CS235807B1 - Putty for bonding lightweight insulators and their surface treatment - Google Patents

Abstract

The invention relates to a sealant for bonding lightweight insulation to building substrates and for surface treatment of these insulation materials before applying the final surface treatment. The invention addresses the issue of using a sealant at the same time for creating base layers for thin-layer sprays, plasters, etc. The essence of the invention lies in mixing 10 to 45 parts by weight of an aqueous dispersion of a suitable copolymer, 0.§ to 8 parts by weight of cellulose derivatives, 20 to 60 parts by weight of an inorganic filler of max. grain size 1 mm, 5 to 30 parts by weight of inorganic filler with a maximum grain size of 0.6 mm, 0.1 to 3 parts by weight of surfactants, 0.2 to 4 parts by weight of aliphatic solvents, 10 to 40 parts by weight of water, 0.2 to 5 parts by weight of polyester or polyamide or polypropylene or glass fibers with a maximum fiber length of 12 mm. The adhesive mastic thus formed can be modified with cement up to an amount of 30% of the total weight of the mastic. The adhesive mastic according to the invention can also be used for bonding and leveling in the case of other building materials than lightweight insulation materials

Description

The invention relates to a sealant for bonding lightweight insulation materials to building substrates and for surface treatment of these insulation materials before applying the final surface treatment.

It is known that the existing materials for bonding lightweight insulation are based on a mixture of inorganic fillers and aqueous dispersions of polymers. The existing known sealants contain modifying additives (e.g. cellulose ethers), which, however, improve primarily the technological properties during application, but do not significantly affect the important resulting properties, do not prevent the formation of cracks in larger thicknesses and do not significantly increase adhesion to lightweight insulation. They can therefore be used only in those cases where the thickness of the layer is relatively thin and when the resulting stresses leading to adhesion failure are small. The undesirable hydrolysis of polymers during cement hydration is also not taken into account.

The above disadvantages are eliminated by the sealant according to the invention, the essence of which lies in the fact that it contains 10 to 40 parts by weight of an aqueous dispersion of a vinyl acetate-acrylate copolymer, 0.5 to 8 parts by weight of cellulose derivatives, 20 to 60 parts by weight of inorganic filler with a maximum grain size of 1 mm, up to 30 parts by weight of inorganic filler with a maximum grain size of 0.6 mm, 0.1 to 3 parts by weight of a surfactant with a wetting and/or air-entraining effect, 0.2 to 4 parts by weight of aliphatic solvents, 10 to 40 parts by weight of water, 0.2 to 5 parts by weight of polyester or polyamide or polypropylene or glass fibers with a maximum fiber length of 12 mm and it can be modified as needed with cement in an amount of up to 30% of the total weight of the sealant.

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The advantage of the sealant according to the invention is sufficient adhesion to insulators with a hydrophobic surface such as expanded polystyrene and the possibility of applying the sealant to insulators with a hydrophobic surface up to 100 mm without the risk of cracks and the possibility of modification with cement.

EXAMPLE 1

Aqueous dispersion of copolymers

vinyl acetate acrylate 30 parts by weight carboxymethylcellulose 4 parts by weight silica sand of maximum size grain 0.8 mm 35 parts by weight ground limestone of max. size grain 0.4 mm 20 parts by weight ethylene oxide 1 part by weight ethyl acetate 3 parts by weight glass fiber with a maximum length of 3 mm 1 part by weight water 15 parts by weight

The putty prepared in this way is mixed with cement in a ratio of 20 parts by weight of cement to 100 parts by weight of putty and is used for bonding polystyrene foam boards to silicate substrates and at the same time as a base putty under the final surface treatment with artificial plaster. After drying, the material has the following properties:

adhesion to silicate substrate min. 0.50 MPa adhesion to expanded polystyrene min. 0.20 ΜΡε volume change t wedge test ) 10 mm »

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EXAMPLE 2

AND

Aqueous dispersion of vinyl acetate copolymer

acrylate / 15 parts weight to arboxyme ty1c elulo for 1 mass fraction ground limestone of maximum size grain 0.7 mm 50 parts weight ground limestone of maximum size grain 0.5 mm 10 parts weight alkyl sulfate 0.2 parts weight white spirit 0.3 parts weight polyester fiber 6 mm long 3 mass parts water 30 parts weight

The putty prepared in this way is mixed with cement in a ratio of 30 parts by weight of cement to 100 parts by weight of putty and used for bonding insulation based on foam resins and perlite to silicate substrates and also as a base putty for the final surface treatment.

The basic technical parameters achieved are as follows:

adhesion to silicate substrate min. 0.50 MPa adhesion to insulation min. 0.20 MPa volume change (wedge test) 10 mm

Claims (3)

CLAIMS 1. Sealant for bonding and surface treatment of light insulators, characterized in that it contains 10 to 40 parts by weight of an aqueous dispersion of tartaric vinyl acetate copolymer, 0.5 to 8 parts by weight of cellulose derivatives, 20 to 60 parts by weight of inorganic filler of maximum grain size 1 mm, 5 to 30 parts by weight of inorganic filler with a maximum grain size of 0.6 mm, 0.1 to 3 parts by weight of a surfactant with a wetting and / or aerating effect, 0.2 to 4 parts by weight of aliphatic solvents, 10 to 40 0.2 parts by weight of water, 0.2 to 5 parts by weight of polyester or polyamide or polypropylene or glass fiber poles having a maximum fiber length of 12 mm. 2. The putty according to claim 1, wherein the inorganic filler is a peak and / or ground limestone and / or float chalk. 3. The sealant of claim 1, wherein the aliphatic solvent is white spirit or ethyl acetate.