DD81673A - - Google Patents

Info

Publication number
DD81673A
DD81673A DD81673DA DD81673A DD 81673 A DD81673 A DD 81673A DD 81673D A DD81673D A DD 81673DA DD 81673 A DD81673 A DD 81673A
Authority
DD
German Democratic Republic
Application number
Publication of DD81673A publication Critical patent/DD81673A/xx

Links

DD81673D DD81673A (OSRAM)

Publications (1)

Publication Number Publication Date
DD81673A true DD81673A (OSRAM)

Family

ID=267908

Family Applications (1)

Application Number Title Priority Date Filing Date
DD81673D DD81673A (OSRAM)

Country Status (1)

Country Link
DD (1) DD81673A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4422216A1 (de) * 1993-06-25 1995-01-05 Fuji Electric Co Ltd Mehrlagige metallische Leiterplatte und gegossener Baustein

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4422216A1 (de) * 1993-06-25 1995-01-05 Fuji Electric Co Ltd Mehrlagige metallische Leiterplatte und gegossener Baustein

Similar Documents

Publication Publication Date Title
US5672414A (en) Multilayered printed board structure
US10154593B2 (en) Electronic assembly group and method for producing the same
CN109121285B (zh) 一种电路板结构及电子设备
US20240290751A1 (en) Semiconductor package
CN103036221B (zh) 母线电容模块及功率单元
JP6489713B2 (ja) 積層回路基板の形成方法及びこれにより形成された積層回路基板
CN109688696A (zh) 电路板装置、电路板装置的制作工艺及电子设备
EP4283662B1 (en) Method of attaching a terminal to a metal substrate structure for a semiconductor power module
TWI474411B (zh) 半導體裝置結構及其製造方法
DD81673A (OSRAM)