DD124092A1 - - Google Patents
Info
- Publication number
- DD124092A1 DD124092A1 DD19113576A DD19113576A DD124092A1 DD 124092 A1 DD124092 A1 DD 124092A1 DD 19113576 A DD19113576 A DD 19113576A DD 19113576 A DD19113576 A DD 19113576A DD 124092 A1 DD124092 A1 DD 124092A1
- Authority
- DD
- German Democratic Republic
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Wire Processing (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD19113576A DD124092A1 (cg-RX-API-DMAC7.html) | 1976-02-09 | 1976-02-09 | |
| GB4781276A GB1536769A (en) | 1976-02-09 | 1976-11-17 | Apparatus for bending capillary wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD19113576A DD124092A1 (cg-RX-API-DMAC7.html) | 1976-02-09 | 1976-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DD124092A1 true DD124092A1 (cg-RX-API-DMAC7.html) | 1977-02-02 |
Family
ID=5503476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DD19113576A DD124092A1 (cg-RX-API-DMAC7.html) | 1976-02-09 | 1976-02-09 |
Country Status (2)
| Country | Link |
|---|---|
| DD (1) | DD124092A1 (cg-RX-API-DMAC7.html) |
| GB (1) | GB1536769A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108501040B (zh) * | 2018-06-06 | 2023-06-20 | 枣庄学院 | 一种磁驱动柔性机械臂 |
| JP7628869B2 (ja) * | 2021-04-05 | 2025-02-12 | Ckd株式会社 | 配管溶接構造 |
-
1976
- 1976-02-09 DD DD19113576A patent/DD124092A1/xx unknown
- 1976-11-17 GB GB4781276A patent/GB1536769A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1536769A (en) | 1978-12-20 |