DD252473A1

DD252473A1 - HOUSING FOR INTEGRATED OPTOELECTRONIC SYSTEMS

Info

Publication number: DD252473A1
Application number: DD86293721A
Authority: DD
Inventors: Thomas Sichting; Hans-Juergen Thunack
Original assignee: Berlin Treptow Veb K
Priority date: 1986-08-19
Filing date: 1986-08-19
Publication date: 1987-12-16

Abstract

Derartige integrierte optoelektronische Systeme werden vorrangig zum Aufbau optischer Sensor- und Anzeigesysteme verwendet. Zur lichtdichten Trennung der im optoelektronischen System enthaltenen optoelektronischen Halbleiterbauelemente und Halbleiterchipbauelemente wird ein aus mehreren Kammern bestehendes Gehaeuse verwendet. Dadurch entfaellt die bisher uebliche Einzelpassivierung mit einer lichtundurchlaessigen Abdeckmasse. Naben der Vereinfachung des technologischen Fertigungsablaufes werden Fehlererscheinungen durch auftretende mechanische Spannungen vermieden und somit die Zuverlaessigkeit und der Integrationsgrad wesentlich erhoeht. Fig. 1Such integrated optoelectronic systems are primarily used for the construction of optical sensor and display systems. For light-tight separation of the optoelectronic semiconductor components and semiconductor chip components contained in the optoelectronic system, a housing consisting of a plurality of chambers is used. This eliminates the hitherto customary individual passivation with an opaque covering compound. Hubs of the simplification of the technological manufacturing process error symptoms are avoided by occurring mechanical stresses and thus significantly increases the reliability and degree of integration. Fig. 1

Description

embodiment

Die Erfindung wird nachstehend erläutert. Die zugehörigen Zeichnungen zeigen:The invention will be explained below. The accompanying drawings show:

Fig. 1: Schnittdarstellung eines hybridintegrierten optoelektronischen Systems mit dem Gehäuse Fig.2: Draufsicht des in Fig. 1 dargestellten Systems1: sectional view of a hybrid integrated optoelectronic system with the housing FIG. 2: top view of the system shown in FIG

Auf einem gemeinsamen Substrat 6 sind gem. Fig. 1 ein optoelektronisches Halbleiterbauelement 2 sowie mehrere Halbleiterchipbauelemente3 angeordnet, die über Drahtbondverbindungen 4elektrisch mit den Leiterstrukturen des Substrats 6 verbunden sind. An den Längsseiten des Substrates 6 sind Anschlußarmaturen 5 angeordnet, über welche der elektrische Kontakt realisiert wird. Zur Verkapselung des mit den Bauelementen 2; 3 und Anschlußarmaturen 5 versehenen Substrates 6 dient das Gehäuse 1, welches durch die konstruktive Gestaltung in zwei Kammern 10; 11 unterteilt ist, von denen die eine Kammer 10 gem. Fig. 2 mit ihrem quadratischen Querschnitt im Mittelfeld des Gehäuses 1 angeordnet ist und zur Aufnahme des optoelektronischen Bauelementes 2 dient, während die andere Kammer 11, in der die Halbleiterchipbauelemente 3 angeordnet sind, die erste Kammer 10 ringförmig umschließt. Dadurch ist eine optische Trennung des optoelektronischen Halbleiterbauelementes 2 von den Halbleiterchipbauelementen 3 gewährleistet. Das Substrat 6 ist mit dem Gehäuse 1 im Bereich der Auflageflächen 7 unter Verwendung eines lichtundurchlässigen Epoxidharzklebstoffes 12 formschlüssig verbunden. Der durch die Rückseite des Substrates 6 und dem Gehäuserand gebildete Hohlraum ist mit einem Epoxidharz 8 ausgefüllt, wodurch eine zusätzliche Fixierung der Anschiußarmaturen 5 sowie der hermetische Verschluß des optoelektronischen Systems erreicht wird. ) On a common substrate 6 gem. 1, an optoelectronic semiconductor component 2 and a plurality of semiconductor chip components 3 are arranged, which are electrically connected via wire bond connections 4 to the conductor structures of the substrate 6. On the longitudinal sides of the substrate 6 connecting fittings 5 are arranged, via which the electrical contact is realized. For encapsulation of the with the components 2; 3 and connection fittings 5 provided substrate 6, the housing 1, which by the structural design in two chambers 10; 11 is divided, of which a chamber 10 gem. Fig. 2 is arranged with its square cross-section in the center of the housing 1 and serves to receive the optoelectronic component 2, while the other chamber 11, in which the semiconductor chip devices 3 are arranged, the first chamber 10 surrounds annular. As a result, an optical separation of the optoelectronic semiconductor component 2 is ensured by the semiconductor chip devices 3. The substrate 6 is positively connected to the housing 1 in the region of the bearing surfaces 7 using an opaque epoxy adhesive 12. The cavity formed by the back of the substrate 6 and the edge of the housing is filled with an epoxy resin 8, whereby an additional fixation of Anschiußarmaturen 5 and the hermetic closure of the optoelectronic system is achieved. )

Für optoelektronische Systeme, die mehrere optoelektronische Halbleiterbauelemente 2 enthalten, kann das Gehäuse 1 in mehr als zwei Kammern 10; 11 unterteilt sein.For optoelectronic systems which contain a plurality of optoelectronic semiconductor components 2, the housing 1 can be divided into more than two chambers 10; 11 be divided.

Die oberhalb des optoelektronischen Halbleiterbauelementes 2 im Gehäuse 1 vorgesehene Lichteinfallöffnung ist mit einem Fenster 9 verschlossen, welches in die dafür vorgesehene Vertiefung im Gehäuse 1 mit Epoxidharz eingeklebt ist, wodurch der Schutz des optoelektronischen Halbleiterbauelementes 2 gegenüber Umwelteinflüssen gegeben ist. Es besteht weiterhin die Möglichkeit, den Schutz gegenüber Umwelteinflüssen beispielsweise durch eine Überzugsschicht aus einem transparenten Kunstharz zu realisieren, wodurch das Fenster 9 entfallen kann.The light incident opening provided above the optoelectronic semiconductor component 2 in the housing 1 is closed by a window 9, which is glued into the recess provided in the housing 1 with epoxy resin, whereby the protection of the optoelectronic semiconductor component 2 against environmental influences is ensured. There is also the possibility to realize the protection against environmental influences, for example, by a coating layer of a transparent synthetic resin, whereby the window 9 can be omitted.

Durch den Mehrkammeraufbau des Gehäuses ist der technische und ökonomische aufwendige Arbeitsgang der Einzelpassivierung mit lichtundurchlässiger Abdeckmasse überflüssig. Das bewirkt eine wesentliche Steigerung der Produktionsausbeute, da die Einzelpassivierung technisch schwer zu handhaben ist. Eine Arbeitsverkürzung wird dadurch erreicht, daß die lichtdichte Passivierung und der Gehäuseverschluß in einem technisch einfach zu realisierendem Arbeitsgang erfolgt. Durch den Wegfall der Abdeckmasse für Halbleiterchipbauelemente werden Fehlererscheinungen durch auftretende mechanische Spannungen vermieden, wodurch die Zuverlässigkeit erhöht wird.Due to the multi-chamber structure of the housing, the technical and economical complex operation of the individual passivation with opaque covering compound is superfluous. This causes a significant increase in production yield, since the individual passivation is technically difficult to handle. A shortening of work is achieved in that the light-tight passivation and the housing closure takes place in a technically easy to realizing operation. By eliminating the covering compound for semiconductor chip components error phenomena are avoided by occurring mechanical stresses, whereby the reliability is increased.

Claims

Housing for integrated optoelectronic systems, characterized in that a light-tight separation of the on a common substrate (6) arranged optoelectronic semiconductor devices (2) and semiconductor chip devices (3) consists of a metal or plastic housing (1) is used, the two or more chambers (10; 11), wherein in one chamber (10) or in a plurality of chambers (10) the optoelectronic semiconductor components (2) and in the other chamber (11) or in a plurality of chambers (11) light-tightly arranged the semiconductor chip devices (3) and hermetically fired.

For this 1 page drawings.

Field of application of the invention

The invention relates to the common encapsulation of optoelectronic semiconductor components with semiconductor chip components, preferably in hybrid technology. Such integrated optoelectronic systems are primarily used for the construction of optical sensor and display systems.

Characteristic of the known state of the art

For the encapsulation of optoelectronic semiconductor components in connection with semiconductor chip components of complete structure, different basic technologies are currently used. It is known to provide display components with a translucent cap which is closed at the back with a cold-curing multi-component molding material. In addition to the light-emitting diodes, digital drive circuits in chip form are also integrated in the display component. The cap of the display device is translucent over the entire surface and has the disadvantage that the integration of analog semiconductor chip devices whose electrical parameters are adversely affected by the influence of light, together with optoelectronic semiconductor devices is not possible (DD-WP 231167).

It is also known to cap an optoelectronic sensor system in a hermetic metal housing with a window. The optoelectronic semiconductor components and the semiconductor chip components are integrated on a common substrate: In order to guarantee the electrical parameters of the semiconductor chip components, the semiconductor chip components are coated with an opaque covering compound (DD-WP 232376). A disadvantage of this arrangement is that the method of wrapping with opaque covering mass limits the degree of integration, since at a high degree of integration by the compulsory small distances of the semiconductor chip components to each other, a concealment of the covering compound can not be prevented. Due to the resulting accumulation of material of the covering compound, mechanical stresses occur under thermal stress, which can lead to the destruction of the semiconductor chip component or the wire bond connections. As a result, the reliability decreases at higher degrees of integration of the semiconductor chip components on a substrate carrier. Furthermore, the method of wrapping with opaque covering mass requires a high technological workload, which adversely affects the economics of production.

Object of the invention

When using the invention, the reliability is increased, the production cost is reduced, simplifies the assembly dismantling and increases the production yield.

Explanation of the essence of the invention

The object of the invention is to optically isolate the optoelectronic semiconductor components and semiconductor chip devices in an integrated optoelectronic system without using an opaque covering compound.

It is necessary to electronically process the electrical signals generated in optoelectronic semiconductor components, in particular receiver components, which generally have a very low signal level, in order to avoid the negative influence of electrical and magnetic interferences as well as of line resistances. The semiconductor chip devices arranged for this reason in the immediate vicinity of the optoelectronic semiconductor component must be light-tightly shielded from the incident on optoelectronic components or emitted light radiation, since the light radiation would change the electrical parameters of unprotected semiconductor chip devices uncontrolled and thus the required function of the processing electronics is not guaranteed.

According to the invention, the object is achieved in that a housing consisting of several chambers, which light-tightly separate the arranged on a substrate optoelectronic semiconductor devices and semiconductor chip devices, is used. '·