CN2874518Y - Power supply device burning test box - Google Patents
Power supply device burning test box Download PDFInfo
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- CN2874518Y CN2874518Y CN 200520135933 CN200520135933U CN2874518Y CN 2874518 Y CN2874518 Y CN 2874518Y CN 200520135933 CN200520135933 CN 200520135933 CN 200520135933 U CN200520135933 U CN 200520135933U CN 2874518 Y CN2874518 Y CN 2874518Y
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- power supply
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- supply unit
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Abstract
A power supplier burning test box comprises a plurality of test layers, a plurality of test back plates, a plurality of electronic analog power loads and a control unit. The test layers comprise a plurality of power supplier installation areas. The test back plates are arranged on the test layers and form electric passageway with the electronic analog power load. The test back plates are connected with power supplier to be tested, and the control unit comprises a temperature controller and an AC power supply route. The temperature controller is used to control the temperature in the power supplier burning test box. And the AC power source is to supply electric energy to power supplier burning test box in tests. There should be at least two test back plates as to the said test back plates above.
Description
[technical field]
The utility model is about a kind of power supply device burning test box, refers to a kind of power supply device burning test box that dissimilar power supply units carries out burn in process that holds especially.
[background technology]
Power supply unit for mainboard provides electric energy, is the indispensable part of computing machine in computing machine, and computer motherboard and power supply have the unified structure standard usually.
The power supply unit of early stage computing machine 386,486 utilizations is AT (Advanced Technology, advanced technology) structure, the multi-functional Pentium extended pattern mainboard epoch have been arrived, the power supply unit of AT structure begins to make the transition to ATX (Advanced Technology Extended, extended pattern advanced technology) structure.The difference that essence is arranged between the power supply unit of the power supply unit of AT external and AT structure: the firstth, the motherboard power supply line that power supply provides, 6 core separate power supply plugs of AT structure are replaced by the biserial plug of one 20 core in AT external, so such power supply unit is also referred to as " 20 core ATX power supply unit "; The secondth, ATX power supply unit output voltage group also provides positive and negative 3.3 volts of voltages to export except that positive and negative 12 volts and positive and negative 5 volts of AT power supply unit, directly is 3.3 volts power devices for the part required voltage.At present, in order to satisfy the needs of high power consumption, the attaching plug of ATX power supply unit has also been made the biserial plug of 24 cores, claims " 24 core ATX power supply unit ".
Development through nearly ten years, the requirement of the high-speed and high power consumption during for the work of the processor, internal memory, video card and the mainboard chip that satisfy computing machine, Intel has released BTX (BalancedTechnology Extended, the extended pattern balancing technique) standard, therefore, power supply unit begins to move towards the BTX structure.Compare with the ATX power supply unit, the output interface of BTX power supply unit has adopted 24 core master power supply interfaces so that more powerful electric power supply to be provided comprehensively.
Because power supply unit is being undertaken the task that electric energy is provided for computer motherboard, so the quality of power supply unit quality directly influences the safe operation of computer and giving full play to of performance, in the manufacturing of power supply unit, in order to discern and eliminate defective products, be a requisite link that guarantees the power supply unit quality to the burn-in test of power supply unit.
In the production of power supply unit, it is carried out the burn-in test power supply device burning test box of generally power supply unit being packed into, can observation power supply unit to be measured normally move under the temperature when being higher than operate as normal.Comprise in the described power supply device burning test box and corresponding testing backboard of power supply unit to be measured and corresponding signal lamp.The connectivity port of power supply unit is connected back access fictitious load with described testing backboard, and the temperature inside the box is controlled within certain scope.
Existing power supply device burning test box only provides testing backboard for 20 early stage core ATX power supply units, and this testing backboard is not suitable for the ATX power supply unit of novel 24 cores that BTX power supply unit that Intel released afterwards and Hewlett-Packard release, therefore, be necessary existing power supply supply burn in process case is improved, with the developing direction of the needs simultaneous adaptation new technology that satisfies existing test.
[summary of the invention]
The purpose of this utility model provides a kind of power supply device burning test box, in order to the polytype power supply unit is carried out burn in process.
A kind of power supply device burning test box, comprise some test layers, some testing backboards, some electronic power loads and a control module, described test layer respectively comprises some power supply unit installing zones, described some testing backboards place respectively on the described test layer, and couple with described some electronic power loads and to form electrical path, the corresponding respectively connection of described testing backboard power supply unit to be measured, described control module comprises a temperature controller and an AC power path, described temperature controller is in order to control the temperature in the described power supply device burning test box, described AC power provides electric energy when being used to the power supply device burning test, and it is characterized in that: described testing backboard comprises at least two kinds of power supply unit testing backboards.
Described power supply device burning test box beneficial effect is and can satisfies the needs of existing test for multiple power supply unit provides test environment.
[description of drawings]
The utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the schematic perspective view of the preferred embodiment of the utility model power supply device burning test box.
Fig. 2 is the test layer lower surface synoptic diagram of the preferred embodiment of the utility model power supply device burning test box.
Fig. 3 is the testing backboard synoptic diagram that is applicable to 20 core ATX power supply units in the preferred embodiment of the utility model power supply device burning test box.
Fig. 4 is the testing backboard synoptic diagram that is applicable to the BTX power supply unit in the preferred embodiment of the utility model power supply device burning test box.
Fig. 5 is the testing backboard synoptic diagram that is applicable to 24 core ATX power supply units in the preferred embodiment of the utility model power supply device burning test box.
[embodiment]
See also Fig. 1 and Fig. 2, the preferred embodiment of the utility model power supply device burning test box comprises first group of test layer 100, second group of test layer 200 and the 3rd group of test layer 300, first group of testing backboard 110, second group of testing backboard 210 and the 3rd group of testing backboard 310, some electronic power loads 400, a control module 500 and a chamber door (figure does not show).
Described first group of test layer 100, second group of test layer 200 and the 3rd group of test layer 300 all have two aspects, and each aspect includes a upper surface 10 and a lower surface 20.Described each upper surface 10 all has power supply unit installing zone 120,220 and 320, and is provided with first group of testing backboard 110, second group of testing backboard 210 and the 3rd group of testing backboard 310 on the upper surface 10 of described first group of test layer 100, second group of test layer 200 and the 3rd group of test layer 300 respectively accordingly.
Described first group of testing backboard 110 be 20 core ATX power supply unit testing backboards as shown in Figure 3, it is installed on described first group of test layer 100.Described first group of testing backboard 110 comprises some dissimilar power interfaces 111～116, some power lights 117 and a power switch 118.Described power interface 111～116 is respectively applied for the respective electrical supply socket of described 20 core ATX power supply units and is connected, wherein, described power interface 111 is one 20 stitch plugs, described power interface 112 is square 4 stitch plugs, described power interface 113 is one 6 stitch plugs, described power interface 114 is the microscler plugs of small-sized 4 stitch, and described power interface 115 is one 15 stitch SATA plugs, and described power interface 116 is the microscler plugs of large-scale 4 stitch.
Described power light 117 is connected with each power interface respectively, can indicate the whether conducting of corresponding power voltage respectively.
Described power switch 118 is used for controlling the through and off that described first group of testing backboard 110 electrically connects.
Described second group of testing backboard 210 be BTX power supply unit testing backboard as shown in Figure 4, it is installed on the described test layer 200.Described second group of testing backboard 210 comprises some dissimilar power interfaces 211～216, some power lights 217 and a power switch 218.Described power interface 211～216 is respectively applied for the respective electrical supply socket of described BTX power supply unit and is connected.Wherein, described power interface 211 is one 24 stitch plugs, described power interface 212 is square 4 stitch plugs, described power interface 213 is one 6 stitch plugs, described power interface 214 is the microscler plugs of small-sized 4 stitch, described power interface 215 is one 15 stitch SATA plugs, and described power interface 216 is the microscler plugs of large-scale 4 stitch.
Described power light 217 is connected with each power interface respectively, can indicate the whether conducting of corresponding power voltage respectively.
Described power switch 218 is used for controlling the through and off that described second group of testing backboard 210 electrically connects.
Described the 3rd group of testing backboard 310 be 24 core ATX power supply unit testing backboards as shown in Figure 5, it is installed on the described test layer 300.Described the 3rd group of testing backboard 310 comprises some dissimilar power interfaces 311～316, some power lights 317 and a power switch 318.Described power interface 311～316 is respectively applied for the respective electrical supply socket of described BTX power supply unit and is connected.Wherein, described power interface 311 is one 24 stitch plugs, described power interface 312 is one 4 stitch square plugs, described power interface 313 is one 6 stitch plugs, described power interface 314 is the microscler plugs of small-sized 4 stitch, described power interface 315 is one 15 stitch SATA plugs, and described power interface 316 is the microscler plugs of large-scale 4 stitch.
Described power light 317 is connected with each power interface respectively, can indicate the whether conducting of corresponding power voltage respectively.
Described power switch 318 is used for controlling the through and off that described the 3rd group of testing backboard 310 electrically connects.
Described electronic power load 400 is installed in the described lower surface 20 of respectively organizing each layer in the test layer 100,200,300, and described each electronic power load 400 is electrically connected with described testing backboard 110,210,310 respectively.
Described control module 500 is located at a side of described power supply device burning test box, it comprises an amp gauge 510, a voltage meter 520, a temperature controller 530 and some power lights 540, be provided with the AC power path in the described control module 500, electric energy be provided for when being used to test described power supply unit.
When carrying out the power supply device burning test, some 20 core ATX power supply units to be measured are installed on each power supply unit installing zone 120 of described first group of test layer 100 respectively, some BTX power supply units to be measured are installed on each power supply unit installing zone 220 of described second group of test layer 200 respectively, some 24 core ATX power supply units to be measured are installed on each power supply unit installing zone 320 of described the 3rd group of test layer 300 respectively.With described power supply unit and described first group of testing backboard 110, second group of testing backboard 210, the 3rd group of testing backboard 310 corresponding electrical connections respectively, and with described electronic power load 400 electric connections.Described power supply unit is inserted AC power path in the described control module 500.Close described test box chamber door and power-on then, regulating described temperature controller 530 makes the interior temperature of described power supply device burning test box in 42～48 degrees centigrade scope, can carry out the burn in process of power supply unit, electric current and magnitude of voltage when this moment, described amp gauge 510 and described voltage meter 520 showed work respectively, described power light 540 shows the connection state of each layer respectively.
Use described power supply device burning test box to eliminate contradiction between the testing backboard of power supply unit polytype and single type, and can provide test environment, satisfy the needs of existing test for multiple power supply unit.
Claims (7)
1. power supply device burning test box, comprise some test layers, some testing backboards, some electronic power loads and a control module, described test layer respectively comprises some power supply unit installing zones, described some testing backboards place respectively on the described test layer, and couple with described some electronic power loads and to form electrical path, the corresponding respectively connection of described testing backboard power supply unit to be measured, described control module comprises a temperature controller and an AC power path, described temperature controller is in order to control the temperature in the described power supply device burning test box, described AC power provides electric energy when being used to the power supply device burning test, and it is characterized in that: described testing backboard comprises at least two kinds of power supply unit testing backboards.
2. power supply device burning test box as claimed in claim 1 is characterized in that: described testing backboard also comprises in 20 core ATX power supply unit testing backboards, BTX power supply unit testing backboard and the 20 four-core ATX power supply unit testing backboards at least two kinds.
3. power supply device burning test box as claimed in claim 1 or 2 is characterized in that: described testing backboard is provided with power light, and described power light is connected with each power interface respectively, can indicate the whether conducting of corresponding power voltage respectively.
4. power supply device burning test box as claimed in claim 2, it is characterized in that: described 20 core ATX power supply unit testing backboards comprise one 20 stitch plug, one four stitch square plug, one six stitch plug, two microscler plugs of small-sized four stitch, one 15 stitch SATA plug, and four microscler plugs of large-scale four stitch.
5. power supply device burning test box as claimed in claim 1, it is characterized in that: described 20 four-core ATX power supply unit testing backboards comprise one 24 stitch plug, one four stitch square plug, one six stitch plug, two microscler plugs of small-sized four stitch, four 15 stitch SATA plugs, and six microscler plugs of large-scale four stitch.
6. power supply device burning test box as claimed in claim 1, it is characterized in that: described BTX power supply unit testing backboard comprises one 24 stitch plug, one four stitch square plug, one six stitch plug, two microscler plugs of small-sized four stitch, two 15 stitch SATA plugs, and five microscler plugs of large-scale four stitch.
7. power supply device burning test box as claimed in claim 1 is characterized in that: described some test layers are divided into three groups, and every group has two test aspects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520135933 CN2874518Y (en) | 2005-10-28 | 2005-10-28 | Power supply device burning test box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520135933 CN2874518Y (en) | 2005-10-28 | 2005-10-28 | Power supply device burning test box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2874518Y true CN2874518Y (en) | 2007-02-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520135933 Expired - Fee Related CN2874518Y (en) | 2005-10-28 | 2005-10-28 | Power supply device burning test box |
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| CN (1) | CN2874518Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103543300A (en) * | 2013-10-29 | 2014-01-29 | 路旺培 | LED power panel aging testing case |
| CN103675500A (en) * | 2012-09-24 | 2014-03-26 | 致茂电子(苏州)有限公司 | Labor-saving burn-in furnace |
| CN106019114A (en) * | 2016-06-23 | 2016-10-12 | 上海战旗电子有限公司 | Test temperature box |
| CN115389830A (en) * | 2021-05-25 | 2022-11-25 | 捷拓科技股份有限公司 | Burn-in equipment |
-
2005
- 2005-10-28 CN CN 200520135933 patent/CN2874518Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103675500A (en) * | 2012-09-24 | 2014-03-26 | 致茂电子(苏州)有限公司 | Labor-saving burn-in furnace |
| CN103675500B (en) * | 2012-09-24 | 2016-02-03 | 致茂电子(苏州)有限公司 | Laborsaving burning machine stove |
| CN103543300A (en) * | 2013-10-29 | 2014-01-29 | 路旺培 | LED power panel aging testing case |
| CN106019114A (en) * | 2016-06-23 | 2016-10-12 | 上海战旗电子有限公司 | Test temperature box |
| CN115389830A (en) * | 2021-05-25 | 2022-11-25 | 捷拓科技股份有限公司 | Burn-in equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070228 Termination date: 20101028 |