CN2889529Y - Semiconductor element cleaning machine - Google Patents
Semiconductor element cleaning machine Download PDFInfo
- Publication number
- CN2889529Y CN2889529Y CN 200520131052 CN200520131052U CN2889529Y CN 2889529 Y CN2889529 Y CN 2889529Y CN 200520131052 CN200520131052 CN 200520131052 CN 200520131052 U CN200520131052 U CN 200520131052U CN 2889529 Y CN2889529 Y CN 2889529Y
- Authority
- CN
- China
- Prior art keywords
- liquid
- rinse bath
- semiconductor element
- rotating disk
- cleaning machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
A cleaning machine for semi-conductor elements comprises a rinse bath, wherein a liquid accumulative ring is arranged at the hemline inside the rinse bath, is connected with a filling pipe therein communicated with a supplying bath of soak solution, and is connected with a inner drainage pipe therein communicated with a recycling bath of soak solution, an outer drainage pipe communicated with the recycling bath of soak solution is connected with the outer part of the liquid accumulative ring, and an ultrasound vibrator is installed outside the body of the recycling bath; a rotating disk, which is installed inside the liquid accumulative ring of the rinse bath, and is driven by a power supply installed outside the rinse bath.; facing the rotating disk, a cleaning spiral arm, wherein the cleaning spiral arm is corresponding to the rotating disk and installed inside the rinse bath, a series of nozzle whose radius is longer than that of the rotating disk are arranged, and the nozzle serials are connected with a feeding pipe for jetting flow liquid and a feeding pipe for dry gas. The utility model is provided with effective cleaning without any dead angle.
Description
Technical field
The utility model relates to a kind of cleaning device of semiconductor element, relates in particular to a kind of semiconductor element cleaning machine with the effect of cleaning no dead angle.
Background technology
The semiconductor element cleaning machine of general wet type, modal is with nozzle ejection cleaning fluid, hydro-peening semiconductor element; But because the cleaning way of hydro-peening, only can the surface clean semiconductor element, for semiconductor element,, can't reach the effect in abundant cleaning slit, that is exist and clean the dead angle because of cleaning fluid is difficult to enter effectively in the slit with slit.
The utility model content
Technical problem underlying to be solved in the utility model is, overcomes the above-mentioned defective that prior art exists, and a kind of semiconductor element cleaning machine is provided, and it has the effect of cleaning no dead angle.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of semiconductor element cleaning machine, it is characterized in that, it is to be provided with: a rinse bath at a board, root edge is provided with a liquid-accumulating ring in the groove, liquid-accumulating ring is internally connected with and passes to the liquid injection pipe that soak is supplied with groove, with pass to discharging tube in the soak accumulator tank, liquid-accumulating ring is externally connected to the exterior liquid pipe that passes to the soak accumulator tank, groove body outside is provided with the ultrasonic vibrations device; One rotating disk is arranged at the liquid-accumulating ring inside of this rinse bath, and is driven by a power source of being located at the rinse bath outside; One cleans spiral arm, and this rotating disk is arranged at this rinse bath inside relatively, and is laid with the nozzle rows longer than this rotating disk radius, and this nozzle rows is connected with jet flow liquid supply pipe and dry gas supply pipe.
Aforesaid semiconductor element cleaning machine wherein cleans spiral arm and is set as back and forth to revolve and turn 90 degrees, and other comprises and adds the second fluid nozzle row that are connected with hydro-peening liquid supply pipe.
Aforesaid semiconductor element cleaning machine, wherein the rinse bath outer rim is coated with heating blanket.
Aforesaid semiconductor element cleaning machine, wherein rinse bath groove top is provided with the electrical static eliminator nozzle.
Aforesaid semiconductor element cleaning machine, wherein rinse bath groove body is provided with steam vent.
The beneficial effects of the utility model are that it has the effect of cleaning no dead angle.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is a combining structure front view of the present utility model
Fig. 2 is a combining structure vertical view of the present utility model
The number in the figure explanation:
10 boards, 27 electrical static eliminator nozzles
11 soaks are supplied with groove 28 steam vents
12 soak accumulator tanks, 30 rotating disks
20 rinse baths, 31 power sources
21 liquid-accumulating rings 40 clean spiral arm
22 liquid injection pipes, 41 nozzle rows
Discharging tube 42 hydro-peening liquid supply pipes in 23
24 exterior liquid pipes, 43 dry gas supply pipes
25 ultrasonic vibrations devices, 44 hydro-peening liquid supply pipes
26 heating blankets, 45 second fluid nozzles row
The specific embodiment
At first, see also Fig. 1, shown in Figure 2, the utility model is to be provided with at a board 10:
One rinse bath 20, root edge is provided with a liquid-accumulating ring 21 in the groove, liquid-accumulating ring 21 is internally connected with and passes to the liquid injection pipe 22 that soak is supplied with groove 11, with the interior discharging tube 23 that passes to soak accumulator tank 12, and be externally connected to the exterior liquid pipe 24 that passes to soak accumulator tank 12 at liquid-accumulating ring 21, be provided with ultrasonic vibrations device 25 in groove body outside again; In addition, the groove outer rim is coated with heating blanket 26, and the groove top then is provided with electrical static eliminator nozzle 27, and the groove body is provided with steam vent 28;
One rotating disk 30 is arranged at liquid-accumulating ring 21 inside of this rinse bath 20, and is driven by a power source 31 of being located at rinse bath 20 outsides;
One cleans spiral arm 40, and this rotating disk is arranged at this rinse bath 20 inside relatively, and is laid with the nozzle rows 41 longer than this rotating disk 30 radiuses, and makes this nozzle rows 41 be connected with hydro-peening liquid supply pipe 42 and dry gas supply pipe 43.
Again, this cleaning spiral arm 40 is set as back and forth to revolve and turn 90 degrees, but is not limited to this, and it can add the second fluid nozzle row 45 that are connected with hydro-peening liquid supply pipe 44, to promote the cleaning performance of hydro-peening; Yet aforesaid second fluid nozzle is to utilize the swiftly flowing principle of compressed air, makes the more micronized nozzle of liquid of ejection.
Based on said structure, the utility model is the liquid-accumulating ring 21 of elder generation at rinse bath 20, supply with the liquid injection pipe 22 injection soaks of groove 11 by passing to soak, and make the vibrations of rinse bath 20 groove bodies by ultrasonic vibrations device 25, and to being positioned over the semiconductor element of rotating disk 30, producing soaking and washing and add the effect that ultrasonic cleans; Wherein, soaking and washing adds in the process of ultrasonic cleaning, overflows the soak of liquid-accumulating ring 21, is to flow to soak accumulator tank 12 by exterior liquid pipe 24; And soaking and washing is when adding the EP (end of program) that ultrasonic cleans, and the soak that accumulate liquid-accumulating ring 21 inside then flow to soak accumulator tank 12 by interior discharging tube 23.
Then, clean the nozzle rows 41 of spiral arm 40, sprayed the semiconductor element that hydro-peening liquid hydro-peening is positioned over rotating disk 30 before this, produce the cleaning performance of hydro-peening; Then, nozzle rows 41 stops to spray the hydro-peening program of hydro-peening liquid, changes the ejection dry gas into, carries out final drying program.And carry out before the drying program, can be by the second fluid nozzle row 45 that add, with micronize hydro-peening liquid more, promote the cleaning performance of hydro-peening.
Therefore, the utility model incorporates and soaks and the vibrations cleaning, and have the effect of cleaning no dead angle outside common hydro-peening mode.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any simple modification, equivalent variations and modification that above embodiment did.
In sum, the utility model is on structural design, use practicality and cost benefit, it is required to meet industry development fully, and the structure that is disclosed also is to have unprecedented innovation structure, have novelty, creativeness, practicality, the regulation that meets relevant novel patent requirement is so mention application in accordance with the law.
Claims (5)
1, a kind of semiconductor element cleaning machine is characterized in that, is to be provided with at a board:
One rinse bath, root edge is provided with a liquid-accumulating ring in the groove, and liquid-accumulating ring is internally connected with and passes to the liquid injection pipe that soak is supplied with groove, and passes to discharging tube in the soak accumulator tank, liquid-accumulating ring is externally connected to the exterior liquid pipe that passes to the soak accumulator tank, and groove body outside is provided with the ultrasonic vibrations device;
One rotating disk is arranged at the liquid-accumulating ring inside of this rinse bath, and is driven by a power source of being located at the rinse bath outside;
One cleans spiral arm, and this rotating disk is arranged at this rinse bath inside relatively, and is laid with the nozzle rows longer than this rotating disk radius, and this nozzle rows is connected with jet flow liquid supply pipe and dry gas supply pipe.
2, semiconductor element cleaning machine according to claim 1 and 2 is characterized in that described cleaning spiral arm is set as back and forth to revolve to turn 90 degrees, and other comprises and adds the second fluid nozzle row that are connected with hydro-peening liquid supply pipe.
3, semiconductor element cleaning machine according to claim 1 and 2 is characterized in that described rinse bath outer rim is coated with heating blanket.
4, semiconductor element cleaning machine according to claim 1 and 2 is characterized in that described rinse bath groove top is provided with the electrical static eliminator nozzle.
5, semiconductor element cleaning machine according to claim 1 and 2 is characterized in that described rinse bath groove body is provided with steam vent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520131052 CN2889529Y (en) | 2005-12-31 | 2005-12-31 | Semiconductor element cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520131052 CN2889529Y (en) | 2005-12-31 | 2005-12-31 | Semiconductor element cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2889529Y true CN2889529Y (en) | 2007-04-18 |
Family
ID=38020181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520131052 Expired - Lifetime CN2889529Y (en) | 2005-12-31 | 2005-12-31 | Semiconductor element cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2889529Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101530852A (en) * | 2008-03-10 | 2009-09-16 | 富士通株式会社 | Cleaning apparatus, cleaning tank, cleaning method, and method for manufacturing article |
| CN102059230A (en) * | 2010-12-30 | 2011-05-18 | 常州松晶电子有限公司 | Rocking washing device for washing wafer |
| CN102097293A (en) * | 2010-11-19 | 2011-06-15 | 嘉盛半导体(苏州)有限公司 | Cleaning machine table for semiconductor package products and cleaning process thereof |
| CN101179009B (en) * | 2007-11-21 | 2011-09-21 | 上海宏力半导体制造有限公司 | Jet cleaning method and device |
| CN103861839A (en) * | 2012-12-12 | 2014-06-18 | 朗姆研究公司 | Ultrasonic cleaning method and apparatus therefor |
| CN106513367A (en) * | 2016-10-31 | 2017-03-22 | 广西大学 | Scrap aluminum alloy surface purifying equipment |
| CN107017160A (en) * | 2015-09-30 | 2017-08-04 | 东京毅力科创株式会社 | Substrate liquid processing device and substrate liquid processing method |
| CN112808657A (en) * | 2019-11-15 | 2021-05-18 | 郑州三华科技实业有限公司 | Cleaning device, industrial tinting machine and cleaning method of industrial tinting machine |
-
2005
- 2005-12-31 CN CN 200520131052 patent/CN2889529Y/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101179009B (en) * | 2007-11-21 | 2011-09-21 | 上海宏力半导体制造有限公司 | Jet cleaning method and device |
| CN101530852A (en) * | 2008-03-10 | 2009-09-16 | 富士通株式会社 | Cleaning apparatus, cleaning tank, cleaning method, and method for manufacturing article |
| CN102097293A (en) * | 2010-11-19 | 2011-06-15 | 嘉盛半导体(苏州)有限公司 | Cleaning machine table for semiconductor package products and cleaning process thereof |
| CN102059230A (en) * | 2010-12-30 | 2011-05-18 | 常州松晶电子有限公司 | Rocking washing device for washing wafer |
| CN102059230B (en) * | 2010-12-30 | 2012-08-08 | 常州松晶电子有限公司 | Rocking washing device for washing wafer |
| KR20140076525A (en) * | 2012-12-12 | 2014-06-20 | 램 리써치 코포레이션 | Ultrasonic cleaning method and apparatus therefore |
| CN103861839A (en) * | 2012-12-12 | 2014-06-18 | 朗姆研究公司 | Ultrasonic cleaning method and apparatus therefor |
| CN103861839B (en) * | 2012-12-12 | 2016-07-06 | 朗姆研究公司 | The method of ultrasonic waves for cleaning and device thereof |
| KR102167499B1 (en) | 2012-12-12 | 2020-10-20 | 램 리써치 코포레이션 | Ultrasonic cleaning method and apparatus therefore |
| CN107017160A (en) * | 2015-09-30 | 2017-08-04 | 东京毅力科创株式会社 | Substrate liquid processing device and substrate liquid processing method |
| CN106513367A (en) * | 2016-10-31 | 2017-03-22 | 广西大学 | Scrap aluminum alloy surface purifying equipment |
| CN106513367B (en) * | 2016-10-31 | 2019-06-18 | 常州苏耐合金有限公司 | A kind of scrap aluminium alloy surface cleaning equipment |
| CN112808657A (en) * | 2019-11-15 | 2021-05-18 | 郑州三华科技实业有限公司 | Cleaning device, industrial tinting machine and cleaning method of industrial tinting machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070418 |
|
| EXPY | Termination of patent right or utility model |