CN87102318A - The flexible composite foil-coating material for printed circuits making method - Google Patents
The flexible composite foil-coating material for printed circuits making methodInfo
- Publication number
- CN87102318A CN87102318A CN 87102318 CN87102318A CN87102318A CN 87102318 A CN87102318 A CN 87102318A CN 87102318 CN87102318 CN 87102318 CN 87102318 A CN87102318 A CN 87102318A CN 87102318 A CN87102318 A CN 87102318A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- resin
- coating material
- printed circuit
- flexible composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Printed circuit is called flexible multiple Copper Foil polyimide film (PI-F-CU-10) or flexible multiple Copper Foil polyester film (PETP-F-OU-9) with flexible composite foil-coating material by British Standard, and they are to be composited by polyimide film or polyester film and electrolytic copper foil.The present invention's feature is that filming polymer (or resin) directly is coated in copper foil surface, treatedly makes various printed circuits.With the multiple copper foil material of flexibility.
This method has been simplified production process greatly, has improved production efficiency, has reduced product cost.
Description
Technical field that the present invention belongs to: insulating material specialty
So far, produce printed circuit and all adopt " two-step method " with flexible composite foil-coating material.Promptly make thin-film material earlier; Then thin-film material is carried out surface treatment, coated with adhesive is through baking, go up surface treated more again and scribble the metal forming of adhesive, put into press or compounding machine and carry out hot-formingly, this technology just has concise and to the point discipline to carry as far back as the seventies domestic and foreign literature, can reference:
1, to day (good friendly bakelite company) technical symposium document, soft and multilayer printed circuit board, one or nine June in the Seventh Five-Year Plan year are in Shanghai.
2, insulating material communication 1983 № 5～6P93 polyimide film flexible copper-clad composite insulating foil.Xi'an Insulating Materials Plant
3, insulating material communication 1984 № 1 polyimide film metalized.Ministry of Astronautics Industry's 699 factory's prunetins are lifted
The present invention's purpose is in order to simplify technology, enhance productivity, to reduce production costs.
(embodiment 1) with 1 mole 4,4 "=amino-diphenylethers and 2000 gram dimethylacetylamides addings have in the three eck bottles of blender, reflux condenser and thermometer; stir until dissolving fully; 15～30 ℃ of control temperature; slowly add 1.006 moles pyromellitic acid anhydride; continued stirring reaction 1～4 hour, end (with 25 ℃ ± 1 ℃ survey of 4# viscosimeter) when the viscosimetric of taking a sample reaches 3～5 minutes; Be warming up to 50～60 ℃ of degradeds then, add 1500 gram toluene, cold filtration is made polyimide resin.
0.035～0.05mm electrolyzing and coarsening Copper Foil with 10～20% potassium bichromate solution Passivation Treatment 3～5 minutes and after drying, is coated with above-mentioned polyimides tree amine with special glue equipment at alligatoring face, gives through 65～75 ℃ and drying by the fire 5～10 minutes, 80～90 ℃ were dried by the fire 10 minutes.Be coated with (deciding) 4～6 times with quadrat method on the film thickness requirement; Handle through 300～310 ℃ of high temperature cyclisation then, promptly make printed circuit flexible composite foil (polyimide film) material.
Dissolve 100 gram polyvinyl butyral resins (embodiment 2) with the industrial absolute alcohol of 900 grams, and adding has blender, in the three eck bottles of reflux condenser and thermometer, under agitation add 17.65 gram phenol resin solutions (by amount of solid 100%), add 20 gram epoxy resin then and account for resin total solid 1～4 ‰ respectively, 0.1 ‰ pigment is (as gorgeous orchid, bright green etc.) and brightener, stir, then with special equipment or instrument be coated in 0.035～0.05mm Copper Foil through surface that anodized is crossed, through giving baking, the printed circuit flexible composite foil-coating material is made in high temperature (150～180 ℃) baking 10～15 minutes.
(reference example) handled 0.035～0.05mm electrolyzing and coarsening Copper Foil 3～5 minutes with 2～10% propyl benzene triazole aqueous solution (adding a small amount of ethylene glycol), and after the oven dry, be coated with 4～7 times 8112-F level polyester imines wire enamels (Shanghai Kailin Paint Factory is industrial production) with special glue equipment, 5～9 meters/minute of the speed of a motor vehicle, 200～230 ℃ of furnace temperature, 300～340 ℃ of bakers are grown 5 meters, make printed circuit flexible composite foil (polyester imines film) material.
The present invention compares with existing production technology and has the following advantages:
1, simplifies production process greatly, saved film surface processing and gluing thereof, roasting procedure and last hot pressing compound working procedure;
2, reduced material consumption, aluminium foil consumption when particularly having saved the manufacturing film;
3, product specification is not subjected to fabric width, the length of film, the restriction of thickness, has improved the utilance of finished product greatly;
4, need not compounding machine etc. equipment, saved the equipment investment expense greatly;
5, rough estimate product cost can reduce by 2～3 times.
Claims (4)
- The printed circuit flexible composite foil-coating material is to be composited by polyimide film or polyester film and electrolytic copper foil; The present invention's feature is the ready-made film of non-employing, has saved compound working procedure again, has changed the method for existing production printed circuit with flexible multiple copper foil material fully.1, the feature by the present invention is coated in copper foil surface with filming polymer (or resin), and through reprocessing, a step makes the printed circuit flexible composite foil-coating material.
- 2, according to claim 1, it is characterized in that the non-limiting polyimide resin of filming polymer (or resin), can also be its modified resin or other high polymers, as epoxy phenolics Modified Polyvinyl Formal Adhesive etc.
- 3, according to claim 2, the model of epoxy resin can be E type, F type etc. without limits; Its quantity is also the amount doesn't matter;
- 4,, can add various auxiliary agents in the filming polymer (or resin), as fire retardant, plasticizer, stabilizer, fast light, heat-resistant aging agent, colouring agent etc. according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87102318 CN87102318A (en) | 1987-03-28 | 1987-03-28 | The flexible composite foil-coating material for printed circuits making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87102318 CN87102318A (en) | 1987-03-28 | 1987-03-28 | The flexible composite foil-coating material for printed circuits making method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN87102318A true CN87102318A (en) | 1987-12-23 |
Family
ID=4813899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 87102318 Pending CN87102318A (en) | 1987-03-28 | 1987-03-28 | The flexible composite foil-coating material for printed circuits making method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN87102318A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101356864B (en) * | 2006-02-06 | 2010-06-16 | Lg化学株式会社 | Copper clad laminate for pasting chip on flexible plate |
| CN103108730A (en) * | 2010-09-17 | 2013-05-15 | 三菱瓦斯化学株式会社 | Entry sheet for drilling |
| CN112118670A (en) * | 2020-09-01 | 2020-12-22 | 安徽美邦树脂科技有限公司 | Transparent flexible PVB composite structure high-frequency transmission line and preparation method thereof |
-
1987
- 1987-03-28 CN CN 87102318 patent/CN87102318A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101356864B (en) * | 2006-02-06 | 2010-06-16 | Lg化学株式会社 | Copper clad laminate for pasting chip on flexible plate |
| CN103108730A (en) * | 2010-09-17 | 2013-05-15 | 三菱瓦斯化学株式会社 | Entry sheet for drilling |
| CN103108730B (en) * | 2010-09-17 | 2015-03-04 | 三菱瓦斯化学株式会社 | Entry sheet for drilling |
| CN112118670A (en) * | 2020-09-01 | 2020-12-22 | 安徽美邦树脂科技有限公司 | Transparent flexible PVB composite structure high-frequency transmission line and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |