Classifications

• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D235/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
  • C07D235/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
  • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
  • C07D233/66—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
  • C07D233/72—Two oxygen atoms, e.g. hydantoin
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/22—Di-epoxy compounds
  • C08G59/26—Di-epoxy compounds heterocyclic
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/32—Epoxy compounds containing three or more epoxy groups
  • C08G59/3236—Heterocylic compounds
  • C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom

Landscapes

• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Plural Heterocyclic Compounds (AREA)
• Epoxy Resins (AREA)
• Epoxy Compounds (AREA)
• Furan Compounds (AREA)
• Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=4292898

Family Applications (3)

Family Applications After (2)

Country Status (19)

Families Citing this family (3)

Family Cites Families (5)

• 1971
  • 1971-04-14 CH CH539871A patent/CH550820A/en not_active IP Right Cessation
• 1972
  • 1972-03-14 CA CA137,006A patent/CA993445A/en not_active Expired
  • 1972-03-16 AU AU40083/72A patent/AU469852B2/en not_active Expired
  • 1972-03-23 SE SE7203760A patent/SE389867B/en unknown
  • 1972-04-06 GB GB1599372A patent/GB1380602A/en not_active Expired
  • 1972-04-11 JP JP3581372A patent/JPS5644090B1/ja active Pending
  • 1972-04-12 IT IT7244/72A patent/IT957186B/en active
  • 1972-04-12 SU SU1826233A patent/SU509242A3/en active
  • 1972-04-12 SU SU1821046A patent/SU453838A3/en active
  • 1972-04-12 AR AR241428A patent/AR194476A1/en active
  • 1972-04-12 SU SU1772451A patent/SU442599A3/en active
  • 1972-04-13 DD DD162275A patent/DD101408A5/xx unknown
  • 1972-04-13 DD DD172369*A patent/DD106379A5/xx unknown
  • 1972-04-13 BE BE782032A patent/BE782032A/en unknown
  • 1972-04-13 ZA ZA727802*A patent/ZA727802B/en unknown
  • 1972-04-13 AT AT322772A patent/AT318922B/en not_active IP Right Cessation
  • 1972-04-13 FR FR7212972A patent/FR2155193A5/fr not_active Expired
  • 1972-04-13 ZA ZA722483A patent/ZA722483B/en unknown
  • 1972-04-13 NL NL7204979A patent/NL7204979A/xx not_active Application Discontinuation
  • 1972-04-13 DE DE19722217914 patent/DE2217914A1/en not_active Withdrawn
  • 1972-04-13 DD DD172373*A patent/DD105246A5/xx unknown
  • 1972-04-14 RO RO74598A patent/RO67634B/en unknown
  • 1972-04-14 BR BR722217A patent/BR7202217D0/en unknown
  • 1972-10-11 BR BR007078/72A patent/BR7207078D0/en unknown
  • 1972-11-30 FR FR7242601A patent/FR2163160A5/fr not_active Expired
• 1973
  • 1973-01-01 AR AR248823A patent/AR204615A1/en active
  • 1973-02-17 ES ES411737A patent/ES411737A1/en not_active Expired
• 1974
  • 1974-09-17 SE SE7411680-7A patent/SE407684B/en not_active IP Right Cessation
• 1980
  • 1980-08-09 JP JP55109757A patent/JPS58419B2/en not_active Expired
• 1982
  • 1982-05-04 JP JP57075063A patent/JPS5855150B2/en not_active Expired

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