CN85102328A - The cooling device of semiconductor integrated circuit board - Google Patents
The cooling device of semiconductor integrated circuit board Download PDFInfo
- Publication number
- CN85102328A CN85102328A CN 85102328 CN85102328A CN85102328A CN 85102328 A CN85102328 A CN 85102328A CN 85102328 CN85102328 CN 85102328 CN 85102328 A CN85102328 A CN 85102328A CN 85102328 A CN85102328 A CN 85102328A
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- Prior art keywords
- integrated circuit
- fin
- heat conducting
- conducting element
- shell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Be used for providing the cooling device of cold to semiconductor integrated circuit board assembling circuit, transmit heat by the thin heat radiation chip part, these thin heat radiation sheets mate with each other by means of a little gap.One is formed with the thin heat radiation sheet in the bottom surface of each heat conducting element.This base area is bigger than the back gauge area of semiconductor integrated circuit board.Heat conducting element remains face each other with semiconductor integrated circuit board and contacts, thereby has improved cooling performance.
Description
The background of invention
The present invention relates to a kind of cooling device, this equipment is used to distribute the heat that is produced by semiconductor element or integrated circuit board.
In the giant brain system, need to realize at high speed handling operation.For this reason, developed the integrated circuit board that is assembled with a large amount of semiconductor elements thereon in recent years.In addition, shorten, proposed in micromodule, to install the method for a large amount of this integrated circuit boards again in order to make the connection electric wire between this integrated circuit board.
So far, proposed a kind of cooling device that is used in particular for the giant brain system, this equipment is in US Patent No 3,993, and is open in 123.In this cooling device, the heat that is produced by the large scale integrated circuit plate passes to piston by helium layer, this helium be present in compression section around between the background surfaces surface of the ball-shaped end of piston and large scale integrated circuit plate, then, heat is passed to helium layer the gap that is present between this piston and the cylinder from piston, passes to the shell of micromodule again.So heat is all passed to the cooler that is used for dispelling the heat, this cooler is contained on the shell, has cooling water or cooling air circulation to pass through in the cooler.
Yet, some problems below above-mentioned existing cooling technology exists.
The thermal conductivity of helium is higher with other gases by comparison, and still, its thermal conductivity is still very low by comparison with the thermal conductivity of metal parts such as piston, cylinder or like.Therefore, for the thermal resistance that makes helium layer is little, just need do the gap between piston and the cylinder little.For this reason, to the processing of piston or cylinder, require to have high accuracy.If their machining accuracy is low, piston can not move reposefully so, and perhaps the temperature of every surface-mounted integrated circuit may be very high.
In order to address the above problem, disclosed cooling structure in 965 has been proposed as US Patent No 4,263.In this structure, face in the shell of large scale integrated circuit plate, a lot of parallel slots are arranged, and in each bar groove, embed the thin heat conducting inserts of a rectangle and a slice reed, this reed is used for exerting pressure to this heat conducting inserts.The improvement of this structure is that the available heat exchange area between the sidewall of heat conducting inserts and parallel slot is big.In addition, the thin surface of every heat conducting inserts is with the end surfaces maintenance face contact of extensive integrated circuit.
, said structure has following problem again.Because every heat conducting inserts separates separately, and embeds in its corresponding parallel slot, carries out heat exchange between the proximity thermal guide card hardly.Because the integrated circuit on the large scale integrated circuit plate is made up of a lot of electronic circuits, usually, the heat that this large scale integrated circuit plate produces seldom is uniform.In the large scale integrated circuit plate, the distribution of the heat that is produced is different because of the space, and is also different because of the time.Therefore, have only near those heat conducting insertses around the heat release part on the extensive integrated circuit and could play thermolysis.In other words, only those are passed the heat energy of coming by very thin surface-mounted integrated circuit from heating part other heat conducting insertses far away and play thermolysis.That is to say, even a lot of heat conducting insertses are housed on the large scale integrated circuit plate, owing to do not have good heat transfer to connect between the heat conducting inserts, and their radiating efficiency is reduced.
Moreover the full-size that heat conducting inserts can be installed is subjected to concentrating on a large scale the width limitations of circuit board, thereby has limited the raising of cooling performance.
In addition, disclose a kind of cooling device in Japanese patent publication No23463/83, this equipment has adopted the thermal conductance metallic plate bundle of being made up of lamination.The shortcoming of this cooling device is that the contact heat resistance between the reed is big.
Summary of the invention
Consider in the above-mentioned prior art intrinsic shortcoming, task of the present invention is to provide a kind of cooling device for semiconductor element or integrated circuit board, this cooling device has high cooling performance, and various replacements have been drawn, comprising the change of substrate, the connection of conversion semiconductor integrated circuit board, the change of assembly structure, various thermal deformations relevant or the like, and be no more than stressed that semiconductor integrated circuit board allows with cooling device.
Characteristics of the present invention are that a lot of first group of fin integrally are contained on the heat conducting element, and the base area of this heat conducting element is greater than the area of dissipation of semiconductor integrated circuit board; These first group of fin matches with many second group of fin, forms little gap at the inner surface of shell; The basal surface of heat conducting element is crushed on by flexible member on the plane surface of semiconductor integrated circuit board, and flexible member is installed between the inner surface of heat conducting element and shell.
The accompanying drawing summary
Fig. 1 is a perspective cutaway view,, and it has provided a cooling device embodiment that cold is provided for semiconductor integrated circuit according to the present invention; Fig. 2 is the vertical direction cross-sectional view of the major part of the cooling device that is used for semiconductor collection wiring board shown in Fig. 1; Fig. 3 is the horizontal direction cross-sectional view of the major part of the cooling device that is used for the semiconductor integrated circuit plate shown in Fig. 1; Fig. 4 is the vertical view of substrate, and semiconductor integrated circuit just is installed on this substrate; Fig. 5,6 and 7 is respectively the vertical direction sectional view of other embodiment of the present invention; Fig. 8 is the detailed structure partial cross section perspective view of the outer casing member shown in Fig. 7; Fig. 9 is the detailed structure partial cross-sectional perspective view of the reed shown in Fig. 7; Figure 10 is the perspective view according to another embodiment of cooling device of the present invention, as to be used for semiconductor integrated circuit board; Figure 11 is the transversal drawing of the vertical direction of additional embodiments of the present invention; Figure 12 and 13 is respectively the cross-sectional view of the shell of other embodiment of the present invention; Figure 14 to 16 is curve charts, and their expression fin axial overlap length is with the relation of thermal resistance, and first group of fin count is with the relation of thermal resistance, so that prove performance of the present invention.
The detailed description of most preferred embodiment
Now, to Fig. 4 one embodiment of the present of invention are described referring to Fig. 1.
In these figure, shell 15 is made as copper, aluminium or other similar materials by the material of high thermal conductivity.On the inner surface of shell, a lot of plate-shaped fins 16 parallel to each other are housed.In addition, the surface area of first heat conducting element 17 is than big by the formed area of heat transfer of the backside surface of large scale integrated circuit plate 1, and heat conducting element 17 also has bottom parts.On this bottom parts, a lot of plate-shaped fins 18 are housed, they are in aggregates with base plate.Fin 18 spacing each other is identical with the distance between the fin 16.The fin 18 of the fin 16 on the shell 15 and the bottom parts of heat conducting element 17 is fitted to each other, and little gap 19 is arranged therebetween.The bottom parts of heat conducting element 17 is crushed on by spring 20 on the plane surface of large scale integrated circuit plate 1, and spring 20 has little elastic constant, so that connects the soldered ball 3 of large scale integrated circuit plate 1 without any influence to being used to.Like this, the bottom parts of heat conducting element 17 is with the backside surface maintenance face contact of large scale integrated circuit 1.Spring 20 is placed in the gap 23 in the fin 16, and is contained in regularly in the formed groove 22 in center of the bottom parts of formed groove 21 and heat conducting element 17 in the shell 15.In this situation, because the application point of spring 20 is present in respectively in the groove 21 and 22 of the bottom parts of heat conducting element 17 and shell 15, heat conducting element 17 can stably be pressed on the plane surface of large scale integrated circuit plate 1.Simultaneously, spring has enough length.In addition, spring can also prevent the backside surface disengagement of the bottom parts of heat conducting element 17 with surface-mounted integrated circuit 1, has guaranteed that therefore the core of heat conducting element 17 is the face contact with surface-mounted integrated circuit 1 all the time.
In view of this embodiment has aforesaid structure, at first all pass the bottom parts that advances with the heat conducting element 17 of integrated electric road maintenance face contact, evenly diffusion in bottom parts then by the heat of sending in the surface-mounted integrated circuit 1.After this, heat is passed in each sheet fin 18 of thermal conductance parts 17.By being in the high thermal conductivity gas blanket in the little gap between fin 16 and 18, heat is transferred in the fin 16 of shell again.At last, heat is taken away (not shown) by the cooling device that is installed on the shell 115.
Because the fin 18 of heat conducting element 17 is an integral body with its bottom parts, even the skewness of heat in the large scale integrated circuit plate 1, the heat of producing in the surface-mounted integrated circuit 1 also can diffusion equably in bottom parts.Therefore the heat transference efficiency of each sheet fin 18 of heat conducting element 17 can be maximum.Heat conducting element 17 sizes can be selected arbitrarily, so that the maximum area 51 that the protrusion of heat conducting element 17 can occupy on substrate 2 to a slice surface-mounted integrated circuit from the minimum backside surface of surface-mounted integrated circuit 1 in the scope of the area on the substrate 2, as shown in Figure 4.The fin 16 of shell 15, perhaps the fin 18 of heat conducting element 17 always has total cross-sectional area of one littler than the back side area of heat transfer of surface-mounted integrated circuit 1 among the two.Because cross-sectional area reduces, and has produced thermal resistance, their heat transference efficiency reduces.Based on this reason, the size of regulation heat conducting element 17 is not less than the backside area of surface-mounted integrated circuit, and the area that perhaps preferably is not less than area 50,50 is more than 2 times or 2 times of backside area.But on the other hand, when the size of heat conducting element 17 increased, element 17 can be with the back side contact of contiguous surface-mounted integrated circuit 1, therefore, the size restrictions of heat conducting element 17 at a slice surface-mounted integrated circuit 1 within the maximum area 51 of being occupied on the substrate 2.
Because spring 20 is arranged to avoid its elastic force to act directly on fin 16 and 18, it is curved that fin 16,18 can not become.Therefore fin 16 and 18 can approach.In addition, because the base part 17B of heat conducting element 17 can freely move when it keeps in touch with surface-mounted integrated circuit 1 only with surface-mounted integrated circuit 1 contact.In addition, heat conducting element 17 can also be at will with surface-mounted integrated circuit 1 separately.
Fig. 5 is an alternative embodiment of the invention.In this embodiment, every fin 25 follows the inner surface of shell 15 to be integral, and the embodiment of front face is the same, and every fin 27 is in aggregates with heat conducting element 26, and fin 25 and 27 all has the trapezoid cross section, and is tapered along its tip direction.Other structures of this embodiment are identical with the structure of embodiment shown in Figure 1, omit description of them at this. Fin 25 and 27 vertical cross-section are added 2 one-tenth this when trapezoidal, simplified the process operation of fin.
Fig. 6 represents another embodiment of the present invention, and its characteristics are that minimum surface or the lower surface of the bottom parts 28B of heat conducting element 28 make garden cylinder 30, and the central shaft of this cylinder extends on the equidirectional with the fin 29 of heat conducting element 28.When heat conducting element 228 constitutes like this, not only the fin 16 of the fin 29 of heat conducting element 28 and shell 15 can freely move in the groove between its corresponding fin, even when surface-mounted integrated circuit 1 when the direction that intersects with fin 29 tilts, also can easily make heat conducting element 28 with surface-mounted integrated circuit 1 motion.
When this lower surface was made the garden cylinder, heat conducting element 28 was the line contact with surface-mounted integrated circuit 1, rather than the some point touches, and had only when lower surface made sphere, and just origination point contacts, so contact heat resistance is little.In addition, because heat conducting element 29 can increase with the increase of surface-mounted integrated circuit 1, can therefore, improve the cooling performance of heat conducting element the most at last so that the gap 19 between fin 16 and 29 is done lessly.
Now, referring to Fig. 7,8 and 9, additional embodiments of the present invention will be described.
Being contained in some fin 32 on the inner surface of shell 15 follows at the ridge 35 at fin tip and forms together.On the other hand, follow the surface of the heat conducting element 40 of surface-mounted integrated circuit 1 contact to be made to flat.When a lot of fin 31 insert between some fin 32, can avoid the axial motion of fin 31 along groove, these grooves are between fin 32, and heat conducting element 40 is pressed between the ridge 35.In addition, be pressed in the both sides of heat conducting element 40 by the sheet spring, heat conducting element 40 is crushed on the surface-mounted integrated circuit 1, and sheet spring 33 is formed one with a lot of springs 34.
Figure 10 is another embodiment of the present invention.In this embodiment, one group of fin 42 on the shell 41 is to install corresponding to each piece surface-mounted integrated circuit 1 dividually or independently.Other structures among this embodiment are with the same among the embodiment shown in Figure 1.This structure of having mentioned has an advantage, even be subjected to thermal deformation or pressure when shell 41 because of use producing, for example carrying surface cause distortion the time, its stops the fin 16 of heat conducting element 17 and fin 42 interlock each other of shell 41.
Figure 11 represents other embodiment of the present invention, in this embodiment, the fin 45 of shell 43 also is the fin of heat conducting element 44, heat conducting element 44 is followed and heat conducting element 17 is installed in the same mode of surface-mounted integrated circuit 1 one sides is contained in shell 43 1 sides, like this, this heat conducting element 44 is connected to the inner surface of shell 43.Because in this embodiment, heat conducting element 17 is identical with 44 the two course of processing, and fin 16 and 45 reaches same machining accuracy easily.In addition, the production efficiency of separate machined fin and shell is than they being processed all-in-one-piece production efficiency height.
Figure 12 has provided another embodiment of the present invention, in this embodiment, the top surface area of each heat conducting element 44 equals maximum area 51 shown in Figure 4, and it is an area that surface-mounted integrated circuit 1 can occupy, and heat conducting element 44 with shell 43 separately, and can slide with respect to 43.By this embodiment,, just prevented that each heat conducting element 44 from moving horizontally because the heat conducting element 44 of two vicinities contacts with each other.Like this, the position of element 44 is automatically fixed in the shell 43.Therefore shell 43, heat conducting element 44 and heat conducting element 17 can be distinguished independent composition, and the result has improved their production efficiency separately.
Figure 13 also is one embodiment of the present of invention, and in this embodiment, shell 46 is divided into flat part 47 and side seat part 49.When processing the fin 48 of shell 46, if side seat part 49 is separated with the flat parts of shell 46 in advance, it is easier that the processing of above-mentioned fin 48 just becomes, in fact only need cut.In addition, be distributed with the substrate 2 of a lot of wiring patterns on it, mechanical strength is low usually, and therefore, the flange that is used for can is independently parts.Among this embodiment because flat part 47 is identical with the manufactured materials of substrate 2, their thermal coefficient of expansion too, and side seat part 49 and sealing flange also can adopt the mechanical strength identical materials respectively.As mentioned above, adopt different materials, can obtain lot of superiority for flat part 47 and side seat part 49, such as the sealing property that improves shell, reduce shell the heat efficiency, increase productivity ratio of shell or the like.
In each above-mentioned embodiment, the number of supposing the height of fin of each heat conducting element or this fin is identical with corresponding every surface-mounted integrated circuit 1, because the service conditions or the electronic circuit difference of every surface-mounted integrated circuit 1, the total amount of heat of Chan Shenging is also different therein.Therefore, in order to increase the operational reliability of this surface-mounted integrated circuit, need to keep the temperature constant of this integrated circuit board.In this respect, if arrange the height of the fin of the height of fin of heat conducting element or shell according to the service conditions of corresponding surface-mounted integrated circuit 1, the perhaps number of this fin so just can easily be controlled the temperature of this surface-mounted integrated circuit.Note that in this connection even the height of the fin of heat conducting element is done lowly, the length that is used to push down the spring of heat conducting element does not need to change.
Usually, heat conducting element or shell are made by high thermal conductivity materials copper or aluminium, and on the other hand, the backside surface of surface-mounted integrated circuit conducts electricity, unless it is special in advance the electric insulation processing.For this reason, if the heat conducting element of being made by copper or aluminium is crushed on the backside surface of surface-mounted integrated circuit, each piece surface-mounted integrated circuit will all be shortened.So, when heat conducting element or shell are made by the silico-carbo material, and this material has electrical insulation capability, when simultaneously high thermal conductivity being arranged again, can not only make heat conducting element or shell have high heat conductance between the thermal conductivity of Xie Yutong and aluminium, and can make heat conducting element or shell very little with the difference of the thermal coefficient of expansion between the substrate of integrated circuit.
Must notice that at this fin number and surface-mounted integrated circuit number can change, this does not deviate from the spirit and scope of the present invention.
In addition, also know, the Fig. 1 in the most preferred embodiment is changed over multiple-piece package shell to the semiconductor integrated circuit board shown in Figure 12, a lot of semiconductor integrated circuit are housed in this shell, also do not deviate from scope of the present invention.
Performance according to cooling device of the present invention has been done check, and its result is illustrated among Figure 14 to Figure 16.
This check is finished under following condition, and wherein: surface-mounted integrated circuit is of a size of 4mm
2The maximum area that surface-mounted integrated circuit occupied is 9mm
2; The material of making heat conducting element and shell is an aluminium; The gas that is sealed in the shell is helium.In addition, the bottom parts full-size of heat conducting element is no more than 8mm
2, so that avoid the heat conducting element of two vicinities to be adjacent to each other.
Figure 14 represents the thermal resistance between heat conducting element and the shell and the relation curve of fin overlap length in vertical direction, this curve is recorded under the following conditions: every thickness of first group of fin of heat conducting element, and every thickness of second group of fin of shell is respectively 11mm, and they are determined values; The number of first group of fin and the degree of depth are respectively 4 and 8mm, and they also are determined values; Under these conditions, when the height separately of first group of fin and second group of fin is done very highly, and first group and second group of fin be when the overlap length of vertical direction is increased to 10mm, and the gap between first group and the second group of fin is a parameter.In the figure, curve A, B, C, D are 25mm corresponding to the gap respectively, 50Mm, the situation of 100Mm and 200Mm.If the gap is constant, a fin overlap length that makes the thermal resistance minimum is arranged.For example, if the gap is 25Mm, best overlapping folded length is approximately 5mm.When the gap is increased to 50Mm by the order of being mentioned, when 100Mm and 200Mm, the also corresponding increase of best overlap length.Its reason is as follows: little or in short-term when overlap length, the heat conduction thermal resistance of every pair of fin of first group and second group fin reduces.But along with overlapping area between first group and the second group of fin reduces, the entire thermal resistance between heat conducting element and the shell increases.On the other hand, when overlap length when big or long, though overlapping area increases, because the heat conduction thermal resistance of every pair of fin in first group and the second group of fin increases, entire thermal resistance still increases.
Figure 15 is the thermal resistance between heat conducting element and the shell and the relation curve of overlap length, and it records under the following conditions: the clearance constant between first group of fin and the second group of fin is 50Mm; The bottom parts of heat conducting element is 8mm
2; The thickness of first group of fin and second group of fin is parameter.Curve E among the figure, F, G and H promptly are respectively (2.6mm, 2) corresponding to all thickness and the number of the fin on the heat conducting element; (1.0mm, 4); (0.4mm, 8) and (0.2mm, 16).Obviously, thermal resistance reduces with the increase of fin number.This should be noted that curve B among Figure 14 represented with curve among Figure 15 under represented be same situation.
As what recognized from Figure 14 and Figure 15, if fin thickness reduces, the number of this fin increases, and the gap between the fin reduces; And select best overlap length may make thermal resistance little.
Figure 16 represents the relation curve between the number of thermal resistance between heat conducting element and the shell and first group of fin.When the thickness of first group of fin is 1mm, highly is 3mm for 4mm, overlap length, when the gap between first group of fin and the second group of fin is 50Mm, under these conditions, first group and second group of fin number reduce with second group of fin thickness successively and increase.Obviously, when first group of fin number increased, thermal resistance reduced.Yet when first group of fin number increased above some, because the thickness of second group of fin reduces, thermal resistance increased.If want to increase the fin number, as shown in figure 15,, make the overlap length weak point just enough simultaneously as long as make first group and second group diffusing strong thin thickness.
Claims (4)
1, is used for providing the cooling device of cold to the assembling circuit of one or several semiconductor integrated circuit board, be sent to shell in order to be installed in the heat that the on-chip a lot of semiconductor integrated circuit board of circuit produced, so that this heat is dissipated, this equipment has some independently heat conducting elements, one end of each heat conducting element is with the backside surface contact of a block semiconductor surface-mounted integrated circuit, the other end cooperates with shell by means of a little gap, and this gap is between the described end and shell of heat conducting element.Between heat conducting element and shell, flexible member is housed, it is characterized in that each heat conducting element comprises a bottom parts, the lower surface of bottom parts is with the backside surface contact of semiconductor integrated circuit board, and bottom surface area is bigger than the backside surface area of semiconductor integrated circuit board, also have a lot of first group of fin, these fin are integral with bottom parts, and extend along the direction perpendicular to lower surface; On shell, be equipped with first group of many second group of fin that fin matches.
2,, it is characterized in that first group is respectively a lot of parallel fuel plates with second group of fin according to the cooling device of claim 1 desired cooling semiconductor integrated circuit plate.
3,, it is characterized in that described those second group of fin are contained in second of every block semiconductor surface-mounted integrated circuit independently on the heat conducting element according to the claim 2 desired cooling devices that are used for the cooling semiconductor integrated circuit plate; As second independently the bottom surface area of heat conducting element be the maximum area that a block semiconductor integrated circuit can occupy, and with contiguous semiconductor integrated circuit board contact.
4, it is characterized in that according to the claim 3 desired cooling devices that are used for the cooling semiconductor integrated circuit plate second heat conducting element can be contained in shell lightly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN85102328A CN85102328B (en) | 1985-04-01 | 1985-04-01 | Cooling device of semiconductor integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN85102328A CN85102328B (en) | 1985-04-01 | 1985-04-01 | Cooling device of semiconductor integrated circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN85102328A true CN85102328A (en) | 1987-01-10 |
| CN85102328B CN85102328B (en) | 1987-10-07 |
Family
ID=4792429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN85102328A Expired CN85102328B (en) | 1985-04-01 | 1985-04-01 | Cooling device of semiconductor integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN85102328B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100464620C (en) * | 2006-02-10 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Heat radiator |
| WO2019175785A1 (en) * | 2018-03-12 | 2019-09-19 | IDEA machine development design AND production ltd. | Heat sink for a mounted element |
| CN110662389A (en) * | 2018-06-28 | 2020-01-07 | 华为技术有限公司 | Heat dissipation device and electronic equipment |
| CN115616385A (en) * | 2022-11-09 | 2023-01-17 | 珠海精实测控技术股份有限公司 | Temperature control test system and method |
-
1985
- 1985-04-01 CN CN85102328A patent/CN85102328B/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100464620C (en) * | 2006-02-10 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Heat radiator |
| WO2019175785A1 (en) * | 2018-03-12 | 2019-09-19 | IDEA machine development design AND production ltd. | Heat sink for a mounted element |
| CN110662389A (en) * | 2018-06-28 | 2020-01-07 | 华为技术有限公司 | Heat dissipation device and electronic equipment |
| CN115616385A (en) * | 2022-11-09 | 2023-01-17 | 珠海精实测控技术股份有限公司 | Temperature control test system and method |
| CN116520134A (en) * | 2022-11-09 | 2023-08-01 | 珠海精实测控技术股份有限公司 | Temperature control testing system |
| CN116520134B (en) * | 2022-11-09 | 2024-01-09 | 珠海精实测控技术股份有限公司 | Temperature control testing system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN85102328B (en) | 1987-10-07 |
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