CS180334B1 - Power semiconducting disc elements suppressing and jigging equipment - Google Patents

Power semiconducting disc elements suppressing and jigging equipment

Info

Publication number
CS180334B1
CS180334B1 CS7500008082A CS808275A CS180334B1 CS 180334 B1 CS180334 B1 CS 180334B1 CS 7500008082 A CS7500008082 A CS 7500008082A CS 808275 A CS808275 A CS 808275A CS 180334 B1 CS180334 B1 CS 180334B1
Authority
CS
Czechoslovakia
Prior art keywords
disc elements
power semiconducting
suppressing
semiconducting disc
jigging equipment
Prior art date
Application number
CS7500008082A
Other languages
Czech (cs)
English (en)
Inventor
Jiri Kovar
Pavel Kafunek
Pavel Reichel
Oldrich Pokorny
Michal Pellant
Jaroslav Zuna
Jindrich Kratina
Original Assignee
Jiri Kovar
Pavel Kafunek
Pavel Reichel
Oldrich Pokorny
Michal Pellant
Jaroslav Zuna
Jindrich Kratina
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiri Kovar, Pavel Kafunek, Pavel Reichel, Oldrich Pokorny, Michal Pellant, Jaroslav Zuna, Jindrich Kratina filed Critical Jiri Kovar
Priority to CS7500008082A priority Critical patent/CS180334B1/cs
Priority to DD7600195456A priority patent/DD127720A1/de
Priority to PL1976193305A priority patent/PL99632B1/xx
Priority to CH1362176A priority patent/CH596669A5/xx
Priority to DE19762649824 priority patent/DE2649824A1/de
Priority to SE7612392A priority patent/SE7612392L/xx
Priority to GB48952/76A priority patent/GB1511100A/en
Priority to US05/745,201 priority patent/US4104677A/en
Priority to FR7635809A priority patent/FR2333351A1/fr
Publication of CS180334B1 publication Critical patent/CS180334B1/cs

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CS7500008082A 1975-11-28 1975-11-28 Power semiconducting disc elements suppressing and jigging equipment CS180334B1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CS7500008082A CS180334B1 (en) 1975-11-28 1975-11-28 Power semiconducting disc elements suppressing and jigging equipment
DD7600195456A DD127720A1 (de) 1975-11-28 1976-10-26 Anpress-und spanneinrichtung fuer halbleiterbauelemente
PL1976193305A PL99632B1 (pl) 1975-11-28 1976-10-27 Urzadzenie dociskowe i mocujace do elementow polprzewodnikowych
CH1362176A CH596669A5 (de) 1975-11-28 1976-10-28
DE19762649824 DE2649824A1 (de) 1975-11-28 1976-10-29 Anpress- und spanneinrichtung fuer halbleiterbauelemente
SE7612392A SE7612392L (sv) 1975-11-28 1976-11-05 Spennanordning for halvledarkomponenter
GB48952/76A GB1511100A (en) 1975-11-28 1976-11-24 Arrangements for pressing semiconductive elements against a heat sink
US05/745,201 US4104677A (en) 1975-11-28 1976-11-26 Arrangement for adjustably urging a semi-conductive element against a heat sink
FR7635809A FR2333351A1 (fr) 1975-11-28 1976-11-26 Dispositif d'application sous pression et de blocage pour elements semi-conducteurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS7500008082A CS180334B1 (en) 1975-11-28 1975-11-28 Power semiconducting disc elements suppressing and jigging equipment

Publications (1)

Publication Number Publication Date
CS180334B1 true CS180334B1 (en) 1977-12-30

Family

ID=5430929

Family Applications (1)

Application Number Title Priority Date Filing Date
CS7500008082A CS180334B1 (en) 1975-11-28 1975-11-28 Power semiconducting disc elements suppressing and jigging equipment

Country Status (9)

Country Link
US (1) US4104677A (de)
CH (1) CH596669A5 (de)
CS (1) CS180334B1 (de)
DD (1) DD127720A1 (de)
DE (1) DE2649824A1 (de)
FR (1) FR2333351A1 (de)
GB (1) GB1511100A (de)
PL (1) PL99632B1 (de)
SE (1) SE7612392L (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH616537A5 (de) * 1978-01-17 1980-03-31 Bbc Brown Boveri & Cie
US5549155A (en) * 1995-04-18 1996-08-27 Thermacore, Inc. Integrated circuit cooling apparatus
TW335503B (en) * 1996-02-23 1998-07-01 Semiconductor Energy Lab Kk Semiconductor thin film and manufacturing method and semiconductor device and its manufacturing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE628175A (de) * 1961-08-04 1900-01-01
CH442502A (de) * 1965-04-23 1967-08-31 Siemens Ag Gleichrichteranlage
DE1514477C3 (de) * 1965-06-10 1975-06-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiteranordnung mit einer Anzahl von Halbleiterbauelementen
GB1260657A (en) * 1968-11-26 1972-01-19 Westinghouse Brake & Signal Improvements relating to mountings for rectifier devices
DE2224040C3 (de) * 1970-09-30 1981-07-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
DE2049012C3 (de) * 1970-09-30 1979-07-12 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
US3688159A (en) * 1970-10-28 1972-08-29 Cutler Hammer Inc Compression mounted scr clamp with heat sink means
US3715632A (en) * 1971-01-08 1973-02-06 Gen Electric Liquid cooled semiconductor device clamping assembly
US3743893A (en) * 1971-05-27 1973-07-03 Mitsubishi Electric Corp Fluid cooled compression bonded semiconductor device structure
SU439034A1 (ru) * 1972-06-07 1974-08-05 Предприятие П/Я Р-6517 Устройство дл охлаждени
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly

Also Published As

Publication number Publication date
SE7612392L (sv) 1977-05-29
GB1511100A (en) 1978-05-17
DE2649824A1 (de) 1977-06-30
FR2333351A1 (fr) 1977-06-24
CH596669A5 (de) 1978-03-15
PL99632B1 (pl) 1978-07-31
DD127720A1 (de) 1977-10-12
US4104677A (en) 1978-08-01

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