CS187625B1 - Method and device for automatic cutting of the corpuses from the moulded wafer - Google Patents

Method and device for automatic cutting of the corpuses from the moulded wafer

Info

Publication number
CS187625B1
CS187625B1 CS732375A CS732375A CS187625B1 CS 187625 B1 CS187625 B1 CS 187625B1 CS 732375 A CS732375 A CS 732375A CS 732375 A CS732375 A CS 732375A CS 187625 B1 CS187625 B1 CS 187625B1
Authority
CS
Czechoslovakia
Prior art keywords
corpuses
automatic cutting
moulded wafer
moulded
wafer
Prior art date
Application number
CS732375A
Other languages
English (en)
Inventor
Karel Patetl
Jiri Paveza
Original Assignee
Karel Patetl
Jiri Paveza
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Karel Patetl, Jiri Paveza filed Critical Karel Patetl
Priority to CS732375A priority Critical patent/CS187625B1/cs
Publication of CS187625B1 publication Critical patent/CS187625B1/cs

Links

CS732375A 1975-10-30 1975-10-30 Method and device for automatic cutting of the corpuses from the moulded wafer CS187625B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CS732375A CS187625B1 (en) 1975-10-30 1975-10-30 Method and device for automatic cutting of the corpuses from the moulded wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS732375A CS187625B1 (en) 1975-10-30 1975-10-30 Method and device for automatic cutting of the corpuses from the moulded wafer

Publications (1)

Publication Number Publication Date
CS187625B1 true CS187625B1 (en) 1979-02-28

Family

ID=5422156

Family Applications (1)

Application Number Title Priority Date Filing Date
CS732375A CS187625B1 (en) 1975-10-30 1975-10-30 Method and device for automatic cutting of the corpuses from the moulded wafer

Country Status (1)

Country Link
CS (1) CS187625B1 (cs)

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