CS267515B1 - Lustre forming admixture - Google Patents

Abstract

Leslwtvoroá additive to acidic galvanic copper baths according to the solution consists of an O-carbamoyl- -methyl-* - »hydroxybutanesulfonic acid of the formula R 1 -J 2 -O- (CH 2 J 4 SO 4 Me, where Me is sodium, potassium or hydrogen and R is a residual pattern residue of IIIa R -S-N = C-Snobo lib -RJ-N-C = S-S-, in which R1 is an o-disubstituted aromatic ring with a number of atoms of λ-6 to nob 2 O or ω-H 2 O the core, R and RJ are the same or various radical-alkyl radicals with a number of carbons of 1 to 6 or water and surfactant based on ethoxylated amine, alcohol, tliiol or phosphate with molecular 200 to 15,000 in a particular lunot— ratio.

Description

The invention relates to a gloss-forming additive for a sulphate, strong acid galvanic copper bath with a high-pore efficiency, which is suitable, for example, for punching holes in the production of printed circuit boards.

Due to the high content of sulfuric acid (up to 200 g / l) and the low content of copper (17 to 30 g / l), the currently used plating baths are not able to work without a finish additive. A wide range of brighteners is known, some of which cannot be used in a given environment, others have a narrow range of applicable current densities to eliminate the shiny story and suitable ductility of the copper to be excluded. The use of the sodium salt of dimothyldithiocarbaraoyl-1-propanesulfonic acid and related derivatives overcomes these shortcomings (U.S. Pat. No. 3,725,220). The novelty of this substance lies in the need to use the highly carcinogenic 1,3-propanesLCone in its synthesis.

This disadvantage is eliminated by the gloss additive for acidic copper baths according to the invention, the essence of which consists in that it consists of a substance of general formula I

R-Cl 2 -O-CCl 2 O 2 SO-M 1 (I) wherein 10' is sodium, potassium or hydrogen and R is a residue of formula

in which the o-disubstituted aromatic or hotoroaromatic nucleus optionally contains halo-, nitro-, sulfo-, hydroxy-, amino-, and / or mecapto groups or aUcylene having a number of atoms of 2-20, R 1 are the same or different alkyl groups. residues having a carbon number of 1 to 6 or hydrogen and a surfactant based on ethoxylated amine, alcohol, thiol or phosphate having a molecular weight of 200 to 15,000 in a weight ratio of 100 to 1 to 1 to 5,000. by increasing the thickness of the precipitated copper layer. Tonsid alone does not act as a loose ingredient.

The concentration of the butanesulfonic acid salt in the working solution is effective in the range of 0.1 to 100 mg / l, for the surfactant based on the polyothoxylated compound in the range of 1 to 5,000 mg / l.

An aqueous solution of copper sulfate and sulfuric acid with the addition of chloride ions up to 80 mg / l is used as the basic galvanic bath.

The polishing agent is used for iodine to apply a galvanic copper bath, both for its maintenance according to the appearance of the coating or the ampere hours elapsed. The additive is not sensitive to overdose. The excluded currency is ductile; when applied to printed circuit boards, the layer does not break at a temperature of 20 ° C for 20 seconds. The depth efficiency in the holes is 90 to 100 / with a hole diameter of 0.8 imn and a material thickness of 1.5. The bath temperature can range from 0 to 35 ° C, the range of usable current densities is 0.5 to 5 A / dn /,

Example 1

Loosening agent for acid galvanic baths containing O- (K, N-dimethyldithiocarbamoylmothyl-) 4-hydroxybutanesulfonic acid sodium salt at a concentration of 1 mg / l and 1,300 molecular weight polyotylonglycol at a concentration of 5θ mg / l.

For galvanic copper plating, a bath is prepared by dissolving 117 g of copper sulphate, 190 g of sulfuric acid and 5θ mg of chloride ions with gloss. the addition of vil water. The coppering takes place at room temperature and a voltage of 1.5 to 2 A / dm of the surface to be coated. With respect to 100 / ó

CS 2Ó7 515 Bl current efficiency is a precipitated copper layer proportional to time and current density. The precipitated measure forms a uniform layer which is smooth and ductile. Example 2

Gloss-forming additive for acid galvanic baths containing sodium salt of O- (K, N-dihydrothithioalkanoylmethylmethyl) 4-hydroxybutanesulfonic acid in a concentration of 1 mg / l and polyothylonglycol with a molecular weight of 6,000 in a concentration of 100 mg / l. Example J

Gloss-forming additive for acid galvanic baths containing O- (S-2-morcaptogenzthialolylinethyl-) 4-hydroxybutanesulfonic acid in a concentration of 10 mg / l and polyethoxylated nonylfonol with 10 molecules of oxirane in a concentration of 25 mg / l, Example 4

Acid galvanic bath polishing agent containing O- (N, N-dimothyldithiocarbamoylmethyl-) 4-hydroxynutanesulfonic acid potassium salt at a concentration of 50 mg / l and polyothoxylated ethylonamine with 2 to 10 oxirane molecules at a concentration of 25 mg / l. Example 5

Gloss-forming additive for acid galvanic baths containing O- (N, N-dimethyldithiocarbamoylmotliyl-) 4-hydroxybutanesulfonic acid sodium salt at a concentration of 20 mg / l and polyotylonglycol with a molecular weight of 1,500 at a concentration of 1,000 mg / l.

Claims (1)

Leskurine additive for acidic galvanic copper baths, characterized in that it consists of the dithio derivative O-carbamoylmethyl-4-hydroxybutanesulfonic acid of the general formula I R is Cl, sodium, potassium or hydrogen and R is a radical of formula IIa or X1b and ¹¹ “·) wherein R ^{1 is} a disubstituted aromatic nucleus having 6 to 20 carbon atoms or a heteroaromatic nucleus having 3 to 10 carbons, sulfur, nitrogen or oxygen, optionally containing halo-, nitro-, sulfo-, hydroxy-, amino- and / or morkapto groups or alkylon 2 3 with a carbon number of 2 to 20, R, R, are standing or various alkyl radicals with a carbon number of one to Sost nobo hydrogen and a surfactant based on otoxylated amine, alcohol, thiol or phosphate with a molecular weight of 200 to 15 000 in a weight ratio of 100 to 1 to 1 to 50,000.