Diamond segment
Technical field
The utility model relates to diamond segment, particularly a kind of efficient minute intensity granularity diamond segment.
Background technology
Diamond tool, because adamantine superhard property was used widely in various manufacturings in recent years, comparatively speaking, be tens times of other general tools the service life of diamond tool.In process such as concrete, stone material, often need cutting and grinding, extensive use in recent years diamond tool.The cutter head of traditional diamond saw blade all is with diamond, metal adhesive, and the mixture of framework material and extraordinary trace element is pressed into desired cutter head shape by high temperature sintering, is welded on the body that is equipped with mutually and uses.As shown in Figure 1 and Figure 2, this big mixing cutter head design, in diamond and bonding agent mixed sintering body 1 manufacturing process, batch mixing is inhomogeneous, and the distribution of diamond grit is the pine pine tightly, big and small, the bonding firmness difference of diamond particles is big, and diamond particles durability in participating in grinding process is poor, each position unbalance stress, vibration strengthens, and has increased the weight of tool damage.
The utility model content
The utility model purpose is to provide a kind of working (machining) efficiency height, the good diamond segment of quality.
To achieve these goals, the utility model adopts following technical scheme: diamond segment, and coarseness layer and fine granularity layer or high strength layer and low-intensity layer alternating layer are stacked in cutter head adds setting, and the diamond in every layer evenly distributes.
The fabrication orientation of described diamond segment is consistent with main cutting face.
The utility model is with the distribution form ruleization of diamond in cutter head, coarseness or high strength and fine granularity or low intensive, be layering, diamond in every layer evenly distributes, adhesive strength is high and consistent, and roughing and fining-off hocket in grinding process like this, every layer of adamantine threshing speed basically identical, the working (machining) efficiency height, quality is good.
Description of drawings
Fig. 1 is the prior art constructions schematic diagram;
Fig. 2 is the side view of prior art;
Fig. 3 is a structural representation of the present utility model;
Fig. 4 is a side view of the present utility model;
Fig. 5 is the matsurface schematic diagram after the coarse-particle bed grinding;
Fig. 6 be after the grinding of fine grained layer than the flat surface schematic diagram.
The specific embodiment
Embodiment: the diamond segment shown in Fig. 3,4, the distribution form ruleization of diamond in cutter head, varigrained diamond exists with the form of different layers, one deck coarseness diamond mixed layer 3, one deck fine-granularity diamond mixed layer 4 again, be layering, the diamond in every layer evenly distributes, and adhesive strength is high and consistent.2 is main cut surfaces among Fig. 3, and 5 is side cut surfaces among Fig. 4.
The distribution form of diamond in cutter head can also varying strength diamond exist with the form of different layers, one deck high-strength diamond mixed layer 3, one deck low-intensity diamond mixed layer 4 again, be layering, the diamond in every layer evenly distributes, and adhesive strength is high and consistent, in working angles, the diamond that intensity is high is durable, and threshing is slow, and the diamond that intensity is low is not durable relatively, threshing is fast, be convenient to form cutting edge, sharp, the working (machining) efficiency height.
Every layer by diamond, metal adhesive, and the formation of framework material and extraordinary trace element is pressed into after the desired cutter head shape sintering finished.The efficient fabrication orientation of granularity intensity diamond segment that divides is consistent with main cutting face, so just can realize high efficiency in process.
Fig. 5 is the matsurface schematic diagram after coarse-particle bed 4 grindings, and wherein 6 is cut surface, and wherein 7 is cutting material, and wherein 8 is cutting groove; Fig. 6 be after 3 grinding of fine grained layer than the flat surface schematic diagram, wherein 9 is cut surface, wherein 7 is cutting material, wherein 8 is cutting groove.