DD81673A - - Google Patents
Info
- Publication number
- DD81673A DD81673A DD81673DA DD81673A DD 81673 A DD81673 A DD 81673A DD 81673D A DD81673D A DD 81673DA DD 81673 A DD81673 A DD 81673A
- Authority
- DD
- German Democratic Republic
Links
Publications (1)
Publication Number | Publication Date |
---|---|
DD81673A true DD81673A (de) |
Family
ID=267908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DD81673D DD81673A (de) |
Country Status (1)
Country | Link |
---|---|
DD (1) | DD81673A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4422216A1 (de) * | 1993-06-25 | 1995-01-05 | Fuji Electric Co Ltd | Mehrlagige metallische Leiterplatte und gegossener Baustein |
-
0
- DD DD81673D patent/DD81673A/xx unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4422216A1 (de) * | 1993-06-25 | 1995-01-05 | Fuji Electric Co Ltd | Mehrlagige metallische Leiterplatte und gegossener Baustein |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5672414A (en) | Multilayered printed board structure | |
US10154593B2 (en) | Electronic assembly group and method for producing the same | |
CN109121285B (zh) | 一种电路板结构及电子设备 | |
CN101958313B (zh) | 半导体模块 | |
US20220157776A1 (en) | Semiconductor package | |
CN103036221B (zh) | 母线电容模块及功率单元 | |
US11122693B2 (en) | Method for forming laminated circuit board | |
CN109688696A (zh) | 电路板装置、电路板装置的制作工艺及电子设备 | |
CN103187405B (zh) | 用于层叠封装器件减少应变的方法和装置 | |
DD81673A (de) |