DD237269A1 - Tin bath soldering - Google Patents

Abstract

The invention relates to a Zinnbad Loetgeraet for flexible use for various tin plating and soldering processes, applicable in particular for the electronic and telecommunications industry. The object of the invention is, by using a simple and straightforward mechanism, to enable the removal of oxide layers and contaminants, a constant immersion depth and a stably available tin alloy for a quality-appropriate soldering process. According to the invention, the object is achieved by arranging in the tin melting vessel 1 a guide tube 2 with a pourable vessel 3 which is movable vertically in said tin melting vessel 1. Fig. 1

Description

embodiment

The invention will be explained in more detail below using an exemplary embodiment. The accompanying drawings show:

Fig. 1: schematic representation of the tin bath soldering apparatus according to the invention in vertical section with immersed

, Scoop vessel, which is in the lowest position Fig.2: a corresponding representation with the highest position of the scoop

In Fig. 1, 1 denotes a tin smelting vessel, which is installed by means not shown, for example, in an automatic soldering device. The tin smelting vessel 1 contains a heated tin melt 4 with the surface 8. A jib 13, which in turn is fixedly connected to a scoop vessel 3, is fastened to a vertically movable push rod 11 next to the tin smelting vessel 1, for example driven by a pneumatic cylinder 12. The scoop vessel 3 is enclosed by a guide tube 2 with little play, so that the scoop vessel 3 can perform a relative to the guide tube 2 vertical movement. The guide tube 2 is fixedly connected to the tin melting vessel 1 by means not shown. Above the tin melting vessel 1, the transport path of the parts to be tinned and / or soldered, for example, coils 14 with the connection points 15th

Fig. 1 shows the rest position of the tin bath soldering machine. The scoop 3 is in the lowest position. In this case, fresh tin melt flows through lateral openings 16 of the guide tube 2 into the guide tube 2 above the scoop vessel 3 until a compensation of the surface 7 of the molten tin 5 with the surface 8 of the tin melt 4 has taken place. During the upward movement of the scoop vessel 3, the molten tin 5 is raised and flows over the upper edge 10 of the guide tube 2 as soon as the surface 7 of the molten tin 5 has reached the upper edge 10 of the guide tube 2 , The drainage takes place until the upper edge 9 of the scoop vessel 3 has reached the upper edge 10 of the guide tube 2. In the scoop 3, a meniscus of certain height is formed, which guarantees, for example, the soldering of coils 14 with the connection points 15 with a defined immersion depth. , ..

During the downward movement of the scoop vessel 3, the tin melt below it is displaced by one or more openings 17 at the lower end of the guide tube 2 in the tin melt 4 until the scoop vessel 3 has reached the lowest position. The tin bath soldering device according to the invention also enables the simultaneous operation of several scoops according to the illustrated principle in a tin smelting vessel 1.

Claims (3)

Invention claim: 1. tin bath soldering machine with a heated tin smelting vessel, characterized in that a firmly connected to the tin smelting vessel guide tube (2) is arranged vertically in the tin melt (4) and in this guide tube (2) vertically, vertically movable scoop vessel (3) , 2. tin bath soldering appliance according to claim 1, characterized in that the guide tube (2) arranged laterally, suitable openings (16), in this way a short-term flow of tin melt (5) into the interior of the guide tube (2) or scoop (3) and allow appropriate mixing. 3. tin bath soldering apparatus according to claim 1, characterized in that the guide tube (2) at the lower end openings (17) via which can drain during the lowering of the scoop to be displaced tin melt and in this way a trouble lowering the scoop is made possible , For this 2 pages drawings Field of application of the invention The invention relates to a tin bath soldering device for the tinning and / or soldering of parts, in particular for use in electronic and telecommunications device construction. Characteristic of the known technical solutions It is known that, especially in the field of electrical engineering / electronics and telecommunications for soldering in some cases specially designed soldering and soldering machines are used. For the quality-compliant implementation of the tin plating and soldering process, it is important that by the on ' Zinnbadoberfläche particularly critical oxide and slag formation and load-dependent changes of the tin alloy, quality-reducing and corresponding adverse effects largely exclude. For this purpose, generated by special pumps and devices Schwallächen or adapted constructed surge soldering machines and mini-wave soldering devices are known. Also find soldering equipment use, which are equipped to remove the oxide layers with corresponding scrapers, doctor blades or wiper mechanisms or covering devices. Also by arranged in the tin bath, vertical movable container or scoops, optionally defined according to the principle of communicating vessels and specification realizable immersion depths can be provided oxide layer-free amounts of tin for the immediate soldering process. A disadvantage of the known devices and solutions appears that they usually require relatively complicated mechanisms associated therewith have certain susceptibility or need continuous maintenance costs. Design and known sizes and correspondingly moving masses and functional elements do not allow in each case an optimal adaptation and cost-minimum solution with regard to the respective parts to be tinned and, where appropriate, appropriate classification in an automatic process. Object of the invention The aim and purpose of the invention is to provide a Zinnbad soldering machine without the known disadvantages, which is constructed using a simple mechanism uncomplicated and flexible in its execution to the respective requirement. Explanation of the essence of the invention The invention has for its object to provide a Zinnbad soldering machine, which solves the problems of oxide formation, the change of the tin alloy and the constant maintenance of the immersion depth, while it is simple and one in relation to the tinned and / or to soldering parts has minimal space requirements. According to the invention the object is achieved in that in a tin bath a fixed guide tube is by a relatively vertical to the guide tube with low Spiei movable scoop is. The upper edge of the scoop is in its uppermost position of the scoop both above the upper edge of the guide tube and over the surface of the tin melt in the tin bath. Since there is little play between the guide tube and the scoop, which is located above the scoop vessel at its lowest position tin melt is raised in the upward movement of the scoop with. This tin melt flows over the upper edge of the guide tube. Oxides or accumulated impurities formed on the surface are thus eliminated and, with the scoop vessel with defined level setting, tin melt is provided in any desired reproducible manner for exactly limited soldering or immersion depths of the parts to be tin-plated. Through lateral openings in the guide tube flows at the lower position of the scoop from the tin bath new tin melt, so that a constant mixing and a corresponding exchange takes place. In this way, adverse changes in the tin melt in the scoop vessel are largely excluded and thus guarantees reproducible and stable soldering conditions.