DD133285A1 - Bonden eines drahtes mit einer anschlussflaeche - Google Patents

Bonden eines drahtes mit einer anschlussflaeche

Info

Publication number
DD133285A1
DD133285A1 DD7700200879A DD20087977A DD133285A1 DD 133285 A1 DD133285 A1 DD 133285A1 DD 7700200879 A DD7700200879 A DD 7700200879A DD 20087977 A DD20087977 A DD 20087977A DD 133285 A1 DD133285 A1 DD 133285A1
Authority
DD
German Democratic Republic
Prior art keywords
bonding
wire
connection plate
connection
plate
Prior art date
Application number
DD7700200879A
Other languages
English (en)
Inventor
Ruediger Uhlmann
Michael Oehme
Frank Rudolf
Original Assignee
Ruediger Uhlmann
Michael Oehme
Frank Rudolf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruediger Uhlmann, Michael Oehme, Frank Rudolf filed Critical Ruediger Uhlmann
Priority to DD7700200879A priority Critical patent/DD133285A1/de
Publication of DD133285A1 publication Critical patent/DD133285A1/de

Links

Classifications

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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05647—Copper [Cu] as principal constituent
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DD7700200879A 1977-09-05 1977-09-05 Bonden eines drahtes mit einer anschlussflaeche DD133285A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DD7700200879A DD133285A1 (de) 1977-09-05 1977-09-05 Bonden eines drahtes mit einer anschlussflaeche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD7700200879A DD133285A1 (de) 1977-09-05 1977-09-05 Bonden eines drahtes mit einer anschlussflaeche

Publications (1)

Publication Number Publication Date
DD133285A1 true DD133285A1 (de) 1978-12-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
DD7700200879A DD133285A1 (de) 1977-09-05 1977-09-05 Bonden eines drahtes mit einer anschlussflaeche

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Country Link
DD (1) DD133285A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3514253A1 (de) * 1984-04-19 1985-10-31 Hitachi, Ltd., Tokio/Tokyo Halbleitereinrichtung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3514253A1 (de) * 1984-04-19 1985-10-31 Hitachi, Ltd., Tokio/Tokyo Halbleitereinrichtung

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