CN87213525U - Semiconductor refrigerator for adopting separative hot tube - Google Patents
Semiconductor refrigerator for adopting separative hot tube Download PDFInfo
- Publication number
- CN87213525U CN87213525U CN 87213525 CN87213525U CN87213525U CN 87213525 U CN87213525 U CN 87213525U CN 87213525 CN87213525 CN 87213525 CN 87213525 U CN87213525 U CN 87213525U CN 87213525 U CN87213525 U CN 87213525U
- Authority
- CN
- China
- Prior art keywords
- utility
- semiconductor refrigerator
- model
- semiconductor
- separative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
The utility model relates to a semiconductor refrigerator which adopts a separative hot tube to improve the heat rejection of the hot junction of the semiconductor refrigerator. The separative hot tube comprises an evaporator clung to the hot junction of the semiconductor refrigerator, separately arranged condensers, and pipes which are connected between the condensers to form a closed system. A certain amount of fluid medium is filled in the system to form a closed evaporation and condensation natural cycle system. The utility model solves the problem that external water source, water inlet and water outlet pipes are needed when water is used for cooling. The effect of the utility model is better than conventional forced-air cooling, so the utility model can be widely used in the semiconductor refrigerator in national defence industry, petrochemical industry, medical instrument industry and electrical appliance industry.
Description
The utility model relates to semiconductor cooling device, more specifically, is a kind of semiconductor cooling device that adopts separate heat pipe cooling semiconductor cooler hot junction.ICL is F25B21/02, F28D15/02.
At present, the method for semiconductor cooler hot junction cooling mainly adopts two kinds of water cooling and forced air coolings.The water cooling effect is better, but needs outer water source, and inlet tube and outlet tube will be arranged, and on using, is very limited, and when operating, often can't use this instrument because of no water source especially in the open air; Forced air cooling then efficient is not high, and refrigeration performance is not good, and especially for the semiconductor cooler of middle power, environment temperature and hot-side temperature differ greatly, and when being used for power sub-cooled and cryogenic box, forced air cooling can not meet the demands.
The purpose of this utility model provides a kind of semiconductor cooling device, and it does not adopt the cooling of outer water source, again there is favorable cooling effect in the semiconductor cooler hot junction.
The utility model is finished by following design: semiconductor cooling device, mainly comprise semiconductor cooler and hot end heat sink, heat abstractor comprises the evaporimeter of being close to the semiconductor cooler hot junction, divide the condenser that is arranged and connect between them and can form the pipeline of closed-cycle system, charges into certain fluid media (medium) in the described system.
This paper deserves to be called and states heat abstractor is separate heat pipe, is intended to come with heat pipe difference of the prior art, and promptly the condenser that is arranged by evaporimeter and branch connects into a closed system by pipeline, and heat transfer medium forms the natural cycle system of an evaporative condenser therein.
Fluid media (medium) can be water or acetone or methyl alcohol, preferentially adopts water as medium, and their amount of charging into is for filling evaporimeter at least.Described condenser one side is provided with cooling fan, strengthens the condenser effect.Because the exothermic coefficient during evaporation is very big, depends merely on the air blast cooling of hot-side heat dissipation sheet and can't reach better heat radiating effect.And the utility model adopts separate heat pipe, and the hot junction heat is introduced condenser by pipeline, its temperature loss＜1 ℃, and the area of condenser is not subjected to the heat release quantitative limitation, just can reach good effect.
Advantage of the present utility model and effect are tangible, it provides a kind of semiconductor cooling device that adopts separate heat pipe, fluid media (medium) is evaporative condenser in separate heat pipe, and the condenser area is not limited by thermal discharge, removed trouble from the cooling of outer water source, effect is better than conventional forced air cooling again, and practical application is very convenient, flexible.In national defense industry, it can be used as infrared detector cooling and air equipment cooling in guided missile, the radar installations; On electronics industry, it can be used as high low temperature testing equipment, laser freuqency doubling generation cooler of electronic devices and components etc.; On petroleum industry, can be used for oil product solidifying point, cloud point, crystalline temperature analyzer and oil low temperature viscosity, gear oil apparent viscosity analyzer etc.; Industrial at medicine instrument, can be used for semiconductor refrigerating biologic slice machine and costly medicine, in the blood plasma accumulating; On daily-use electrical appliance, can be used for aircraft, boats and ships cold drink device and milk, beer iced on.
Below, will be in conjunction with the accompanying drawings, most preferred embodiment of the present utility model is illustrated, but the utility model is not limited thereto.
Accompanying drawing 1 is the broken section perspective view of oil instrument for measuring low-temperature performance.
With reference to accompanying drawing 1: the utility model device 1 comprises semiconductor cooler 2, the evaporimeter 3 of being close to semiconductor cooler 2 hot junctions, divide the condenser 4 that is arranged, the pipeline 5, the pipeline 6 that connect evaporimeter 3 and condenser 4 and formation closed-cycle system, be located at the cooling fan 7 of condenser 4 one sides, be close to the cold-trap 8 of semiconductor cooler 2 cold junctions.
Above-mentioned semiconductor cooler is the semiconductor cooler in the prior art.The evaporimeter 3 of being close to semiconductor cooler 2 hot junctions can adopt cavity structure, its cavity volume is 270 cubic centimetres, the mode of being close to of itself and semiconductor cooler 2 can adopt soft fine weldering, be close to the shape of face and the shape of semiconductor cooler 2 hot junction faces and match, the material of evaporimeter 3 can be selected red copper for use.Described condenser 4 is that heat transfer area is 3 square metres a ribbed pipe type condenser, is connected to form a closed-cycle system by described pipeline 5 and pipeline 6 between evaporimeter 3 and the condenser 4.Pipeline 5 is drawn from evaporimeter 3 end face tops, inserts the top of condenser 4, and pipeline 6 is drawn from evaporimeter 3 end face bottoms, inserts the bottom of condenser 4.If it is single that evaporimeter adopts, connect according to aforesaid way; If evaporimeter adopts more than two, then adopt parallel way to connect, the specification of pipeline is φ 8 * 1mm, its material also can be selected red copper for use.
Before the use, the nitric acid with 50% adds 50% phosphoric acid and pours in the system, remove oxidation scale after, the discharging acid solution with clear water flushing 5 minutes, feeds the second distillation water washing then, again with system's oven dry and be evacuated down to 10
-5Holder.The medium that charges into can be a water, and the amount of charging into is for filling evaporimeter 3 at least, and system must seal with cold welding or fine weldering, otherwise system leak will influence result of use.
Semiconductor cooler 2 hot junction liberated heats make fluid media (medium), as water, become gaseous state by liquid state, and by the heat in evaporation latent heat absorption semiconductor cooler 2 hot junctions, gas enters condenser 4 through piping 5, and by the forced air cooling of fin, gas becomes liquid.After the condensation, liquid is back to the evaporimeter 3 from pipeline 6.So, formed the natural cycle system of fluid media (medium) evaporation, condensation.
When using this oil instrument for measuring low-temperature performance, at first start cooling fan 7, give semiconductor cooler 2 for direct currents then, when 30 ℃ of environment temperatures, only need 1 hour, the temperature of cold-trap 8 just can drop to-51 ℃.If with the semiconductor cooling device refrigeration of the prior art of general forced air cooling, then under the kindred circumstances, the temperature of cold-trap is minimum can only to drop to-45 ℃, can't reach-51 ℃.This shows that effect of the present utility model is tangible.
Claims (3)
1, a kind of semiconductor cooling device, mainly comprise semiconductor cooler and hot end heat sink, it is characterized in that described hot end heat sink comprises the evaporimeter of being close to the semiconductor cooler hot junction, divides the condenser that is arranged and connect between them and can form the pipeline of natural cycle system, charges into fluid media (medium) in the described system.
2, semiconductor cooling device as claimed in claim 1 is characterized in that the medium that charges in the described system can be water or acetone or methyl alcohol, preferentially adopts water.
3, semiconductor cooling device as claimed in claim 1 or 2 is characterized in that described condenser one side is provided with cooling fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87213525 CN87213525U (en) | 1987-09-17 | 1987-09-17 | Semiconductor refrigerator for adopting separative hot tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87213525 CN87213525U (en) | 1987-09-17 | 1987-09-17 | Semiconductor refrigerator for adopting separative hot tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN87213525U true CN87213525U (en) | 1988-04-13 |
Family
ID=4828005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 87213525 Withdrawn CN87213525U (en) | 1987-09-17 | 1987-09-17 | Semiconductor refrigerator for adopting separative hot tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN87213525U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999050604A1 (en) * | 1998-03-30 | 1999-10-07 | Chen Guo | Thermoelectric cooling device using heat pipe for conducting and radiating |
| CN100386587C (en) * | 2006-06-12 | 2008-05-07 | 北京科技大学 | Pump-free self-circulation non-vacuum split type gravity heat pipe |
| CN106323815A (en) * | 2015-07-02 | 2017-01-11 | 博奥生物集团有限公司 | Biomolecule detection system and non-labeled detection method |
| CN107504714A (en) * | 2012-05-07 | 2017-12-22 | 弗诺尼克设备公司 | It is related to the system and method for thermoelectric heat exchange system |
| US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
| CN113720094A (en) * | 2021-08-03 | 2021-11-30 | 西安交通大学 | Air cooling and gravity heat pipe coupling type cooling device and method |
-
1987
- 1987-09-17 CN CN 87213525 patent/CN87213525U/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999050604A1 (en) * | 1998-03-30 | 1999-10-07 | Chen Guo | Thermoelectric cooling device using heat pipe for conducting and radiating |
| US6351951B1 (en) | 1998-03-30 | 2002-03-05 | Chen Guo | Thermoelectric cooling device using heat pipe for conducting and radiating |
| CN100386587C (en) * | 2006-06-12 | 2008-05-07 | 北京科技大学 | Pump-free self-circulation non-vacuum split type gravity heat pipe |
| CN107504714A (en) * | 2012-05-07 | 2017-12-22 | 弗诺尼克设备公司 | It is related to the system and method for thermoelectric heat exchange system |
| US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
| CN106323815A (en) * | 2015-07-02 | 2017-01-11 | 博奥生物集团有限公司 | Biomolecule detection system and non-labeled detection method |
| CN113720094A (en) * | 2021-08-03 | 2021-11-30 | 西安交通大学 | Air cooling and gravity heat pipe coupling type cooling device and method |
| CN113720094B (en) * | 2021-08-03 | 2022-05-20 | 西安交通大学 | Air cooling and gravity heat pipe coupling type cooling device and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CO5111061A1 (en) | DUAL REFRIGERATION CYCLES OF MULTICOMPONENTS FOR NATURAL GAS LICUEFACTION | |
| CN87213525U (en) | Semiconductor refrigerator for adopting separative hot tube | |
| CA2095494A1 (en) | Cooling Method and Apparatus | |
| US4756167A (en) | Helium cooling apparatus | |
| US2389452A (en) | Drying | |
| US3224212A (en) | Process and apparatus for continuously dehydrating gas | |
| US2900798A (en) | Heat-exchanger in which a multi-component medium is cooled | |
| US3266258A (en) | Method of increasing a vapour compressing refrigerating machine cooling effect | |
| Smirnov et al. | Domestic refrigerators with absorption-diffusion units and heat-transfer panels | |
| ES8207330A1 (en) | Sorption refrigerating apparatus,operating process and utilisation thereof | |
| US2421773A (en) | Heat exchange apparatus in refrigeration systems | |
| US3713305A (en) | DEVICE FOR PRODUCING COLD AT TEMPERATURE LOWER THAN THAT OF lambda -POINT OF HELIUM | |
| GB2017889A (en) | Refrigerating apparatus | |
| RU2661363C1 (en) | Device for low-temperature cooling | |
| US2610479A (en) | Two-temperature refrigerator | |
| US2959941A (en) | Refrigeration devices for individual glass vessels | |
| US2452699A (en) | Refrigeration | |
| Mark et al. | An evaporative-gravity technique for airborne equipment cooling | |
| FR2284839A1 (en) | eutectic evaporator with ribbed inner pipe - has circular ribs on pipe for increasing cooling surface area | |
| USRE17078E (en) | Iiiciav u | |
| CN214276210U (en) | Enrichment pipe refrigerating device | |
| CN218955230U (en) | Pump-free full-liquid type cold water device | |
| GB1333052A (en) | Device for producing cold at temperatues below the lambta- point of helium | |
| CN115371356B (en) | Mars surface oxygen liquefaction system and method adopting Stirling cryocooler | |
| US2300086A (en) | Refrigeration apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |