CN2880384Y

CN2880384Y - Edge polishing wheel for drinding ceramic tile or stone material

Info

Publication number: CN2880384Y
Application number: CN 200520146934
Authority: CN
Inventors: 高峻峰
Original assignee: Individual
Current assignee: Individual
Priority date: 2005-12-28
Filing date: 2005-12-28
Publication date: 2007-03-21
Anticipated expiration: 2015-12-28

Abstract

The utility model relates to an edge grinding wheel for ceramic tiles and/or stone sheets, and the wheel includes an integrated base and a powder layer. The intersection plane of the grinding layer and the base is as high as or lower than the none-positioning plane A of the edge grinding wheel. The powder layer and the base are one-step sintered and formed, and the intersection plane of the grinding layer and the base is as high as or lower than the none-positioning plane A of the edge grinding wheel, so the base and the powder layer are tightly connected. Such design can prolong service life of the edge grinding wheel when other conditions are left unchanged.

Description

The edging wheel of a kind of grinding ceramic tile and/or stone slab

Technical field

The utility model relates to the edging wheel of a kind of grinding ceramic tile and/or stone slab.

Background technology

Now use the edging wheel of grinding ceramic tile and/or stone slab, by grinding layer, transition zone and matrix three parts are formed, be split type between transition zone and matrix, the two is by welding, bonding, modes such as riveted joint are fixedly connected, the edging wheel of this structure, because between matrix and transition zone is split, need by welding, bonding, modes such as riveted joint are fixedly connected, the weak link that has power between matrix and transition zone, operating mode is poor in addition, in grinding process, bear big grinding force, especially Welding Structure is impacted and tension, with easy fracture more between the increase transition zone of grinding layer thickness and matrix, therefore the thickness of grinding layer is restricted, grinding layer and transition region thickness sum are between 10-13MM, then in other condition such as prescription, under the identical condition of sintering process, because the thickness of grinding layer is restricted, therefore the life-span of edging wheel is restricted, Granted publication number is the utility model patent of CN2558491, announced a kind of diamond disk, matrix casts directly on the grinding layer through casting mould, need not alternate manner between matrix and grinding layer is connected, but owing to adopt the method for cast to connect grinding layer and matrix, matrix and grinding interfacial bonding strength are still low, for increasing the bond strength between matrix and grinding layer, its cutter head is provided with the dovetail boss towards the one side of matrix, contain the diamond bed of material that is difficult to common process and equipment processing on the dovetail boss on the cutter head and be arranged on, difficulty of processing is big, to making production efficiency low and processing cost is high, simultaneously, its bonding strength is still low, the thickness of grinding layer still is restricted, and the life-span of grinding tool is restricted.

The utility model content

The purpose of this utility model is the above-mentioned deficiency at prior art, provide a kind of matrix and transition zone in conjunction with firm edging wheel, thereby can increase the thickness of edging wheel grinding layer, under the constant situation of other condition, prolong the service life of edging wheel while the edging wheel simple in structure of grinding tool.

The purpose of this utility model is achieved through the following technical solutions:

The edging wheel of a kind of grinding ceramic tile and/or stone slab, the grinding layer continuous distributed is sintered into one on a side end face of matrix and with matrix, and described grinding layer is mutually concordant with the non-locating surface A of edging wheel with the faying face of matrix or be lower than the non-locating surface A of edging wheel.

Described grinding layer is provided with the draining chip area, and described draining chip area extends along diametric(al), along the circumferential direction distributes.

Be provided with transition zone between described grinding layer and matrix, grinding layer is sintered into one by transition zone and matrix.

Described transition zone is positioned at the circumferential surface of matrix, and grinding layer is mutually concordant substantially with the non-locating surface A of edging wheel with the faying face of transition zone or be lower than non-locating surface A.

Adopt the edging wheel of the utility model structure, owing to be integral by sinter bonded between grinding layer and matrix, and the faying face of grinding layer and matrix or transition zone is lower than non-locating surface, can increase the bond strength between grinding layer and matrix, therefore can increase the thickness of edging wheel grinding layer, thereby prolong the life-span of edging wheel, adopt the thickness of structure grinding layer of the present utility model can increase to 13MM-50MM, simultaneously, because the grinding layer of the utility model edging wheel is distributed on the matrix continuously, and continuous all edge works are provided during grinding, therefore can improve the stressed of edging wheel, do not have and impact, noise is low.

The utility model will be further described below in conjunction with accompanying drawing:

Description of drawings

Fig. 1 is the edging wheel structural representation of the utility model matrix and the direct combination of grinding layer;

Fig. 2 is the utility model matrix and the grinding layer edging wheel structural representation by the transition zone combination;

Fig. 3 is provided with the edging wheel structural representation of draining chip area for the utility model;

Fig. 4 is the vertical view schematic diagram of Fig. 3;

The specific embodiment

Edging wheel of the present utility model is mainly used in the grinding of ceramic tile and/or slabstone edge portion, and matrix can be selected metal for use, also can adopt metal powder.As shown in Figure 1, 2, 3, the grinding layer 1 of edging wheel is arranged on a side of edging wheel, and 4 of grinding layer 1 and matrixes pass through sinter bonded.As shown in Figure 1, in order to increase the bond strength between matrix 4 and the grinding layer 1, grinding layer 1 is mutually concordant substantially with the non-locating surface A of edging wheel with the faying face of matrix 4 or be lower than non-locating surface A; Grinding layer is distributed on the matrix serially, can obtain low the impact and low noise like this, improve the edging quality, shown in Fig. 2,3, when between matrix and grinding layer transition zone 3 being set, transition zone 3 is positioned at the circumferential surface of matrix, and grinding layer 1 is mutually concordant substantially with the non-locating surface A of edging wheel with the faying face of transition zone 3 or be lower than non-locating surface A.For increasing draining chip removal and cooling effect, also draining chip area 5 can be set on the grinding layer 1, same as the prior art, draining chip area 5 prolongs diametric(al) and extends, and prolongs circumferencial direction and distributes;

Claims

1, the edging wheel of a kind of grinding ceramic tile and/or stone slab, grinding layer (1) continuous distributed is sintered into one on a side end face of matrix (4) and with matrix (4), it is characterized in that: described grinding layer (1) is mutually concordant with the non-locating surface A of edging wheel with the faying face of matrix (4) or be lower than the non-locating surface A of edging wheel.

2, the edging wheel of grinding ceramic tile as claimed in claim 1 and/or stone slab is characterized in that: described grinding layer (1) is provided with draining chip area (5), and described draining chip area (5) extends along diametric(al), along the circumferential direction distributes.

3, the edging wheel of grinding ceramic tile as claimed in claim 1 and/or stone slab is characterized in that: be provided with transition zone (3) between described grinding layer (1) and matrix (4), grinding layer (1) is sintered into one by transition zone (3) and matrix (4).

4, the edging wheel of grinding ceramic tile as claimed in claim 3 and/or stone slab, it is characterized in that: described transition zone (3) is positioned at the circumferential surface of matrix, and grinding layer (1) is mutually concordant substantially with the non-locating surface A of edging wheel with the faying face of transition zone (3) or be lower than non-locating surface A.