DD133714A1 - SILICON BENDING PLATE WITH INTEGRATED PIEZORESISTIVAL SEMICONDUCTOR MEASURING ELEMENTS - Google Patents

SILICON BENDING PLATE WITH INTEGRATED PIEZORESISTIVAL SEMICONDUCTOR MEASURING ELEMENTS

Info

Publication number
DD133714A1
DD133714A1 DD7700202998A DD20299877A DD133714A1 DD 133714 A1 DD133714 A1 DD 133714A1 DD 7700202998 A DD7700202998 A DD 7700202998A DD 20299877 A DD20299877 A DD 20299877A DD 133714 A1 DD133714 A1 DD 133714A1
Authority
DD
German Democratic Republic
Prior art keywords
piezoresistival
integrated
bending plate
measuring elements
semiconductor measuring
Prior art date
Application number
DD7700202998A
Other languages
German (de)
Inventor
Frank Loeffler
Original Assignee
Frank Loeffler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Frank Loeffler filed Critical Frank Loeffler
Priority to DD7700202998A priority Critical patent/DD133714A1/en
Priority to DE19782844893 priority patent/DE2844893A1/en
Priority to GB7843496A priority patent/GB2011707B/en
Priority to IT52392/78A priority patent/IT1158180B/en
Priority to SE7813216A priority patent/SE7813216L/en
Publication of DD133714A1 publication Critical patent/DD133714A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Measuring Fluid Pressure (AREA)
DD7700202998A 1977-12-29 1977-12-29 SILICON BENDING PLATE WITH INTEGRATED PIEZORESISTIVAL SEMICONDUCTOR MEASURING ELEMENTS DD133714A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DD7700202998A DD133714A1 (en) 1977-12-29 1977-12-29 SILICON BENDING PLATE WITH INTEGRATED PIEZORESISTIVAL SEMICONDUCTOR MEASURING ELEMENTS
DE19782844893 DE2844893A1 (en) 1977-12-29 1978-10-14 SILICON BENDING PLATE WITH INTEGRATED PIEZORESISTIVE SEMICONDUCTOR EXTENSION MEASURING ELEMENTS
GB7843496A GB2011707B (en) 1977-12-29 1978-11-07 Silicon diaphragm with integrated piezo resistive semi conductor strain gauge elements
IT52392/78A IT1158180B (en) 1977-12-29 1978-12-20 FOLDING SILICON PLATE WITH INTEGRATED PIEZORESISTIC SEMI-CONDUCTIVE EXTENSIMETRIC ELEMENTS
SE7813216A SE7813216L (en) 1977-12-29 1978-12-21 PIEZZO RESISTANT TOJNINGSELEMENT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD7700202998A DD133714A1 (en) 1977-12-29 1977-12-29 SILICON BENDING PLATE WITH INTEGRATED PIEZORESISTIVAL SEMICONDUCTOR MEASURING ELEMENTS

Publications (1)

Publication Number Publication Date
DD133714A1 true DD133714A1 (en) 1979-01-17

Family

ID=5511095

Family Applications (1)

Application Number Title Priority Date Filing Date
DD7700202998A DD133714A1 (en) 1977-12-29 1977-12-29 SILICON BENDING PLATE WITH INTEGRATED PIEZORESISTIVAL SEMICONDUCTOR MEASURING ELEMENTS

Country Status (5)

Country Link
DD (1) DD133714A1 (en)
DE (1) DE2844893A1 (en)
GB (1) GB2011707B (en)
IT (1) IT1158180B (en)
SE (1) SE7813216L (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60128673A (en) * 1983-12-16 1985-07-09 Hitachi Ltd Semiconductor pressure-sensing device
US4672853A (en) * 1984-10-30 1987-06-16 Burr-Brown Corporation Apparatus and method for a pressure-sensitive device
FR2653197B1 (en) * 1989-10-12 1991-12-27 Vulcanic METHOD FOR WATERPROOFING AN END OF AN ELECTRIC HEATING ELEMENT AND WATERPROOFING ELEMENT THROUGH THIS METHOD.
FR2653271B1 (en) * 1989-10-13 1994-06-10 Schlumberger Ind Sa SEMICONDUCTOR SENSOR.
US5397911A (en) * 1991-04-02 1995-03-14 Honda Giken Kogyo Kabushiki Kaisha Semiconductor sensor with plural gate electrodes
JP3009239B2 (en) * 1991-04-02 2000-02-14 本田技研工業株式会社 Semiconductor sensor
CN105333812B (en) * 2015-12-04 2018-06-29 浙江工业大学 Interdigital metal strain plate in five sensitive grid of cross direction profiles
CN105318830B (en) * 2015-12-04 2018-03-02 浙江工业大学 The sensitive grid full-bridge of lateral deviation six mixes interdigital metal strain plate
US10296148B2 (en) 2016-08-31 2019-05-21 Synaptics Incorporated Full-bridge strain-gauge array of finger thermal compensation

Also Published As

Publication number Publication date
IT1158180B (en) 1987-02-18
SE7813216L (en) 1979-06-30
GB2011707B (en) 1982-06-16
GB2011707A (en) 1979-07-11
IT7852392A0 (en) 1978-12-20
DE2844893A1 (en) 1979-07-05

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