DD141884A2 - LOETABLE ELECTRICAL CONNECTION - Google Patents
LOETABLE ELECTRICAL CONNECTION Download PDFInfo
- Publication number
- DD141884A2 DD141884A2 DD20671678A DD20671678A DD141884A2 DD 141884 A2 DD141884 A2 DD 141884A2 DD 20671678 A DD20671678 A DD 20671678A DD 20671678 A DD20671678 A DD 20671678A DD 141884 A2 DD141884 A2 DD 141884A2
- Authority
- DD
- German Democratic Republic
- Prior art keywords
- electrical connection
- connection point
- conductors
- conductor
- item
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/14—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by wrapping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Securing Of Glass Panes Or The Like (AREA)
Abstract
Die Erfindung betrifft elektrische Verbindungen von Leitern untereinander bzw. mit Anschlusskontakten unter Verwendung von hohlnietfoermigen, loetfaehigen Elementen, welche die zu verbindenden elektrischen Leiter aufnehmen und mit diesen zusammen in einem Loetprozess zu einer homogenen Loetstelle verbunden werden nach WP 130 017. Ausgehend von dem Ziel, die Zahl der Montagearbeitszugaenge bei der Loetstellenvorbereitung zu verringern, liegt ihr die Aufgabe zugrunde, die in der Hauptanmeldung vorgeschlagenen Loetverbindungsstellen zu vereinfachen. Dies erfolgt erfindungsgemaess dadurch, dass ein an der Verbindung teilnehmender Leiter an seinem Ende unmittelbar zu dem hohlnietfoermigen Element ausgebildet ist.-Fig.2-The invention relates to electrical connections of conductors with each other or with terminal contacts using hollow rietfoermigen, loetfaehigen elements which receive the electrical conductors to be connected and connected together with these in a Loetprozess to a homogeneous Loetstelle after WP 130 017. Based on the goal, The task of reducing the number of assembly workpieces involved in job preparation is to simplify the solder joints proposed in the parent application. This is done according to the invention in that a conductor participating in the connection is formed at its end directly to the hollow riveting element.
Description
Lötbare elektrische VerbindungsstelleSolderable electrical connection
Anwendrings ge biet der ErfindungApplication ring area of the invention
Die Erfindung betrifft die elektrische Verbindung von Leiterenden untereinander bzw, mit Anschlußkontakten und dergleichen durch Löten,The invention relates to the electrical connection of conductor ends with each other or, with terminal contacts and the like by soldering,
Charakteristik der bekannten technischen LösungenCharacteristic of the known technical solutions
In dem Patent yi35"ö-/if ' wurde bereitsIn the patent y i35 "ö- / if 'has already been
eine Anordnung von in einem einzigen Lötvorgang herstellbaren elektrischen Verbindungen mit Leitern verschiedener Arten, Formen und Abmessungen vorgeschlagen, wobei in einem isolierenden, flächenförmigen Träger hohlnietföx'mige, lötfähige Elemente eingebracht sind, welche wiederum die zu verbindenden Enden der elektrischen Leiter aufnehmen, und Leiter und Elemente nachfolgend mittels Lot zu einer homogenen Lötstelle verbunden werden« Damit lassen sich in vorteilhafter Weise Lötverbindungen massenhaft gleichzeitig herstellen« Als nachteilig bei der Herstellung derartiger Verbindungen wurde jedoch die Bestückung des Trägers mit den einzelnen Elementen und das nachträgliche Zusammenführen mit den Leiterenden in einem separaten Arbeitsgang empfunden.an arrangement of producible in a single soldering electrical connections with conductors of various types, shapes and dimensions proposed, wherein in an insulating, sheet-like carrier hollow rietföx'mige, solderable elements are introduced, which in turn receive the ends of the electrical conductors to be connected, and conductors and Elements are subsequently connected by means of solder to form a homogeneous soldering joint. In this way, soldering connections can be massively produced at the same time. However, it was disadvantageous in the production of such connections to equip the carrier with the individual elements and subsequently to merge with the conductor ends in a separate operation felt.
Ziel der ErfindungObject of the invention
Das Ziel der Erfindung besteht deshalb in der Verringerung der Anzahl Montagearbeitsgänge bei der Vorbereitung der Lötstelle,The object of the invention is therefore to reduce the number of assembly operations in the preparation of the solder joint,
-2- 206716-2- 206716
Darlegung des Wesens der ErfindungExplanation of the essence of the invention
Der Erfindung liegt die Aufgabe zugrunde, die in der Hauptanmeldung vorgeschlagenen Lötverbindungsstellen zu vereinfachen.The invention has for its object to simplify the proposed in the parent application solder joints.
Die Lösung der Aufgabe gelingt erfinderisch dadurch, daß ein an der Verbindung teilnehmender Leiter an seinem Ende unmittelbar als hohlnietförmiges Element ausgebildet ist. Vorzugsweise bieten sich für die Elementeanbringung auch litzenfönoige Leiter an. Das Element .selbst kann wahlweise ein- oder zweigängig gewickelt, sein Bund und sein unterer Abschluß mehr oder weniger ausgebildet sein. Für Verbindungsstellen mit lagestabilen Leitern kann der die Elemente aufnehmende Träger entweder lediglich als Vorrichtung fungieren bzw, gegebenenfalls ganz entfallen,The solution of the problem succeeds inventive in that a conductor participating in the connection is formed directly at its end as a hollow rivet-shaped element. Preferably also litzenfönoige ladder offer for the element attachment. The element itself can optionally be wound in one or two courses, its collar and its lower termination more or less formed. For connection points with position-stable conductors, the carrier receiving the elements can either act merely as a device or, if appropriate, can be omitted altogether,
Ausführungsbeispielembodiment
Ein nachfolgendes Ausführungsbeispiel dient zur näheren Erläuterung der Erfindung. Die zugehörige Darstellung aeigt inA subsequent embodiment serves to illustrate the invention. The corresponding representation is in
Pig, 1 einen Längsschnitt durch die fertig ausgebildete Verbindungsstelle und inPig, 1 a longitudinal section through the fully formed joint and in
Pig, 2 deren Draufsicht,Pig, 2 whose top view,
In eine Bohrung eines aus Isoliermaterial bestehenden Trägers 1 ist ein gewickeltes Element 2 eingebracht, das sich direkt am Ende eines an der Verbindung teilnehmenden Leiters 3 befindet, indem es diesem unmittelbar entspringt, Das Element 2 selbst weist eine annähernd hohlnietförmige Gestalt mit einem im wesentlichen zylindrischen Schaft, einem unteren Abschluß 4 und.einem Bund 5, der in den eigentlichen Leiter 3 übergeht. Je nach dem gewählten technologischen Verfahren zum Wickeln kann das Element 2 ein- oder zweigängig ausgeführt sein. Während bei der Zweigängigkeit, wie sie in den Hg, 1 und 2 "dargestellt ist, derIn a bore of a carrier consisting of insulating material 1, a wound element 2 is introduced, which is located directly at the end of a participating in the compound conductor 3, by this directly springs, the element 2 itself has an approximately hollow rivet shape with a substantially cylindrical Shank, a lower termination 4 and.a collar 5, which merges into the actual conductor 3. Depending on the chosen technological process for winding the element 2 can be made one or two-speed. Whereas in the case of twofoldness, as shown in Figs. 1 and 2 ", the
-3- 206716-3- 206716
untere Abschluß 4 des Elements 2 bei dessen Herstellung νorteilhafterweise mit ausgebildet wird, kann dieser bei eingängig" gewickelten Elementen 2 nur zum Teil vorhanden sein oder ganz entfallen« Auch die Größe des Bundes 5 kann in ähnlicher Weise variieren, da seine Anwesenheit infolge des etwa tangential von dem Wickelkörper wegführenden Leiters 3» der damit ein Durchfallen des Elementes 2 durch den Träger 1 bereits wirksam verhindert, nicht unbedingt erforderlich.ist. Besonders positiv wirkt sich das Weglassen des Bundes 5 auf die Sicherheit gegen Kurzschlüsse bei Einsatz kleiner Rastermaße aus. Als Leiter 3» an deren Ende das Element 2 angewickelt wird, eignen sich-nicht nur massive, sondern ebenso litzenförmige Drähte«lower conclusion 4 of the element 2 is formed in the manufacture thereof ñorteilhafterweise, it may be present in catchy "wrapped elements 2 only partially or completely eliminated." The size of the covenant 5 may vary in a similar manner, since its presence due to the approximately tangential conductor leading away from the winding body 3, which thus effectively prevents the element 2 from falling through the support 1, is not absolutely necessary. The omission of the collar 5 has a particularly positive effect on the safety against short circuits when small grid dimensions are used 3 "at the end of which Element 2 is wound, not only solid wires but also stranded wires are suitable"
Die endgültige Kontaktierung mit einem oder mehreren anderen Leitern 6 bzw* Kontaktstiften 7 erfolgt nach der Einbringung ihrer isolationsfreien Enden in den von den Windungen des Elements 2 umschlossenen Hohlraum, wobei aus der direkten Verknüpfung von Element 2 und Leiter 3, eine vergrößerte Querschnittsfläche für die Bestückung mit den elementlosen Leitern 6, 7 resultiert, durch die Zufuhr von Lot 8 in einem nachfolgenden, vorzugsv/eise maschinellen Lötverfahren mit dem Ergebnis einer homogenen Lötstelle.The final contact with one or more other conductors 6 or * contact pins 7 takes place after the introduction of their insulation-free ends in the space enclosed by the windings of the element 2 cavity, from the direct linkage of element 2 and conductor 3, an enlarged cross-sectional area for the assembly with the elementless conductors 6, 7 results, by the supply of Lot 8 in a subsequent, preferably by mechanical soldering process with the result of a homogeneous solder joint.
Die Verbindung von mit einem Element 2 versehenen Leiter 3 mit lagestabilen Anschlüssen, wie sie beispielsweise als Kontaktfahnen an Steckern oder dergleichen in Erscheinung treten, erlaubt eine besondere Gestaltung. In diesen Fällen wird der Träger 1 nicht bleibend, sondern lediglich als Vorrichtung für das Rigen der beteiligten Kontaktteile eingesetzt und anschließend wieder entfernt. Unter bestimmten Verhältnissen kann auch bereits bei der Hontage auf den Träger 1 verzichtet werden. Da das Anbringen der Elemente 2 an die Leiterenden 3 i& einer geeigneten Vorrichtung für mehrere Leiter gleich-The connection of provided with an element 2 conductor 3 with position-stable terminals, as they occur, for example, as tabs on plugs or the like in appearance, allows a special design. In these cases, the carrier 1 is not permanent, but only used as a device for the rigging of the contact parts involved and then removed again. Under certain conditions can be dispensed already during assembly on the carrier 1. Since the attachment of the elements 2 to the conductor ends 3 i & a suitable device for multiple conductors equal
-4--4-
-4_ 2 067 16-4_ 2 067 16
zeitig erfolgen kann und zum anderen die Verbindungsstelle im Normalfall .ebenfalls nicht einzeln, sondern im Komplex auftritt, -führt die Anwendung der Erfindung im Montageprozeß zu erheblichen Einsparungen»on the other hand, the connection point in the normal case. also not in isolation, but in the complex occurs, the application of the invention in the assembly process leads to significant savings »
-5--5-
Claims (6)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD20671678A DD141884B1 (en) | 1978-07-14 | 1978-07-14 | LOETABLE ELECTRICAL CONNECTION |
CS426679A CS228705B1 (en) | 1978-07-14 | 1979-06-20 | Soldered electric point of connection |
DE19792925623 DE2925623A1 (en) | 1978-07-14 | 1979-06-25 | Solderable conductor connection with hollow rivet-like elements - uses conductor whose joining end is shaped with rivet-like cavity |
HURO001029 HU181945B (en) | 1978-07-14 | 1979-07-13 | Solderable electric joint |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD20671678A DD141884B1 (en) | 1978-07-14 | 1978-07-14 | LOETABLE ELECTRICAL CONNECTION |
Publications (2)
Publication Number | Publication Date |
---|---|
DD141884A2 true DD141884A2 (en) | 1980-05-21 |
DD141884B1 DD141884B1 (en) | 1982-01-27 |
Family
ID=5513608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DD20671678A DD141884B1 (en) | 1978-07-14 | 1978-07-14 | LOETABLE ELECTRICAL CONNECTION |
Country Status (4)
Country | Link |
---|---|
CS (1) | CS228705B1 (en) |
DD (1) | DD141884B1 (en) |
DE (1) | DE2925623A1 (en) |
HU (1) | HU181945B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1196834A (en) * | 1996-06-24 | 1998-10-21 | 菲利浦电子有限公司 | Method of interconnecting electroconductive wires by means of hard soldering |
JP6108164B2 (en) * | 2012-11-07 | 2017-04-05 | 日本電産株式会社 | Solder joint structure and solder joint method |
-
1978
- 1978-07-14 DD DD20671678A patent/DD141884B1/en not_active IP Right Cessation
-
1979
- 1979-06-20 CS CS426679A patent/CS228705B1/en unknown
- 1979-06-25 DE DE19792925623 patent/DE2925623A1/en not_active Withdrawn
- 1979-07-13 HU HURO001029 patent/HU181945B/en unknown
Also Published As
Publication number | Publication date |
---|---|
CS228705B1 (en) | 1984-05-14 |
DD141884B1 (en) | 1982-01-27 |
HU181945B (en) | 1983-11-28 |
DE2925623A1 (en) | 1980-01-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENJ | Ceased due to non-payment of renewal fee |