element ( 3 )
  • 5. 1.5 is slightly resilient.
2. Verbindungselement nach Anspruch 1, bei dem die Fede­ rungseigenschaft in Verbindungsrichtung vorhanden ist.2. Connecting element according to claim 1, wherein the Fede tion property is present in the connection direction. 3. Verbindungselement nach Anspruch 1 oder 2, bei dem das Abstützelement (3) mindestens eine Öse (10) bzw. Ring­ element aufweist, wobei die Kontaktelemente an den gegenüberliegenden Rändern der Öse (10) angeordnet sind. 3. Connecting element according to claim 1 or 2, wherein the support element ( 3 ) has at least one eyelet ( 10 ) or ring element, wherein the contact elements are arranged on the opposite edges of the eyelet ( 10 ). 4. Verbindungselement nach einem der vorhergehenden Ansprü­ che, bei dem mehrere durch Stege (12) verbundene Ösen (10) vorhanden sind.4. Connecting element according to one of the preceding claims, in which a plurality of eyelets ( 10 ) connected by webs ( 12 ) are present. 5. Verbindungselement nach einem der vorhergehenden Ansprü­ che, bei dem mehrere Ösen (10) hintereinander bzw. nebeneinander angeordnet sind.5. Connecting element according to one of the preceding claims, in which a plurality of eyelets ( 10 ) are arranged one behind the other or next to one another. 6. Verbindungselement nach einem der vorhergehenden Ansprü­ che, bei dem die Ösen (10) rechteckig ausgebildet sind, wobei die Längsrichtung der Rechtecke vorzugsweise senkrecht zur Verbindungsrichtung verläuft.6. Connecting element according to one of the preceding claims, in which the eyelets ( 10 ) are rectangular, the longitudinal direction of the rectangles preferably running perpendicular to the connecting direction. 7. Verbindungselement nach einem der vorhergehenden Ansprü­ che, mit einem das Einpressen begrenzenden Quersteg (8).7. Connecting element according to one of the preceding claims, with a transverse web ( 8 ) limiting the pressing in. 8. Verbindungselement nach einem der Ansprüche 4 bis 7, bei dem die Stege (2, 12, 4) längs einer Linie ausgerichtet sind.8. Connecting element according to one of claims 4 to 7, wherein the webs ( 2 , 12 , 4 ) are aligned along a line. 9. Verbindungselement nach einem der vorhergehenden Ansprü­ che, bei dem mindestens ein in Verbindungsrichtung ver­ laufender Randbereich des Abstandselements rechtwinklig umgebogen ist.9. Connecting element according to one of the preceding claims che, in which at least one ver in the connecting direction current edge area of the spacer element at right angles is bent. 10. Verbindungselement nach Anspruch 9, bei dem beide Randbereiche umgebogen sind.10. Connecting element according to claim 9, in which both Edge areas are bent. 11. Verbindungselement nach Anspruch 10, bei dem das Ab­ standselement einen U-förmigen Querschnitt aufweist.11. The connecting element according to claim 10, wherein the Ab Stand element has a U-shaped cross section.
DE2000109509 2000-02-29 2000-02-29 Connecting element for connecting two circuit boards, has contact pin for first board and contact element for second board connected by slightly springy distance element Withdrawn DE10009509A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE2000109509 DE10009509A1 (en) 2000-02-29 2000-02-29 Connecting element for connecting two circuit boards, has contact pin for first board and contact element for second board connected by slightly springy distance element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2000109509 DE10009509A1 (en) 2000-02-29 2000-02-29 Connecting element for connecting two circuit boards, has contact pin for first board and contact element for second board connected by slightly springy distance element

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DE2000109509 Withdrawn DE10009509A1 (en) 2000-02-29 2000-02-29 Connecting element for connecting two circuit boards, has contact pin for first board and contact element for second board connected by slightly springy distance element

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011119841A1 (en) 2011-12-01 2013-06-06 I F M Electronic Gmbh Electronic unit for electronic measuring device e.g. fluid flow measurement sensor, has contact pins whose one end is soldered to pad on the printed circuit board in which carrier is provided
DE102011119842A1 (en) 2011-12-01 2013-06-06 I F M Electronic Gmbh Electrical interconnect component for connection of printed circuit boards that are utilized in electronic measuring device, has contact pins whose end section stands in solder-free electrical contact with connection portion of component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7815776U1 (en) * 1978-05-26 1978-09-14 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig, 8510 Fuerth Device for fastening two printed circuit boards
DE7925592U1 (en) * 1979-09-10 1979-12-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen CONTACT TERMINALS FASTENED IN HOLES IN CIRCUIT PANELS
DE3744541A1 (en) * 1987-12-30 1989-07-13 Karl Lotter CONNECTING SYSTEM FOR DETACHABLE CONNECTING, IN PARTICULAR, TWO BOARDS, AND BOARD THEREFOR
DE69502040T2 (en) * 1994-02-22 1998-11-19 Molex Inc Electrical connector for printed circuit boards

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7815776U1 (en) * 1978-05-26 1978-09-14 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig, 8510 Fuerth Device for fastening two printed circuit boards
DE7925592U1 (en) * 1979-09-10 1979-12-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen CONTACT TERMINALS FASTENED IN HOLES IN CIRCUIT PANELS
DE3744541A1 (en) * 1987-12-30 1989-07-13 Karl Lotter CONNECTING SYSTEM FOR DETACHABLE CONNECTING, IN PARTICULAR, TWO BOARDS, AND BOARD THEREFOR
DE69502040T2 (en) * 1994-02-22 1998-11-19 Molex Inc Electrical connector for printed circuit boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011119841A1 (en) 2011-12-01 2013-06-06 I F M Electronic Gmbh Electronic unit for electronic measuring device e.g. fluid flow measurement sensor, has contact pins whose one end is soldered to pad on the printed circuit board in which carrier is provided
DE102011119842A1 (en) 2011-12-01 2013-06-06 I F M Electronic Gmbh Electrical interconnect component for connection of printed circuit boards that are utilized in electronic measuring device, has contact pins whose end section stands in solder-free electrical contact with connection portion of component

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